KR101944197B1 - Film forming apparatus, film forming method and manufacturing method of organic el display apparatus using the same - Google Patents

Abstract

A film forming apparatus of the present invention comprises: a substrate holding unit including a support part for supporting the peripheral part of a substrate; and an electrostatic chuck provided on the upper side of the support part and adsorbing the substrate. The support part includes: a first support member installed in a first direction; and a second support member installed in the first direction so as to face the first support member. The support force of the first support member for supporting the substrate is different from the support force of the second supporting member for supporting the substrate. The substrate can be attracted to the electrostatic chuck in a more flat shape.

Description

TECHNICAL FIELD [0001] The present invention relates to a film forming apparatus, a film forming method, and a manufacturing method of an organic EL display using the same. BACKGROUND ART [0002]

The present invention relates to a film forming apparatus, and more particularly to a substrate supporting unit for flatly attaching a substrate to an electrostatic chuck.

Recently, an organic EL display device has been spotlighted as a flat panel display device. The organic EL display device is a self-luminous display, and its characteristics such as response speed, viewing angle, and thinness are superior to those of a liquid crystal panel display, and thus various types of portable terminals represented by monitors, televisions, and smart phones are rapidly replacing existing liquid crystal panel displays . In addition, automotive displays are expanding their applications.

The element of the organic EL display device has a basic structure in which an organic material layer causing light emission is formed between two opposing electrodes (cathode electrode, anode electrode). The organic material layer and the electrode layer of the organic EL display device are formed by depositing the evaporated evaporation material on the lower surface of the substrate placed on the upper part of the vacuum chamber through the mask having the pixel pattern by heating the evaporation source provided at the lower part of the vacuum chamber .

The substrate is held and supported by the substrate holder in the vacuum chamber of the deposition apparatus of the upward deposition type. The substrate is supported by the support of the substrate holder so that the periphery of the lower surface of the substrate is not damaged by the organic layer / electrode layer formed on the substrate . In this case, as the size of the substrate increases, the central portion of the substrate, which is not supported by the support portion of the substrate holder, is sagged by the weight of the substrate, which causes a decrease in the deposition accuracy.

A technique of using an electrostatic chuck as a method for reducing deflection due to the weight of the substrate has been studied. That is, an electrostatic chuck is provided on the upper surface of the substrate, and the upper surface of the substrate supported by the supporter of the substrate holder is attracted to the electrostatic chuck, so that the central portion of the substrate is pulled by the electrostatic attraction of the electrostatic chuck, .

However, in the conventional substrate holder, the substrate placed on the support of the substrate holder is supported in a state where the central portion of the substrate is sagged by its own weight and the peripheral portion of the substrate is higher than the central portion of the substrate. The peripheral portion of the substrate supported by the support portion of the substrate holder receives the electrostatic attraction from the electrostatic chuck at almost the same time and is attracted to the electrostatic chuck, and the central portion of the substrate receives the electrostatic attraction most late.

That is, since the adsorption of the substrate to the electrostatic chuck proceeds from the periphery of the substrate toward the central portion of the substrate, even if the electrostatic chuck and the substrate are sufficiently close, the substrate is not adsorbed flat on the electrostatic chuck, A gap is left between them. Since the peripheral portion of the lower surface of the substrate is supported by the support portion of the substrate holder with the strongest supporting force so that the electrostatic attraction is strongest, deflection of the central portion of the substrate, which receives the electrostatic attraction of the electrostatic chuck at the latest, The wrinkles are left unexpanded.

It is an object of the present invention to provide a film forming apparatus, a film forming method, and a method for manufacturing an electronic device by using such a film forming method, which enables a substrate to be attracted to the electrostatic chuck in a more flat shape.

A film forming apparatus according to an aspect of the present invention includes a substrate holding unit including a support for supporting a periphery of a substrate and an electrostatic chuck provided above the support for attracting the substrate, And a second support member installed in the first direction so as to face the first support member, wherein a supporting force for supporting the substrate by the first support member is greater than a support force of the second support member The member is different from the supporting force for supporting the substrate.

According to another aspect of the present invention, there is provided a film forming method comprising: A step of bringing a substrate into a film forming apparatus according to an aspect of the present invention and placing the substrate on a supporting portion of the substrate holding unit, a step of adsorbing an upper surface of the substrate placed on the supporting portion of the substrate holding unit with an electrostatic chuck, And depositing an evaporation material on the substrate through a mask.

A method for manufacturing an organic EL display device according to another aspect of the present invention uses the film forming method according to another aspect of the present invention to manufacture an organic EL display device.

According to the present invention, since the supporting members of the substrate holding unit for supporting the periphery of the lower surface of the substrate are provided with different supporting forces, when the substrate supported by the supporting members of the substrate holding unit is attracted to the electrostatic chuck , The corrugation of the substrate can be spread toward the other side supported by the support member whose supporting force is weaker than the side supported by the support member having a large supporting force in the two opposing directions of the substrate, The chuck can be brought into close contact with the gap, and the substrate as a whole can be brought into flat contact with the electrostatic chuck without wrinkles.

1 is a schematic view of a part of a manufacturing line of an organic EL display device
2 is a schematic view of a film forming apparatus of the present invention.
3 is a schematic view showing a support portion of a substrate holding unit used in a film forming apparatus according to an embodiment of the present invention.
4 is a schematic view showing a support portion of a substrate holding unit used in a film forming apparatus according to another embodiment of the present invention.
5 is a schematic view showing a configuration of a support portion of a substrate holding unit according to another embodiment of the present invention.
6 is a schematic diagram showing a structure of an organic EL display device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration, the software configuration, the process flow, the manufacturing conditions, the size, the material, the shape, and the like of the apparatus are intended to limit the scope of the present invention unless otherwise specified no.

The present invention can be suitably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation on the surface of a substrate. As the material of the substrate, any material such as glass, a film of a polymer material, or a metal can be selected, and as the evaporation material, an arbitrary material such as an organic material, a metallic material (metal, metal oxide, etc.) can be selected. Specifically, the technique of the present invention is applicable to an organic electronic device (for example, an organic EL display, a thin film solar cell), an optical member, and the like. In particular, in the apparatus for manufacturing an organic EL display device, the evaporation material accommodated in the evaporation source is evaporated and deposited on the substrate through a mask to form a desired organic EL display device, which is one of preferred applications of the present invention.

<Electronic Device Manufacturing Line>

1 is a plan view schematically showing a part of the configuration of a manufacturing line of an electronic device. The manufacturing line of Fig. 1 is used, for example, in manufacturing a display panel of an organic EL display device for a smart phone. In the case of a display panel for a smart phone, for example, organic EL is formed on a substrate having a size of about 1800 mm x about 1500 mm, and then the substrate is diced into a plurality of small size panels.

The manufacturing line of the electronic device generally includes a plurality of film forming chambers 11 and 12 and a transport chamber 13 as shown in Fig. In the transfer chamber 13, a transfer robot 14 for holding and transferring the substrate 10 is provided. The carrying robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate 10 is mounted on a multi-joint arm, and performs carrying in / out of the substrate 10 into each of the film forming chambers.

Each of the deposition chambers 11 and 12 is provided with a deposition apparatus (also referred to as a deposition apparatus). A series of film formation processes such as the transfer of the substrate 10 to the transfer robot 14, the alignment of the relative position of the substrate 10 and the mask, the fixing of the substrate 10 onto the mask, Is automatically performed by the film forming apparatus.

Hereinafter, the structure of the film forming apparatus of the film forming chamber will be described.

&Lt;

2 is a cross-sectional view schematically showing the structure of the film forming apparatus 2. As shown in Fig. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. Assuming that the substrate is fixed parallel to the horizontal plane (XY plane) at the time of film formation, the direction parallel to the short side of the substrate is defined as X direction, and the direction parallel to the long side is defined as Y direction. And the rotation angle around the Z axis is denoted by?.

The film forming apparatus 2 has a vacuum chamber 20 defining a space in which a film forming process is performed. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

A substrate holding unit 21 for holding and holding a substrate, a mask table 22 on which a mask is placed, an electrostatic chuck 23 for attracting the substrate by an electrostatic attracting force is provided in an upper portion of the vacuum chamber 20 of the film forming apparatus 2, A magnet 24 for applying a magnetic force to a metal mask, and the like, and an evaporation source 25 for accommodating the evaporation material is provided in a lower portion of the vacuum chamber 20 of the film formation apparatus.

The substrate holding unit 21 receives the substrate 10 from the transfer robot 14 of the transfer chamber 13, holds it, and transfers it. The substrate holding unit 21 is also referred to as a substrate holder. The substrate holding unit 21 includes supports 211 and 212 for supporting the peripheral edge of the lower surface of the substrate. On the support, a fluorine-coated pad (not shown) is installed to prevent damage to the substrate. The support portion of the present invention includes a plurality of support members having different supporting forces such that the substrate can be attracted to the electrostatic chuck as a whole flatly as described later.

A mask 221 having a frame shape is provided under the substrate holding unit 21 and a mask 221 having an opening pattern corresponding to the thin film pattern to be formed on the substrate 10 . Particularly, a mask used for manufacturing an organic EL device for a smart phone is also called a fine metal mask (FMM) as a metal mask having a fine opening pattern.

An electrostatic chuck 23 is provided above the supporting portions 211 and 212 of the substrate holding unit 21 for attracting and fixing the substrate by electrostatic attraction. The electrostatic chuck has a structure in which an electric circuit such as a metal electrode is buried in a matrix of ceramic material. When positive (+) and negative (-) voltages are applied to a metal electrode, a polarization charge is induced in the substrate through the ceramic matrix , The substrate can be attracted and fixed to the electrostatic chuck 23 by the electrostatic attraction between them. The electrostatic chuck can be divided into a plurality of modules according to the structure of the buried electric circuit.

 A magnet 24 for applying a magnetic force to the metal mask 221 to prevent sagging of the mask and to closely contact the mask 221 and the substrate 10 is provided on the electrostatic chuck 23. The magnet 24 may be made of a permanent magnet or an electromagnet, and may be divided into a plurality of modules.

Although not shown in FIG. 2, a cooling plate for cooling the substrate is provided between the electrostatic chuck 23 and the magnet 24. The cooling plate may be integrally formed with the magnet 24.

The evaporation source 25 includes a crucible (not shown) in which an evaporation material to be formed on the substrate is housed, a heater (not shown) for heating the crucible, and evaporation materials scattered to the substrate until the evaporation rate from the evaporation source becomes constant. And a shutter (not shown) for blocking the shutter. The evaporation source 25 may have various configurations depending on the application such as a point evaporation source, a linear evaporation source, and a revolver evaporation source.

Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) and a film thickness calculating unit (not shown) for measuring the film thickness deposited on the substrate.

A driving mechanism for moving the substrate holding unit 21, the electrostatic chuck 23, the magnet 24, and the like in the vertical direction (Z direction) is formed on the outer upper surface of the vacuum chamber 20 of the film forming apparatus 2, A driving mechanism for moving the electrostatic chuck 23, the substrate holding unit 21, and the like in parallel with the horizontal plane (X direction, Y direction, and? Direction) is provided for alignment of the mask. An alignment camera (not shown) is also provided for taking an alignment mark formed on the substrate and the mask through a window provided on the ceiling of the vacuum chamber 20 for aligning the mask and the substrate.

Hereinafter, the film forming process by the film forming apparatus of the present invention will be described.

The substrate is carried into the vacuum chamber 20 by the transfer robot 14 of the transfer chamber 13 and placed in the substrate holding unit 21. [ An alignment step for measuring and adjusting the relative positions of the substrate 10 placed on the substrate holding unit 21 and the mask 221 placed on the mask table 22 is performed. When the alignment process is completed, the substrate holding unit 21 is lowered by the driving mechanism to place the substrate 10 on the mask 221, and after that, the magnet 24 is lowered to move the substrate 10 and the mask 221 ). The substrate is fixed by the supporting portions 211 and 212 of the substrate holding unit 21 and the electrostatic chuck 23 in the alignment process, the lowering process for placing the substrate on the mask, the process of closely contacting the substrate with the mask by the magnet, .

In this state, the shutter of the evaporation source 25 is opened, and the evaporation material evaporated from the crucible of the evaporation source 25 is deposited on the substrate through the fine pattern opening of the mask.

The shutter of the evaporation source 25 is closed and then the transfer robot 14 transfers the substrate from the vacuum chamber 20 to the transfer chamber 13 Out.

&Lt; Supporting portion of the substrate holding and supporting unit &

Hereinafter, the configuration of the substrate holding unit 21, particularly, the configuration of the supporting portions 211 and 212 for holding the substrate together with the electrostatic chuck will be described with reference to Fig.

The substrate holding and holding unit 21 holds and supports the peripheral portion of the substrate 10 by the supporting portions 211 and 212, and conveys it. In the embodiment of the present invention shown in Fig. 3, the supporting portions 211 and 212 are provided to support opposite side edges (e.g., two long sides) of the substrate.

That is, the supporting portions 211 and 212 of the substrate holding and holding unit 21 are provided with a plurality of first supporting members 211 installed along one side (first side) of two opposing sides of the substrate, And a plurality of second support members 212 installed along the second side. For example, a plurality of first support members 211 are provided along the long side direction (Y direction, first direction) of the substrate, and a plurality of second support members 212 are provided to the plurality of first support members 211, (Y direction, first direction) of the substrate. 3, the first support member 211 and the second support member 212 are each composed of a plurality of support members. However, the present invention is not limited to this, and the first support member 211 and / 2 support members 212 may each be composed of a single support member extending in a first direction. 3, the first supporting member 211 and the second supporting member 212 are illustrated as being installed along the long side of the substrate. However, the present invention is not limited to this, 2 support members 212 may be provided along mutually opposite short sides of the substrate.

 The supporting portions 211 and 212 for supporting the peripheral edge of the lower surface of the substrate are provided so that the substrate supporting surface thereof is movable in the vertical direction (Z direction) with respect to the substrate holding unit 21. [ To this end, the support may comprise an elastic member.

For example, as shown in Fig. 3 (a), each of the plurality of support members 211, 212 of the support portion includes a substrate support surface portion 30 and an elastic body portion 31. [ The substrate supporting surface portion 30 supports the peripheral edge of the lower surface of the substrate, and the elastic body portion 31 supports the substrate supporting surface portion 30 elastically displaceably.

(For example, a compressive displacement or a tensile displacement) when the substrate supported by the substrate supporting surface portion 30 is subjected to a pressing force from the electrostatic chuck by configuring the supporting member to include the elastic body portion 31, It is possible to prevent the substrate from being damaged by absorbing the pressing force from the electrostatic chuck 23. Even if the height of the substrate supporting surface portion 30 is not the same due to a manufacturing error of each supporting member, the effect on the overall supporting function can be reduced by the elastic displacement of the elastic body portion 31. [

&Lt; Substrate Bearing Force of Supporting Unit of Substrate Holding >

The supporting portion of the substrate holding unit 21 of the present invention can be set such that the supporting force for supporting the substrate by the plurality of supporting members 211 and 212 varies depending on the supporting member. That is, the supporting portion of the substrate holding unit 21 is configured such that the first supporting member 211 supporting the first side, which is any one of the opposite sides of the substrate, And the second supporting member 212 supporting the sides are provided so as to have different supporting forces for supporting the substrate. For example, the supporting force by which the first supporting member 211 supports the substrate is set to be larger than the supporting force by which the second supporting member 212 supports the substrate.

4, the elastic modulus of the elastic body 31 of the first supporting member 211 is made greater than the elastic modulus of the elastic body 31 of the second supporting member 212, The length of the elastic body portion 31 of the support member 211 is longer than the length of the elastic body portion 31 of the second support member 212. The elastic body 31 of the first supporting member 211 is elastically displaced by a pressing force from the electrostatic chuck 23 when the length of the elastic body 31 of the first supporting member 211 is longer, The supporting force for supporting the substrate by the first supporting member 211 is larger than the supporting force for supporting the substrate by the second supporting member 212, Can be made larger than the supporting force for supporting the substrate.

Since the supporting force of the first supporting member 211 is larger than the supporting force of the second supporting member 212, the deflection of the central portion of the substrate can be extended toward the second supporting member 212 having a small supporting force. (23).

In the present invention, as long as the supporting force of the first supporting member 211 is greater than the supporting force of the second supporting member 212, various combinations of elastic modulus and length may be used.

For example, as shown in Fig. 4, the elastic body 31 of the first support member 211 may have a larger elastic modulus and a longer length than that of the elastic body 31 of the second support member 212, The elastic modulus of the elastic body 31 of the first supporting member 211 is the same as the elastic modulus of the elastic body 31 of the first supporting member 211 and the elastic modulus of the elastic body 31 of the second supporting member 212, The length of the elastic member 31 of the second support member 212 may be longer than the length of the elastic member 31 of the second support member 212. As shown in Fig. 4 (c), even though the lengths of the elastic members of the first and second support members 211 and 212 are the same, the difference in the elastic modulus may be different to impart a difference in the support force. The length of the elastic body 31 of the first supporting member 211 is the same as the length of the elastic body 31 of the second supporting member 212 but the length of the elastic body 31 of the first supporting member 211 is, The elastic modulus of the elastic member 31 of the second support member 212 may be greater than the elastic modulus of the elastic member 31 of the second support member 212. [

Even if the elastic modulus of the elastic body of the first supporting member 211 is smaller than the elastic modulus of the elastic body of the second supporting member 212, the length of the elastic body 31 of the first supporting member 211, The supporting force of the first supporting member 211 can be made larger than the supporting force of the second supporting member 212 as a result.

As shown in Fig. 5, the supporting portion of the substrate holding unit 21 of the present invention includes a plurality of first supporting members 211 arranged to support a first side edge portion of the substrate, A plurality of second supporting members 212 disposed so as to support the peripheral portions of the second side plates and a plurality of second supporting members 212 arranged so as to be able to support the peripheral edge portions of the third side and the fourth side connecting the first side and the second side, A third support member 213 and a plurality of fourth support members 214. [

The third support member 213 and the fourth support member 214 also include the substrate supporting surface portion 30 and the elastic body portion 31. The elastic modulus and length of the elastic members 31 of the third and fourth support members 213 and 214 are set such that the third support member 213 and the fourth support member 214 are located on the third side It is preferable that the supporting force for supporting the peripheral edge portion and the fourth side edge portion is set to be smaller than the supporting force of the first supporting member 211. [ More preferably, the elastic modulus and / or length is set so that the supporting force of the third supporting member 213 and the fourth supporting member 214 is higher than the supporting force of the second supporting member 212. When the substrate 10 is attracted to the electrostatic chuck 23 by adjusting the supporting force of the supporting member in this way, the substrate 10 is moved from the periphery of the substrate on the side of the first side (for example, The adsorption can be progressed sequentially toward the second side (e.g., the long side of the other of the opposite long sides), and the substrate can be flatly adsorbed on the electrostatic chuck.

&Lt; Method of manufacturing electronic device &

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be exemplified as an example of the electronic device.

First, an organic EL display device to be manufactured will be described. 6 (a) is an overall view of the organic EL display device 60, and Fig. 6 (b) shows a cross-sectional structure of one pixel.

6A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 each having a plurality of light emitting elements are arranged in a matrix form. Each of the light emitting devices has a structure including an organic layer sandwiched between a pair of electrodes. The term &quot; pixel &quot; as used herein refers to a minimum unit capable of displaying a desired color in the display region 61. [ In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B, . The pixel 62 is often formed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. no.

Fig. 6 (b) is a partial sectional schematic view taken along the line A-B in Fig. 6 (a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, light emitting layers 66R, 66G and 66B, an electron transport layer 67, a second electrode (cathode) 68 The organic EL device according to claim 1, Of these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to the light emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue, respectively. The first electrode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67 and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed separately for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

Although the hole transport layer 65 and the electron transport layer 67 are shown as one layer in FIG. 6 (b), depending on the structure of the organic EL display device, a plurality of layers including a hole blocking layer and an electron blocking layer It is possible. A hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 64 into the hole transport layer 65 is formed between the first electrode 64 and the hole transport layer 65 . Similarly, an electron injection layer may be formed between the second electrode 68 and the electron transport layer 67 as well.

Next, an example of a manufacturing method of the organic EL display device will be described in detail.

First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

An acrylic resin is formed on the substrate 63 on which the first electrode 64 is formed by spin coating and the acrylic resin is patterned by lithography so as to form an opening in a portion where the first electrode 64 is formed, . This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is brought into the first organic material film forming apparatus to hold the substrate by the substrate holding unit and the electrostatic chuck and the hole transport layer 65 is transported to the first electrode 64 As a common layer. The hole transport layer 65 is formed by vacuum evaporation. In practice, since the hole transport layer 65 is formed in a size larger than the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transporting layer 65 is brought into the second organic film forming apparatus, and held by the substrate holding unit and the electrostatic chuck. Alignment of the substrate and the mask is performed and the substrate is placed on the mask to form a light emitting layer 66R that emits red light on the portion where the red emitting element of the substrate 63 is disposed.

The light emitting layer 66G that emits green light is formed by the third organic film forming apparatus similarly to the film formation of the light emitting layer 66R and further the light emitting layer 66B that emits blue light by the fourth organic film forming apparatus is formed. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth organic material film forming apparatus. The electron transporting layer 67 is formed as a common layer to the three color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transporting layer 67 is moved to the metallic deposition material film forming apparatus to form the second electrode 68. [

According to the present invention, in the deposition of various organic and metallic materials on a substrate for the production of an organic EL display device, since the supporting members of the supporting portions 211, 212, 213, and 214 of the substrate holding unit for supporting the substrate have different supporting forces , When the substrate supported by the supporting portion of the substrate holding unit is adsorbed to the electrostatic chuck, the accuracy of the deposition process as a whole can be improved since the substrate is more flatly adsorbed.

Thereafter, the protective layer 70 is formed by moving to a plasma CVD apparatus to complete the organic EL display device 60.

When the substrate 63 having the insulating layer 69 is exposed to an atmosphere containing moisture or oxygen from the time when the substrate 63 having been patterned is transferred to the film forming apparatus to the completion of film formation of the protective layer 70, There is a possibility of deterioration due to moisture or oxygen. Therefore, in this example, the carrying-in and carrying-out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, but may be appropriately modified within the scope of the technical idea.

21: substrate holding unit
22: Mask band
23: Electrostatic Chuck
24: Magnet
30: substrate supporting surface
31:
211: first supporting member
212: second supporting member
213: third supporting member
214: fourth supporting member

Claims (16)

A film forming apparatus for forming a film on a substrate through a mask,
A substrate holding unit including a support for supporting a peripheral edge of a deposition surface of the substrate,
And an electrostatic chuck provided above the support for adsorbing a surface of the substrate opposite to the deposition surface,
The support portion includes a first support member installed in a first direction along one side of the substrate and a second support member provided in the first direction along a side opposite to the first side of the substrate so as to face the first support member, Member,
Wherein the supporting force for supporting the substrate by the first supporting member is different from the supporting force for supporting the substrate by the second supporting member when the substrate supported by the substrate holding unit is attracted to the electrostatic chuck.
The film forming apparatus according to claim 1, wherein the supporting force of the first supporting member is greater than the supporting force of the second supporting member.
3. The apparatus according to claim 2, wherein the first support member includes a plurality of support members disposed in the first direction, and the second support member is disposed in the first direction so as to face the plurality of first support members A film forming apparatus comprising a plurality of support members.
The film forming apparatus according to claim 3, wherein the first direction is parallel to a long side direction of the substrate.
The film forming apparatus according to claim 2, wherein the first supporting member and the second supporting member include an elastic body, and the elastic body of the first supporting member has a greater elastic modulus than the elastic body of the second supporting member.
The film forming apparatus according to claim 2, wherein the first supporting member and the second supporting member include an elastic body, and the elastic body of the first supporting member is longer than the elastic body of the second supporting member.
3. The apparatus of claim 2, wherein the support portion further comprises a third support member installed in a second direction intersecting with the first direction, and a fourth support member installed in the second direction so as to face the third support member ,
Wherein the supporting force for supporting the substrate by the third supporting member and the fourth supporting member is larger than the supporting force for supporting the substrate by the second supporting member and smaller than the supporting force for supporting the substrate by the first supporting member.
The image forming apparatus according to claim 7, wherein the third support member includes a plurality of support members arranged in the second direction, and the fourth support member is arranged in the second direction so as to face the plurality of third support members A film forming apparatus comprising a plurality of support members.
The film forming apparatus according to claim 8, wherein the plurality of third support members and the plurality of fourth support members are installed so that the supporting force with respect to the substrate gradually changes in the second direction.
The film forming apparatus according to claim 8, wherein the plurality of third support members and the plurality of fourth support members are provided so as to have the same supporting force with respect to the substrate.
The film forming apparatus according to claim 8, wherein the supporting force of the third supporting member and the fourth supporting member is the same as the supporting force of the first supporting member.
8. The image forming apparatus according to claim 7, wherein the third support member and the fourth support member include an elastic body portion, and the elastic members of the third and fourth support members are larger in elastic modulus than the elastic body portion of the second support member And the modulus of elasticity of the elastic member is smaller than that of the elastic member of the first support member.
8. The image forming apparatus according to claim 7, wherein the third support member and the fourth support member include an elastic body portion, the elastic body portions of the third and fourth support members are longer than the elastic body portion of the second support member, And the length of the elastic supporting member is shorter than that of the elastic member of the first supporting member.
2. The apparatus of claim 1, further comprising: a mask table installed below the substrate holding unit to hold a metal mask;
And a magnet provided above the electrostatic chuck to apply a magnetic force to the mask to bring the substrate and the mask into close contact with each other.
A film forming method for forming an evaporation material on a substrate through a mask,
A method for manufacturing a semiconductor device, comprising the steps of bringing a substrate into the film forming apparatus of any one of claims 1 to 14 and placing the substrate on a supporting portion of the substrate holding unit,
A step of electrostatically chucking the upper surface of the substrate placed on the support of the substrate holding unit,
A film forming process for depositing an evaporation material on a substrate through a mask
&Lt; / RTI &gt;
A manufacturing method of an organic EL display device manufacturing an organic EL display device using the film forming method of claim 15.

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