CN112750746B - Substrate holding unit, substrate holding member, substrate holding device, and substrate processing device - Google Patents

Substrate holding unit, substrate holding member, substrate holding device, and substrate processing device Download PDF

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Publication number
CN112750746B
CN112750746B CN202011182426.5A CN202011182426A CN112750746B CN 112750746 B CN112750746 B CN 112750746B CN 202011182426 A CN202011182426 A CN 202011182426A CN 112750746 B CN112750746 B CN 112750746B
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China
Prior art keywords
substrate
holding
substrate holding
adhesive
adhesive member
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Active
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CN202011182426.5A
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Chinese (zh)
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CN112750746A (en
Inventor
大川显
锅岛健
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Canon Tokki Corp
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Canon Tokki Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Abstract

The invention relates to a substrate holding unit, a substrate holding member, a substrate holding device and a substrate processing device, and provides a technique for better holding a substrate by using an adhesive member. A substrate holding apparatus having a plurality of substrate holding units for holding a substrate on a holding surface, each of the plurality of substrate holding units using a substrate holding apparatus, the substrate holding apparatus having: an adhesive member having an adhesive surface provided with an adhesive material adhered to a substrate; a tilting mechanism that enables the bonding surface of the bonding member to tilt relative to the holding surface; and an advancing and retreating mechanism that advances and retreats the bonding surface of the bonding member with respect to the holding surface.

Description

Substrate holding unit, substrate holding member, substrate holding device, and substrate processing device
Technical Field
The invention relates to a substrate holding unit, a substrate holding member, a substrate holding device, a substrate processing method, and a method for manufacturing an electronic device.
Background
In various fields such as industrial and civil use, a display device for displaying an image on a display panel is widely used. As a display device, for example, an organic EL device including an organic EL element using electroluminescence of an organic material, a liquid crystal display device, or the like is used. In manufacturing the display device, a film forming material (a metal electrode material, an organic material, or the like) is attached to a substrate in a film forming device, and film formation is performed. At the time of carrying in and out the substrate into the film forming chamber or at the time of the film forming process, the substrate held by the holding mechanism may be moved or turned over by the carrying mechanism. Therefore, it is necessary to stably hold the substrate so as not to generate positional displacement or the like.
As a mechanism for holding a substrate during conveyance or film formation, there are methods of holding a substrate by an adhesive material, in addition to methods of clamping by a clamp, placing onto a receiving claw, suction by an electrostatic chuck, and the like. Physical bonding using an adhesive material is also called PSC (Physical Sticky Chuck), and can be preferably used for a large-sized glass substrate or the like.
Patent document 1 describes the following structure: the glass substrate is held by an adhesive member (adhesive pad) provided on the holding plate, and the glass substrate held by adhesion is carried and turned over together with the holding plate, and is processed in a state of being held by adhesion on the holding plate.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2013-55093
Disclosure of Invention
Problems to be solved by the invention
However, in the case of holding the substrate using an adhesive member, a method of holding the substrate more favorably is required.
The present invention has been made in view of the above problems, and an object thereof is to provide a technique for holding a substrate more favorably using an adhesive member.
Means for solving the problems
The invention adopts the following structure. That is to say,
a substrate holding device having a plurality of substrate holding units for holding substrates on a holding surface, characterized in that,
The plurality of substrate holding units each have: an adhesive member having an adhesive surface provided with an adhesive material adhered to the substrate; a tilting mechanism that enables the bonding surface of the bonding member to tilt with respect to the holding surface; and an advancing and retreating mechanism that advances and retreats the bonding surface of the bonding member with respect to the holding surface.
In addition, the present invention adopts the following structure. That is to say,
a substrate holding unit for holding a substrate on a holding surface, the substrate holding unit comprising:
an adhesive member having an adhesive surface provided with an adhesive material adhered to the substrate; and
and a biasing member that biases the adhesive member toward the substrate while the adhesive member is swingable.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a technique for more favorably holding a substrate using an adhesive member can be provided.
Drawings
Fig. 1 is a diagram showing a schematic configuration of a substrate holding apparatus according to embodiment 1.
Fig. 2A and 2B are cross-sectional views showing the forward and backward operations of the substrate holding unit of embodiment 1.
Fig. 3 is a cross-sectional view showing tilting operation of the substrate holding unit of embodiment 1.
Fig. 4 is a cross-sectional view showing tilting operation of the substrate holding unit of embodiment 1.
Fig. 5A is a diagram illustrating a flow of operations of the substrate holding unit of embodiment 1.
Fig. 5B is another diagram illustrating a flow of operations of the substrate holding unit of embodiment 1.
Fig. 5C is another diagram illustrating a flow of operations of the substrate holding unit of embodiment 1.
Fig. 6 is an operation explanatory diagram of the inverting apparatus according to embodiment 1.
Fig. 7 is an operation explanatory diagram of the film forming apparatus of embodiment 1.
Fig. 8 is an operation explanatory diagram of the substrate peeling apparatus of embodiment 1.
Fig. 9 is a cross-sectional view showing the forward and backward operations of the substrate holding unit according to embodiment 2.
Fig. 10 is a cross-sectional view showing tilting operation of the substrate holding unit according to embodiment 2.
Fig. 11 is a plan view showing an apparatus for manufacturing an electronic device according to embodiment 3.
Fig. 12 is a diagram illustrating an electronic device according to embodiment 4.
Description of the reference numerals
100: substrate holding device, 120: substrate holding unit, 122: support flange portion, 122a: tilting mechanism, 123: bonding pad, 300: electromagnetic coil unit, 360: electromagnetic coil, 720: and a control unit.
Detailed Description
Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the accompanying drawings. However, the following embodiments and examples merely exemplify preferred structures of the present invention, and do not limit the scope of the present invention to these structures. The scope of the present invention is not limited to the hardware configuration and software configuration of the device, the process flow, the manufacturing conditions, the dimensions, the materials, the shapes, the number of the components, the arrangement positions, and the like in the following description unless specifically stated otherwise.
The present invention is preferably applicable to a substrate holding apparatus and a substrate holding method for holding a substrate, a film forming apparatus and a film forming method using the substrate holding apparatus and the substrate holding method, a substrate processing apparatus and a substrate processing method, a manufacturing apparatus of an electronic device and a manufacturing method of an electronic device using a substrate after film formation, and the like. The film formation method is not limited to a method such as vapor deposition or sputtering, and is not limited to the type of film formation material or vapor deposition material. The present invention is also understood as a program for causing a computer to execute a substrate holding method or a film forming method, and a storage medium storing the program. The storage medium may be a nonvolatile storage medium that can be read by a computer.
The present invention can be preferably applied to an apparatus for cleaning a substrate or forming a thin film (material layer) of a desired pattern on the surface of a substrate or a film of another material formed on the surface of a substrate. As a material of the substrate, any material such as glass, resin, metal, and silicon can be selected. As the film-forming material, any material such as an organic material and an inorganic material (metal, metal oxide, or the like) can be selected. The technique of the present invention can be applied to, for example, an apparatus for manufacturing an electronic device or an optical member. In particular, the present invention can be applied to a manufacturing apparatus for an organic electronic device (for example, an organic EL device using an organic EL element, a thin film solar cell, or an organic CMOS image sensor).
The present invention can be applied to not only an apparatus for film formation but also an apparatus having a step of holding a substrate by an adhesive member, for example, a display manufacturing apparatus, a display processing apparatus, or the like, and is particularly preferably applied to an apparatus having a large substrate as a processing target and an apparatus having a step of inverting the substrate.
< study >
From the study of the inventors of the present application, it is known that: in order to stably hold a substrate by using an adhesive member provided in a planar shape by a substrate holding device, it is important to perform adhesive holding in a state where the substrate is parallel to an adhesive surface provided with the adhesive member. For example, in the case of using an adhesive pad having an adhesive material disposed in a planar shape, the adhesive force increases as the contact area between the adhesive material and the substrate increases. On the other hand, if the parallelism between the bonding surface and the substrate is reduced, the contact area may be reduced, and the holding force may be reduced.
In particular, in a large-sized substrate, the substrate is likely to be in a corrugated or deflected state, and when a plurality of adhesive pads are brought into contact with the substrate in this state, the holding force may vary depending on the position of the substrate. That is, even if a certain bonding pad can be abutted in parallel with the substrate, other bonding pads may be abutted obliquely with respect to the substrate due to the influence of deflection or waviness of the substrate (japanese: ね). If the bonding pad is inclined in a direction not parallel to the substrate, a sufficient holding force may not be exerted as described above, which may prevent stable substrate holding.
Thus, the inventors of the present application have found the following cases and have made the present invention after diligent studies: when a substrate is held by a substrate holding device having an adhesive surface, such as an adhesive pad, the adhesive pad is made to be movable in a tilting manner relative to the substrate, and the adhesive pad follows the inclination of the substrate, whereby the parallelism between the adhesive surface of the adhesive pad and the substrate can be improved. Hereinafter, embodiments of the present invention are described.
Embodiment 1
The structure of the substrate holding apparatus according to the present embodiment will be described with reference to the drawings. Fig. 1 is a diagram for explaining an internal structure of a substrate holding device, fig. 1 (a) is a plan view of a substrate holding member, and fig. 1 (b) is a side sectional view of the substrate holding device.
< substrate holding Member >
The substrate holding member 100 includes a base body having a surface (hereinafter referred to as a holding surface 110X) for holding the substrate 10. In the present embodiment, the base includes a flat plate-like member 110 and a frame 115 supporting the flat plate-like member 110, and the holding surface 110X of the flat plate-like member 110 is formed of a flat surface. The flat plate-like member 110 is provided with a plurality of through holes 111 through which pins 240 protrude from and retract into the holding surface 110X of the flat plate-like member 110, and the pins 240 are used to move the substrate 10 up and down. The substrate holding member 100 further includes a plurality of substrate holding units (bonding units) 120 for holding the substrate 10 by adhesive force. The structure and function of the substrate holding unit 120 will be described later. The flat plate-like member 110 is also provided with a plurality of through holes 112, and the through holes 112 are configured to allow the constituent members (the bonding pads 123 and the like) of the substrate holding unit 120 to move. As described later, by driving the adhesive pad 123 by the adhesive member driving mechanism, the adhesive pad 123 can be projected from or retracted into the holding surface 110X through the through hole 112, or the adhesive surface of the adhesive pad 123 can be brought into a state of being flush with (flush with) the holding surface 110X.
The substrate holding member 100 further includes a plurality of fixing tools 130 for fixing the periphery of the substrate 10 to the flat plate member 110. In the present embodiment, the holder is shown as an example of the fixing tool 130, but the fixing tool is not limited to the holder, and various known techniques can be adopted. The shape and size of the flat plate-like member 110 are appropriately set according to the size of the substrate 10 and the film formation region of the substrate 10. The number and arrangement of the through holes 111, the substrate holding units 120, and the fixing tools 130 are also appropriately set according to the size of the substrate 10 and the film formation region of the substrate 10. In the present embodiment, an example in which the base is constituted by the flat plate-like member 110 and the frame 115 is described, but the present invention is not limited to this. That is, the base may include at least one of the flat plate member 110 and the frame 115. Alternatively, the base may be formed of any other member as long as the base has a planar holding surface 110X.
< substrate holding device >
As shown in fig. 1 b, the substrate holding member 100 has a substrate holding chamber R1 (first chamber). The substrate holding chamber R1 is typically maintained in a vacuum environment, and has an opening for carrying in and out the substrate 10 or the mask. In the present specification, the vacuum means a state in which a space is filled with a gas having a pressure lower than the normal atmospheric pressure (1013 hPa). The substrate holding apparatus further includes a pin unit 200 (substrate moving mechanism) for moving the substrate 10 up and down, a solenoid unit 300 (adhesive member driving mechanism) having a solenoid 360, and a support table 400 for supporting (fixing) the substrate holding member 100. The structure is as follows: the holding surface 110X of the substrate holding member 100 (flat plate-like member 110) is parallel to the horizontal plane in a state where the substrate holding member 100 is supported on the support table 400.
The substrate holding chamber R1 is divided into a substrate processing region A1 and a drive source arrangement region A2. A substrate holding member 100 and the like are disposed in the substrate processing region A1. In the driving source arrangement area A2, the motor 210 of the pin unit 200, the motor 310 of the electromagnetic coil unit 300, and the like are arranged. With this configuration, it is possible to prevent foreign matter generated by the rotation of the motors 210 and 310 and foreign matter generated in the sliding portion of the ball screw mechanism from entering the substrate processing area A1. The pin 240 may further include a pin unit 200 as a substrate moving mechanism.
In the present embodiment, the configuration in which all of the two regions (A1, A2) are disposed in the vacuum environment of the substrate holding chamber R1 is described, but the present invention is not limited thereto. For example, only the substrate processing region A1 may be disposed in the vacuum environment of the substrate holding chamber R1, and the driving source disposition region A2 may be disposed in the atmosphere environment. This can further enhance the effect of suppressing the intrusion of foreign matter into the substrate processing area A1.
Each unit included in the substrate holding member 100 is supplied with electric power from the power supply 710, and is controlled and operated by receiving a control signal from the control unit 720. Any known power supply device can be used as the power supply 710. As the control unit 720, for example, an information processing device such as a PC or a workstation that has a processor, a memory, or other computing resource and operates according to a program is used.
The substrate holding member 100 includes the pin unit 200 for moving the substrate 10 up and down by the pins 240, the solenoid unit 300 for moving the solenoid 360 up and down, and the support table 400 for supporting (fixing) the substrate holding member 100. The support table 400 can support the substrate holding member 100 to be substantially horizontal with respect to the holding surface 110X formed by the flat plate-like member 110.
The pin unit 200 includes a motor 210, a screw shaft 220 rotated by the motor 210, a nut portion 230 vertically moving along the screw shaft 220 in response to a rotation operation of the screw shaft 220, and a pin 240 fixed to the nut portion 230 and vertically moving together with the nut portion 230. Further, the constitution is as follows: a plurality of balls are infinitely circulated between the inner peripheral surface of the nut portion 230 and the outer peripheral surface of the screw shaft 220. The structure for moving the pin 240 up and down is not limited to the ball screw mechanism, and other known techniques such as a rack and pinion system can be adopted.
In the illustrated example, each pin 240 is provided with a driving mechanism such as a motor 210. With this configuration, the pin can be independently adjusted to move up and down. However, a plurality of pins 240 may be driven simultaneously by a single driving mechanism. For example, in the case of using the ball screw mechanism, a plurality of pins 240 may be provided in one nut portion 230.
The electromagnetic coil unit 300 includes a motor 310, a screw shaft 320 rotated by the motor 310, a nut portion 330 vertically moving along the screw shaft 320 in response to rotation of the screw shaft 320, a shaft portion 340 fixed to the nut portion 330 and vertically moving together with the nut portion 330, a support portion 350 provided at a distal end of the shaft portion 340, and an electromagnetic coil 360 supported by the support portion 350. Further, the constitution is as follows: a plurality of balls are infinitely circulated between the inner peripheral surface of the nut portion 330 and the outer peripheral surface of the screw shaft 320. The structure for moving the electromagnetic coil 360 up and down is not limited to the ball screw mechanism, and other known techniques such as a rack and pinion system can be adopted.
In the illustrated example, a driving mechanism such as the motor 310 is provided for each electromagnetic coil 360. With this configuration, the upward and downward movement of the electromagnetic coil can be independently adjusted. However, a configuration may be adopted in which a plurality of electromagnetic coils 360 are simultaneously driven by a single driving mechanism. For example, in the case of using the ball screw mechanism, a plurality of shaft portions 340, support portions 350, and electromagnetic coils 360 may be provided for one nut portion 330.
In addition, the constitution is as follows: under the control of the control unit 720, a current is caused to flow in the electromagnetic coil 360 by the power supply 710. The control unit 720 can control the operation of the electromagnetic coil 360 by changing the direction and magnitude of the current flowing through the electromagnetic coil 360.
Here, a plurality of electromagnetic coils 360 are provided so as to correspond to each of the plurality of substrate holding units 120. Thus, the electromagnetic coil unit 300 functions as an adhesive member driving mechanism for driving the adhesive pads 123 of the substrate holding units 120. That is, the electromagnetic coil unit 300 can advance and retreat the bonding surface of the bonding pad 123 with respect to the holding surface by acting in a noncontact manner on the advancing and retreating mechanism provided in each of the substrate holding units 120. As a result, even when the distance between the holding surface and the substrate 10 varies from position to position due to the waviness of the substrate 10 or the like, the adhesive pad 123 can be moved to a position where it can be brought into contact with the substrate 10. Further, since the advancing and retreating mechanism provided in each of the substrate holding units 120 is operated in a noncontact manner to advance and retreat the bonding surface of the bonding pad 123, it is possible to suppress the generation of foreign substances (abrasion powder or the like) due to sliding or the like when the bonding surface of the bonding pad 123 is advanced and retreated by contact, and realize advance and retreat of the bonding surface of the bonding pad 123.
< Structure of substrate holding Unit >
Fig. 2A, 2B, 3 are schematic cross-sectional views of the substrate holding unit 120, showing a cross-section of the AA line part of fig. 1. Each substrate holding unit 120 is held by a substrate holding unit holding portion 150 having an L-shaped cross section. The substrate holding unit holding portion 150 includes a fixed portion 151 fixed to the flat plate member 110 and a holding portion 152 holding the substrate holding unit 120. The holding portion 152 is provided with a through hole 153. In the present embodiment, the substrate holding unit holding portion 150 is fixed to the frame 115, but the present invention is not limited to this, and the substrate holding unit holding portion 150 may be fixed to the base.
The substrate holding unit 120 includes a shaft portion 121, a support flange portion 122 fixed to one end of the shaft portion 121, and an adhesive pad 123 fixed to the support flange portion 122. The adhesive pad 123 is a sheet-like member having an adhesive surface formed by molding an adhesive material composed of a silicone resin, a fluorine resin, a diene resin, or the like. The bonding pad 123 may be considered as the bonding member of the present invention, or the support flange 122 and the bonding pad 123 may be considered as the bonding member. The adhesive pad 123 may have a structure in which an adhesive layer having adhesiveness and having a grip surface (or an adhesive surface) and an adhesive layer for adhering the adhesive layer to the support flange portion 122 are laminated.
The support flange 122 is tiltably fixed to one end side of the shaft 121 serving as a rotation shaft. For example, by providing the support flange 122 with a receiving portion for receiving the shaft end portion, the support flange 122 can be supported by the shaft so as to be tiltable with respect to the shaft in the extending direction of the shaft portion 121. As such a tilting mechanism including the shaft end portion and the bearing receiving portion 122a, a known structure such as a ball joint structure can be adopted. For example, in fig. 3 (a), the bonding surface of the bonding pad 123 is substantially horizontal along the substrate 10, whereas in fig. 3 (b), in which the substrate 10 is corrugated, the bonding surface of the bonding pad 123 is tilted with respect to the horizontal plane so as to follow the substrate 10.
In the present embodiment, the support flange 122 is fixed to the one end side of the shaft 121 so as to be tiltable, but the support flange 122 is not limited thereto and may be rigidly fixed to the shaft 121 by welding or the like. Even in this case, since the integrally fixed support flange portion 122 and shaft portion 121 are supported by an elastic body 128 described later, the support flange portion 122 can be tilted with respect to the holding surface. That is, when the support flange portion 122 is tilted, the elastic body 128 is bent, and the shaft portion 121 is tilted. As a result, as shown in fig. 4, the swing can be performed within the range of the play of the through hole 153 provided in the holding portion 152. This makes it possible to make the bonding surface of the bonding pad 123 follow the inclination of the substrate 10. That is, the elastic body 128 also functions as a tilting mechanism.
The substrate holding unit 120 further includes: a stopper 124 fixed to the shaft 121, a cylindrical permanent magnet 125 inserted through the shaft 121 and fixed to the shaft 121 in a state adjacent to the stopper 124, and a washer 126 and a nut 127 for fixing the permanent magnet 125 to the shaft 121. Further, a female screw is formed on the other end side of the shaft portion 121, and the permanent magnet 125 can be fixed to the shaft portion 121 by screwing the nut 127 onto the female screw. The stopper 124 is fixed to the other end side of the both ends of the shaft 121, which is opposite to the one end side where the adhesive pad is disposed, by screw fastening, welding, or the like.
In the state where the nut 127 is screwed in, the shaft portion 121, the support flange portion 122, the adhesive pad 123, the stopper 124, the permanent magnet 125, the washer 126, and the nut 127 are integrated, and the integrated shaft portion 121 and the like are configured. The cylindrical permanent magnet 125 is configured such that the magnetic poles are different at one end side and the other end side in the axial direction. In the illustrated example, the side where the adhesive pad 123 is provided is an N-pole, and the opposite side is an S-pole.
The substrate holding unit 120 includes an elastic body 128, and the elastic body 128 is configured to support the integrated shaft portion 121 and the like in a state where the shaft portion 121 can reciprocate (move up and down) and the shaft portion 121 can swing. In the illustrated example, a metal spring (coil spring) is used as the elastic body 128. However, the elastic body may be a metal plate spring, a cylindrical member made of an elastic material, or the like. However, when the substrate holding member 100 is used in vacuum, it is preferable to use a metal elastic member as the elastic body 128 from the viewpoint of reducing outgas from the constituent materials.
The substrate holding unit 120 is held by the substrate holding unit holding portion 150 in a state where the shaft portion 121 is inserted into the through hole 153, so that the adhesive pad 123 and the like are disposed on the holding surface 110X side with the holding portion 152 interposed therebetween, and the stopper 124 and the like are disposed on the opposite side thereof. At this time, the elastic body 128 is provided in a state where one end is fixed to the support flange 122 and the other end is fixed to the holding portion 152. Further, the constitution is as follows: a gap is provided between the inner peripheral surface of the elastic body 128 and the outer peripheral surface of the shaft 121, and the elastic body 128 is not in contact with the shaft 121. Further, by setting the stopper 124 to be larger than the diameter of the through hole 153, the integrated shaft 121 and the like are prevented from falling out of the through hole 153. As described above, the substrate holding unit 120 is configured to: only the other end of the elastic body 128 is fixed to the holding portion 152, and other members constituting the substrate holding unit 120 are not in contact with the constituent members other than the substrate holding unit 120. By configuring in this manner, the generation of foreign matter (particles) caused by contact wear can be suppressed. In the present embodiment, the stopper 124 is disposed adjacent to the permanent magnet 125, and has both a positioning and fixing function of the permanent magnet 125 in the axial direction of the shaft 121 and a function (mechanical stopper function) of preventing the integrated shaft 121 and the like from coming off the through hole 153 by abutting against the holding portion 152, but the present invention is not limited to this configuration. That is, a member having a positioning and fixing function of the permanent magnet 125 may be provided separately from the stopper 124 having a mechanical stopper function.
The bonding pad 123 can change position between a forward state shown in fig. 2A and a reverse state shown in fig. 2B. That is, the adhesive pad 123 protrudes slightly upward in the vertical direction from the holding surface 110X in a state where the holding surface 110X is parallel to the horizontal plane and faces upward in the vertical direction, and the substrate holding unit 120 is only under its own weight. In this advanced state, the integrated shaft portion 121 and the like are supported only by the elastic body 128. Thus, the integrated shaft portion 121 and the like are allowed to reciprocate (move up and down) so that the bonding surface of the bonding pad 123 can advance and retreat with respect to the holding surface 110X. Therefore, the adhesive pad 123 can advance and retreat from the holding surface 110X. When the bonding surface of the bonding pad 123 tilts, the spring constituting the elastic body 128 deforms as shown in fig. 3 (b), and can absorb the pressure. In the present embodiment, the bonding pad 123 is described as being slightly protruded from the holding surface 110X in the above state, but the present invention is not limited to this, and the bonding surface of the bonding pad 123 and the holding surface 110X may be located on the same plane in the above state.
Here, by the control of the control unit 720, the power supply 710 causes a current to flow in the electromagnetic coil 360, thereby generating an electromagnetic force that pulls the permanent magnet 125 into the electromagnetic coil 360. Thus, the integrated shaft portion 121 and the like move downward in the vertical direction against the elastic repulsive force (elastic force of the spring) of the elastic body 128 in the substrate holding unit 120. As a result, as shown in fig. 2B, the adhesive pad 123 moves downward in the vertical direction of the holding surface 110X. The substrate holding unit 120 is provided with the permanent magnet 125, but the present invention is not limited to this, and a magnetic member made of a magnetic material may be used instead of the permanent magnet. A ferromagnetic material or a diamagnetic material is preferably used as the magnetic material. This allows the integrated shaft portion 121 and the like to move vertically downward or upward by an external magnetic force such as an electromagnetic force generated by the electromagnetic coil 360.
< substrate holding Process >
Referring to fig. 5A to 5C, the case where the substrate holding unit 120 illustrated in fig. 4 of the present embodiment is bonded to the substrate 10 will be described.
Fig. 5A shows a case where the pins 240 hold the substrate 10 above the holding surface 110X. That is, before the substrate 10 is carried into the substrate holding chamber R1, the pin unit 200 is controlled so that the surface formed at one end of each of the plurality of pins 240 comes above the holding surface 110X in the Z direction. The control unit 720 controls the power supply 710 to energize the electromagnetic coil 360 in advance, and causes the bonding pads 123 of the substrate holding unit 120 to be in a retracted state in advance. In this state, the substrate 10 is carried into the substrate holding chamber R1, and thus the state is shown. In the illustrated state, the substrate 10 is positioned above the holding surface 110X, and the two are not in contact with each other. The height of the substrate at this time is set to a first height.
In fig. 5B, the pin unit 200 moves the plurality of pins 240 downward. Thereby, the substrate 10 is in contact with the holding surface 110X. The height of the substrate at this time is set to the second height. However, in the illustrated example, since the waviness of the substrate 10 occurs, a part of the substrate 10 does not contact the holding surface 110X, and the angle of the substrate 10 is also inclined with respect to the horizontal plane part, and is in a non-parallel state with the holding surface 110X.
In addition, for example, in the case of using a side deposition (side deposition) method instead of an upward deposition method, the substrate 10 is laterally moved instead of being lifted. In this case, the substrate 10 is moved between a first position where it does not contact the holding surface and a second position where it contacts the holding surface by the substrate moving mechanism. In this case, the substrate holding unit moves the bonding surface backward to a position away from the substrate compared to the holding surface when the substrate is positioned at the first position. After the substrate moving mechanism moves the substrate to the first position where the substrate does not contact the holding surface, the adhesive surface is advanced to the holding surface, and the substrate contacts the adhesive surface.
In fig. 5C, the control unit 720 controls the energization of the power supply 710 to the electromagnetic coil 360, and advances the bonding pad 123 of the substrate holding unit 120 to a state slightly protruding from the holding surface 110X. Since the elastic body 128 biases the side of the holding surface facing the substrate, the adhesive pad 123 is in contact with the substrate 10. At this time, the tilting mechanism allows tilting of the bonding pad 123, and the substrate 10 and the bonding surface of the bonding pad 123 are in contact with each other in a substantially parallel state. That is, the elastic body 128 also functions as a biasing member that biases the bonding surface of the bonding pad 123 toward the substrate 10 side. The elastic body 128 as the urging member urges the bonding pad 123 toward the substrate in a swingable state, and the contact state of the bonding surface with the substrate is improved.
As shown in fig. 2A to 5C, in the present embodiment, the adhesive pad 123 is tiltable while being retractable with respect to the holding surface. That is, by advancing and retreating the bonding pad 123 with respect to the holding surface 110X by the integrated shaft portion 121 or the like and bringing the bonding pad 123 into a state of biasing the substrate by the elastic body 128, even when the distance from the holding surface 110X differs depending on the position of the substrate 10 due to the waviness or the like of the substrate 10, the bonding pad 123 can be brought to the height of the substrate 10 and bonded to the substrate. The shaft 121 and the like, the solenoid unit 300, and the solenoid 360 can be considered as an advancing and retreating mechanism that can advance and retreat the adhesive pad 123 with respect to the holding surface.
Further, the inclination of the bonding surface of the bonding pad 123 with respect to the holding surface 110X (arbitrary inclination with respect to the XY direction when the surface parallel to the holding surface is the XY plane) is allowed to be changed by the tilting mechanism. By allowing the substrate holding unit 120 to allow tilting (head-swing operation) of the bonding pad 123 in this way, parallelism at the time of contact of the bonding surface of the bonding pad 123 with the substrate 10 is improved even when the angle of the substrate 10 is inclined with respect to the horizontal plane due to waviness or the like of the substrate 10, and thus a decrease in the bonding force is suppressed.
After the state shown in fig. 5B, the pins 240 may be moved downward and the substrate 10 may be placed on the base, and then the pressing step may be further provided: the substrate 10 is pressed from above by a pressing portion, not shown, to planarize the substrate 10. By sandwiching the substrate 10 between the pressing portion (not shown) and the holding surface 110X of the base body, the substrate 10 can be corrected to be in a flatter state. Further, as shown in fig. 5C, the substrate 10 can be held more favorably by advancing the adhesive pad 123. In addition, even when the substrate 10 is held by the adhesive pad 123 after being corrected in this way, the substrate 10 may flex or undulate due to internal stress of the substrate 10 itself or various films formed on the substrate 10, or the like, with the passage of time. Even in this case, according to the present embodiment, the elastic body 128 biases the bonding pad 230 in a direction approaching (or pressing) the substrate 10, and the bonding pad 230 is configured to be tiltable, so that the bonding pad 230 moves following tilting or floating of the substrate 10. Therefore, according to the present embodiment, the substrate 10 can be stably held for a long period of time.
In the present embodiment, the substrate holding member 100 is configured to hold the substrate 10 in a state where the holding surface 110X of the substrate holding member 100 is arranged parallel to the horizontal plane and faces upward in the vertical direction, but the present invention is not limited thereto. For example, the substrate holding member 100 may hold the substrate 10 in a state where the holding surface 110X of the substrate holding member 100 is arranged orthogonal to the horizontal plane, that is, in a state where the holding surface 110X is arranged to face in the horizontal direction. In this case, as the substrate moving mechanism, a mechanism may be used in which the substrate 10 is supported in a state where the main surface (film formation surface) of the substrate 10 is oriented in the horizontal direction, and the substrate 10 can be brought close to or away from the holding surface 110X of the substrate holding member 100 in this state. As such a substrate moving mechanism, conventionally known mechanisms can be employed, for example, a holding portion that holds the upper and lower sides of the substrate 10 with the main surface facing in the horizontal direction, and an actuator that moves the holding portion in the horizontal direction can be used. Alternatively, an electrostatic chuck that electrostatically attracts a surface of the substrate 10 opposite to the film formation surface in a state where the main surface faces in the horizontal direction, and an actuator that moves the electrostatic chuck in the horizontal direction may be used.
In the present embodiment, the pin unit 200 including the pins 240 and the actuator is used as the substrate moving mechanism, but the present invention is not limited to this as described above. As the substrate moving mechanism, in addition to the above example, one or more support portions (receiving claws) that support the peripheral portion of the substrate 10 arranged in a state where the main surface (film formation surface) is parallel to the horizontal plane, and an actuator that moves the support portions may be used. In this case, it is preferable that the base body of the substrate holding member 100 is provided with a notch or the like at a position corresponding to each of the one or more support portions, and the support surface of the support portion and the holding surface 110X of the substrate holding member 100 can be positioned on the same plane.
In view of the above, the substrate holding process is completed, and the substrate holding member 100 holding the substrate 10 is carried out from the substrate holding chamber R1.
< other procedure >
< turnover procedure >
Fig. 6 (a) and (b) show the overall schematic structure of the turning device in cross section. The inverting device includes an inverting chamber R2. The inside of the inversion chamber R2 is configured as a vacuum environment. The turning device is provided with: a holding member 610 that holds the substrate holding member 100, a rotation shaft 620 fixed to the holding member 610, a motor 630 that rotates the rotation shaft 620, and a support member 640 that axially supports the rotation shaft 620.
The substrate holding member 100 holding the substrate 10 is carried out of the substrate holding chamber R1 and then conveyed to a reversing device (reversing chamber R2). The substrate holding member 100 carried into the reversing chamber R2 is held by the holding member 610 (see fig. 6 (a)). Thereafter, the substrate holding member 100 is turned over (rotated 180 °) by the motor 630. Thus, the substrate 10 is oriented vertically downward with respect to the substrate holding member 100. Fig. 6 (b) shows a flipped state. According to the present embodiment, the adhesion surface of the adhesion pad 123 is in contact with the substrate 10 substantially in parallel, so that the substrate 10 can be held without lowering the adhesion force. In addition, it is also preferable that the substrate is fixed to the substrate holding member 100 by a clamping work using the fixing tool 130 before the flipping work. In the state where the substrate holding member 100 is turned over, the stopper 124 is brought into a state of abutting against the holding portion 152 of the substrate holding unit holding portion 150. Thus, the substrate 10 is held by the plurality of substrate holding units 120 while maintaining the parallel state.
As described above, the reversing process is completed, and the substrate holding member 100 holding the substrate 10 is carried out from the reversing chamber R2.
Mask holding Process
The substrate holding member 100 holding the substrate 10 is carried out of the reversing chamber R2 and then conveyed to an alignment device (alignment chamber). In the alignment chamber, the mask 20 is held on the substrate 10 in a state where the position matching (alignment) is performed on the substrate 10. As a method for holding the mask 20, a mechanical holding member such as a clamp may be used, as well as a magnetic force generated by a permanent magnet, an electromagnet, a permanent electromagnet, or the like. Of course, they can be used in combination. The device for holding the mask 20 in a state where the position of the substrate 10 is matched may be any of various known techniques, and therefore, a description thereof will be omitted.
In view of the above, the mask holding process is completed, and the substrate holding member 100 holding the substrate 10 and the mask 20 is carried out from the alignment chamber.
< film Forming Process >
Fig. 7 shows a schematic configuration of the entire film forming apparatus (vapor deposition apparatus in this embodiment) in cross section. The film forming apparatus includes a film forming chamber (second chamber) R3. The film forming chamber R3 is configured in a vacuum atmosphere. The film forming apparatus further includes an evaporation source 30 as a film forming source.
The substrate holding member 100 holding the substrate 10 and the mask 20 is carried out of the alignment chamber and then conveyed to a film forming apparatus (film forming chamber R3). A film forming source for forming a film is disposed in the film forming chamber R3, and a film is formed on the substrate 10 held by the substrate holding member 100 through the mask 20. In this example, film formation (vapor deposition) was performed by vacuum vapor deposition. Specifically, a film is formed on the substrate 10 by evaporating or sublimating a film-forming material from the evaporation source 30 as a film-forming source, and vapor-depositing the film-forming material on the substrate 10. The evaporation source 30 is a known technique, and therefore a detailed description thereof will be omitted. For example, the evaporation source 30 may be constituted by a container for storing a film forming material, such as a crucible, a heating device for heating the container, or the like. The film forming chamber R3 may be constituted by a plurality of chambers, and each chamber may be provided with a film forming source for forming a film of a different film forming material. Further, the substrate holding members 100 holding the substrates 10 may be sequentially conveyed in the respective chambers, whereby film formation by the respective film forming materials may be sequentially performed. The film forming source is not limited to the evaporation source 30, and the film forming source may be a sputtering cathode for forming a film by sputtering.
According to the above, the film forming process is completed. Thereafter, the mask 20 is detached from the substrate 10. The device for removing the mask 20 from the substrate 10 is a known technique, and therefore, a description thereof will be omitted. After the mask 20 is removed, a process of forming a film of another film forming material using another mask may be repeatedly performed. After the completion of all the film forming steps, the mask is removed, and then the substrate 10 is peeled off from the substrate holding member 100.
Substrate peeling Process-
Fig. 8 (a) and (b) show the overall schematic structure of the substrate peeling apparatus in cross section. The substrate peeling apparatus includes a substrate peeling chamber R4. The inside of the substrate separation chamber R4 is configured as a vacuum environment. Like the substrate holding apparatus, the substrate peeling apparatus includes a pin unit 200 (substrate moving mechanism) for moving the substrate 10 up and down, an electromagnetic coil unit 300 (first adhesive member driving mechanism), and a support table 500 for supporting the substrate holding member 100. Since these structures themselves are described above, their description is omitted.
The substrate peeling apparatus includes: a support table 370 for supporting the solenoid unit 300, and a driving device 380 (second adhesive member driving mechanism) capable of moving the solenoid unit 300 in parallel with the holding surface 110X by moving the support table 370 in parallel with the holding surface 110X. The driving device 380 can be applied to various known technologies such as a ball screw mechanism and a rack and pinion type actuator. In the illustrated example, the configuration is as follows: a plurality of solenoid units 300 are provided, and a support table 370 supports all the solenoid units 300.
After the mask is removed, the substrate holding member 100 holding the substrate 10 is carried into the substrate peeling chamber R4. Further, the substrate holding member 100 is supported (fixed) by a support table 500. Fig. 8 (a) shows a state in which the substrate holding member 100 is supported by the support table 500. Thereafter, by flowing an electric current through the electromagnetic coil 360, an electromagnetic force is generated that pulls the permanent magnet 125 into the electromagnetic coil 360. In the present embodiment, since the adhesive force of the adhesive pad 123 is high, if only the electromagnetic force is used, the adhesive pad 123 is not peeled off from the substrate 10.
Then, by moving the support table 370 by the driving device 380 in a state where the electromagnetic force is generated, all the electromagnetic coils 360 are simultaneously moved in parallel with the holding surface 110X. As a result, the permanent magnet 125 in the substrate holding unit 120 is pulled in a direction parallel to the holding surface 110X, and the shaft 121 is slightly inclined, so that the adhesive pad 123 is also inclined and is peeled off from the substrate 10. Thereafter, the adhesive pad 123 is moved downward in the vertical direction by an electromagnetic force against the elastic repulsive force of the elastic body 128 by the integrated shaft portion 121 or the like, and is separated from the substrate 10. In the present embodiment, a case is shown in which all the electromagnetic coils 360 are moved simultaneously by one support table 370 and one driving device 380. However, the present invention is not limited to this structure. For example, the plurality of electromagnetic coils 360 may be divided into a plurality of groups, and the support table 370 and the driving device 380 may be provided for each group. In this case, the electromagnetic coils 360 may be moved simultaneously for all groups, or the electromagnetic coils 360 may be moved in accordance with the component times. There may be more than one electromagnetic coil 360 in each group. In the case where a plurality of electromagnetic coils 360 are present in each group, a configuration may be adopted in which a driving mechanism such as the motor 310 is provided separately from one electromagnetic coil 360, or a configuration may be adopted in which a plurality of electromagnetic coils 360 are simultaneously driven by one driving mechanism, as described above. Therefore, a configuration may be adopted in which only one electromagnetic coil unit 300 (but a plurality of electromagnetic coils 360 are provided) is provided for each group. In addition, the substrate peeling apparatus may be configured to include only one electromagnetic coil unit 300 (but a plurality of electromagnetic coils 360 are provided).
After the adhesive pad 123 is separated from the substrate 10, the fixing tool 130 is released from the substrate 10. Fig. 8 (b) shows a state in which the support table 370 moves and the fixing of the fixing tool 130 to the substrate 10 is released. The releasing operation of the fixing tool 130 to the substrate 10 may be controlled to be performed before the support table 370 is moved. Thereafter, the pins 240 are moved upward in the vertical direction by the motor 210, and the substrate 10 is lifted by the plurality of pins 240 and separated from the substrate holding member 100. Thereafter, the substrate 10 is carried out from the substrate peeling chamber R4.
In the present embodiment, the substrate 10 is peeled off from the substrate holding member 100 in a state where the holding surface 110X of the substrate holding member 100 is arranged parallel to the horizontal plane and oriented upward in the vertical direction, but the present invention is not limited thereto. For example, the substrate 10 may be peeled off from the substrate holding member 100 in a state where the holding surface 110X of the substrate holding member 100 is arranged orthogonal to the horizontal plane, that is, in a state where the holding surface 110X is arranged to face the horizontal direction. As the substrate moving mechanism, as described in the description of the substrate holding step, other mechanisms known in the related art can be used.
Embodiment 2
Referring to fig. 9 to 10, another configuration of the substrate holding member 100 will be described. The same components as those of embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.
Fig. 9 (a) shows a forward state in which the adhesive surface of the adhesive pad 123 of the substrate holding member 100 of the present embodiment protrudes upward from the holding surface 110X, and fig. 9 (b) shows a backward state in which the adhesive surface is retreated downward from the holding surface 110X. The difference from the adhesive pad 123 of embodiment 1 will be described. Fig. 9 (c) is a plan view of the adhesive pad 123 viewed from above in the Z direction.
As shown in fig. 9 (a) to 9 (c), the support flange 122 of the present embodiment is formed in a bottomed cylindrical container shape having a hole in the center through which the shaft 121 is inserted, and the adhesive material of the adhesive pad 123 is disposed on the upper portion of the wall of the cylindrical container to form an adhesive surface. By fixing the shaft portion 121 via the insertion hole by the bolt 129, the adhesive pad 123 does not fall off even when the substrate holding member 100 is turned upside down.
In the present embodiment, the substrate 10 is carried in a state where the bonding pad 123 is retracted downward from the holding surface 110X, and is supported above the holding surface 110X by the pins 240. The pins 240 are lowered, and the substrate 10 is placed on the holding surface 110X. Thereafter, the electromagnetic coil 360 is operated under the control of the control unit 720, and the substrate holding unit 120 is moved upward, so that the bonding pad 123 is brought into contact with the substrate 10.
Fig. 10 (a) shows an abutting state when the substrate 10 is placed substantially horizontally on the holding surface 110X. On the other hand, fig. 10 (b) shows a case where the substrate 10 is placed at a certain angle with respect to the holding surface 110X due to waviness. As shown in the drawing, the support flange 122 biased by the elastic body 128 is configured to be tiltable according to the inclination of the substrate 10, so that the adhesion surface of the adhesion pad 123 can be brought into contact with the substrate 10 substantially in parallel.
In embodiment 2, the adhesion surface of the adhesion pad 123 can advance and retreat with respect to the holding surface and can tilt, so that the contact area between the substrate 10 and the adhesion pad 123 increases, and the decrease in adhesion force can be suppressed.
Embodiment 3
In this embodiment, a method of applying the film forming apparatus of each of the above embodiments to an electronic device manufacturing apparatus for manufacturing an organic EL display or the like will be described. Fig. 11 is a plan view schematically showing a part of an apparatus 500 for manufacturing an electronic device. In the electronic device manufacturing apparatus 500, the steps from the pretreatment of the substrate to the film formation and sealing are automatically performed.
In addition, a serial (in-line) configuration in which a plurality of processing chambers are arranged in the process order may be used instead of the illustrated cluster configuration in which a plurality of processing chambers are arranged around the transfer chamber. In the case of the tandem type structure, a substrate holding device for holding the substrate may be provided in advance in the carrier, and may be moved between the processing chambers. In this case, the transfer carrier may be held on the substrate carried into the electronic device manufacturing apparatus with the film formation surface facing upward, and then the mask may be provided on the substrate while being aligned, and then the transfer carrier may be turned upside down. Thus, the substrate with the film formation surface facing downward is carried into the film formation chamber together with the carrier, and film formation using the film formation material is performed.
Around the transfer chamber 510, a pretreatment chamber 511, an organic treatment chamber 512, a metal treatment chamber 513, and a measurement chamber 514 are radially arranged. Fig. 11 is a simplified diagram, and the types and numbers of the process chambers are not limited thereto. For example, a process chamber such as a hole injection layer, a hole transport layer, an electron transport layer, or an electron injection layer may be provided, or a process chamber such as a light-emitting layer may be provided for each color of R (red), G (green), and B (blue). The transfer chamber 510 is provided with a transfer robot 519 for holding and transferring the substrate 10. The transfer robot 519 is a robot having a structure in which a robot hand for holding a substrate is attached to a multi-joint arm, for example, and performs loading and unloading of the substrate into and from each of the processing chamber and the measurement chamber.
The manufacturing process of the electronic device is approximately as follows. First, the substrate 10 is carried into the pretreatment chamber 511, and is subjected to pretreatment such as cleaning. Thereafter, the substrate is transferred to the organic processing chamber 512 or the metal processing chamber 513 by the transfer robot 519 according to the type of the film forming material. In each processing chamber, a deposition material is attached to a substrate by deposition or sputtering from an evaporation source to form a film. Next, the substrate 10 is carried into the measurement chamber 514. In the measuring chamber, the film thickness, uniformity of film formation, and the like are measured.
Film forming apparatuses are provided in the respective processing chambers for forming films. A series of processes such as transfer of the substrate to the transfer robot, adjustment (alignment) of the relative positions of the substrate and the mask, fixation of the substrate to the mask, and film formation (vapor deposition) are automatically performed by the film formation apparatus. In addition, the process of measurement in the measurement chamber can also be automated. Further, as the treatment after measurement, sealing treatment may be performed by using sealing glass coated with a desiccant or an adhesive. The completed panel is automatically carried out from the manufacturing apparatus and supplied to the subsequent process (for example, the process of assembling the display panel). However, the above configuration is an example, and the configuration of the film forming apparatus of the present invention and the electronic device manufacturing apparatus including the film forming apparatus of the present invention is not limited.
According to the above-described electronic device manufacturing apparatus and electronic device manufacturing method using the electronic device manufacturing apparatus, the temperature of the substrate is favorably adjusted in the film forming apparatus, and thus film formation is favorably performed. As a result, an electronic device of good quality can be manufactured.
Embodiment 4
< method for producing organic electronic device >
In this embodiment, an example of a method for manufacturing an organic electronic device using a film forming apparatus including an evaporation source device will be described. Hereinafter, a structure of the organic EL display device and a manufacturing method thereof are exemplified as an example of the organic electronic device. First, a manufactured organic EL display device will be described. Fig. 12 (a) is an overall view of the organic EL display device 60, and fig. 12 (b) shows a cross-sectional structure of one pixel.
As shown in fig. 12 (a), in the display region 61 of the organic EL display device 60, a plurality of pixels 62 each including a plurality of light-emitting elements are arranged in a matrix. Each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The pixel herein refers to the smallest unit that can display a desired color in the display area 61. In the case of the organic EL display device of the present figure, the pixel 62 is constituted by a combination of the first light-emitting element 62R, the second light-emitting element 62G, and the third light-emitting element 62B which show different light emission from each other. The pixel 62 is often constituted by a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and is not particularly limited as long as it is at least one color. In addition, a plurality of light-emitting layers may be stacked to form each light-emitting element.
The pixel 62 may be configured by a plurality of light emitting elements that emit light in the same manner, and a color filter in which a plurality of different color conversion elements are arranged in a pattern so as to correspond to the respective light emitting elements may be used so that a desired color can be displayed in the display region 61 by one pixel. For example, the pixel 62 may be configured with at least 3 white light emitting elements, and a color filter in which each of the color conversion elements of red, green, and blue is arranged so as to correspond to each of the light emitting elements may be used. Alternatively, the pixel 62 may be configured with at least 3 blue light emitting elements, and a color filter in which red, green, and colorless color conversion elements are arranged so as to correspond to the respective light emitting elements may be used. In the latter case, by using a Quantum Dot (QD-CF) filter using a QD material as a material constituting the color filter, the display color gamut can be increased as compared with a general organic EL display device not using the Quantum Dot filter.
Fig. 12 (B) is a partial cross-sectional schematic view at line a-B of fig. 12 (a). The pixel 62 includes an organic EL element including a first electrode (anode) 64, a hole transport layer 65, one of light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on the substrate 10. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to organic layers. In the present embodiment, the light-emitting layer 66R is an organic EL layer that emits red light, the light-emitting layer 66G is an organic EL layer that emits green light, and the light-emitting layer 66B is an organic EL layer that emits blue light. In addition, as described above, in the case of using a color filter or a quantum dot color filter, the color filter or the quantum dot color filter is disposed on the light emission side of each light emitting layer, that is, on the upper or lower portion of fig. 12 (b), but the illustration is omitted.
The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red light, green light, and blue light, respectively. In addition, the first electrode 64 is separately formed for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light-emitting elements 62R, 62G, and 62B, or may be formed for each light-emitting element. In addition, in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign substances, an insulating layer 69 is provided between the first electrodes 64. Further, since the organic EL layer is degraded by moisture and oxygen, a protective layer P for protecting the organic EL element from moisture and oxygen is provided.
Next, a specific description will be given of an example of a method of manufacturing an organic EL display device as an electronic device. First, a substrate 10 on which a circuit (not shown) for driving the organic EL display device and a first electrode 64 are formed is prepared.
Next, an acrylic resin is formed on the substrate 10 on which the first electrode 64 is formed by spin coating, and the insulating layer 69 is formed by patterning the acrylic resin by photolithography so that an opening is formed at a portion where the first electrode 64 is formed. The opening corresponds to a light emitting region where the light emitting element actually emits light.
Next, the substrate 10 patterned with the insulating layer 69 is carried into the first film formation apparatus, the substrate is held by the substrate holding means, and the hole transport layer 65 is formed as a common layer on the first electrode 64 in the display region. The hole transport layer 65 is formed by vacuum deposition. In practice, the hole transport layer 65 is formed to be larger in size than the display region 61, and therefore a high-definition mask is not required. Here, the film forming apparatus used for forming the film in this step and the film forming of each layer below is the film forming apparatus described in any one of the above embodiments.
Next, the substrate 10 formed to the hole transport layer 65 is carried into the second film forming apparatus and held by the substrate holding unit. Alignment of the substrate and the mask is performed, the substrate is placed on the mask, and the red light emitting layer 66R is formed on the portion of the substrate 10 where the red light emitting element is arranged. According to this example, the mask and the substrate can be favorably overlapped, and film formation with high accuracy can be performed.
In the same manner as the formation of the light-emitting layer 66R, the light-emitting layer 66G that emits green light is formed by the third film formation device, and the light-emitting layer 66B that emits blue light is formed by the fourth film formation device. After the formation of the light-emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth film formation device. The electron transport layer 67 is formed as a common layer in the light emitting layers 66R, 66G, and 66B of 3 colors. In the present embodiment, the electron transport layer 67 and the light emitting layers 66R, 66G, and 66B are formed by vacuum deposition.
The substrate formed to the electron transport layer 67 is moved to a sputtering apparatus to form a film of the second electrode 68, and thereafter moved to a plasma CVD apparatus to form a film of the protective layer P, and the organic EL display device 60 is completed. The second electrode 68 is formed by sputtering here, but the second electrode 68 is not limited thereto, and may be formed by vacuum deposition similarly to the electron transport layer 67.
When the substrate 10 on which the insulating layer 69 is patterned is carried into a film forming apparatus and the protective layer P is exposed to an environment containing moisture and oxygen until the film formation of the protective layer P is completed, the light-emitting layer made of the organic EL material may be degraded by the moisture and oxygen. Therefore, in this example, the substrate between the film forming apparatuses is carried in and carried out in a vacuum atmosphere or an inert gas atmosphere.
According to the substrate holding unit, the substrate holding member, the substrate holding device, the substrate processing method, and the manufacturing method of the electronic device of the present embodiment, since the contact area between the substrate and the adhesive member when holding the substrate is increased and the adhesive performance of the adhesive member can be exhibited, the stability can be improved and the substrate can be held well.

Claims (14)

1. A substrate holding unit for holding a substrate on a holding surface, characterized in that,
the substrate holding unit includes:
an adhesive member having an adhesive surface provided with an adhesive material adhered to the substrate;
a coil spring connected to the adhesive member; and
a shaft portion inserted through an inner peripheral side of the coil spring and coupled to the adhesive member,
the adhesive member is attached to a base body via the coil spring so that the adhesive surface of the adhesive member can tilt with respect to the holding surface and can advance and retract with respect to the holding surface,
the adhesive member is composed of a bottom portion having an opening with a diameter larger than that of the shaft portion, and a cylindrical wall portion having the adhesive surface at an upper portion,
A bolt having a diameter larger than that of the opening is mounted at one end of the shaft portion,
the shaft portion is coupled to the adhesive member by being inserted through the opening.
2. The substrate holding unit according to claim 1, wherein,
the adhesive member is fixed to the shaft portion.
3. The substrate holding unit according to claim 1, wherein,
the adhesive member is connected to the shaft portion so as to be tiltable.
4. The substrate holding unit according to any one of claim 1 to 3, wherein,
the coil spring biases the adhesive surface of the adhesive member toward the substrate, thereby causing the adhesive surface to protrude from the holding surface.
5. The substrate holding unit according to any one of claim 1 to 3, wherein,
the substrate holding unit has a magnet mounted at one end of the shaft portion on the opposite side of the adhesive member.
6. A substrate holding member having a base body having the holding surface and a plurality of substrate holding units, characterized in that,
the plurality of substrate holding units are the substrate holding units according to any one of claims 1 to 3,
The substrate is held by bonding the substrate to the bonding surface of each of the plurality of substrate holding units.
7. A substrate holding device for holding a substrate by a substrate holding member, characterized in that,
the substrate holding member has a base body having a holding surface for holding a substrate and a plurality of substrate holding units,
the plurality of substrate holding units of the substrate holding member each have:
a shaft portion;
an adhesive member coupled to the first end of the shaft portion, the adhesive member having an adhesive surface provided with an adhesive material adhered to the substrate;
a stopper coupled to a second end of the shaft portion opposite to the first end; and
an elastic member connected with the adhesive member,
the base body of the substrate holding member has a holding portion provided with an opening,
in the substrate holding member, the shaft portion is inserted through the opening of the holding portion so that the adhesive member and the stopper portion are arranged at a position sandwiching the holding portion therebetween,
in the substrate holding member, the plurality of substrate holding units are respectively attached to the base body so that the bonding surface of the bonding member can tilt with respect to the holding surface and can advance and retreat with respect to the holding surface,
The substrate holding device includes:
a substrate moving member that moves the substrate between a first position where the substrate does not contact the holding surface and a second position where the substrate contacts the holding surface; and
an adhesive member moving means for moving the adhesive surface to a position apart from the substrate compared with the holding surface when the substrate is positioned at the first position, the adhesive member moving means bringing the adhesive surface into contact with the substrate after the substrate moving means moves the substrate to the second position,
the bonding member moving part of the substrate holding device has an electromagnetic coil for moving the bonding surface by electromagnetic force.
8. The substrate holding apparatus according to claim 7, wherein,
the plurality of substrate holding units are mounted on the holding portion via elastic members connected to the adhesive members, respectively.
9. The substrate holding apparatus according to claim 8, wherein,
the elastic member biases the adhesive member toward the substrate so that the adhesive surface of the adhesive member protrudes from the holding surface.
10. The substrate holding apparatus according to claim 7, wherein,
the diameter of the stop portion is larger than the diameter of the opening.
11. The substrate holding apparatus according to claim 7, wherein,
the adhesive member moving means moves the adhesive surface in a noncontact manner with respect to the holding surface.
12. The substrate holding apparatus according to claim 7, wherein,
the substrate holding member holding the substrate is conveyed to a flipping device and flipped within the flipping device.
13. A substrate processing apparatus, comprising:
the substrate holding device of claim 7; and
and a film forming device that performs film formation on the substrate held by the substrate holding device on the substrate holding member.
14. A method for manufacturing an electronic device, characterized in that,
an electronic device manufactured by processing the substrate using the substrate processing apparatus according to claim 13.
CN202011182426.5A 2019-10-29 2020-10-29 Substrate holding unit, substrate holding member, substrate holding device, and substrate processing device Active CN112750746B (en)

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JP7057334B2 (en) 2022-04-19

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