TWI466811B - Adhesive and holding method for sheet-like workpieces and adhesive holding device for sheet-like workpieces and manufacturing system - Google Patents

Description

Adhesive holding method of thin plate-shaped workpiece and adhesion holding device of thin plate-shaped workpiece and manufacturing system

The present invention relates to adhesion retention of a thin plate-shaped workpiece used for detachably holding a thin plate-like workpiece such as a glass substrate during manufacture of a flat panel display (FPD) such as an organic EL display (OLED) or a liquid crystal display (LCD). A method and an adhesion holding device for a thin plate-shaped workpiece used for carrying out the method, and a manufacturing system including the adhesion holding device of the thin plate-shaped workpiece and used for manufacturing, for example, an organic EL display (OLED).

An organic EL device that forms a functional film constituting an organic EL element in a film formation region in which a film formation substrate is formed by overlapping a film formation mask having an opening portion corresponding to a film formation region and a film formation substrate The manufacturing apparatus has a device having a chamber, a vapor deposition source disposed at the bottom of the chamber to evaporate the film forming material, and maintaining the film formation substrate in a substantially horizontal state in a manner opposed to the vapor deposition source. In the substrate holding portion, the substrate holding portion includes a support having a holding portion in a jig-like shape on the outer side, and the holding portion holds the magnets that are sequentially stacked, the film-formed substrate, and the magnetic flux with respect to the magnet The peripheral portion of the laminate formed by the film-forming mask having a magnetic field having a saturation magnetization, and the film-forming substrate is held between the magnet and the film-forming mask by magnetic attraction (for example, reference patent) Document 1).

In addition, as a method and apparatus for manufacturing another organic EL device, there is provided a magnet unit including a substrate supporting surface and a magnet on a surface on the opposite side to the film formation surface on which the substrate to be processed is placed; magnetic a vapor deposition mask made of a material is placed on the film formation surface of the substrate to be processed, and is adsorbed to the magnet unit so as to be held between the substrate support surface and the substrate support surface by the magnetic attraction force of the magnet The substrate is processed, and the substrate to be processed and the vapor deposition mask are placed on the substrate supporting surface in a state where the magnet unit is vertically inverted, and the magnetic attraction force of the magnet included in the magnet unit is The substrate to be processed is sandwiched between the vapor deposition masks, and then the entire vapor deposition mask is vertically inverted, and the vapor deposition mask is disposed downward in a rotating mechanism of the mask vapor deposition device, and vapor deposition is performed in this state (for example, Refer to Patent Document 2).

Further, when the element substrate of the organic EL device is formed in Patent Document 2, each layer is formed by a semiconductor process such as mask vapor deposition with respect to a large substrate (substrate to be processed) in which a plurality of element substrates are available, and then cut into individual pieces. Component substrate.

[Advanced technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-209441

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-185107

However, in recent years, the size of substrates used in organic EL displays and the like has increased in size, and substrates having a side of more than 2,000 mm have been manufactured. When such a large substrate is formed into a thin plate shape by a fragile material such as glass and supported by a lattice-shaped support member, the central portion (unsupported portion) of the large substrate surrounded by the support member is deflected by its own weight and When the external load is applied to the deformed unsupported portion, the substrate may be further deformed and broken.

That is, it is difficult to maintain the large substrate in a planar shape from the lower side thereof in a non-full support manner.

Therefore, it is conceivable that the large substrate is horizontally held without any local deflection as described in Patent Document 1 or Patent Document 2 mentioned above.

However, in the above-described Patent Document 1, in the apparatus for holding the substrate between the magnet and the film forming mask by the magnetic attraction force of the magnet, as the size of the substrate is increased, the side of the mask for film formation is also When the magnet, the large substrate, and the peripheral portion of the film formation mask are held by the holding portion of the jig-like shape, the center portion (non-support portion) of the laminate is deflected by its own weight. If it hangs down to a position lower than the magnetic attraction region of the magnet, the non-supporting portion cannot be magnetically attracted by the magnet to return it to a planar shape.

As a result, there is a problem in that the mask pattern in the mask for film formation is deformed or warped, and an accurate pattern cannot be formed and the yield is lowered.

Further, as described in the above-mentioned Patent Document 2, in the method and apparatus for vertically inverting the entire substrate by sandwiching the substrate between the substrate supporting surface of the magnet unit and the vapor deposition mask by the magnetic attraction force of the magnet, Since the size of the vapor deposition mask or the magnet unit is increased to 2,000 mm or more and becomes heavy, it is difficult to easily reverse up and down by a transport mechanism such as a robot, and there is a problem such as lack of realization.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an adhesion holder for a thin plate-like workpiece capable of correcting the self-weight deflection of a thin plate-shaped workpiece by adhering and holding a thin plate-shaped workpiece without damage. Providing an adhesive holding device capable of adhering and holding a thin plate-shaped workpiece without damage to correct a self-weight deflection of a thin plate-like workpiece; and providing a thin plate-like workpiece that can be adhered and held without damage A manufacturing system in which a surface and a processing mask are held in a planar shape.

In order to achieve the object, a method for adhering and holding a thin plate-like workpiece according to the present invention is characterized in that, in a thin plate-like workpiece supporting a part thereof by a supporting member, moving and adhering toward a direction intersecting the thin plate-like workpiece The mechanism is in contact with a non-supporting portion supported by the supporting member until a part of the adhesive surface is in contact with the surface of the non-supporting portion, and a part of the adhesive surface is At the time of local adhesion of the surface of the unsupported portion, the approaching movement of the adhesion mechanism is stopped, and then the adhesion surface is moved while being touched with the non-supporting portion, so that the contact area between the adhesion surface and the non-support portion is gradually increased. Incidentally, when the substantially entire contact surface is in contact with the surface of the non-supporting portion, the adhesion mechanism is moved in the opposite direction of the approaching movement to the support surface and the support of the thin plate-shaped workpiece supported by the support member The part becomes the same plane position.

Further, the adhesion holding device for a thin plate-shaped workpiece according to the present invention is characterized in that: a support member is provided to support and support the thin plate-like workpiece in contact with a part of the thin plate-like workpiece; and an adhesion mechanism having the foregoing a non-supporting portion of the thin plate-shaped workpiece that is not abutted by the support member, and is disposed to reciprocate in a direction intersecting the thin plate-like workpiece; the reciprocating movement control mechanism is opposite to the unsupported surface of the adhesion surface Reciprocating movement of the part for actuation control; and adhesion area increasing mechanism, Actuating the adhesion mechanism to move the adhesion surface relative to the unsupported portion, and the reciprocating movement control mechanism moves the adhesion surface toward the non-support portion so that a portion of the adhesion surface and a surface of the non-support portion Touching, when a part of the adhesion surface is partially adhered to the surface of the non-supporting portion, stopping the movement of the adhesion surface, and after stopping the movement of the adhesion mechanism, the adhesion area increasing mechanism makes the aforementioned The adhesion surface moves while being touched with respect to the non-supporting portion, so that the contact area between the adhesion surface and the non-support portion is gradually increased, and after the substantially whole of the adhesion surface is in contact with the non-support portion, the reciprocating movement control mechanism makes The adhesion is moved to the position opposite to the movement in the opposite direction to a position on the same plane as the support portion supported by the support member in the thin plate-shaped workpiece.

Further, the manufacturing system according to the present invention includes: the adhesion holding device for the thin plate-shaped workpiece; and the processing mask, which is provided by a smooth magnet surface and a surface of the thin plate-shaped workpiece that is facing non-machining The processing of the thin plate-shaped workpiece is configured to face the magnetic body that is reciprocally movable in a direction intersecting the thin plate-shaped workpiece; and the mask movement control mechanism for the aforementioned processing mask with respect to the thin plate-shaped workpiece Actuation control is performed by the reciprocating movement of the machined surface, and the mask movement control means is moved in conjunction with the reciprocating movement control means to move the processing mask to the magnet surface after substantially contacting the entire non-supporting portion of the adhesion surface Magnetic attraction area.

According to the method for adhering and holding a thin plate-like workpiece of the present invention having the foregoing characteristics, on a thin plate-like workpiece supported by the supporting member, the sheet and the sheet are The direction in which the workpiece intersects is close to the moving adhesive mechanism until a portion of the adhesive surface contacts the unsupported portion which is deflected downward by its own weight, so that a part of the adhesive surface touches the surface of the unsupported portion, Stopping the proximal movement of the adhesion mechanism when a part of the adhesion surface is partially adhered to the surface of the non-supporting portion, and then moving the adhesion surface while being touched with the non-supporting portion to cause the adhesion The contact area between the surface and the unsupported portion is gradually increased, whereby the adhesion surface is gradually in contact with the self-weight deflection of the unsupported portion, and the contact is gradually suppressed with respect to the thin plate-shaped workpiece. Small, and substantially the entire adhesion surface is in contact with the non-supporting portion and is adhered and held, and then, when the substantially entire contact surface is in contact with the surface of the non-support portion, the adhesion mechanism is moved toward the vicinity. Moving in the opposite direction to the aforementioned adhesion surface and the aforementioned thin plate-like workpiece supported by the aforementioned support member The support portion is at the same plane position, and the self-weight deflection of the non-support portion is reduced by the above method, and the entire thin plate-shaped workpiece is adhered and held in a planar shape, so that the thin plate-shaped workpiece can be adhered and retained without damage to correct the thin plate-shaped workpiece. Self-weight deflection.

As a result, even if the substrate size of the thin plate-shaped workpiece is increased to 2,000 mm or more, the self-weight deflection of the unsupported portion can be suppressed to a constant range by partially supporting the large substrate from the lower side by the support member. Can be kept in a flat shape.

Further, according to the adhesion holding device of the thin plate-like workpiece of the present invention having the above-described features, the non-support portion of the thin plate-like workpiece supported by the supporting member is flexibly deformed downward by the reciprocating movement control mechanism due to its own weight. Positioning in a direction intersecting the thin plate-shaped workpiece close to the moving adhesive mechanism, so that a part of the adhesion surface of the adhesion mechanism is in light contact with the surface of the non-supporting portion, and a part of the adhesion surface and the non-supporting portion are When the surface is partially adhered, the close movement of the adhesion surface is stopped, and then the adhesion area is moved while the adhesion surface is touched with the non-supporting portion, so that the contact area between the adhesion surface and the non-support portion is gradually increased. Increasingly, the adhesion surface is gradually in contact with the self-weight deflection of the unsupported portion by a time difference, and accordingly, the load is suppressed to be extremely small with respect to the thin plate-shaped workpiece, and the entire adhesion surface is substantially Adhering to the unsupported portion to be adhered and held, and then the reciprocating movement control mechanism moves the adhesion surface in the opposite direction of the approaching movement to a position on the same plane as the support portion supported by the support member in the thin plate-shaped workpiece. Thereby, the self-weight deflection of the unsupported part is reduced, and the entire thin plate is Adhesion is maintained in a planar shape, it is possible to work without breakage of the thin plate retaining adhesion to correct the deflection of thin plate-like workpiece weight.

As a result, even if the substrate size of the thin plate-shaped workpiece is increased to 2,000 mm or more, the self-weight deflection of the unsupported portion can be suppressed to a constant range by partially supporting the large substrate from the lower side by the support member. Can be kept in a flat shape.

Further, according to the manufacturing system of the present invention having the above-described features, after the substantially entire contact surface is in contact with the unsupported portion, the mask for movement is moved by the mask movement control mechanism to the magnetic attraction region of the magnet surface. The thin plate-shaped workpiece is sucked together with the processing mask by the magnetic attraction of the magnet face Leading to the magnet surface, the entire thin plate-like workpiece is held between the magnet faces and the processing mask, so that the thin plate-like workpiece can be adhered and held without damage and held in a planar shape between the magnet face and the processing mask. .

As a result, even if the substrate size of the thin plate-shaped workpiece is increased to 2,000 mm or more, the self-weight deflection of the unsupported portion can be suppressed to a constant range by partially supporting the large substrate from the lower side by the support member. Can be kept in a flat shape.

Thereby, since the mask pattern in the processing mask does not undergo deformation or warpage, an accurate pattern can be formed by vapor deposition or the like, and the precision can be improved to improve the yield.

Further, in the conventional device, after the substrate is supported by the magnetic attraction force of the magnet between the substrate supporting surface of the magnet unit and the vapor deposition mask, the whole is inverted up and down, compared with the conventional device, even if the substrate The size is increased to 2,000 mm or more on one side, and it is possible to maintain a flat shape without reversing the entire large substrate upside down, and it is excellent in realization.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

As shown in FIG. 1 to FIG. 4, the adhesion holding device A for a thin plate-shaped workpiece used for carrying out the method of adhering and holding a thin plate-shaped workpiece according to an embodiment of the present invention has a main component: a support member 1 and a thin plate shape. A part of the workpiece W is partially abutted to support and support the thin plate-like workpiece W; the adhesion mechanism 2 has an adhesion surface 2a opposite to the non-supporting portion W1 which is not in contact with the support member 1 of the thin plate-like workpiece W, and is It is arranged to reciprocate in a direction intersecting the thin plate-like workpiece W; the reciprocating movement control mechanism 3 is attached to The movement control of the reciprocating movement of the surface 2a with respect to the surface of the non-supporting portion W1 is performed; and the adhesion area increasing mechanism 4 controls the movement of the adhesion mechanism 2 so that the adhesion surface 2a moves relative to the surface of the non-supporting member W1.

Further, although not shown, a peeling mechanism to be described later for peeling off the adhesion surface 2a of the unsupported portion W1 adhered to the thin plate-like workpiece W from the surface of the non-supporting portion W1 is preferable.

The thin plate-shaped workpiece W is, for example, a glass substrate used in an organic EL display, a liquid crystal display, or the like, and has a small thickness with respect to a surface area thereof, and thus has a disadvantage of being easily broken by deformation.

In the manufacturing process of an organic EL display or a liquid crystal display, for example, a thin film-shaped workpiece W has a film surface having a functional portion (not shown) such as an organic EL element.

The support member 1 is formed in, for example, a lattice shape or the like in other shapes so as to support only a part of the film surface (fitting surface) of the thin plate-like workpiece W.

As shown in FIG. 1 and FIG. 2, as a specific example, when the support member 1 is formed in a lattice shape, two or more vertical frames 1a extending in the Y direction and two extending in the X direction are formed on the same plane. The above-described horizontal frames 1b are combined in a frame and arranged to be substantially horizontal. The thin plate-shaped workpiece W is placed on the film surface with respect to the upper surface of the support member 1 so as not to come into contact with a region requiring post-processing (post-treatment) such as a functional portion, and thus, only the region where the post-processing is not required and the support member 1 are The upper portion abuts to hold the entire sheet-like workpiece W.

In other words, in the thin plate-like workpiece W, a region that does not require post-processing other than the functional portion or the like becomes the support portion W2 supported by the support member 1, the functional portion. The non-supporting portion W1 that does not need to be in contact with the support member 1 and is not supported by the support member 1 is bent and deformed downward by its own weight, and the central portion of the unsupported portion W1 is most drooped.

For example, when the adhesive surface 2a of the adhesion mechanism 2 is brought into surface contact with the unsupported portion W1 which is flexibly deformed by its own weight, the external load is applied to the non-supporting portion W1 at one time, and the substrate may be further deformed and broken.

In other words, when the adhesive material of the adhesive surface 2a of the adhesive mechanism 2 to be described later is in contact with the surface of the thin plate-shaped workpiece W, since the adhesive material has elasticity, the adhesive material is first deformed and exerts a force corresponding to the elastic force to exhibit some adhesion. force. When the adhesive material is further pressed, the thin plate-shaped workpiece W is deformed, and the adhesion force is increased by the repulsive force. However, if the deformation exceeds a certain limit, the tension of the surface of the thin plate-like workpiece W cannot be broken by the deformation.

Therefore, even if it is within this limit, as long as the pressing by the adhesive material is stopped, the thin plate-shaped workpiece W can be adhered without being broken. In order to limit the pressing of the adhesive material to the force within the limit, it is necessary to reduce the contact area to a very small area, and it is important to limit the degree to which the thin plate-shaped workpiece W is not required to be displaced. Press the pressure.

For the time being, assuming that the adhesion surface 2a is partially adhered to the surface of the thin plate-like workpiece W, the same adhesion can be achieved by applying the same degree of pressing to the portion adjacent thereto. At this time, if it is assumed that the portion adjacent to it has been adhered, the surface tension of the thin plate-like workpiece W in the vicinity thereof is looser than before and is not easily broken, and the sag caused by the self-weight of the thin plate-shaped workpiece W is also moderated. So it is easy to stick.

This adhesive surface 2a is expanded relative to the thin plate by sequentially expanding to adjacent portions. Partial adhesion of the surface of the workpiece W enables adhesion to the entire unimportant bonding surface 2a.

If the thin plate-like workpiece W is completely parallel to the adhesion surface 2a and can be brought into contact in a state of being completely parallel, it is not necessary to continue the above partial contact. That is, it should be possible to obtain adhesion at one time. However, in actuality, the surface of the thin plate-like workpiece W is deflected upward by its own weight, and therefore, if it is too close to exhibit adhesive force at once in the entire adhesive surface 2a having a planar width, especially on the adhesion surface 2a The end of the end produces a state similar to the shoulder contact, causing it to partially break.

Therefore, as an actual device, it is necessary to make the adhesion surface 2a only partially contact the surface of the thin plate-like workpiece W, firstly achieve adhesion at a partial contact portion thereof, and try to gradually increase the adhesion surface 2a based on the adhesion portion. The adhesion area of the surface of the thin plate-like workpiece W.

Further, the lattice pitch of the support members 1 is preferably configured to adjust the interval between the vertical frames 1a and the interval between the lateral frames 1b in accordance with the size of the thin plate-like workpiece W.

Further, as an example of the thin plate-shaped workpiece W, when a plurality of single-sized substrates (not shown) are taken from a single large substrate (not shown), they are partially contacted with only the boundary portions of the respective substrates. The support member 1 in which three or more vertical frames 1a and three or more horizontal frames 1b are combined in a lattice shape is placed, and the boundary portion of each substrate becomes a support portion W2 supported by the support member 1, and the film surface of each substrate becomes The non-supporting portion W1 that does not abut the support member 1 and is not supported by the support member 1.

In the example shown in Figs. 1(a) to (c), a partial enlargement of the workpiece W as a thin plate In the case where a plurality of single-piece substrates are taken from one large substrate, the adhesion mechanism 2 described later is disposed one by one on the one-piece substrate so as to face the central portion of the non-support portion W1. In other words, even if the other single-piece substrates are omitted, the adhesion mechanism 2 described later is disposed one by one so as to face the central portion of each of the non-supporting portions W1.

Further, although not shown in the drawings, a plurality of adhesion mechanisms 2 to be described later may be disposed on a single-piece substrate so as to face the non-support portion W1, or two thin workpieces W may be used. The frame 1a and the two horizontal frames 1b are supported by a lattice-shaped support member 1 to support the outer periphery of a single-piece substrate, and a single or a plurality of later descriptions are disposed so as to oppose the unsupported portion W1 of the substrate. Adhesion mechanism 2.

In addition, the support member 1 has the vertical frame 1a and the horizontal frame 1b, and the vertical frame 1c for press and the horizontal frame 1d which are disposed so as to sandwich the thin plate-shaped workpiece W, and the vertical frame 1c for press and the horizontal frame 1d are provided. It is preferable to move up and down with respect to the support vertical frame 1a and the horizontal frame 1b.

For example, a magnet or a magnetic body is provided on either the support vertical frame 1a and the horizontal frame 1b, or the press vertical frame 1c and the horizontal frame 1d, or the support vertical frame 1a and the horizontal frame 1b, and the press vertical frame 1c and the horizontal frame 1d. The magnetic attraction means (not shown) such as a body is preferably held by the magnetic attraction means so that the thin plate-shaped workpiece W is held in the vertical direction.

The adhesion mechanism 2 is composed of an adhesive chuck having an adhesive surface 2a detachably attached to the unsupported portion W1 of the thin plate-shaped workpiece W, and the adhesive surface 2a is movably attached to the main body 2b, and the adhesion surface 2a is adhered to Thin plate The main body 2b is reciprocally movable in the Z direction intersecting (orthogonal) with the support direction of the thin plate-shaped workpiece W based on the support member 1 so that the unsupported portion W1 of the member W faces.

In the mounting structure of the adhesive surface 2a with respect to the main body 2b, the adhesion surface 2a is supported along the surface of the thin-plate-shaped workpiece W so as to be capable of performing predetermined mechanical activities such as tilting or swinging freely or vibrating freely. More specifically, it is preferable to support the adhesion surface 2a so as to surround or rotate while contacting the surface of the thin plate-like workpiece W.

The adhesive surface 2a is an adhesive sheet made of an adhesive material such as fluororubber or elastomer, butyl rubber, photosensitive resin, acryl or enamel, and its surface is formed into an elastic surface. Further, the surface of the adhesive surface 2a is preferably formed to be easily adhered to the surface of the non-supporting portion W1 by, for example, forming an embossing process, a groove, or the like and being elastically deformable as a whole.

The main body 2b of the adhesion mechanism 2 is operatively controlled to reciprocate the adhesion surface 2a with respect to the surface of the unsupported portion W1 of the thin plate-shaped workpiece W by a reciprocating movement control mechanism 3 which will be described later.

Further, with respect to the main body 2b of the adhesion mechanism 2, the adhesion surface 2a is controlled by the adhesion area increasing mechanism 4 to be described later so that the surface of the adhesion surface 2a with respect to the unsupported portion W1 of the thin plate-shaped workpiece W and the thin plate-like workpiece are controlled. When the surface of W touches, it moves around (swivel).

The reciprocating movement control mechanism 3 and the adhesion area increasing mechanism 4 are, for example, together with other actuation control mechanisms such as a mechanism for controlling the movement of the support member 1 and a mechanism for controlling the movement of the vertical frame 1c for pressing and the vertical movement of the horizontal frame 1d. It is provided with a controller (not shown) which will be described later.

The controller is electrically connected to a driving source (not shown) for reciprocating the main body 2b of the adhesion mechanism 2, and a driving source (not shown) for moving the adhesion surface 2a to the main body 2b of the adhesion mechanism 2, and the like. The program for inputting the setting in advance is controlled by the reciprocating movement control mechanism 3 for the driving source for reciprocating movement, and the movement of the adhesion driving unit is controlled by the adhesion area increasing mechanism 4.

When an example of the actuation control of the reciprocating movement drive source by the reciprocating movement control mechanism 3 is given, in the initial state, the main body 2b of the adhesion mechanism 2 is placed on standby so that the adhesion surface 2a is in a thin plate supported by the supported member 1. The surface of the support portion W2 of the workpiece W is on the same plane or away from the plane thereof. Thereafter, when the operation start signal is input by the operation of the worker or the like, the unsupported portion W1 toward the thin plate-shaped workpiece W moves closer, and when the portion of the adhesion surface 2a comes into contact with the unsupported portion W1, the approach of the main body 2b is stopped. mobile. Thereafter, the adhering area increasing mechanism 4 outputs an operation completion signal to be described later, and is set so that the main body 2b moves in the opposite direction of the approaching movement to the surface of the supporting surface W2 of the bonding surface 2a and the thin plate-shaped workpiece W on the same plane. position.

Regarding the reciprocating distance of the main body 2b based on the drive source for reciprocating movement, the target thin plate-shaped workpiece W is placed on the support member 1 in advance, and the self-weight deflection amount of the unsupported portion W1 is actually measured, and the actual measured value is calculated. The moving distance of the main body 2b from the standby position of the adhesive surface 2a to the non-supporting portion W1 and the surface of the adhesion surface 2a from the vicinity of the movement stop position of the adhesion surface 2a to the surface of the support portion W2 of the thin plate-like workpiece W The reverse moving distance of the main body 2b at the position on the same plane, and these The calculated value setting is input to the controller.

When an example of the actuation control of the adhesion driving unit by the adhesion area increasing mechanism 4 is given, the adhesion surface 2a of the adhesion mechanism 2 is placed in the initial state so as to be in contact with the unsupported portion W1 of the thin plate-shaped workpiece W. Opposite at a predetermined angle. After that, a part of the adhesion surface 2a is brought into contact with the non-supporting portion W1 by the approach movement of the main body 2b, and the adhesion surface 2a is brought into contact with the surface of the thin plate-like workpiece W while being swung (rotation) or the like. Moving so as to gradually increase the contact area with the surface of the unsupported portion W1, and stopping the movement of the adhesive surface 2a with respect to the main body 2b at the time when the substantially entire contact surface 2a is in contact with the surface of the non-supporting portion W1, and is set to reciprocate The movement control mechanism 3 outputs an operation completion signal.

Regarding the movement of the adhesion surface 2a with respect to the surface of the non-supporting portion W1, the adhesion surface 2a may be "circumfered (rotated)" one or more times according to the action content thereof, or "swinging" several times, or continuously for a predetermined time. vibration".

Moreover, as shown in the flow chart of FIG. 3, the method of adhering and holding the thin plate-shaped workpiece W of the embodiment of the present invention includes the step of moving the adhesion mechanism 2, the step of adhering the adhesion surface 2a, the step of moving the adhesion mechanism 2, and the reverse movement step of the adhesion mechanism 2, The peeling step of the adhesive face 2a.

As shown in FIG. 1(a), in the approaching movement of the adhesion mechanism 2, the main body 2b of the adhesion mechanism 2 is made to stand by the adhesion mechanism 2 of the thin plate-shaped workpiece W supported by the support member 1 by the reciprocating movement control mechanism 3. The unsupported portion W1 whose position is toward the thin plate-like workpiece W is moved closer. Next, when a portion of the adhesion surface 2a of the adhesion mechanism 2 comes into contact with the surface of the non-support portion W1, the approach movement of the adhesion mechanism 2 is stopped.

As shown in Fig. 1(b), in the adhesion step of the adhesion surface 2a, a portion of the adhesion surface 2a which is in contact with the surface of the non-support portion W1 is moved to the surface of the non-support portion W1 by the adhesion area increasing mechanism 4. The contact area is gradually increasing. Then, substantially the entire adhesion surface 2a is moved by contact with the surface of the unsupported portion W1 by the movement of the adhesion surface 2a, and then the movement of the adhesion surface 2a is stopped.

As shown in FIG. 1(c), in the reverse moving step of the adhering mechanism 2, the reciprocating movement control mechanism 3 reversely moves the adhesive surface in contact with the surface of the non-supporting portion W1 and adheres to the opposite direction of the approaching movement. 2a, in the adhesion surface 2a and the surface of the support portion W2 supported by the support member 1 in the thin plate-like workpiece W, the position on the same plane stops the reverse movement of the adhesion mechanism 2.

Further, in the peeling step of the adhesive surface 2a, the adhesive surface 2a is peeled off or peeled off from the surface of the non-supporting portion W1. Thereafter, the adhesion mechanism 2 is returned to the standby position, and then the procedure is completed in the same manner as the above-described steps.

According to the adhesion holding method of the thin plate-like workpiece W of the embodiment of the present invention and the adhesion holding device A of the thin plate-shaped workpiece W, first, in the approaching movement step of the adhesion mechanism 2, the main body 2b of the adhesion mechanism 2 is reciprocated The control mechanism 3 moves from the standby position toward the unsupported portion W1 in which the self-weight is deflected downward by the self-weight from the standby position toward the thin plate-like workpiece W. Next, when a portion of the adhesion surface 2a of the adhesion mechanism 2 comes into contact with the surface of the non-support portion W1, the approach movement of the adhesion mechanism 2 is stopped. (Refer to Figure 1(a))

Thereby, a part of the adhesion surface 2a is brought into light contact with the surface of the non-supporting portion W1 to perform local adhesion.

Thereafter, in the adhesion step of the adhesion surface 2a, the adhesion surface 2a is adhered by the adhesion surface When the product-increasing mechanism 4 is in contact with the surface of the thin-plate-shaped workpiece W, it is moved around (rotation) or the like, and the contact area between the adhesion surface 2a and the surface of the non-supporting portion W1 is gradually enlarged. (Refer to Figure 1(b))

Thereby, the adhesion surface 2a is emulated that the self-weight deflection of the unsupported portion W1 is gradually brought into contact with each other with a time difference, and accordingly, the load is suppressed to be extremely small with respect to the thin plate-shaped workpiece W, and the substantially whole and non-stick of the adhesion surface 2a. The surface of the support portion W1 is in contact with and is adhered and held.

Thereafter, in the reverse moving step of the adhesion mechanism 2, the adhesion surface 2a of the adhesion mechanism 2 is reversely moved by the reciprocating movement control mechanism 3 to be the same as the surface of the support portion W2 supported by the support member 1 in the thin plate-like workpiece W. The position on the plane. (Refer to Figure 1(c))

Thereby, the self-weight deflection of the unsupported portion W1 is reduced, and the entire thin plate-like workpiece W is adhered and held in a planar shape.

Therefore, the thin plate-shaped workpiece W can be adhered and held so that the unsupported portion W1 and the support portion W2 are substantially flush with each other to correct the self-weight deflection of the thin plate-shaped workpiece W.

Further, as shown in Figs. 2(a) to 2(e), the manufacturing system according to the embodiment of the present invention includes the above-described adhering and holding device A for a thin plate-like workpiece, and a non-machined surface which is provided along the thin plate-like workpiece W and the surface thereof. The magnet face 5 opposed to W3, the processing mask 6 which is formed of a magnetic body which is disposed along the thin plate-like workpiece W and the processed surface W4 which is the film surface thereof, and the processing mask 6 with respect to the thin plate-shaped workpiece The mask movement control mechanism 7 that performs the operation control of the reciprocating movement of the machined surface (film surface) W4 of W.

The magnet face 5 is buried by a plate of substantially the same size as the thin plate-like workpiece W A permanent magnet or the like is formed by forming a whole plate material by a permanent magnet or the like, and the smooth magnetic surface portion 5a is disposed on the same plane as the non-machined surface W3 of the support portion W2 in the thin plate-shaped workpiece W supported by the support member 1.

That is, the magnetic surface portion 5a of the magnet surface 5 is disposed on the same plane as the lower surface of the pressing vertical frame 1c and the horizontal frame 1d.

The processing mask 6 is formed by, for example, forming a single or a plurality of vapor deposition masks (not shown) corresponding to the vapor deposition pattern on the film surface of the thin plate-shaped workpiece W, and is provided in the same manner as the adhesion mechanism 2 The Z direction reciprocates freely, and the movement control mechanism 7 controls the reciprocating movement of the processing surface W4 with respect to the thin plate-shaped workpiece W.

The mask movement control unit 7 is provided in the controller together with the reciprocating movement control unit 3 and the like, and is electrically connected to a drive source (not shown) for reciprocating the processing mask 6 in accordance with a program input in advance. Actuation control is performed on the drive source for reciprocating movement of the mask.

As an example of the operation control of the processing mask 6 by the mask movement control mechanism 7, as shown in FIG. 2(a), in the initial state, the processing mask 6 is moved away from the unsupported member. It is preferable that the processing surface W4 of the unsupported portion W1 in the supported thin plate-shaped workpiece W is standby. As shown in Figs. 2(a) to (c), the processing mask 6 is also kept away from the adhesion step of the adhesion mechanism 2 and the adhesion step of the adhesion surface 2a and the reverse movement step of the adhesion mechanism 2. The processing surface W4 of the unsupported portion W1 is in standby mode. In conjunction with the reciprocating movement control mechanism 3, at the same time as the reverse movement step of the adhesion mechanism 2 or after the reverse movement step of the adhesion mechanism 2 is completed, as shown in Fig. 2(d), the processing mask 6 is oriented toward the thin plate-like workpiece W's working surface W4 moves and is set to The processing mask 6 enters the magnetic attraction region of the magnet face 5.

In the example shown in Fig. 2 (c) (d), in the reverse movement step of the adhesion mechanism 2, the adhesion surface 2a is reversely moved to a position on the same plane as the surface of the support portion W2 in the thin plate-like workpiece W. . Although not shown in the other examples, the adhesion surface 2a may be reversely moved until it enters the magnetic attraction region of the magnet surface 5.

According to the manufacturing system of the embodiment of the present invention, after substantially the entire adhesion surface 2a of the adhesion mechanism 2 is in contact with the surface of the non-supporting portion W1, the processing mask 6 is moved to the magnet surface 5 by the mask movement control mechanism 7. In the magnetic attraction region, the thin plate-like workpiece W is attracted to the magnet surface 5 by the magnetic attraction force of the magnet surface 5 together with the processing mask 6, and the non-machined surface W3 of the support portion W2 is pressed against the smooth surface of the magnet surface 5. At the same time as the magnetic surface portion 5a, the surface of the processing mask 6 is pressed against the processing surface W4 of the thin plate-shaped workpiece W, and the entire thin plate-shaped workpiece W is held between the magnet surface 5 and the processing mask 6. (Refer to Figure 2(e))

Therefore, the thin plate-shaped workpiece W can be adhered and held so that the non-supporting portion W1 and the supporting portion W2 are substantially flush with each other, and are held in a planar shape between the magnetic surface portion 5a of the magnet surface 5 and the processing mask 6 .

Thereby, the mask pattern in the processing mask 6 is not deformed or warped, so that an accurate pattern can be formed by vapor deposition or the like, and the precision can be improved to improve the yield.

Next, an embodiment of the present invention will be described based on the drawings.

[Examples]

As shown in FIGS. 4( a ) to 4 ( d ), in this embodiment, as the specificity of the adhesion mechanism 2 In the example, the adhesion surface 2a is supported by the main body 2b of the adhesion mechanism 2, and the adhesion area increasing mechanism 4 causes the adhesion surface 2a to move around the non-supporting portion W1 of the thin plate-shaped workpiece W while rotating (rotating). Further, a peeling mechanism 8 for peeling off the adhesion surface 2a from the unsupported portion W1 of the thin plate-shaped workpiece W is integrally assembled to the main body 2b of the adhesion mechanism 2.

The main body 2b of the adhesion mechanism 2 is formed in a disk shape or a rectangular plate shape, and is inserted into the cylindrical body 2c so as to reciprocate in the Z direction with respect to the through hole formed in the center thereof, and is provided over the main body 2b and the cylindrical body 2c. For example, the urging member 2d such as a coil spring always urges the cylindrical body 2c in a direction in which the thin plate-shaped workpiece W placed on the lattice-shaped support member 1 is isolated.

The floating body 2e is provided in a fitting manner at one end of the cylindrical body 2c, and the adhesive sheet of the adhesive surface 2a is fixed to the front end of the floating body 2e, and a rubber such as rubber is interposed between the cylindrical body 2c and the floating body 2e. The elastic member 2f which is elastically deformable, such as the sheet, is such that the floating body 2e and the adhesion surface 2a are slidably supported with respect to the cylindrical body 2c.

The floating body 2e and the adhesion surface 2a are controlled by the adhesion area increasing mechanism 4 with respect to the supporting direction of the cylindrical body 2c, and a part of the adhesion surface 2a which is inclined at a predetermined angle with respect to the unsupported portion W1 of the thin plate-shaped workpiece W is made. After being in contact with the surface of the non-supporting portion W1, the adhesive surface 2a is moved (rotated) while being in contact with the non-supporting portion W1 within a range in which the adhesive material and the non-supporting portion W1 which are the adhesive surfaces 2a are elastically deformable from each other. Thereby, the contact area with the surface of the unsupported portion W1 is gradually increased.

In the example shown in Fig. 4 (c), the rod 4a is rotatably inserted into the inner peripheral hole of the cylindrical body 2c as an adhesion driving portion, and is formed in The inclined surface 4b of the front end of the rod 4a abuts against the base end of the floating body 2e with a predetermined pressure, so that the adhesion surface 2a is inclined only by a predetermined angle θ, and the inclined surface 4b of the rod 4a is rotated while maintaining the abutting state, thereby The adhesion surface 2a is rotationally moved while being inclined at a predetermined angle θ.

Further, in the example shown in Figs. 4(b) and 4(c), the adhesion surface 2a of the adhesion mechanism 2 is not inclined, but is moved to the unsupported portion W1 of the thin plate-like workpiece W by the reciprocating movement control mechanism 3. The position of the surface contact is directly forward, and then the inclined surface 4b of the rod 4a abuts against the base end of the floating body 2e by the adhesion area increasing mechanism 4, and is inclined to a part of the adhesion surface 2a and the unsupported portion W1. After the surface is contacted, the inclined surface 4b of the rotating rod 4a is operatively controlled so that the adhesive surface 2a is in contact with the non-supporting portion W1 in a range in which the adhesive material and the non-supporting portion W1 which become the adhesive surface 2a are elastically deformable from each other. The state of the tilt is surrounded (swing).

Further, although not shown in the drawings, the adhesion surface 2a may be left in an inclined state in advance, or the adhesion surface 2a may be inclined in the vicinity of the movement, and a part of the adhesion surface 2a and the unsupported portion W1 may be used. The moment of surface contact stops moving closer.

Further, the peeling mechanism 8 pulls the surfaces of the adhesion surface 2a and the non-supporting portion W1 which are adhered to each other in the Z direction with a force larger than the adhesion force of the adhesion surface 2a.

As a specific example of the peeling mechanism 8, the pusher 8a is slidably disposed toward the surface of the non-supporting portion W1 in the plane of the adhesive surface 2a or around the adhesive surface 2a, and the protruding movement of the pusher 8a is unsupported. It is preferable that the surface of the portion W1 is forcibly pressed against the peeling adhesion surface 2a.

In the example shown in Fig. 4 (d), the pusher 8a is inserted into the through hole 2g which is opened at the center of the floating body 2e, and is actuated such that the front end portion 8b protrudes from the adhesive surface 2a.

Further, although not shown in the other examples, the adhesion surface 2a may be forcibly peeled off from the surface of the non-supporting portion W1 by the reverse movement of the adhesion mechanism 2.

According to the adhesion holding method of the thin plate-like workpiece W of the embodiment of the present invention and the adhesion holding device A and the manufacturing system of the thin plate-like workpiece W, a part of the adhesion surface 2a is lightly touched with the surface of the non-supporting portion W1. After the partial adhesion, the adhesion surface 2a is moved by the adhesion area increasing mechanism 4 while being in contact with the non-supporting portion W1 in a range in which the adhesion material and the non-supporting portion W1 which are the adhesion surfaces 2a are elastically deformable from each other. Therefore, the adhesion surface 2a is emulated by the reaction force of the posture of the non-supporting portion W1 by the cushioning action of the elastic member 2f, and the adhesion surface 2a is partially partially adjacent to the surface of the non-supporting portion W1 in the circumferential direction, and these adhesion surfaces 2a The contact area with the surface of the unsupported portion W1 is gradually enlarged.

Thereby, the adhesion surface 2a of the adhesion mechanism 2 can be lightly partially contacted with the unsupported portion W1 of the flexural deformation of the thin plate-shaped workpiece W, and the entire adhesion surface 2a can be reliably brought into contact with the ground.

As a result, it is possible to completely prevent the sheet-like workpiece W from being cracked and adhered and held in a planar shape, and has an advantage of being excellent in workability.

Further, in the above-described embodiment, the adhesive surface 2a is supported with respect to the main body 2b of the adhesive mechanism 2, and the adhesive surface 2a is brought into contact with the non-supporting portion W1 of the thin-plate-shaped workpiece W by the adhesion-increasing area 2 Surround (swivel) movement, but not limited to this, instead of the wraparound (rotation) movement of the adhesive surface 2a The movement may be controlled to be inclined with respect to the inclination angle of the non-supporting portion W1 so as to gradually decrease from one end to the other end of the adhesion surface 2a.

Further, the peeling mechanism 8 for peeling off the adhesive surface 2a from the unsupported portion W1 of the thin plate-shaped workpiece W is integrally assembled to the main body 2b of the adhesive mechanism 2, but is not limited thereto, and the peeling mechanism 8 may be provided separately from the adhesive mechanism 2. .

1‧‧‧Support members

1a‧‧‧Support vertical frame

1b‧‧‧Support horizontal frame

1c‧‧‧ Pressing vertical frame

1d‧‧‧ Pressing transverse frame

2‧‧‧Adhesive mechanism

2a‧‧‧Adhesive surface

2b‧‧‧Subject

3‧‧‧Reciprocating movement control mechanism

4‧‧‧Adhesive area increasing mechanism

5‧‧‧Magnetic surface

6‧‧‧Processing masks

7‧‧‧Mask mobile control mechanism

A‧‧‧Adhesive holding device for thin plate-shaped workpiece

W‧‧‧thin plate workpiece

W1‧‧‧Unsupported parts

W2‧‧‧ support

W3‧‧‧Non-machined surface

W4‧‧‧Processing surface

1 is a longitudinal cross-sectional front view showing an outline of an adhesion holding device for a thin plate-like workpiece according to an embodiment of the present invention, wherein (a) shows adhesion before (b) shows contact of the adhesion surface, and (c) shows adhesion holding.

Fig. 2 is a longitudinal cross-sectional front view showing an outline of a manufacturing system according to an embodiment of the present invention, wherein (a) shows adhesion, (b) shows contact of an adhesive surface, (c) shows adhesion, and (d) shows processing. When the movement of the mask is moved, (e) indicates the magnetic adsorption of the processing mask.

Fig. 3 is a flow chart showing a method of adhering and holding a thin plate-like workpiece according to an embodiment of the present invention.

Figure 4 is a longitudinal cross-sectional front view showing an embodiment of the adhesion mechanism, (a) showing the adhesion before, (b) showing the close movement of the adhesion surface, (c) indicating the contact of the adhesion surface, and (d) indicating the adhesion surface. When peeling off.

1‧‧‧Support members

1a‧‧‧Support vertical frame

1b‧‧‧Support horizontal frame

1c‧‧‧ Pressing vertical frame

1d‧‧‧ Pressing transverse frame

2‧‧‧Adhesive mechanism

2a‧‧‧Adhesive surface

2b‧‧‧Subject

3‧‧‧Reciprocating movement control mechanism

4‧‧‧Adhesive area increasing mechanism

A‧‧‧Adhesive holding device

W‧‧‧thin plate workpiece

W1‧‧‧Unsupported parts

W2‧‧‧ support

Claims (4)

A method for adhering and holding a thin plate-like workpiece, characterized in that, for a thin plate-like workpiece supporting a part thereof by a supporting member, moving toward the moving direction of the thin plate-like workpiece is moved to a part of the adhesive surface until a part of the adhesive surface thereof is opposed Not contacting the unsupported portion supported by the support member, causing a portion of the adhesion surface to contact the surface of the non-support portion; and partially adhering a portion of the adhesion surface to the surface of the non-support portion At the same time, the approaching movement of the adhesion mechanism is stopped; then, the adhesion surface is moved while being touched by the non-supporting portion, and the contact area between the adhesion surface and the non-support portion is gradually increased; and the entire adhesion surface is substantially At the time of contact with the surface of the unsupported portion, the adhesion mechanism is moved in the opposite direction to the near movement until the adhesion surface is at the same plane as the support portion supported by the support member of the thin plate-shaped workpiece. An adhesion holding device for a thin plate-shaped workpiece, comprising: a support member that is disposed to support and supports the thin plate-like workpiece in a portion abutting the thin plate-like workpiece; and an adhesion mechanism having the same as the aforementioned thin plate-shaped workpiece The non-supporting portion of the supporting member that is not abutting is opposed to the adhesive surface, and is disposed to reciprocate in a direction intersecting with the thin plate-shaped workpiece; the reciprocating movement control mechanism reciprocates the adhesion surface relative to the non-supporting portion Mobile for actuation control; and An adhesion area increasing mechanism that controls actuation of the adhesion mechanism to move the adhesion surface relative to the unsupported portion; and the reciprocating movement control mechanism moves the adhesion surface toward the non-support portion to make the adhesion surface a part of the contact with the surface of the non-supporting portion, when a part of the adhesion surface is partially adhered to the surface of the non-supporting portion, stopping the movement of the adhesion surface; stopping the movement of the adhesion mechanism Thereafter, the adhesion area increasing mechanism moves the adhesion surface while contacting the non-supporting portion, so that the contact area between the adhesion surface and the non-support portion is gradually increased; and the substantially whole of the adhesion surface is different from the foregoing After the contact portion is contacted, the reciprocating movement control mechanism moves the adhesion surface in a direction opposite to the approaching movement to a position that is flush with a support portion of the thin plate-shaped workpiece supported by the support member. The adhesion holding device of the thin plate-shaped workpiece of claim 2, wherein the adhesion surface is tiltably supported with respect to the main body of the adhesion mechanism, and the adhesion area increasing mechanism moves around the adhesion surface while contacting the thin plate-shaped workpiece . A manufacturing system comprising the adhesive holding device of the thin plate-like workpiece of claim 2 or 3, characterized by comprising: a smooth magnet surface disposed opposite to a non-machined surface of the thin plate-shaped workpiece; a cover comprising a facing surface of the aforementioned thin plate-like workpiece And a magnetic body that is reciprocally movable in a direction intersecting the thin plate-shaped workpiece; and a mask movement control mechanism that controls an operation of the reciprocating movement of the processing mask with respect to the processing surface of the thin plate-shaped workpiece; Further, the mask movement control means moves in conjunction with the reciprocating movement control means to move the processing mask to the magnetic attraction region of the magnet surface after substantially contacting the entire adhesion surface with the unsupported portion.