JP4342210B2 - STAGE DEVICE, PASTE COATING DEVICE USING SAME, AND PASTE COATING METHOD - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a stage apparatus for placing a substrate such as a glass substrate, a paste application apparatus using the same, and a paste application method.
[0002]
[Prior art]
In the manufacturing process of a liquid crystal display panel or the like, two glass substrates sandwiching a liquid crystal are bonded together, and in order to perform the bonding, a paste such as a sealant is applied to the bonding surface of at least one glass substrate. The
[0003]
4 is a structural layout diagram of a conventional paste coating apparatus, FIG. 5 is a perspective view of the paste coating apparatus shown in FIG. 4, and FIG. 6 is a schematic perspective view of a stage device and a transfer arm of the paste coating apparatus shown in FIG. Is shown.
[0004]
That is, as shown in FIG. 4, the substrate 2 that is sequentially conveyed and supplied onto the supply table 1 is suction-held on the opposite side of the paste application surface by the transfer arm 3, and the four paste application devices 41 to 44 are connected. Each stage 4A is sequentially conveyed and supplied with the paste application surface facing up. The reason for transporting in this way is to prevent the occurrence of product defects due to adhesion of dust or the like by adsorbing the paste application surface of the substrate.
[0005]
The transfer arm 3 receives the substrate 2 from the supply table 1 and supplies it to the paste coating devices 41 to 44 arranged opposite to each other toward the transfer line while transferring the substrate 2 in the direction of the arrow X as a transfer line. .
[0006]
Thus, the reason why the four paste coating apparatuses 41 to 44 are arranged toward the conveyance line is because a throughput time having consistency with other processes is required, and there are relatively many. This is to increase the throughput time in the paste application process and increase the productivity of the entire assembly manufacturing by operating a plurality of paste application apparatuses that require the above operation time in parallel.
[0007]
In FIG. 4, the configuration of the main part of only one paste application device 41 is shown, and the other three paste application devices 42 to 44 have the same configuration, so the configuration of the main part is omitted.
[0008]
As shown in FIG. 6, the stage 4A is provided with a plurality of suction disks 4A1, which are connected to the pneumatic control unit 6 via the pipe 8B and can simultaneously vacuum-suck the substrate 2. Further, a plurality of recesses 4A2 are formed on the stage 4A at predetermined intervals in the direction of the arrow Y in FIG. 5 so as to correspond to the arm 7 of the transfer arm 3. The arm 7 is provided with a suction plate 7A, and is connected to the pneumatic control unit 6 through a pipe 8A.
[0009]
The stage 4A is fixed to the θ (turning) axis of the XY-θ moving mechanism 4B, the θ axis is fixed to the Y axis 4B1, the Y axis is fixed to the X axis 4B2, and the X− The entire Y-θ moving mechanism 4B is installed on a table (frame) 4C.
[0010]
The stage 4 </ b> A moves to the transfer position moved forward near the transfer arm 3 when the substrate 2 is transferred, and moves to the application work position retracted away from the transfer arm 3 when the paste is applied to the substrate 2.
[0011]
Prior to the start of the paste application operation, the substrate 2 sucked and held on the stage 4A is aligned with the application head (head mechanism) 4D, but the substrate 2 itself is also transferred from the transfer arm 3 to the stage 4A. In many cases, the positional deviation occurs in the XY-θ direction. Therefore, as shown in FIG. 4, the alignment mark on the substrate 2 is set by the CCD cameras 4D3 and 4D4 attached corresponding to the two syringes 4D1 and 4D2 of the head mechanism 4D, or a recognition camera provided separately. The image is photographed, and positional deviation correction is performed in advance by correction control based on the video pattern.
[0012]
In addition, the pair of syringes 4D1 and 4D2 of the head mechanism 4D has a plurality of application pattern intervals (pitch) in the arrow X direction on the substrate 2 before the paste application operation starts. They are individually moved and adjusted in the direction of the arrow X so as to coincide with each other, and are positioned and fixed.
[0013]
In other words, the paste pattern is formed on the surface of the substrate 2 by the program control of the controller 4E, but the interval between the syringes 4D1 and 4D2 is a multi-surface substrate (a plurality of substrates of the same type (sub-substrate) formed on one sheet). This corresponds to the arrangement pitch in the X direction of each of the plurality of child boards arranged on the substrate 2.
[0014]
As shown in FIGS. 4 and 5, a monitor display 4F and a keyboard 4G are connected to the controller 4E, and an operator can paste on the substrate 2 by operating the keyboard 4G. The coating operation can be adjusted.
[0015]
The substrate 2 on which the paste pattern is formed by applying the paste is moved forward toward the transfer position to the transfer arm 3 and transferred to the transfer arm 3. The received transfer arm 3 is to transfer the substrate 2 to the next process. Then, it is supplied to the carry-out stand 5 shown in FIG.
[0016]
[Problems to be solved by the invention]
By the way, in recent years, as a display device such as a personal computer or a television, a liquid crystal display and a plasma display that can be thinned are often used, and at the same time, these displays are required to have a large screen. It has become. In addition, in order to increase the productivity of the display, the size of the substrate is increasing so that a larger number of displays can be taken from one substrate. From this viewpoint, the substrate tends to be increased in size. On the other hand, the substrate thickness tends to be reduced due to the demand for lighter display. However, when the substrate becomes large and thin as described above, the conventional stage apparatus as described above has the following problems.
[0017]
That is, the thinned substrate 2 has low rigidity, and therefore, due to its own weight, the portion corresponding to the recess 4A2 is bent as shown in FIG.
[0018]
On the other hand, in the paste application apparatuses 41 to 44 described above, a distance sensor that moves integrally with the nozzle of the head mechanism when applying the paste in order to keep the application amount of the paste applied onto the substrate 2 constant. The height of the surface of the substrate 2 is measured at a set time interval, and the height of the nozzle is feedback-controlled based on the measured value, so that the interval between the nozzle and the substrate 2 is kept constant.
[0019]
However, when the nozzle passes so as to cross the above-described bending portion, the height feedback control of the nozzle with respect to the change in the height of the surface of the substrate 2 is not in time, and the interval between the nozzle and the substrate 2 increases. As a result, the application accuracy is deteriorated.
[0020]
Therefore, an object of the present invention is to provide a stage device that can prevent the substrate from being bent due to its own weight, a paste coating device that can form a highly accurate coating pattern, and a paste coating method.
[0021]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a stage apparatus according to the present invention includes a receiving surface on which a substrate held and carried on a transfer arm is placed, and the substrate in the transfer arm that is formed below the height position of the receiving surface. Entry space that allows the substrate holder to hold the Formed recess In a stage apparatus having: Recessed A support member movable in the entry space is provided, and the support member is positioned at a retreat position where the substrate holding part of the transfer arm retreats from the entry path when entering the entry space. When the substrate holding portion is retracted, the substrate support portion is positioned at a support position that can support the substrate placed on the receiving surface from below.
[0022]
The support member Retraction position and support position It is preferable to further include a drive unit that moves between the two.
[0023]
Moreover, it is preferable that the front-end | tip part of a supporting member is formed in the curved surface shape.
[0025]
A paste coating apparatus according to the present invention includes a receiving surface on which a substrate held and carried on a transfer arm is placed, and a substrate holding unit that is formed below the height of the receiving surface and holds the substrate in the transfer arm. Entry space that allows entry Formed recess In the paste coating apparatus for applying the paste to the substrate by relative movement between the coating head and the stage apparatus, Recessed A support member movable in the entry space is provided, and the support member is positioned at a retreat position where the substrate holding part of the transfer arm retreats from the entry path when entering the entry space. When the substrate holding portion is retracted, the substrate support portion is positioned at a support position that can support the substrate placed on the receiving surface from below.
[0026]
The paste coating method according to the present invention is applied to the receiving surface. By recess A step of causing the carry-in arm to enter the formed entry space and placing the substrate held by the carry-in arm on the receiving surface; and after placing the substrate on the receiving surface, retract the carry-in arm from the entry space And a step of supporting the lower surface of the substrate placed on the receiving surface by a support member movable in the entry space after the carry-in arm is retracted from the entry space; and A step of applying a paste to the placed substrate, a step of retracting the support member from the entry space of the carry-in arm after applying the paste, and after the support member has retreated, allowing the carry-out arm to enter the entry space, And a step of taking out the substrate from the receiving surface by the carry-out arm.
[0027]
According to the stage apparatus of the present invention, the support member movable in the entry space formed below the height position of the receiving surface is retracted from the entry space and delivered when the substrate is delivered to the stage. After that, the transferred substrate is supported from below. Therefore, the substrate can be prevented from being bent into the entry space formed on the stage by its own weight, and the substrate can be held with good flatness.
[0028]
Further, according to the paste coating apparatus and the paste coating method according to the present invention, the support member movable in the entry space formed below the height position of the receiving surface is removed from the entry space when the substrate is transferred to the stage. After retracted and delivered, the delivered substrate is supported from below. Therefore, the substrate can be prevented from being bent into the entry space formed on the stage by its own weight, and the substrate can be held with good flatness, so that the paste can be applied to the substrate with high accuracy.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to FIGS. The same components as those of the conventional paste applying apparatus shown in FIGS. 4 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0030]
1 is a schematic perspective view of a stage device and a transfer arm to which the present invention is applied, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB in FIG. It is.
[0031]
The stage device and the transfer arm of the paste coating apparatus shown in FIG. 1 have the same configuration as the conventional paste coating apparatus shown in FIGS. 4 and 5, except for the structure of the stage device, and the others are the same.
[0032]
That is, as in the prior art, the substrate 2 sequentially conveyed and supplied onto the supply table 1 is held by suction on the opposite side of the paste application surface to the arm 7 of the conveyance arm 3 and rotated in the θ (swivel) axis direction. In addition, by the movement in the direction of the conveyance line (arrow X), the paste is applied to the stages of the four paste application devices 41 to 44 sequentially with the paste application surface facing up.
[0033]
Each paste application device 41 to 44 includes a stage 4A for receiving and placing the substrate 2 and a head mechanism 4D. The transfer arm 3 receives the substrate 2 from the supply table 1 and supplies it to the paste coating devices 41 to 44 arranged opposite to each other toward the transfer line while transferring the substrate 2 in the direction of the arrow X as a transfer line. .
[0034]
The stage 4A is fixed to the θ (turning) axis of the XY-θ moving mechanism 4B, the θ-axis is fixed to the Y-axis 4B1, the Y-axis is fixed to the X-axis 4B2, and the XY- The entire θ moving mechanism 4B is installed on a table (base) 4C.
[0035]
The stage 4 </ b> A moves to the transfer position moved forward near the transfer arm 3 when the substrate 2 is transferred, and moves to the application work position retracted away from the transfer arm 3 when the paste is applied to the substrate 2.
[0036]
Prior to the start of the paste application operation, the substrate 2 attracted and held on the stage 4A is aligned with the head mechanism 4D, but the substrate 2 itself is also transferred from the transfer arm 3 to the X- on the stage 4A. In many cases, a positional deviation occurs in the Y-θ direction. Therefore, as shown in FIG. 4, the alignment mark on the substrate 2 is set by the CCD cameras 4D3 and 4D4 attached corresponding to the two syringes 4D1 and 4D2 of the head mechanism 4D, or a recognition camera provided separately. The image is photographed, and positional deviation correction is performed in advance by correction control based on the video pattern.
[0037]
In addition, the pair of syringes 4D1 and 4D2 of the head mechanism 4D has a plurality of application pattern intervals (pitch) in the arrow X direction on the substrate 2 before the paste application operation starts. They are individually moved and adjusted in the direction of the arrow X so as to coincide with each other, and are positioned and fixed.
[0038]
In other words, the paste pattern is formed on the surface of the substrate 2 by the program control of the controller 4E, but the interval between the syringes 4D1 and 4D2 is a multi-surface substrate (a plurality of substrates of the same type (sub-substrate) formed on one sheet). This corresponds to the arrangement pitch in the X direction of each of the plurality of child boards arranged on the substrate 2.
[0039]
As shown in FIGS. 4 and 5, a monitor display 4F and a keyboard 4G are connected to the controller 4E, and an operator can paste on the substrate 2 by operating the keyboard 4G. The coating operation can be adjusted.
[0040]
The substrate 2 on which the paste pattern is formed by applying the paste is moved forward toward the transfer position to the transfer arm 3 and transferred to the transfer arm 3. The received transfer arm 3 is to transfer the substrate 2 to the next process. Then, it is supplied to the carry-out stand 5 shown in FIG.
[0041]
Here, the stage apparatus will be described in detail with reference to FIGS.
[0042]
As shown in FIG. 1, the substrate 2 is transferred to the receiving surface 4A3 of the stage device by the transfer arm 3, and is sucked and held on the receiving surface 4A3. After the paste is applied, the substrate 2 is again taken out from the receiving surface 4A3 by the transfer arm 3. It is.
[0043]
The transfer arm 3 is provided with a plurality of suction disks 7A on the upper surface of a bifurcated fork-shaped arm 7, and the suction disks 7A are connected to the pneumatic control unit 6 via a pipe 8A.
[0044]
The stage device is schematically configured from a stage 4A and a driving device 9.
[0045]
The stage 4A includes a receiving surface 4A3 on which the substrate 2 is placed, a plurality of suction disks 4A1 that suck and hold the substrate 2 on which the paste is applied to the receiving surface 4A3, and a substrate while preventing interference between the receiving surface 4A3 and the arm 7. 2 has two recesses 4A2 of the transfer arm 3, a support pin 10 as a support member, and a through hole 4A4 through which the support pin 10 provided on the bottom surface of the recess 4A2 passes. Configured.
[0046]
On the other hand, the drive device 9 is configured to include an elevating plate 11 provided with a support pin 10 having a substantially spherical tip portion 10A and an air cylinder 12 that supports the elevating plate 11 so as to be movable up and down.
[0047]
Here, the two recesses 4A2 correspond to the distance between the arms 7, and the suction disk 4A1 is connected to the pneumatic control unit 6 via the pipe 8B. The support pins 10 and the through holes 4A4 through which the support pins 10 pass are provided at three equal intervals for each recess 4A2. Further, the support pin 10 is driven between the support position where the tip portion 10A substantially coincides with the height position of the receiving surface 4A3 and the retreat position where the support pin 10 retracts and sinks below the bottom surface of the recess 4A2. It can be moved.
[0048]
Next, an operation in which the stage 4A receives the substrate 2 from the transfer arm 3 will be described.
[0049]
First, the substrate 2 placed on the supply table 1 is sucked and held on the suction plate 7A on the upper surface of the arm 7 of the transfer arm 3. The arm 7 moves in the direction of the arrow X in FIG. 4 as the transfer line based on the command of the controller 4E, and moves in the direction of the arrow Y, the θ-axis rotation direction, and the vertical direction to position the substrate 2 and paste The coating device 41 is positioned on the stage 4A. At this time, the arm 7 is positioned so as to face the two recesses 4A2.
[0050]
Next, the arm 7 descends in the vertical direction and causes the arm 7 to enter the recess 4A2. In this descending process, the substrate 2 is placed on the receiving surface 4A3. The vacuum suction of the substrate 2 by the suction disk 7A is released at the timing when the substrate 2 comes into contact with the receiving surface 4A3. As a result, the substrate 2 is placed on the receiving surface 4A3. In other words, the recess 4A2 forms an entry space in which the substrate holding part in the transfer arm 3 can enter, and the substrate 2 of the arm 7 enters the entry space, so that the substrate 2 receives the receiving surface. It will be placed on 4A3.
[0051]
Next, the arm 7 moves in a direction indicated by an arrow -Y in FIG. 1 after being lowered to a position where the suction plate 7A on the upper surface does not contact the lower surface of the substrate 2 and the lower surface does not contact the bottom surface of the recess. And retreat from the entry space of the stage 4A.
[0052]
When the arm 7 moves away from the stage 4A, the stage 4A starts to move to the application work position. Along with this movement, compressed air is supplied to the air cylinder 12 in the stage 4A through a pipe (not shown) so that the cylinder rod of the air cylinder 12 Rise The tip of the support pin 10 installed on the elevating plate 11 rises to a height position substantially coincident with the receiving surface 4A3, that is, a support position on the lower surface of the substrate, and supports the substrate 2 from below. As a result, as shown in FIG. Like The substrate 2 is supported in the recess 4A2 of the stage 4A without being bent by its own weight. Thereafter, the substrate 2 is vacuum-sucked by the suction disk 4A1 provided on the receiving surface 4A3 of the stage 4A.
[0053]
When the movement of the stage 4A is completed, the alignment marks on the substrate 2 are imaged by the cameras 4D3 and 4D4. Then, based on the imaging patterns of the cameras 4D3 and 4D4, the control device 4E calculates the positional deviation of the substrate 2, corrects the movement of the stage 4A in the XYθ direction, and accurately applies the paste to a predetermined position.
[0054]
Subsequently, an operation of the transfer arm 3 taking out the receiving surface 4A3 from the receiving surface 4A3 will be described.
[0055]
First, the stage 4A is moved from the coating position to the substrate delivery position. During this movement, the tip 10A of the support pin 10 supporting the substrate 2 is lowered to the retracted position by the air cylinder 12.
[0056]
Next, the transfer arm 3 is moved based on a command from the controller 4E so that the tip of the arm 7 faces the side surface of the recess 4A2 of the stage 4A. At this time, the height position of the arm 7 in the height direction is such that a gap is formed between the suction plate 7A on the upper surface and the lower surface of the substrate 2 on the stage 4A, and the lower surface of the recess 4A2 of the stage 4A is formed. It is positioned so as to be a height position that forms a gap with the bottom surface.
[0057]
Next, the arm 7 is moved in the direction of arrow Y in FIG. 1, and the suction cup 7A is positioned below the substrate 2 held by the stage 4A. Then, after releasing the vacuum suction of the suction disk 4A1 on the receiving surface 4A3, the arm 7 is raised to scoop up the substrate 2 from the receiving surface 4A3. At this time, the substrate 2 is sucked and held on the arm 7 by vacuum suction of the suction disk 7A. Next, by raising the arm 7, the substrate 2 is raised to a position where it does not come into contact with the receiving surface 4A3, and then retracted in the direction of the arrow -Y in FIG.
[0058]
Next, the arm 7 rotates around the arrow θ axis in FIG. 4 to position the suction-held substrate 2 on the transport line. Then, the arm 7 moves in the X direction to position the substrate 2 at the unloading position. Here, the arm 7 is lowered to place the substrate 2 on the carry-out table 5.
[0059]
Through the above operation, the substrate 2 is unloaded from the stage 4A to the unloading table 5. In the other paste coating apparatuses 42 to 44, the substrate 2 is carried in and out by the same operation.
[0060]
In the embodiment described above, the portion corresponding to the recess 4A2 in the substrate 2 carried into the stage 4A is supported by the support pins 10 from below, so that the substrate 2 is placed in the recess 4A2 of the stage 4A by its own weight. It is possible to prevent bending due to the weight of the U-shaped bent state. When used in a paste application apparatus, it is possible to prevent a phenomenon in which the distance between the nozzle and the substrate 2 increases as in the prior art, and the paste can be applied onto the substrate 2 with high accuracy. For the same reason, the substrate 2 supplied to the stage 4A can be reliably held by the suction disk 4A1 of the receiving surface 4A3 prior to the paste application operation, so that the paste application operation is performed with higher accuracy. Can do.
[0061]
Further, when the arm 7 of the transport arm 3 enters the recess 4A2 forming the entry space, the support pin 10 is positioned at a lower position retracted from the entry path, so that the entry of the arm 7 is not hindered. It is possible to deliver a substrate.
[0062]
Further, when correcting the positional deviation of the substrate 2 transported to the stage 4A using a camera, even if the alignment mark on the substrate 2 is positioned on or near the recess 4A2 of the stage 4A, the image is captured by the camera. Since the reflected light of the alignment mark is surely incident on the cameras 4D3 and 4D4 because the part is not bent, the alignment mark can be read well, and the apparatus can be prevented from stopping without being detected, improving productivity. It is possible to save labor.
[0063]
Further, according to the present embodiment, when the portion corresponding to the concave portion 4A2 of the stage 4A is bent downwardly due to the warpage inherent to the substrate, this bending is corrected by the upward movement of the support pin 10. can do. Accordingly, even in such a case, the paste can be applied onto the substrate 2 with high accuracy.
[0064]
Further, according to the present embodiment, the support pins 10 are raised while the stage 4A is moved to the application work position, and the support pins 10 are lowered while the stage 4A is moved to the substrate delivery position. As a result, it is possible to prevent an increase in the throughput time for the raising / lowering operation of the support pin 10.
[0065]
Further, according to the present embodiment, since the tip portion 10A is supported by the spherical support pins 10 on the lower surface of the substrate 2, when adjusting the height of the support pins 10 at the support position, the tip portion 10A. Need only be adjusted so as to be in contact with the lower surface of the substrate 2, and there is no need to adjust the tilt of the support pin 10 in the vertical direction, and only the height direction needs to be adjusted. This effect is sufficient if the tip of the support pin 10 is curved.
[0066]
In the above-described embodiment, the paste application apparatus that applies paste to the substrate has been described. However, the present invention is not limited to such an embodiment, and various semiconductor manufacturing apparatuses that handle a substrate such as a liquid crystal substrate, such as projection exposure. You may apply to board | substrate support apparatuses, such as an apparatus, a spin coater, a film-forming apparatus, and a bonding apparatus.
[0067]
Further, in the embodiment of the present invention, two coating heads are provided for one paste coating apparatus, but this may be one or three or more, and four paste coating apparatuses are conveyed. Two units are arranged opposite to the line, but this is not limited to this embodiment, and may be freely arranged by matching with other processes.
[0068]
Further, in the embodiment of the present invention, three support pins are provided on the same lift plate, and the lift plate is moved up and down by one air cylinder. However, the three support pins are individually driven, for example, It may be driven by an air cylinder. Here, the drive timings for raising the support pins by the air cylinder are not necessarily the same.
[0069]
Further, in the embodiment of the present invention, the air cylinder is used as a drive unit for moving the support pin 10 up and down in order to support the substrate 2 or to avoid interference with the arm 7. For example, the support pin 10 is urged upward by a spring in the recess to the substantially lower surface position of the substrate 2, and the support pin 10 is urged to the lower surface of the arm 7 by the arm 7 entering the recess 4 </ b> A <b> 2 from above. You may comprise so that the support pin 10 may be moved up and down.
[0070]
Further, although the number of support pins 10 that support the substrate is three per concave portion, it may be changed according to the size of the concave portion, and may be two or less or four or more.
[0071]
Further, in the embodiment of the present invention, the substrate is supported by a plurality of pin members in which the tip end portions of the support pins have a substantially spherical shape. However, the present invention is not limited to the pin-shaped members, and for example, a plurality of support pins are connected. It may be changed to a single kamaboko shape and supported. In this case, since the substrate is supported in a line shape, the effect of correcting the warpage of the substrate and the warpage inherent to the substrate is further improved as compared with the support member having a curved tip end portion.
[0072]
Further, in the embodiment of the present invention, the case where the substrate on the stage is held by the vacuum pressure has been described, but it may be held by another holding method, for example, an electrostatic chuck.
[0073]
In the embodiment of the present invention, the two recesses 4A2 are provided in the stage 4A as the entry space. However, the present invention is not limited to this, and may be one or three or more. The number of recesses may be determined according to the number of arms 7.
[0074]
In the embodiment of the present invention, when the substrate 2 is carried in and out of the stage 4A, the same transfer arm 3 is used. However, the substrate 2 is carried in and out by separate arms. Also good.
[0075]
In the embodiment of the present invention, the support pin 10 is moved up and down to support the substrate 2 or to avoid interference with the arm 7. The structure is not limited to this, and the support pin 10 may be retracted and entered from the recess 4A2 by sliding or rotating in a substantially horizontal direction.
[0076]
In the above-described embodiment, the entrance space of the transfer arm 3 has been described as the recess 4A2, that is, a recess with a bottom. However, the present invention can be applied even when there is no bottom.
[0077]
【The invention's effect】
As described above, according to the present invention, it is possible to prevent the substrate from being bent due to its own weight, and when used in a paste coating operation, it is possible to form a highly accurate coating pattern.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a stage device and a transfer arm to which the present invention is applied.
2 is a cross-sectional view taken along line AA in FIG.
3 is a cross-sectional view taken along the line BB in FIG.
FIG. 4 is a configuration layout diagram of a conventional paste coating apparatus.
5 is a perspective view of the paste application apparatus shown in FIG. 4. FIG.
6 is a schematic perspective view of a stage device and a transfer arm of the paste application apparatus shown in FIG.
7 is a schematic cross-sectional view of the stage device taken along the line CC in FIG. 6;
[Explanation of symbols]
1 Supply stand
2 Substrate
3 Transfer arm
41 Paste applicator
42 Paste applicator
43 Paste applicator
44 Paste applicator
4A stage
4A1 Suction board
4A2 recess (entrance space)
4A3 receiving surface
4A4 Through hole
4B XY-θ moving mechanism
4B1 Y axis
4B2 X axis
4C table
4D head mechanism (coating head)
4D1 syringe
4D2 syringe
4D3 CCD camera
4D4 CCD camera
4E controller
4F monitor display
4G keyboard
5 Unloading stand
6 Pneumatic control unit
7 Arm (substrate holding part)
7A Suction board
8A piping
8B piping
9 Drive unit
10 Support pin (support member)
10A tip (substrate support)
11 Lift plate
12 Air cylinder

Claims (5)

A receiving surface on which a substrate to be held and carried on the transfer arm is placed, and an entrance space formed below the height position of the receiving surface to allow the substrate holding portion for holding the substrate in the transfer arm to enter . In a stage apparatus having a recessed portion formed ,
Provide a support member movable in the entry space of the recess ,
The support member is positioned at a retreat position where the substrate holding portion of the transfer arm retreats from the entry path when the substrate holding portion enters the entry space, and the substrate support portion is disposed when the substrate holding portion retreats from the entry space. A stage apparatus, wherein the stage apparatus is positioned at a support position where the substrate placed on the receiving surface can be supported from below.   The stage apparatus according to claim 1, further comprising a drive unit that moves the support member between the retracted position and the support position.   The stage apparatus according to claim 1 or 2, wherein a tip portion of the support member is formed in a curved surface shape. A receiving surface on which a substrate to be held and carried on the transfer arm is placed, and an entrance space formed below the height position of the receiving surface to allow the substrate holding portion for holding the substrate in the transfer arm to enter . A stage device having a formed recess ;
An application head for applying a paste to the substrate;
In a paste application device for applying paste to the substrate by relative movement between the application head and the stage device,
Provide a support member movable in the entry space of the recess ,
The support member is positioned at a retreat position where the substrate holding portion of the transfer arm retreats from the entry path when the substrate holding portion enters the entry space, and the substrate support portion is disposed when the substrate holding portion retreats from the entry space. A paste application apparatus, wherein the paste application device is positioned at a support position where the substrate placed on the receiving surface can be supported from below. A step of entering the loading arm into the entry space formed by the recess on the receiving surface and placing the substrate held by the loading arm on the receiving surface;
After the substrate is placed on the receiving surface, the step of retracting the loading arm from the entry space;
A step of supporting the lower surface of the substrate placed on the receiving surface with a support member movable within the entry space after the carry-in arm is retracted from the entry space;
Applying paste to the substrate placed on the receiving surface;
Retreating the support member from the entry space of the carry-in arm after applying the paste;
After the support member is retracted, a step of entering a carry-out arm into the entry space, and taking out the substrate from the receiving surface by the carry-out arm;
A paste coating method characterized by comprising:

Images