KR20110046901A - Substrate inspection system and substrate inspection method - Google Patents

Abstract

PURPOSE: A substrate inspecting system and substrate inspection method are provided to determine whether a foreign material is movable by comparing the coordinates and sizes of first and second inspected defects, thereby preventing foreign materials from being too much detected. CONSTITUTION: A first inspecting unit(110) inspects whether a defect occurs on the frontal surface of a substrate(105), and the coordinate and size of the defect. The first inspecting unit comprises a first photographing unit(111), a first driving unit(112), a first table unit(113), and a first cleaning unit(114). A second inspecting unit(120) inspects a defect formed on a substrate which is inspected by the first inspecting unit. The second inspecting unit includes a second photographing unit(121), a second driving unit(122), a second table unit(123), and a second cleaning unit(124). A controller(130) determines whether a defect occurs on the substrate by comparing the coordinates and sizes of inspected defects of the first and second inspecting units.

Description

Substrate Inspection System and Substrate Inspection Method {SUBSTRATE INSPECTION SYSTEM AND SUBSTRATE INSPECTION METHOD}

The present invention relates to a substrate inspection system and a substrate inspection method.

Recently, the trend of multifunctional and high speed electronic products is progressing at a rapid pace. In order to cope with this trend, semiconductor chips and semiconductor chip mounting substrates connecting semiconductor chips and main boards are also developing at a very rapid rate.

The requirements for the development of the semiconductor chip mounting substrate are closely related to the high speed and high density of the semiconductor chip mounting substrate, and in order to satisfy them, the thin and small size of the substrate, the fine circuit, the excellent electrical characteristics, the high reliability, and the high speed signal are satisfied. Many improvements and developments in semiconductor chip mounting substrates, such as transfer structures, are needed.

On the other hand, in accordance with the demand for high density and high reliability of the substrate on which the chip is mounted, the pattern of the substrate is gradually miniaturized, so that defect inspection of the substrate by the human eye becomes more and more difficult and the productivity is lowered. Accordingly, research on a method of inspecting a defect of a substrate has been made.

1 is a perspective view of a substrate inspection apparatus 10 according to the prior art. Hereinafter, the substrate inspection apparatus 10 and the substrate inspection method according to the related art will be described with reference to the following.

First, the board | substrate 11 is located in the drive part 13 provided in the table part 12 as a loader 14. As shown in FIG.

Next, the upper surface of the substrate 11 is cleaned using the cleaning unit 15.

Next, the illumination part 16b illuminates the front surface of the board | substrate 11, and it image | photographs with the camera part 16a, and acquires an image.

Next, the captured image is inspected to specify the position of the defect formed on the substrate 11.

Next, the substrate 11 is unloaded from the substrate inspection apparatus 10 using an unloader 17, and an operator inspects a defect formed in the substrate 11 directly through a magnifying glass. In the case where the operator directly inspects and judges that the actual defect is present, the substrate 11 is determined as defective.

However, in the conventional substrate inspection apparatus 10 and the substrate inspection method, the cleaning unit 15 is used to clean the substrate 11 in advance, so that the removal effect of the light moving foreign material is not a defect, but the thin and heavy moving foreign material is There was a problem that the moving foreign matter was overdetected only by moving in the substrate 11 without being removed.

In addition, the camera portion 16a is equipped with a low magnification lens in order to maximize productivity, and the illumination portion 16b uses monochromatic light, and the image photographed therefrom is black and white, so that defects cannot be accurately measured. There was a problem that the time for the operator to inspect directly.

The present invention was created to solve the problems of the prior art as described above, and an object of the present invention is to provide a substrate inspection system and a substrate inspection method in which mobile foreign matter is not overdetected.

Another object of the present invention is to provide a substrate inspection system and a substrate inspection method for reducing the time for direct inspection by the operator by accurately measuring the formation of defects, the image captured from the image pickup unit is composed of high resolution and color.

According to a preferred embodiment of the present invention, a substrate inspection system includes: a first inspection unit which photographs a first image of a front surface of a substrate, and inspects coordinates of a defect formed on the substrate as the first image and an area of the defect; A second inspection unit for capturing a second image with respect to a point where the defect of the substrate moved from the first inspection unit is formed, and inspecting coordinates of the defect and an area of the defect as the second image, and the first inspection unit And a control unit for determining the defect as a mobile foreign object when the coordinates of the defect inspected by the second inspection unit are different and the area of the defect is the same or similar.

The second image may be captured by a CCD camera.

The first image may be captured by a camera equipped with a low magnification lens, and the second image may be captured by a camera equipped with a high magnification lens.

The second image may be captured by a color camera.

In addition, a plurality of lights are used in the imaging of the second image.

The first inspection section and the second inspection section each include an imaging section for imaging the substrate, a driving section for moving the substrate, and a cleaning section for cleaning before imaging the substrate.

The drive unit formed in the second inspection unit may move the substrate along an X axis and a Y axis.

The resolution of the second image may be equal to or higher than that of the first image.

According to a first aspect of the present invention, there is provided a substrate inspection method comprising: (A) acquiring a first image of a front surface of a substrate and first inspecting a coordinate of a defect formed on the substrate and an area of the defect; B) receiving the substrate from the first inspection step, acquiring a second image of the point where the defect is formed, and secondly inspecting the coordinates of the defect and the area of the defect, and (C) the first Comparing the coordinates of the defects inspected and the second inspected and the area of the defects, if the coordinates of the defects are different and the areas of the defects are the same or similar, it is determined that the defect is a mobile foreign material and the substrate is good. Characterized in that it comprises a step.

At this time, (D) if it is determined that the substrate is defective, characterized in that the operator further comprises the step of directly inspecting the third point where the defect is formed.

Further, in the step (B), the second image is characterized in that the color.

Also, in the step (B), the resolution of the second image is the same as the resolution of the first image, or higher resolution than the resolution of the first image.

In addition, the step (A), (A1) cleaning the entire surface of the substrate, (A2) obtaining a first image of the front surface of the substrate, and (A3) on the substrate as the first image And first inspecting the coordinates of the formed defect and the area of the defect.

In addition, the step (B), (B1) receiving the substrate from the first inspection step, (B2) cleaning the substrate, (B3) obtaining a second image of the point where the defect is formed And (B4) second inspecting the coordinates of the defect and the area of the defect as the second image.

In addition, the step (C), (C1) comparing the coordinates of the first inspection and the second inspection and the area of the defect, and (C2) the coordinates of the defect is different and the area of the defect Determining that the defect is a mobile foreign matter if the same or similar, the substrate is determined to be good, and if the coordinates, areas of the defect are all the same or similar, or if the area of the defect is different, determining that the substrate is bad Characterized in that it comprises a.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may appropriately define the concept of a term in order to best describe its invention The present invention should be construed in accordance with the spirit and scope of the present invention.

In the substrate inspection system and the substrate inspection method according to the present invention, the inspection of the substrate is performed twice, and the coordinates and the areas of the first inspection and the second inspection defect are compared to determine that the movement is foreign matter. There is no advantage.

In addition, the substrate inspection system and the substrate inspection method according to the present invention by capturing the second image by a second camera unit having a high magnification lens and color camera and a second illumination unit having a plurality of lights, to determine whether the substrate is defective. Accurate measurement, and accordingly, there is an advantage that the time for direct inspection by the operator is reduced.

BRIEF DESCRIPTION OF THE DRAWINGS The objects, particular advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Board Inspection System

2 is a view for explaining a substrate inspection system 100 according to a preferred embodiment of the present invention. Hereinafter, a description will be given of the substrate inspection system 100 according to the present embodiment.

As shown in FIG. 2, the substrate inspection system 100 according to the present exemplary embodiment includes a first inspection unit 110, a second inspection unit 120, and a controller 130.

The first inspection unit 110 is a portion for inspecting whether the defect is formed, the coordinates and the area of the defect on the entire surface of the substrate 105. The first imaging unit 111, the first driving unit 112, and the first table unit 113, and a first cleaning unit 114. Here, the term 'defect' is a concept that includes, for example, a mobile foreign matter such as dust, and even a defect on a pattern.

The first imaging unit 111 is a member for capturing the first image of the entire surface of the substrate 105. For example, the first imaging unit 111 may include a first camera unit 111a and a first lighting unit 111b.

Here, in the case of the first inspection unit 110 inspects the entire surface of the substrate 105, in order to maximize productivity, the first camera unit 111a is preferably composed of a camera having a low magnification lens. In this case, the camera may be configured of, for example, a TDI scan, a line scan, or an area scan camera. In addition, it is preferable to widen the field of view of the lens or to replace the lens having a wide field of view so as to capture the entire surface of the substrate 105. Meanwhile, a member for fixing and moving the first camera portion 111a may be further included.

The first lighting unit 111b is a member that assists the imaging of the first camera unit 111a by illuminating the upper surface of the substrate 105. The first lighting unit 111b is preferably composed of mono-light to reduce inspection time and inspection cost. Do.

On the other hand, the imaging operation of the first imaging unit 111 is performed while synchronizing according to the moving position of the substrate 105 or while the substrate 105 is temporarily stopped.

The first driver 112 is a member that drives the substrate 105 to position the substrate 105 under the first imaging unit 111.

For example, the first drive unit 112 may be configured as a belt conveyor or include a motor, and may be a member capable of driving the substrate 105. Meanwhile, in the first inspection unit 110, the front surface of the substrate 105 is imaged by the first imaging unit 111. The first driving unit 112 is moved on the X axis, and may not be moved on the Y axis. In the case where the width of the substrate 105 is widened on the Y axis and the image is divided, the first imaging unit 111 moves to image.

The first table portion 113 is a kind of rail or guide member in which the first driving portion 112 is moved. Since the first driving portion 112 is moved on the X axis, the first table 113 may be configured only of the X axis.

The first cleaning part 114 is installed in the first table part 113, and serves to clean the entire surface of the substrate 105 before the substrate 105 is positioned below the first imaging part 111. . For example, the substrate 105 being transferred may be cleaned with a brush having a brush formed on an outer circumferential surface thereof, and at the same time, static electricity may be removed by using an ionizer. Alternatively, a part of the mobile foreign matter may be removed in a complex form such as a brush, an ionizer, an air blower, an ultrasonic vibrator, and the like.

The first inspection unit 110 may further include a first loader unit 115 and a first unloader unit 116.

Here, the first loader unit 115 serves to position the substrate 105 in the first inspection unit 110, and the first unloader unit 116 carries the substrate 105 out of the first inspection unit 110. It plays a role. Meanwhile, the first unloader unit 116 is connected to the second inspection unit 120 to be described below, and performs the role of placing the substrate 105 of the first inspection unit 110 in the second inspection unit 120 at one time. You may.

The second inspection unit 120 inspects the defect formed on the substrate 105 moved after the inspection by the first inspection unit 110, and the second imaging unit 121, the second driving unit 122, and the second table are inspected. The part 123 and the second cleaning part 124 are included. Here, the second cleaning unit 124 has the same configuration and function as the first cleaning unit 114, and will be omitted below. The second loader 125 and the second unloader 126 may be further installed on the second inspector 120 to access the substrate 150.

Here, the second imaging unit 121 is a member for imaging the second image with respect to the spot where the defect inspected by the first inspection unit 110 is formed. For example, the second camera unit 121a and the second illumination unit ( 121b).

The second camera unit 121a may capture the second image with respect to the spot where the defect inspected by the first inspection unit 110 is formed in the substrate 105 moved from the first inspection unit 110. In this case, unlike the first camera unit 111a, the second camera unit 121a may be configured as a CCD camera having a high magnification lens. In the case of using a high magnification lens, the resolution may be, for example, less than half the resolution of the first inspection unit 110, and thus it is possible to more accurately detect whether the defect is formed, the coordinates, and the area of the defect. In addition, the second camera unit 121a may be configured as a color camera. In the case of a color camera, for example, the second camera unit 121a may be formed of red, green, and blue to more accurately detect whether a defect is formed. Here, the inspection speed may be slow when a high magnification lens or a color camera is used, but when a moving foreign object is detected in the controller 130, the time for the operator to inspect defects of the substrate 105 is reduced, so that the entire substrate is reduced. The inspection speed of the inspection system 100 can be increased.

The second lighting unit 121b is an illumination that assists in capturing the second image of the second camera unit 121a. For the purpose of accurate measurement, the second lighting unit 121b may be configured of a plurality of illuminations, unlike the first lighting unit 111b. When the second lighting unit 121b includes a plurality of lights, the second camera unit 121a may capture the second image formed in three dimensions.

The second driver 122 is a member that positions the substrate 105 in the second imaging unit 121, and the second table part 123 serves as a guide for driving the second driver 122.

Here, since the second inspection unit 120 inspects a point where a defect is detected in the first inspection unit 110, the second driving unit 122 is not only the X axis but also the Y axis, unlike the first driving unit 112. It is also possible to move. Accordingly, the second table portion 123 may also be configured to have a '+' shape including the X-axis table portion 123a and the Y-axis table portion 123b.

The controller 130 is connected to the first inspection unit 110 and the second inspection unit 120 by wire or wirelessly, and compares the coordinates and the area of the defects inspected by the inspection units 110 and 120, and determines whether the substrate is defective. This is the part to judge.

Specifically, the coordinates and the area of the defects inspected from the first inspection unit 110 are compared with the coordinates and the area of the defects inspected from the second inspection unit 120. In this case, when the area of the defect is the same or similar, but the coordinates are different, it may be determined that the moving foreign material such as dust, for example, is moved in accordance with the movement of the substrate 105. In this case, since the moving foreign material cannot be seen as a defect of the substrate 105 and can be removed, the controller 130 does not determine that the substrate 105 is defective.

On the other hand, when the area of the defect is different, it can be regarded that a defect has occurred in the substrate 105 regardless of whether the coordinates are the same, the controller 130 determines that the substrate 105 is defective. In addition, if the area and the coordinates of the defect are the same, even though the substrate 105 has moved, since the defect remains at the same point as the point inspected by the first inspection unit 110, it cannot be regarded as a mobile foreign matter, and thus the control unit. 130 determines that the substrate 105 is defective.

Substrate inspection method

3 is a view for explaining a substrate inspection method according to a preferred embodiment of the present invention. Hereinafter, referring to this, a substrate inspection method according to a preferred embodiment of the present invention will be described.

As shown in FIG. 3, the substrate inspection method includes a first inspection step (S100), a second inspection step (S200), a step of comparing and determining a coordinate and an area of a defect (S300), and a third inspection. It consists of a step S400.

First, a first image of the entire surface of the substrate 105 is obtained, and a first inspection is performed on whether a defect is formed on the substrate 105, coordinates of the defect, and an area of the defect (S100).

At this time, after imaging the first image with the first imaging unit 111 with respect to the entire surface of the substrate 105, and inspects whether a defect is formed on the substrate 105, if the defect is formed, the coordinates and the area of the defect Check it. Meanwhile, the upper surface of the substrate 105 may be cleaned before the first image is captured.

Next, in the substrate 105 moved from the first inspection step S100, a second image is acquired with respect to the point where the defect is formed, and the coordinates of the defect formed on the substrate 105 and the area of the defect are second inspected. (S200).

In this case, it is not necessary to inspect the portion of the substrate on which the defect is not formed, and the coordinates and the area of the defect that have passed through the first inspection step S100 may be inspected. Meanwhile, the second image in the second inspection step S200 may be color, and the resolution may be less than half the resolution of the first inspection unit 110. In addition, similar to the first inspection step S100, the substrate 105 may be cleaned before the second image is captured.

Next, by comparing and analyzing the data of the coordinates and the area of the defects inspected in the first inspection step (S100) and the second inspection step (S200), it is determined whether the substrate is defective (S300).

At this time, when the area of the defect is the same or similar but different coordinates, it can be determined that the state of the substrate is good. In addition, when the areas of the defects are different or both the areas and the coordinates of the defects are the same or similar, it may be determined that the state of the substrate is poor.

Next, when it is determined that the state of the substrate is bad (S300), the operator directly inspects the point where the defect is formed (S400).

At this time, the defect formed on the substrate is magnified by equipment such as a microscope, for example, and inspected directly by an operator. If a worker inspects directly and determines that the board is a real defect, the board may be destroyed.

As the above steps, the substrate inspection method according to a preferred embodiment of the present invention is completed.

Although the present invention has been described in detail through specific examples, this is for describing the present invention in detail, and the substrate inspection system and the substrate inspection method according to the present invention are not limited thereto, and the technical field of the present invention is within the scope of the present invention. It will be apparent that modifications and improvements are possible by those skilled in the art.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

1 is a perspective view of a substrate inspection apparatus 10 according to the prior art.

2 is a view for explaining a substrate inspection system 100 according to a preferred embodiment of the present invention.

3 is a inspection flowchart of a substrate inspection method according to a preferred embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

105: substrate 110: first inspection unit

111: first imaging unit 112: first driver

113: first table portion 114: first cleaning portion

115: first loader part 116: second unloader part

120: second inspection unit 121: second imaging unit

122: second drive part 123: second table part

124: second cleaning section 125: second loader section

126: second unloader 130

Claims (15)

A first inspection unit which photographs a first image of the entire surface of the substrate and inspects coordinates of a defect formed on the substrate and an area of the defect as the first image; A second inspection unit which picks up a second image with respect to a point where the defect of the substrate moved from the first inspection unit is formed, and inspects coordinates of the defect and an area of the defect as the second image; And A control unit for determining the defect as a mobile foreign object when the coordinates of the defects inspected by the first inspection unit and the second inspection unit are different and the areas of the defects are the same or similar; Substrate inspection system comprising a. The method according to claim 1, And the second image is captured by a CCD camera. The method according to claim 1, And the first image is captured by a camera equipped with a low magnification lens, and the second image is captured by a camera equipped with a high magnification lens. The method according to claim 1, And the second image is captured by a color camera. The method according to claim 1, And a plurality of lights for imaging the second image. The method according to claim 1, And the first inspection section and the second inspection section each include an imaging section for imaging the substrate, a driving section for moving the substrate, and a cleaning section for cleaning before imaging the substrate. The method according to claim 6, And the drive unit formed in the second inspection unit can move the substrate along an X axis and a Y axis. The method according to claim 1, And the resolution of the second image is equal to or higher than the resolution of the first image. (A) acquiring a first image of the front surface of the substrate to first inspect the coordinates of the defects formed on the substrate and the area of the defects; (B) receiving the substrate from the first inspection step, acquiring a second image of the point where the defect is formed, and second inspecting the coordinates of the defect and the area of the defect; And (C) comparing the coordinates of the defects and the areas of the defects inspected by the first inspection and the second inspection, and when the coordinates of the defects are different and the areas of the defects are the same or similar, the defects are determined as mobile foreign objects, Determining that the substrate is good; Substrate inspection method comprising a. The method according to claim 9, (D) if it is determined that the substrate is defective, inspecting the spot where the defect is directly formed by a worker; Substrate inspection method characterized in that it further comprises. The method according to claim 9, In the step (B), the second image is a substrate inspection method, characterized in that the color. The method according to claim 9, In the step (B), the resolution of the second image is the same as the resolution of the first image, the substrate inspection method, characterized in that higher resolution than the resolution of the first image. The method according to claim 9, Step (A) is (A1) cleaning the entire surface of the substrate; (A2) acquiring a first image of the front surface of the substrate; And (A3) first inspecting a coordinate of a defect formed on the substrate and an area of the defect as the first image; Substrate inspection method comprising a. The method according to claim 9, Step (B) is, (B1) receiving the substrate from the first inspection step; (B2) cleaning the substrate; (B3) acquiring a second image of the point at which the defect was formed; And (B4) second inspecting the coordinates of the defect and the area of the defect as the second image; Substrate inspection method comprising a. The method according to claim 9, Step (C) is (C1) comparing coordinates of the defects of the first inspection and the second inspection and an area of the defects; And (C2) When the coordinates of the defects are different and the areas of the defects are the same or similar, the defects are judged as a mobile foreign object, and the substrate is judged to be good, and the coordinates and the areas of the defects are all the same or similar, If the area is different, determining that the substrate is defective; Substrate inspection method comprising a.

Images