CN110095933A - Camera module and its standardized test method - Google Patents
Camera module and its standardized test method Download PDFInfo
- Publication number
- CN110095933A CN110095933A CN201810096149.2A CN201810096149A CN110095933A CN 110095933 A CN110095933 A CN 110095933A CN 201810096149 A CN201810096149 A CN 201810096149A CN 110095933 A CN110095933 A CN 110095933A
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- China
- Prior art keywords
- camera module
- contact
- module according
- test method
- standardized test
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B43/00—Testing correct operation of photographic apparatus or parts thereof
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
Abstract
The present invention proposes a kind of camera module and its standardized test method, camera module circuit plate is provided with contact, it lighted, focused by the contact, being tested, the one or more steps process in burning and detection OTP information, reduce manpower intervention, promote testing efficiency, testing cost is reduced, while improving compatibility and accuracy.
Description
Technical field
The present invention relates to a kind of camera module and its standardized test methods.
Background technique
In camera module production process, need to light camera module, focus, testing, burning and detection OTP
One or more steps process in information.As camera module market scale expands, mould group shape and interface increase, mould group
Testing efficiency and compatibility are increasingly becoming the bottleneck in production process.
Existing camera module structure is as shown in Figure 1, the image sensor chip 6 in mould group passes through 1 lower section of circuit board
Connector 2 with test focusing mechanism be electrically connected.The traditional testing process of present industry:
Process 1:
Mould splits version-> manually take single mould group-> manual-alignment mould group and test board electrical connecting position and press or insert
Enter-> automatic test-> manually remove mould group
Process 2:
> manually taking single mould group ,-> test fixture (Socket) is opened manually and is put into mould group-> is manually closed mould splits version-
Socket-> automatic test-> artificial taking-up mould group
Process 1 and process 2 are that have its congenital defect for being difficult to overcome:
1) operation mode of manual operation loading and unloading occupies the plenty of time, has become the main bottleneck of testing efficiency promotion；
2) single test, testing efficiency are lower；
3) manual operation proficiency is affected to test accuracy, and connector contraposition is inaccurate, pressing is unstable, is easy to appear mistake
It surveys；
4) manually to mould group pressing bending action, static electricity on human body etc., the potential risk for causing mould group to damage；
5) frequently manual operation also be easy to cause damage to test focusing mechanism (test board etc.)；
6) the mould group defined for distinct interface, frequently replaces test board.
So can be obvious see the test of current mould group to manually-operated dependence, while the efficiency and accuracy tested
It is also a contradiction, how coordinates and obtain optimization testing efficiency to be camera module industry problems faced always.
Although process 2 simplifies operating process using Socket, manpower intervention is reduced, improves test effect to a certain extent
Rate.But Socket requires shape and the interface definition of mould group, a kind of Socket can only test a kind of mould group, not have simultaneous
Capacitive, and Socket involves great expense compared to test board.
Summary of the invention
The purpose of the present invention is to provide a kind of camera module and its standardized test methods, reduce people in test process
Work intervention, promotes testing efficiency, reduces testing cost, while improving compatibility and accuracy.
Based on considerations above, the present invention provides a kind of camera module, and camera module circuit plate is provided with contact, is used for
It lighted, focused by the contact, being tested, the one or more steps process in burning and detection OTP information.
Preferably, the number of the contact is less than or equal to the number of pins of connector.
Preferably, the front and back sides of the camera module circuit plate are provided with contact, the position of the contact relative to
The position of camera module is fixed.
Preferably, some or all pins connection in the image sensor chip output signal in the camera module
To the contact.
Preferably, in test pattern: picture signal work passes through signal in normal condition, the picture signal of selected section
Pin transmission, splices to obtain entire image by multiframe, to carry out the test of picture signal.
Preferably, the contact has turning, to guarantee the reliability of connection.
Another aspect of the present invention provides a kind of standardized test method of camera module, comprising: camera module circuit
Plate is provided with contact, is lighted, is focused by the contact, tested, the one or more steps work in burning and detection OTP information
Sequence.
Preferably, the number of the contact is less than or equal to the number of pins of connector.
Preferably, the front and back sides of the camera module circuit plate are provided with contact, the position of the contact relative to
The position of camera module is fixed.
Preferably, some or all pins connection in the image sensor chip output signal in the camera module
To the contact.
Preferably, in test pattern: picture signal work passes through signal in normal condition, the picture signal of selected section
Pin transmission, splices to obtain entire image by multiframe, to carry out the test of picture signal.
Preferably, the contact has turning, to guarantee the reliability of connection.
Preferably, the standardized test method of the camera module further include: offer is provided with several probes and focusing
The test focusing mechanism of mechanism, the probe correspond to the contact, and the focus adjusting mechanism corresponds to camera module to be measured；It will
After several camera module batch feedings, the probe is electrically connected to the contact and is tested, the focus adjusting mechanism pair
Camera module to be measured is focused.
Preferably, after the completion of the process, the probe and focus adjusting mechanism are unclamped, batch is carried out to the camera module
Blanking.
Camera module and its standardized test method of the invention, camera module circuit plate are provided with contact, pass through
The contact lighted, focused, being tested, the one or more steps process in burning and detection OTP information, reduces manpower intervention,
Testing efficiency is promoted, testing cost is reduced, while improving compatibility and accuracy.
Detailed description of the invention
By Figure of description and then it is used to illustrate the specific reality of the certain principles of the present invention together with Figure of description
Mode is applied, other feature possessed by the present invention and advantage will be apparent or more specifically illustrated.
Fig. 1 is the structural schematic diagram of existing camera module；
Fig. 2 is the structural schematic diagram of camera module of the invention.
Specific embodiment
In the following detailed description of the preferred embodiment, reference is constituted to the appended attached drawing of present invention a part.Institute
Attached attached drawing, which has been illustrated by way of example, can be realized specific embodiment.Exemplary embodiment is not intended to
Exhaustive all embodiments according to the present invention.It is appreciated that without departing from the scope of the present invention, can use other
Embodiment can also carry out the modification of structure or logic.Therefore, it is below specific descriptions and it is unrestricted, and this
The range of invention is defined by the claims appended hereto.
Fig. 2 shows camera module of the invention, including circuit board 101, which is provided with contact 103, preferably
, the number of the contact 103 is less than or equal to the number of pins of connector 102, the image sensor chip in camera module
Some or all pins in 106 output signals are connected to the contact 103, then, can be carried out a little by the contact 103
One or more steps process in bright, focusing, test, burning and detection OTP information, such as in test pattern: picture signal work
Make in normal condition, the picture signal of selected section splices to obtain entire image by multiframe by signal pin transmission, with into
The test of row picture signal.
Camera module and its standardized test method of the invention is, it can be achieved that automatic loading/unloading saves without human intervention
The a large amount of time is saved.Mould group is not required to a point version, full page or more editions batch loading and unloading, realizes more moulds in full page or more editions mould groups
It organizes while testing, improve testing efficiency；If mould group has divided version, single Mo Zu can be also fixed on carrier respectively, a load
Have fixed more mould groups, batch loading and unloading, more are tested simultaneously, and high efficiency test equally may be implemented.
The standardized test method of camera module of the invention further include: offer is provided with several probes and focus adjusting mechanism
Test focusing mechanism, the probe correspond to the contact 103, the focus adjusting mechanism correspond to camera module to be measured；It will
After several camera module batch feedings, the probe is electrically connected to the contact 103 and is tested, the focus adjusting mechanism
It focuses to camera module to be measured, after the completion of the process, unclamps the probe and focus adjusting mechanism, to the camera mould
Group carries out patch blanking.Automation equipment realizes stable, controllable in real time electricity in such a way that probe and contact 103 press
Gas connection, it is minimum to mould group damage risk without pressing bending mould-group circuit-board 101, improve test accuracy.
Preferably, the front and back sides of camera module circuit plate 101 are provided with contact 103, the position phase of the contact 103
The position of camera module is fixed, by the contact design of unified standard, a kind of probe structure can test circuit board 101
The shape mould group different with interface improves utilization rate of equipment and installations and test compatibility, saves test without frequently replacement probe
Cost.
Preferably, the contact 103 has turning, that is to say, that on the basis of the normal Butut cabling of mould-group circuit-board 101
On, realize the connection of contact 103 and script route 105, by way of bypassing cabling 104 to guarantee that 103 structure of contact will not
Script route 105 is influenced, to guarantee the reliability of connection.
Camera module and its standardized test method of the invention, camera module circuit plate are provided with contact, pass through
The contact lighted, focused, being tested, the one or more steps process in burning and detection OTP information, reduces manpower intervention,
Testing efficiency is promoted, testing cost is reduced, while improving compatibility and accuracy.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
How from the point of view of, the present embodiments are to be considered as illustrative and not restrictive.In addition, it will be evident that one word of " comprising " not
Exclude other elements and steps, and wording "one" be not excluded for plural number.The multiple element stated in device claim can also
To be implemented by one element.The first, the second equal words are used to indicate names, and are not indicated any particular order.
Claims (14)
1. a kind of camera module, which is characterized in that
Camera module circuit plate is provided with contact, for being lighted, being focused by the contact, tested, burning and detection
One or more steps process in OTP information.
2. camera module according to claim 1, which is characterized in that the number of the contact is less than or equal to connector
Number of pins.
3. camera module according to claim 1, which is characterized in that the front and back sides of the camera module circuit plate are equal
It is provided with contact, the position of the contact is fixed relative to the position of camera module.
4. camera module according to claim 1, which is characterized in that the imaging sensor core in the camera module
Some or all pins in piece output signal are connected to the contact.
5. camera module according to claim 4, which is characterized in that in test pattern: picture signal works just
The picture signal of normal state, selected section is transmitted by signal pin, splices to obtain entire image by multiframe, to carry out image
The test of signal.
6. camera module according to claim 1, which is characterized in that the contact has turning, to guarantee connection
Reliability.
7. a kind of standardized test method of camera module, which is characterized in that
Camera module circuit plate is provided with contact, is lighted, is focused by the contact, tested, burning and detection OTP are believed
One or more steps process in breath.
8. the standardized test method of camera module according to claim 7, which is characterized in that the number of the contact
Less than or equal to the number of pins of connector.
9. the standardized test method of camera module according to claim 7, which is characterized in that the camera module
The front and back sides of circuit board are provided with contact, and the position of the contact is fixed relative to the position of camera module.
10. the standardized test method of camera module according to claim 7, which is characterized in that the camera mould
Some or all pins in image sensor chip output signal in group are connected to the contact.
11. the standardized test method of camera module according to claim 10, which is characterized in that in test pattern
In: picture signal work is transmitted by signal pin in normal condition, the picture signal of selected section, splices to obtain by multiframe
Entire image, to carry out the test of picture signal.
12. the standardized test method of camera module according to claim 7, which is characterized in that the contact has
Turning, to guarantee the reliability of connection.
13. the standardized test method of camera module according to claim 7, which is characterized in that further include:
The test focusing mechanism for being provided with several probes and focus adjusting mechanism is provided, the probe corresponds to the contact, the tune
Focusing mechanism corresponds to camera module to be measured；
After several camera module batch feedings, the probe is electrically connected to the contact and is tested, the focusing
Mechanism focuses to camera module to be measured.
14. the standardized test method of camera module according to claim 13, which is characterized in that the process is completed
Afterwards, the probe and focus adjusting mechanism are unclamped, patch blanking is carried out to the camera module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810096149.2A CN110095933A (en) | 2018-01-31 | 2018-01-31 | Camera module and its standardized test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810096149.2A CN110095933A (en) | 2018-01-31 | 2018-01-31 | Camera module and its standardized test method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110095933A true CN110095933A (en) | 2019-08-06 |
Family
ID=67442888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810096149.2A Pending CN110095933A (en) | 2018-01-31 | 2018-01-31 | Camera module and its standardized test method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110095933A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747147A (en) * | 2021-08-17 | 2021-12-03 | 荣耀终端有限公司 | Camera module testing equipment and camera module testing method |
| CN117539509A (en) * | 2024-01-09 | 2024-02-09 | 成都本原聚能科技有限公司 | Burning method of OTP module and data frame |
-
2018
- 2018-01-31 CN CN201810096149.2A patent/CN110095933A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747147A (en) * | 2021-08-17 | 2021-12-03 | 荣耀终端有限公司 | Camera module testing equipment and camera module testing method |
| CN117539509A (en) * | 2024-01-09 | 2024-02-09 | 成都本原聚能科技有限公司 | Burning method of OTP module and data frame |
| CN117539509B (en) * | 2024-01-09 | 2024-03-22 | 成都本原聚能科技有限公司 | Burning method of OTP module and data frame |
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