CN111998960B - Method for identifying infrared scanning equipment of integrated circuit board - Google Patents
Method for identifying infrared scanning equipment of integrated circuit board Download PDFInfo
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- CN111998960B CN111998960B CN202010945259.9A CN202010945259A CN111998960B CN 111998960 B CN111998960 B CN 111998960B CN 202010945259 A CN202010945259 A CN 202010945259A CN 111998960 B CN111998960 B CN 111998960B
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000012360 testing method Methods 0.000 claims abstract description 94
- 230000005855 radiation Effects 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 15
- 238000012634 optical imaging Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 230000002159 abnormal effect Effects 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 230000008717 functional decline Effects 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/52—Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/52—Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
- G01J5/53—Reference sources, e.g. standard lamps; Black bodies
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/80—Calibration
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention provides an identification method of infrared scanning equipment of an integrated circuit board, which comprises the following steps: starting up the infrared scanning equipment, enabling the infrared detector, the optical imaging lens, the display screen and the calculator to enter an initialization state, obtaining infrared radiation energy of a scanning area of the infrared detector after initialization is completed, converting the infrared radiation energy into a standard video signal, and displaying an infrared thermal image after the display screen displays the standard video signal from the infrared detector; and manufacturing a test board, namely manufacturing the test board for learning of the infrared scanning equipment according to the through and short-circuit characteristics of each position of the detected integrated circuit board. The invention can accurately monitor the test state and the test accuracy of the equipment by comparing the processing results of test processing before and after the test of the integrated circuit board, avoids misjudgment or missed judgment, has high equipment test reliability, simultaneously avoids the problem of fuzzy judgment of the fault critical point, and has high detection accuracy.
Description
Technical Field
The invention relates to the technical field of infrared detection equipment, in particular to an identification method of infrared scanning equipment of an integrated circuit board.
Background
Along with the development of the manufacturing process of the circuit board, the integration level of electronic components is higher and higher, the circuit is more and more complex, and a great deal of time and energy are required for traditional contact diagnosis after faults occur, so that a non-contact fault diagnosis method has become an urgent need at present, an infrared thermal imager receives infrared radiation energy of a detected target by utilizing an optical imaging lens and an infrared detector, converts the infrared radiation energy into a standard video signal, displays an infrared thermal image through a display screen, and is widely applied to fault detection of an integrated circuit board.
At present, the infrared scanning equipment of the integrated circuit board judges the read fault critical point in a fuzzy manner during automatic detection, so that the final judgment has errors, in addition, the problem of function degradation of local components of the equipment after long-term use can occur, and if the equipment is not monitored for the function degradation in time, the erroneous judgment or the missed judgment of the equipment is directly caused.
Disclosure of Invention
In view of the above, the invention provides an identification method of an infrared scanning device of an integrated circuit board, which solves the problems of judgment errors, misjudgment or missed judgment after a long time in the prior art of the infrared scanning device of the integrated circuit board.
For this purpose, the invention provides an infrared scanning equipment identification method of an integrated circuit board, which comprises the following steps:
A) Starting up the infrared scanning equipment, enabling the infrared detector, the optical imaging lens, the display screen and the calculator to enter an initialization state, obtaining infrared radiation energy of a scanning area of the infrared detector after initialization is completed, converting the infrared radiation energy into a standard video signal, and displaying an infrared thermal image after the display screen displays the standard video signal from the infrared detector; executing the step B);
b) Manufacturing a test board, manufacturing the test board for learning of infrared scanning equipment according to the through and short circuit characteristics of each position of the detected integrated circuit board, respectively designing dense circuits, PAD and large copper pattern modules on the test board, taking one circuit to be made into a position of disconnection 2, a position of a dense circuit area film to be used as a needle printing notch 4, a position of short circuit 2, a position of a bulge and a position of residual copper 2, abnormal points of a film painting 10, wherein the design size of the abnormal points is not more than 0.02mm, recording, etching patterns by a copper-clad plate, and carrying out gold plating treatment on the surface, wherein the plating layer is about 1.2-2 mu m; executing the step C);
c) Making a standard judgment graph, and inputting a standard infrared thermal image graph of the examination board capable of displaying 10 abnormal points into a computer for storage, wherein the standard infrared thermal image graph is used as a standard for subsequent comparison judgment; executing the step D);
d) Examination processing before test board test: placing the examination board in a detection area, electrifying the examination board, scanning infrared radiation energy on the examination board by an optical imaging lens and an infrared detector, converting the infrared radiation energy into a standard video signal, displaying an infrared thermal image of the examination board after a display screen displays the standard video signal from the infrared detector, and simultaneously, transmitting the infrared thermal image into a computer to be compared with a standard judging graph, wherein 10 abnormal points in the two graphs are matched, so that the equipment is normal; executing the step E);
e) The method comprises the steps of testing an integrated circuit board, placing the integrated circuit board in a detection area, electrifying the integrated circuit board, scanning the integrated circuit board by an optical imaging lens and an infrared detector, forming different infrared radiation energies at the positions of an integrated circuit board passage and a short circuit, converting the infrared radiation energies into standard video signals, displaying an infrared thermal image of the integrated circuit board after displaying the standard video signals from the infrared detector by a display, transmitting the infrared thermal image of the integrated circuit board into a computer, and intelligently comparing the difference of the infrared thermal image and the standard judgment graph at 10 abnormal points by the computer so as to judge the condition of the integrated circuit board; executing the step F);
F) After the test board is tested, the test board is placed in a detection area, the test board is electrified, the optical imaging lens and the infrared detector scan infrared radiation energy on the test board and convert the infrared radiation energy into standard video signals, the infrared thermal image of the test board is displayed after the display screen displays the standard video signals from the infrared detector, meanwhile, the infrared thermal image is transmitted to a computer to be compared with standard judging patterns, 10 abnormal points in the two patterns are matched, and the equipment is normal; executing the step G); .
G) And finally judging the result, namely judging that the equipment normally has no component function decline when the test processing results of the test boards are consistent before and after the test of the integrated circuit board, and directly acquiring the judgment result from the test result of the integrated circuit.
Further, in the step D), if 10 abnormal points in the two graphs are not matched, an attempt is made to perform maintenance and debugging on each component of the device.
Further, in the step F), if 10 abnormal points in the two graphs are not matched, an attempt is made to perform maintenance and debugging on each component of the device.
Further, in the step G), if the test results of the test boards before and after the integrated circuit board test are inconsistent, the inspection and debugging of each component of the device is attempted, and the test results of the integrated circuit are invalid.
In the method for identifying the infrared scanning equipment of the integrated circuit board, the prefabricated test board is used as a template for equipment calibration, standard judgment patterns are recorded in a computer for comparison of test results, and the stability of the equipment can be judged from the test processing results of two times by carrying out test processing of the test board before and after the test of the integrated circuit board, so that the functional decline of the equipment is monitored, and the accuracy of the test results is ensured.
Therefore, compared with the prior art, the invention has the following beneficial effects:
The test state and the test accuracy of the equipment can be accurately monitored through comparison of the processing results of test processing before and after the test of the integrated circuit board, misjudgment or missed judgment is avoided, the equipment test reliability is high, meanwhile, the problem of fuzzy judgment of the fault critical point is also avoided, and the detection accuracy is high.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
fig. 1 is a flowchart of an embodiment one of an identification method of an infrared scanning device of an integrated circuit board according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Referring to fig. 1, the present embodiment provides an embodiment of an infrared scanning device identification method of an integrated circuit board, the infrared scanning device identification method of the integrated circuit board including the steps of:
Step S01, starting up an infrared scanning device, enabling an infrared detector, an optical imaging lens, a display screen and a calculator to enter an initialization state, obtaining infrared radiation energy of a scanning area of the infrared detector after initialization is completed, converting the infrared radiation energy into a standard video signal, and displaying an infrared thermal image after the display screen displays the standard video signal from the infrared detector; step S02 is performed.
S02, manufacturing a test board, manufacturing the test board for learning of infrared scanning equipment according to the access short-circuit characteristics of each position of the detected integrated circuit board, respectively designing dense circuits, PAD and large copper pattern modules on the test board, taking one of the circuits to be made into a position of disconnection 2, a position of a dense circuit area film to be used as a needle printing notch 4, a position of short circuit 2, a position of a bulge and a position of residual copper 2, an abnormal point at a position of a film painting 10, wherein the design size of the abnormal point is not more than 0.02mm, recording, etching patterns by a copper-clad plate, carrying out surface gold plating treatment, and enabling the plating layer to be about 1.2-2 mu m; step S03 is performed.
S03, making a standard judgment graph, and inputting a standard infrared thermal image of the examination board capable of displaying 10 abnormal points into a computer for storage, wherein the standard infrared thermal image is used as a standard for subsequent comparison judgment; step S04 is performed.
Step S04, test board test-before-test processing: placing the examination board in a detection area, electrifying the examination board, scanning infrared radiation energy on the examination board by an optical imaging lens and an infrared detector, converting the infrared radiation energy into a standard video signal, displaying an infrared thermal image of the examination board after a display screen displays the standard video signal from the infrared detector, and simultaneously, transmitting the infrared thermal image into a computer to be compared with a standard judging graph, wherein 10 abnormal points in the two graphs are matched, so that the equipment is normal; step S05 is performed.
S05, testing the integrated circuit board, placing the integrated circuit board in a detection area, electrifying the integrated circuit board, scanning the integrated circuit board by an optical imaging lens and an infrared detector, forming different infrared radiation energies at the positions of a passage and a short circuit of the integrated circuit board, converting the infrared radiation energies into standard video signals, displaying the standard video signals from the infrared detector on a display, displaying an infrared thermal image of the integrated circuit board, transmitting the infrared thermal image of the integrated circuit board into a computer, and intelligently comparing the difference of the infrared thermal image and the standard judgment graph at 10 abnormal points by the computer so as to judge the condition of the integrated circuit board; executing step S06;
Step S06, test board test after test treatment, the test board is placed in a detection area, the test board is electrified, an optical imaging lens and an infrared detector scan infrared radiation energy on the test board and convert the infrared radiation energy into a standard video signal, a display screen displays an infrared thermal image of the test board after displaying the standard video signal from the infrared detector, meanwhile, the infrared thermal image is transmitted to a computer to be compared with a standard judgment graph, 10 abnormal points in the two graphs are matched, and the equipment is normal; step S07 is performed;
And S07, finally judging the result, namely judging that the equipment is normal without the condition of component function decline when the test processing results of the test boards are consistent before and after the test of the integrated circuit board, and directly acquiring the judgment result from the test result of the integrated circuit.
Specifically, in S04, if 10 abnormal points in the two graphs are not matched, an attempt is made to inspect and debug each component of the device.
Specifically, in S06, if 10 abnormal points in the two graphs are not matched, an attempt is made to inspect and debug each component of the device.
Specifically, in S07, if the test results of the test boards before and after the integrated circuit board test are inconsistent, the test results of the integrated circuit board test are invalid after the test is attempted to examine and debug each component of the device.
In the method for identifying the infrared scanning equipment of the integrated circuit board, the prefabricated test board is used as a template for equipment calibration, standard judgment patterns are recorded in a computer and used for comparing test results, and the stability of the equipment can be judged from the test processing results of two times by carrying out test processing of the test board before and after the test of the integrated circuit board, so that the functional decline of the equipment is monitored, and the accuracy of the test results is ensured.
Therefore, compared with the prior art, the invention has the following beneficial effects:
The test state and the test accuracy of the equipment can be accurately monitored through comparison of the processing results of test processing before and after the test of the integrated circuit board, misjudgment or missed judgment is avoided, the equipment test reliability is high, meanwhile, the problem of fuzzy judgment of the fault critical point is also avoided, and the detection accuracy is high.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (2)
1. The method for identifying the infrared scanning equipment of the integrated circuit board is characterized by comprising the following steps of:
Starting up the infrared scanning equipment, enabling the infrared detector, the optical imaging lens, the display screen and the calculator to enter an initialization state, obtaining infrared radiation energy of a scanning area of the infrared detector after initialization is completed, converting the infrared radiation energy into a standard video signal, and displaying an infrared thermal image after the display screen displays the standard video signal from the infrared detector;
Manufacturing a test board, manufacturing the test board for learning of infrared scanning equipment according to the through and short circuit characteristics of each position of the detected integrated circuit board, respectively designing dense circuits, PAD and large copper pattern modules on the test board, taking one circuit to be made into a position of disconnection 2, a position of a dense circuit area film to be used as a needle printing notch 4, a position of short circuit 2, a position of a bulge and a position of residual copper 2, abnormal points of a film painting 10, wherein the design size of the abnormal points is not more than 0.02mm, recording, etching patterns by a copper-clad plate, and carrying out gold plating treatment on the surface, wherein the plating layer is about 1.2-2 mu m;
Making a standard judgment graph, and inputting a standard infrared thermal image graph of the examination board capable of displaying 10 abnormal points into a computer for storage, wherein the standard infrared thermal image graph is used as a standard for subsequent comparison judgment;
The test board is placed in a detection area, the test board is electrified, an optical imaging lens and an infrared detector scan infrared radiation energy on the test board and convert the infrared radiation energy into standard video signals, a display screen displays the standard video signals from the infrared detector and then displays infrared thermal images of the test board, meanwhile, the infrared thermal images are transmitted to a computer to be compared with standard judging patterns, 10 abnormal points in the two patterns are matched, and the equipment is normal;
The method comprises the steps of testing an integrated circuit board, placing the integrated circuit board in a detection area, electrifying the integrated circuit board, scanning the integrated circuit board by an optical imaging lens and an infrared detector, forming different infrared radiation energies at the positions of an integrated circuit board passage and a short circuit, converting the infrared radiation energies into standard video signals, displaying an infrared thermal image of the integrated circuit board after displaying the standard video signals from the infrared detector by a display, transmitting the infrared thermal image of the integrated circuit board into a computer, and intelligently comparing the difference of the infrared thermal image and the standard judgment graph at 10 abnormal points by the computer so as to judge the condition of the integrated circuit board;
After the test board is tested, the test board is placed in a detection area, the test board is electrified, the optical imaging lens and the infrared detector scan infrared radiation energy on the test board and convert the infrared radiation energy into standard video signals, the infrared thermal image of the test board is displayed after the display screen displays the standard video signals from the infrared detector, meanwhile, the infrared thermal image is transmitted to a computer to be compared with standard judging patterns, 10 abnormal points in the two patterns are matched, and the equipment is normal;
The final result judgment, namely judging that the device is normal without the condition of component function decline when the test processing results of the test boards are consistent before and after the test of the integrated circuit board, and directly obtaining the judgment result from the test results of the integrated circuit;
And if the test processing results of the test boards before and after the test of the integrated circuit board are inconsistent, the overhaul and the debugging of each component of the equipment are tried, and the test results of the integrated circuit are invalid.
2. The method for identifying an infrared scanning device of an integrated circuit board according to claim 1, wherein: if 10 abnormal points in the two graphs are not matched, the overhaul and the debugging are attempted to be carried out on each component of the equipment.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010945259.9A CN111998960B (en) | 2020-09-10 | 2020-09-10 | Method for identifying infrared scanning equipment of integrated circuit board |
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| CN202010945259.9A CN111998960B (en) | 2020-09-10 | 2020-09-10 | Method for identifying infrared scanning equipment of integrated circuit board |
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| CN113804125A (en) * | 2021-09-29 | 2021-12-17 | 镇江福坤船舶配件有限公司 | Method for inspecting surface linear deviation of propeller shaft bracket casting |
| CN116626544B (en) * | 2023-07-26 | 2023-12-26 | 武汉能钠智能装备技术股份有限公司 | Frequency domain trigger data acquisition system and method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102565069A (en) * | 2011-12-22 | 2012-07-11 | 天津理工大学 | Infrared microscopic non-destructive detector for integrated circuit |
| CN103399248A (en) * | 2013-07-18 | 2013-11-20 | 江苏物联网研究发展中心 | PCB (printed circuit board) defect mass detection system and method |
| CN107025648A (en) * | 2017-03-20 | 2017-08-08 | 中国人民解放军空军工程大学 | A kind of board failure infrared image automatic testing method |
| CN108693462A (en) * | 2018-06-13 | 2018-10-23 | 奇酷互联网络科技（深圳）有限公司 | Circuit board detecting method, system, readable storage medium storing program for executing, equipment and circuit board |
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| TW200801487A (en) * | 2006-06-23 | 2008-01-01 | Innolux Display Corp | Method and device for detecting circuit |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102565069A (en) * | 2011-12-22 | 2012-07-11 | 天津理工大学 | Infrared microscopic non-destructive detector for integrated circuit |
| CN103399248A (en) * | 2013-07-18 | 2013-11-20 | 江苏物联网研究发展中心 | PCB (printed circuit board) defect mass detection system and method |
| CN107025648A (en) * | 2017-03-20 | 2017-08-08 | 中国人民解放军空军工程大学 | A kind of board failure infrared image automatic testing method |
| CN108693462A (en) * | 2018-06-13 | 2018-10-23 | 奇酷互联网络科技（深圳）有限公司 | Circuit board detecting method, system, readable storage medium storing program for executing, equipment and circuit board |
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