CN109241681B - Reflow soldering simulation optimization method and system, computer storage medium and equipment - Google Patents
Reflow soldering simulation optimization method and system, computer storage medium and equipment Download PDFInfo
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Abstract
The invention provides a simulation optimization method, a simulation optimization system, a computer storage medium and a device for reflow soldering, wherein the method comprises the following steps: generating a three-dimensional model of the PCB to be optimized; generating a corresponding three-dimensional model of the solder paste; selecting components needing reflow soldering process, and arranging each component on the soldering paste three-dimensional model according to the position information of the selected components on the three-dimensional model of the PCB to be optimized; performing soldering paste welding simulation on the selected components and the soldering pads according to preset reflow soldering simulation parameters to form a reflow soldering simulation model of the PCB to be optimized; carrying out PCB inspection on a reflow soldering simulation model of the PCB to be optimized so as to find a problem to be optimized; and aiming at the problem to be optimized, adopting corresponding design and optimization modification of the process. The invention can find the possible welding problems in advance by the reflow soldering simulation technology in the design stage, thereby leading technicians to modify the design and optimize the process.
Description
Technical Field
The invention belongs to the technical field of welding, relates to a simulation optimization method and a simulation optimization system, and particularly relates to a reflow soldering simulation optimization method and a reflow soldering simulation optimization system, a computer storage medium and computer equipment.
Background
With the development of economy and science and technology, people have higher and higher requirements on electronic products, which not only can meet the requirements of multifunction, miniaturization, high density and high performance, but also needs to have good product quality. As a core process of electronic assembly, namely an SMT (surface mount technology) process, the quality of welding quality directly influences the overall quality and production cost of products. Thus, for the electronics manufacturing industry, a premium solder quality is one of the product's standing costs, and is a product's competitive capital and chips with others.
At present, welding defects can be found only through an actual production link in the industry, namely the welding problem of an SMD element can be found only after SMT mounting and reflow soldering. The soldering problems found at this time are not entirely caused by the reflow process; the SMT welding quality is closely related to the manufacturability design of the PCB welding pad, the design and layout of a steel mesh, the component selection and the weldability of the PCB welding pad, the state of production equipment, the quality of solder paste, the process parameters of each procedure and the operating skill of an operator besides the direct relation with the reflow welding process (temperature curve); these factors affect each other and changing either one may ultimately affect the weld result.
At present, no systematic scheme similar to the scheme of the invention exists in the industry, and the existing methods are all used for judging the reason of the welding problem after actual production by technicians based on own experience so as to modify the design or optimize the process; however, these experiences come from a summary of the day-to-month accumulated production practices, and thus enterprises are difficult to promote in efficiency and highly dependent on technicians. Then there is no method that can prevent the soldering defect in advance without the actual production link of reflow soldering after SMT mounting, and by optimizing the design and process in advance, the trial production is reduced, and the product quality and production efficiency are improved?
Therefore, how to provide a method, a system, a computer storage medium and a device for simulation optimization of reflow soldering to solve the defects that soldering of an SMD component can be found only in the production link of reflow soldering after SMT mounting in the prior art, has become a technical problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a method, a system, a computer storage medium and a device for simulation optimization of reflow soldering, which are used to solve the problem that the soldering of SMD components can be found only in the actual production process of reflow soldering after SMT mounting.
To achieve the above and other related objects, an aspect of the present invention provides a method for optimizing a reflow soldering simulation, including: generating a three-dimensional model of the PCB to be optimized; generating a corresponding soldering paste three-dimensional model according to the thickness of the steel mesh openings which are read in one by one or the thickness of the steel mesh openings generated by the soldering pads; selecting components needing reflow soldering process from the three-dimensional model of the PCB to be optimized, and setting each component on the soldering paste three-dimensional model according to the position information of the selected components on the three-dimensional model of the PCB to be optimized; performing soldering paste welding simulation on the selected components and the soldering pads according to preset reflow soldering simulation parameters to form a reflow soldering simulation model of the PCB to be optimized; carrying out PCB inspection on the reflow soldering simulation model of the PCB to be optimized so as to find out the problem to be optimized; and aiming at the problem to be optimized, adopting corresponding design and optimization modification of the process.
In an embodiment of the invention, if the PCB is inspected and no problem to be optimized is found, the reflow soldering simulation optimization method further includes outputting a reflow soldering simulation model of the PCB to be optimized.
In an embodiment of the present invention, the generating the three-dimensional model of the PCB to be optimized includes: directly receiving a three-dimensional model of a PCB to be optimized, which is created by a user; or generating a three-dimensional model of the PCB to be optimized according to the acquired EDA wiring data.
In an embodiment of the present invention, the selection criteria in selecting the components requiring the reflow soldering process from the three-dimensional model of the PCB to be optimized are as follows: according to the recommendation of a component manufacturer or the actual circuit board process condition; the position information of the selected component on the three-dimensional model of the PCB to be optimized comprises the coordinate and the angle of the selected component on the three-dimensional model of the PCB to be optimized; the preset reflow soldering simulation parameters comprise the length of reflow soldering, the temperature range of each section, the conveying speed of each section and/or the length of each section.
In an embodiment of the invention, after the step of forming the reflow soldering simulation model of the PCB to be optimized, the reflow soldering simulation optimization method further includes simulating and displaying stress changes of the components and the PCB during and after soldering.
In an embodiment of the present invention, the to-be-optimized problem includes a solder distance problem, a solder bridging problem, a component tombstoning problem, a component tilting problem, a component offset problem, and/or a component and circuit board stress deformation problem on the to-be-optimized PCB.
In an embodiment of the present invention, the step of inspecting the PCB of the reflow soldering simulation model of the PCB to be optimized includes: checking the soldering tin distance on the PCB to be optimized; checking the solder bridging on the PCB to be optimized; carrying out tombstoning inspection on the selected components on the PCB to be optimized; performing tilt inspection on the selected components on the PCB to be optimized; carrying out offset inspection on the selected components on the PCB to be optimized; and/or carrying out stress deformation inspection on the selected components and the circuit board on the PCB to be optimized.
In another aspect, the present invention provides a simulation optimization system for reflow soldering, including: the generating module is used for generating a three-dimensional model of the PCB to be optimized; the generating module is used for generating a corresponding soldering paste three-dimensional model according to the thickness of the steel mesh openings which are read in one by one or the thickness of the steel mesh openings generated by the bonding pads; the device comprises a setting module, a soldering paste three-dimensional model and a control module, wherein the setting module is used for selecting components needing reflow soldering process from the three-dimensional model of the PCB to be optimized, and setting each component on the soldering paste three-dimensional model according to the position information of the selected components on the three-dimensional model of the PCB to be optimized; the simulation module is used for carrying out soldering paste welding simulation on the selected components and the soldering pads according to preset reflow soldering simulation parameters to form a reflow soldering simulation model of the PCB to be optimized; the inspection module is used for inspecting the PCB of the reflow soldering simulation model of the PCB to be optimized so as to find a problem to be optimized; and the optimization modification module is used for carrying out corresponding design and process optimization modification aiming at the problem to be optimized.
Yet another aspect of the present invention provides a computer storage medium having a computer program stored thereon, which when executed by a processor, implements the method for simulation optimization of reflow soldering.
A final aspect of the invention provides an apparatus comprising: a processor and a memory; the memory is used for storing a computer program, and the processor is used for executing the computer program stored by the memory so as to enable the device to execute the reflow soldering simulation optimization method.
As described above, the simulation optimization method, system, computer storage medium and device for reflow soldering according to the present invention have the following advantages:
the reflow soldering simulation optimization method, the reflow soldering simulation optimization system, the computer storage medium and the reflow soldering simulation equipment can find possible soldering problems in advance through the reflow soldering simulation technology in the design stage, so that technicians can modify the design and optimization process, the workload which needs to be finished within several days originally is finished within 1-2 hours, and the manufacturing quality and the manufacturing efficiency of products are greatly improved; the original diagnosis and analysis of the lag production result of the electronic manufacturing enterprise are changed into simulation prevention at the front end of the design, and the problem points in the production can be prevented in advance; therefore, it can be said that the simulation optimization method for reflow soldering provided by the embodiment is an effective scheme and technical support for electronic manufacturing enterprises to realize intelligent manufacturing and industrial 4.0.
Drawings
Fig. 1 is a schematic flow chart illustrating a simulation optimization method for reflow soldering according to an embodiment of the invention.
Fig. 2 is a diagram showing an example of a three-dimensional model of solder paste printed through a steel mesh opening on a PCB circuit board according to the present invention.
Fig. 3 is a view showing an example of a three-dimensional model of solder paste formed by the present invention.
Fig. 4 is a diagram showing an example of a reflow soldering simulation model by the present invention.
Fig. 5 is a schematic structural diagram of a simulation optimization system for reflow soldering according to an embodiment of the present invention.
Description of the element reference numerals
5-reflow-soldering simulation optimization system
51 generating module
52 Generation module
53 setting module
54 selecting module
55 simulation module
56 inspection module
57 optimization module
58 output module
S11-S18
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
Example one
The embodiment provides a simulation optimization method for reflow soldering, which comprises the following steps:
generating a three-dimensional model of the PCB to be optimized;
generating a corresponding soldering paste three-dimensional model according to the thickness of the steel mesh openings which are read in one by one or the thickness of the steel mesh openings generated by the soldering pads;
selecting components needing reflow soldering process from the three-dimensional model of the PCB to be optimized, and setting each component on the soldering paste three-dimensional model according to the position information of the selected components on the three-dimensional model of the PCB to be optimized;
performing soldering paste welding simulation on the selected components and the soldering pads according to preset reflow soldering simulation parameters to form a reflow soldering simulation model of the PCB to be optimized;
carrying out PCB inspection on the reflow soldering simulation model of the PCB to be optimized so as to find out the problem to be optimized;
and aiming at the problem to be optimized, adopting corresponding design and optimization modification of the process.
The method for optimizing the simulation of reflow soldering provided by the present embodiment will be described in detail with reference to the drawings. Fig. 1 is a schematic flow chart illustrating a simulation optimization method for reflow soldering in an embodiment. As shown in fig. 1, the simulation optimization method for reflow soldering specifically includes the following steps:
and S11, generating a three-dimensional model of the PCB to be optimized. In this embodiment, the S11 includes directly receiving a three-dimensional model of the PCB circuit board to be optimized, which is created by a user; or generating a three-dimensional model of the PCB to be optimized according to the acquired EDA wiring data.
Specifically, the step of generating the three-dimensional model of the PCB to be optimized according to the acquired EDA wiring data comprises the following steps:
directly acquiring two-dimensional PCB graphic data of the PCB to be optimized from the cadence allegro phases API, and then generating a three-dimensional model of the PCB to be optimized according to the thickness of each layer of the PCB. The three-dimensional model of the PCB to be optimized comprises the thickness and the material of a conductive substance of each layer of the circuit board, the thickness and the material of an insulating layer, direct communicating holes and non-communicating holes between layers and the like.
And S12, generating a corresponding solder paste three-dimensional model according to the thickness of the steel mesh openings read in one by one or the thickness of the steel mesh openings generated by the pads. In this embodiment, if the PCB is a double-sided board, the TOP surface and BOTTOM surface of the PCB need to generate corresponding three-dimensional models of solder paste, and an example of the three-dimensional model of solder paste printed out from the opening of the steel mesh on the PCB is shown in fig. 2.
S13, selecting the components needing reflow soldering process from the three-dimensional model of the PCB to be optimized, and setting the three-dimensional model of each component on the three-dimensional model of the soldering paste according to the position information of the selected components on the three-dimensional model of the PCB to be optimized. In this embodiment, the selection criteria in selecting the components requiring the reflow soldering process from the three-dimensional model of the PCB to be optimized is as follows: according to the recommendation of a component manufacturer or the actual circuit board process condition. The position information of the selected components on the three-dimensional model of the PCB to be optimized comprises the coordinates and the angles of the selected components on the three-dimensional model of the PCB to be optimized.
Specifically, the recommended or actual circuit board process condition of a component manufacturer is used as a selection standard of components of the process needing reflow soldering, the components of the process needing reflow soldering are selected from the three-dimensional model of the PCB to be optimized, and the three-dimensional model of each component is arranged on the soldering paste three-dimensional model according to the coordinates and the angles of the selected components on the three-dimensional model of the PCB to be optimized. An exemplary diagram of the formed three-dimensional model of the solder paste is shown in fig. 3.
And S14, starting a reflow soldering parameter database, selecting preset reflow soldering simulation parameters, and reading in previous reflow soldering curve generation parameters (the solder profile generation parameters are parameters generated by generating a visual chart according to the preset reflow soldering simulation parameters and then reducing the visual chart into the visual chart, so that the solder profile generation parameters can be directly used). In this embodiment, the required parameters may be increased continuously depending on the accuracy of the reflow soldering simulation. In the present embodiment, the preset reflow simulation parameters include the length of the reflow, the temperature range of each section, the conveying speed of each section, and/or the length of each section.
S15, performing solder paste soldering simulation on the selected components and pads according to preset reflow soldering simulation parameters to form a reflow soldering simulation model of the PCB to be optimized, after the reflow soldering simulation model of the PCB to be optimized is generated (specifically, a three-dimensional soldering model of each solder point on the PCB to be optimized is generated), simulating and displaying stress variation (in this embodiment, stress variation of the components and the PCB indicates where the PCB is deformed during reflow soldering or/and causes changes such as bending of the components and cracks of the components and the like, and the changes can cause damage such as cracking of the components) of the components and the PCB during soldering and after soldering, wherein an exemplary diagram of the reflow soldering simulation model is shown in fig. 4.
S16, carrying out PCB inspection on the reflow soldering simulation model of the PCB to be optimized so as to find the problem to be optimized.
In this embodiment, the to-be-optimized problem includes a solder distance problem, a solder bridging problem, a component tombstoning problem, a component tilting problem, a component shift problem, and/or a component and circuit board stress deformation problem on the to-be-optimized PCB.
Specifically, the S16 includes:
checking the soldering tin distance on the PCB to be optimized;
checking the solder bridging on the PCB to be optimized;
carrying out tombstoning inspection on the selected components on the PCB to be optimized;
performing tilt inspection on the selected components on the PCB to be optimized;
carrying out offset inspection on the selected components on the PCB to be optimized; and/or
And carrying out stress deformation inspection on the selected components and the circuit board on the PCB to be optimized and the like.
For example, an inspection problem is reported when the solder pitch of the components is smaller than the preset solder pitch of 0.127mm in the reflow soldering simulation model shown in fig. 4, and then the three-dimensional model of the PCB to be optimized before reflow soldering is checked, and then the solder pitch caused by excessive solder paste of the left pad of R2 is inspected to be smaller than the preset solder pitch.
For example, another inspection problem is that the coordinate position deviation of the component is reported to exceed the preset deviation value by 0.005mm in the reflow soldering simulation model shown in fig. 4, the three-dimensional model of the PCB to be optimized before reflow soldering is checked, and it is immediately checked that the soldering of the left side solder paste is too fast due to the fact that the copper foil on one side of the component is too large, and the soldering of the right side solder paste is completed without being cooled, so that the position of the component is moved.
And S17, aiming at the problem to be optimized, adopting corresponding design and process optimization modification.
In this embodiment, the corresponding design and process optimization modifications include:
PCB wiring optimization: pads, wires, etc.; the optimization aims at the problems of too much or too little soldering tin and the like.
2. And (3) element selection optimization: changing manufacturers, customizing components, and the like; the optimization aims at the problems of poor welding and the like caused by oversize/undersize pins, overweight or too light weight of components.
3. Optimizing the steel mesh opening: opening redesign, etc.; the optimization aims at the problems of more solder balls, short circuit and the like.
4. The parameters of reflow soldering equipment are optimized, and even the reflow soldering function is customized; the optimization aims at the problems of insufficient solder joint and the like.
Optimizing the SMT equipment: coordinate offset of a chip mounter, AOI (automated optical inspection), and the addition of a process fool-proof means and the like. The optimization aims at the problems that 1 to 4 devices cannot be optimized and the like.
For example, for the above-mentioned inspection problem, the corresponding design and process optimization is modified to modify the steel mesh opening size;
for example, for the other inspection problem, the optimization of the corresponding design and process is modified to modify the size of the copper foil of the PCB design, or the design can be modified synchronously through the Cadence allogoro kill API.
In this embodiment, the above 5 kinds of problems to be optimized for welding can all be optimized, but there are high and low optimization costs and high and low optimization difficulty degrees. The priority sequence in turn is: 4>3>1>5>2, although this is also true.
And S18, if the PCB is not checked to find the problem to be optimized, outputting the reflow soldering simulation model of the PCB to be optimized. In the embodiment, the simulation optimization method of reflow soldering is applied without the need of AOI online learning of a sample as a standard test board.
The present embodiment also provides a computer storage medium (also referred to as a computer-readable storage medium) having a computer program stored thereon, which when executed by a processor implements the above-described simulation optimization method for reflow soldering.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the above method embodiments may be performed by hardware associated with a computer program. The aforementioned computer program may be stored in a computer readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
The simulation optimization method for reflow soldering provided by the embodiment can find possible soldering problems in advance through a reflow soldering simulation technology in a design stage, so that technicians can modify the design and optimization process, the workload which needs to be finished within several days originally is finished within 1-2 hours, and the manufacturing quality and the manufacturing efficiency of products are greatly improved; the original diagnosis and analysis of the lag production result of the electronic manufacturing enterprise are changed into simulation prevention at the front end of the design, and the problem points in the production can be prevented in advance; therefore, it can be said that the simulation optimization method for reflow soldering provided by the embodiment is an effective scheme and technical support for electronic manufacturing enterprises to realize intelligent manufacturing and industrial 4.0.
Example two
The present embodiment provides a reflow soldering simulation optimization system, including:
the generating module is used for generating a three-dimensional model of the PCB to be optimized;
the generating module is used for generating a corresponding soldering paste three-dimensional model according to the thickness of the steel mesh openings which are read in one by one or the thickness of the steel mesh openings generated by the bonding pads;
the device comprises a setting module, a soldering paste three-dimensional model and a control module, wherein the setting module is used for selecting components needing reflow soldering process from the three-dimensional model of the PCB to be optimized, and setting each component on the soldering paste three-dimensional model according to the position information of the selected components on the three-dimensional model of the PCB to be optimized;
the simulation module is used for carrying out soldering paste welding simulation on the selected components and the soldering pads according to preset reflow soldering simulation parameters to form a reflow soldering simulation model of the PCB to be optimized;
the inspection module is used for inspecting the PCB of the reflow soldering simulation model of the PCB to be optimized so as to find a problem to be optimized;
and the optimization modification module is used for carrying out corresponding design and process optimization modification aiming at the problem to be optimized.
The simulation optimization system for reflow soldering provided by the present embodiment will be described in detail with reference to the drawings. It should be noted that the division of each module of the following simulation optimization system is only a division of a logic function, and the actual implementation may be wholly or partially integrated into one physical entity, or may be physically separated. And the modules can be realized in a form that all software is called by the processing element, or in a form that all the modules are realized in a form that all the modules are called by the processing element, or in a form that part of the modules are called by the hardware. For example: the x module can be a separately established processing element, and can also be integrated in a certain chip of the following simulation optimization system. The x-module may be stored in the form of program code in a memory of the following apparatus, and a function of the following x-module may be called and executed by one of the processing elements of the apparatus. Other modules are implemented similarly. All or part of the modules can be integrated together or can be independently realized. The processing element described herein may be an integrated circuit having signal processing capabilities. In implementation, the steps of the above method or the following modules may be implemented by hardware integrated logic circuits in a processor element or instructions in software. The following modules may be one or more integrated circuits configured to implement the above methods, for example: one or more Application Specific Integrated Circuits (ASICs), one or more microprocessors (DSPs), one or more Field Programmable Gate Arrays (FPGAs), and the like. When some of the following modules are implemented in the form of a program code called by a processing element, the processing element may be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling the program code. These modules may be integrated together and implemented in the form of a System-on-a-chip (SOC).
Fig. 5 is a schematic structural diagram of a reflow soldering simulation optimization system in an embodiment. As shown in fig. 5, the simulation optimization system 5 for reflow soldering includes: the device comprises a generating module 51, a generating module 52, a setting module 53, a selecting module 54, a simulating module 55, a checking module 56, an optimizing module 57 and an outputting module 58.
The generating module 51 is used for generating a three-dimensional model of the PCB to be optimized. In this embodiment, the S11 includes directly receiving a three-dimensional model of the PCB circuit board to be optimized, which is created by a user; or generating a three-dimensional model of the PCB to be optimized according to the acquired EDA wiring data.
The generating module 51 is specifically configured to directly obtain two-dimensional PCB graphic data of the PCB to be optimized from the cadence aggregate twist API, and then generate a three-dimensional model of the PCB to be optimized according to the thickness of each layer of the PCB. The three-dimensional model of the PCB to be optimized comprises the thickness and the material of a conductive substance of each layer of the circuit board, the thickness and the material of an insulating layer, direct communicating holes and non-communicating holes between layers and the like.
The generating module 52 coupled to the generating module 51 is configured to generate a corresponding three-dimensional model of solder paste according to the thickness of the steel mesh openings read in one by one or according to the thickness of the steel mesh openings generated by the pads. In this embodiment, if the PCB is a double-sided board, the TOP surface and BOTTOM surface of the PCB need to generate corresponding three-dimensional models of solder paste, and an example of the three-dimensional model of solder paste printed out from the opening of the steel mesh on the PCB is shown in fig. 2.
The setting module 53 coupled to the generating module 51 and the generating module 52 is configured to select components requiring a reflow soldering process from the three-dimensional model of the PCB to be optimized, and set the three-dimensional model of each component on the three-dimensional model of the solder paste according to the position information of the selected component on the three-dimensional model of the PCB to be optimized. In this embodiment, the selection criteria in selecting the components requiring the reflow soldering process from the three-dimensional model of the PCB to be optimized is as follows: according to the recommendation of a component manufacturer or the actual circuit board process condition. The position information of the selected components on the three-dimensional model of the PCB to be optimized comprises the coordinates and the angles of the selected components on the three-dimensional model of the PCB to be optimized.
Specifically, the setting module 53 selects the components requiring the reflow soldering process from the three-dimensional model of the PCB to be optimized by using the recommended or actual circuit board process conditions of the component manufacturer as the selection criteria of the components requiring the reflow soldering process, and sets the three-dimensional model of each component on the solder paste three-dimensional model according to the coordinates and angles of the selected components on the three-dimensional model of the PCB to be optimized. An exemplary diagram of the formed three-dimensional model of the solder paste is shown in fig. 3.
The selecting module 54 coupled to the setting module 53 is configured to start a database of reflow soldering parameters, select preset reflow soldering simulation parameters, and read in previous solder reflow soldering curve generation parameters (the pointer profile generation parameters are visual charts generated according to the preset reflow soldering simulation parameters, and the parameters are restored from the charts, so that the pointer profile generation parameters can be directly used). In this embodiment, the required parameters may be increased continuously depending on the accuracy of the reflow soldering simulation. In the present embodiment, the preset reflow simulation parameters include the length of the reflow, the temperature range of each section, the conveying speed of each section, and/or the length of each section.
The simulation module 55 coupled to the setting module 53 and the selecting module 54 is configured to perform solder paste soldering simulation on the selected components and pads according to preset reflow soldering simulation parameters to form a reflow soldering simulation model of the PCB to be optimized, simulate and display stress variation (in this embodiment, stress variation of the components and the PCB refers to which place the PCB has deformation during reflow soldering and/or causes the components to have deformation and the like, and the variation may cause the components to crack and the like) of the components and the PCB during soldering and after soldering after the reflow soldering simulation model of the PCB to be optimized is generated (specifically, a three-dimensional soldering model of each solder point on the PCB to be optimized is generated), and an exemplary diagram of the reflow soldering simulation model is shown in fig. 4.
The inspection module 56 coupled to the simulation module 55 is used for performing PCB inspection on the reflow soldering simulation model of the PCB to be optimized to find out the problem to be optimized.
In this embodiment, the to-be-optimized problem includes a solder distance problem, a solder bridging problem, a component tombstoning problem, a component tilting problem, a component shift problem, and/or a component and circuit board stress deformation problem on the to-be-optimized PCB.
Specifically, the inspection module 56 is configured to inspect a solder distance on the PCB to be optimized; checking the solder bridging on the PCB to be optimized; carrying out tombstoning inspection on the selected components on the PCB to be optimized; performing tilt inspection on the selected components on the PCB to be optimized; carrying out offset inspection on the selected components on the PCB to be optimized; and/or performing stress deformation inspection and the like on the selected components and the circuit board on the PCB to be optimized.
An optimization module 57 coupled to the inspection module 56 is used to adapt the corresponding design and process optimization modifications to the problem to be optimized.
In this embodiment, the optimization and modification of the design and process corresponding to the optimization module 57 includes:
PCB wiring optimization: pads, wires, etc.; the optimization aims at the problems of too much or too little soldering tin and the like.
2. And (3) element selection optimization: changing manufacturers, customizing components, and the like; the optimization aims at the problem of poor welding caused by oversize/undersize pins and overweight or too light weight of components.
3. Optimizing the steel mesh opening: opening redesign, etc.; the optimization aims at the problems of more solder balls, short circuit and the like.
4. The parameters of reflow soldering equipment are optimized, and even the reflow soldering function is customized; the optimization aims at the problems of insufficient solder joint and the like.
Optimizing the SMT equipment: coordinate offset of a chip mounter, AOI (automated optical inspection), and the addition of a process fool-proof means and the like. The optimization aims at the problems that 1 to 4 devices cannot be optimized and the like.
And the output module 58 coupled to the optimization module 57 is configured to output the reflow soldering simulation model of the PCB to be optimized if no problem to be optimized is found in the inspection of the PCB. In this embodiment, the simulation optimization system applying reflow soldering does not need AOI to learn a sample as a standard test board online.
EXAMPLE III
This embodiment provides an apparatus, comprising: a processor, memory, transceiver, communication interface, or/and system bus; the memory is used for storing the computer program, the communication interface is used for communicating with other devices, and the processor and the transceiver are used for running the computer program to enable the devices to execute the steps of the simulation optimization method of reflow soldering according to the first embodiment.
The above-mentioned system bus may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The system bus may be divided into an address bus, a data bus, a control bus, and the like. The communication interface is used for realizing communication between the database access device and other equipment (such as a client, a read-write library and a read-only library). The Memory may include a Random Access Memory (RAM), and may further include a non-volatile Memory (non-volatile Memory), such as at least one disk Memory.
The Processor may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the integrated Circuit may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, or discrete hardware components.
The protection scope of the simulation optimization method for reflow soldering according to the present invention is not limited to the execution sequence of the steps listed in the embodiment, and all the solutions implemented by adding, subtracting, and replacing the steps in the prior art according to the principles of the present invention are included in the protection scope of the present invention.
The invention also provides a reflow soldering simulation optimization system, which can realize the reflow soldering simulation optimization method, but the realization device of the reflow soldering simulation optimization method of the invention includes but is not limited to the structure of the reflow soldering simulation optimization system listed in the embodiment, and all structural deformation and replacement of the prior art made according to the principle of the invention are included in the protection scope of the invention.
In summary, the reflow soldering simulation optimization method, system, computer storage medium and device provided by the invention can find possible soldering problems in advance by the reflow soldering simulation technology in the design stage, so that technicians can modify the design and optimization process, the workload which needs to be finished within several days originally can be finished within 1-2 hours, and the manufacturing quality and the manufacturing efficiency of products are greatly improved; the original diagnosis and analysis of the lag production result of the electronic manufacturing enterprise are changed into simulation prevention at the front end of the design, and the problem points in the production can be prevented in advance; therefore, it can be said that the simulation optimization method for reflow soldering provided by the embodiment is an effective scheme and technical support for electronic manufacturing enterprises to realize intelligent manufacturing and industrial 4.0. The invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (9)
1. A simulation optimization method for reflow soldering is characterized by comprising the following steps:
generating a three-dimensional model of the PCB to be optimized;
generating a corresponding soldering paste three-dimensional model according to the thickness of the steel mesh openings which are read in one by one or the thickness of the steel mesh openings generated by the soldering pads;
selecting components needing reflow soldering process from the three-dimensional model of the PCB to be optimized, and setting each component on the soldering paste three-dimensional model according to the position information of the selected components on the three-dimensional model of the PCB to be optimized;
starting a reflow soldering parameter database, selecting preset reflow soldering simulation parameters, and reading in previous reflow soldering curve generation parameters;
performing soldering paste welding simulation on the selected components and the soldering pads according to preset reflow soldering simulation parameters to form a reflow soldering simulation model of the PCB to be optimized; after forming a reflow soldering simulation model of the PCB to be optimized, simulating and displaying stress changes of components and the PCB during soldering and after soldering;
carrying out PCB inspection on the reflow soldering simulation model of the PCB to be optimized so as to find out the problem to be optimized;
and aiming at the problem to be optimized, adopting corresponding design and optimization modification of the process.
2. The reflow soldering simulation optimization method according to claim 1, wherein if no problem to be optimized is found in the inspection of the PCB, the reflow soldering simulation optimization method further comprises outputting a reflow soldering simulation model of the PCB to be optimized.
3. The reflow soldering simulation optimization method according to claim 1, wherein the generating of the three-dimensional model of the PCB to be optimized comprises:
directly receiving a three-dimensional model of a PCB to be optimized, which is created by a user; or
And generating a three-dimensional model of the PCB to be optimized according to the acquired EDA wiring data.
4. The method of simulation optimization of reflow soldering according to claim 1,
the selection standard of the components needing the reflow soldering process selected from the three-dimensional model of the PCB to be optimized is as follows: according to the recommendation of a component manufacturer or the actual circuit board process condition;
the position information of the selected component on the three-dimensional model of the PCB to be optimized comprises the coordinate and the angle of the selected component on the three-dimensional model of the PCB to be optimized;
the preset reflow soldering simulation parameters comprise the length of reflow soldering, the temperature range of each section, the conveying speed of each section and/or the length of each section.
5. The reflow solder simulation optimization method of claim 1, wherein the to-be-optimized problem includes a solder distance problem, a solder bridging problem, a component tombstoning problem, a component tilting problem, a component offset problem, and/or a component and circuit board stress deformation problem on the to-be-optimized PCB.
6. The reflow soldering simulation optimization method according to claim 5, wherein the step of checking the PCB circuit board of the reflow soldering simulation model of the PCB circuit board to be optimized comprises the following steps:
checking the soldering tin distance on the PCB to be optimized;
checking the solder bridging on the PCB to be optimized;
carrying out tombstoning inspection on the selected components on the PCB to be optimized;
performing tilt inspection on the selected components on the PCB to be optimized;
carrying out offset inspection on the selected components on the PCB to be optimized; and/or
And carrying out stress deformation inspection on the selected components and the circuit board on the PCB to be optimized.
7. A simulation optimization system for reflow soldering, comprising:
the generating module is used for generating a three-dimensional model of the PCB to be optimized;
the generating module is used for generating a corresponding soldering paste three-dimensional model according to the thickness of the steel mesh openings which are read in one by one or the thickness of the steel mesh openings generated by the bonding pads;
the device comprises a setting module, a soldering paste three-dimensional model and a control module, wherein the setting module is used for selecting components needing reflow soldering process from the three-dimensional model of the PCB to be optimized, and setting each component on the soldering paste three-dimensional model according to the position information of the selected components on the three-dimensional model of the PCB to be optimized;
the selection module is used for starting a reflow soldering parameter database, selecting preset reflow soldering simulation parameters and reading in previous reflow soldering curve generation parameters;
the simulation module is used for carrying out soldering paste welding simulation on the selected components and the soldering pads according to preset reflow soldering simulation parameters to form a reflow soldering simulation model of the PCB to be optimized; after forming a reflow soldering simulation model of the PCB to be optimized, simulating and displaying stress changes of components and the PCB during soldering and after soldering;
the inspection module is used for inspecting the PCB of the reflow soldering simulation model of the PCB to be optimized so as to find a problem to be optimized;
and the optimization modification module is used for carrying out corresponding design and process optimization modification aiming at the problem to be optimized.
8. A computer storage medium having a computer program stored thereon, wherein the program, when executed by a processor, implements a method for simulation optimization of reflow soldering according to any one of claims 1 to 6.
9. An apparatus, comprising: a processor and a memory;
the memory is used for storing a computer program, and the processor is used for executing the computer program stored by the memory to cause the device to execute the simulation optimization method of reflow soldering according to any one of claims 1 to 6.
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| CN201811277969.8A CN109241681B (en) | 2018-10-30 | 2018-10-30 | Reflow soldering simulation optimization method and system, computer storage medium and equipment |
| PCT/CN2019/082638 WO2020087874A1 (en) | 2018-10-30 | 2019-04-15 | Reflow soldering simulation optimization method and system, computer storage medium, and device |
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| CN109241681B (en) * | 2018-10-30 | 2020-09-08 | 上海望友信息科技有限公司 | Reflow soldering simulation optimization method and system, computer storage medium and equipment |
| CN110209066A (en) * | 2019-05-05 | 2019-09-06 | 珠海格力电器股份有限公司 | Control method, device and equipment of welding furnace |
| CN110197019B (en) * | 2019-05-20 | 2021-09-10 | 上海望友信息科技有限公司 | Process design method, system, medium and equipment based on system packaging technology |
| CN110633544A (en) * | 2019-09-25 | 2019-12-31 | 北京轩宇空间科技有限公司 | Modeling method for system-in-package module and electronic device |
| CN111274697B (en) * | 2020-01-19 | 2023-10-27 | 上海望友信息科技有限公司 | Simulation method and simulation device for welding tension, electronic equipment and storage medium |
| CN111753458A (en) * | 2020-07-03 | 2020-10-09 | 北京航天微电科技有限公司 | Reflow soldering temperature field analysis method and device, and computer equipment |
| CN114036887A (en) * | 2021-12-08 | 2022-02-11 | 深圳Tcl新技术有限公司 | Clock signal circuit design method, clock signal circuit design device, storage medium and electronic equipment |
| CN114417626B (en) * | 2022-01-24 | 2023-01-10 | 深圳市采芯检测科技有限公司 | Method and device for detecting assemblability, method and medium for checking bill of materials |
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