CN108170918B - Cold plate audit methods, systems, computer readable storage media and apparatus - Google Patents
Cold plate audit methods, systems, computer readable storage media and apparatus Download PDFInfo
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- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
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Abstract
The invention provides a cold plate examination method, a system, a computer readable storage medium and equipment, comprising: extracting at least one object from the input design information of the printed circuit board, and acquiring vector information of a cold plate; and step two, checking the corresponding relation of the vector information of the object and the cold plate according to a pre-created checking condition data structure so as to generate a checking grade report. The cold plate examination method, the cold plate examination system, the computer readable storage medium and the cold plate examination equipment can shorten the time for manually examining the cold plate from 1 to 3 hours to several minutes, avoid the omission of manual examination and improve the examination precision; the original manual spot check is changed into a comprehensive and non-exhaustive automatic check, so that an engineer can find problems possibly caused after the cold plate is installed on the PCB in time; the method is beneficial to improving the manufacturing quality and efficiency and reducing the production cost of electronic enterprises.
Description
Technical Field
The invention belongs to the technical field of circuit board detection, relates to an examination method and system, and particularly relates to an examination method and system of a cold plate, a computer-readable storage medium and equipment.
Background
Designers in the electronics industry often design a cold plate for component heat dissipation when designing PCB boards, primarily for component heat dissipation purposes, as well as for the purpose of supporting the PCBA and increasing strength. Currently, there are cold plates designed for DIP package components and cold plates designed for SMD surface mount components in the industry.
For a cold plate designed by a DIP plug-in component, the process requirement is that the cold plate is installed firstly, and then the plug-in component is installed. The cold plate is a metal plate with the same integral thickness and needs to be tightly attached to the PCB for fixing; the lower surface of the DIP plug-in body which needs heat dissipation is tightly attached to the cold plate, and plug-in components equivalent to DIP are mounted on the cold plate strip in a riding mode. For plug-in components that do not require heat dissipation, such as plug capacitors, connectors, etc., the mounting location of the cold plate to the component may be hollowed out to allow it to be mounted properly, as in a mounting without a cold plate.
The existing methods generate two types of cold plates for the DIP package elements above:
1. region drawing is performed manually by the designer according to the positions of the elements which need to dissipate heat: if the component areas are hollowed out, the metal plates are arranged at the places, and the plug hole areas are hollowed out;
2. the cold plate pattern is automatically generated by software.
The cold plate patterns generated by the above two methods may cause problems in practical production, such as components and various pads on the PCB, which may cause problems in terms of collision, interference, maintenance, etc. after practical assembly. These problems are currently detected in the industry by engineers manually comparing the cold plate drawing to the PCB to inspect the areas that may cause the problems, or at the time of actual assembly. Such an examination method is not only inefficient and less accurate, but also has many problems that cannot be found by the above-described methods.
Therefore, it is a technical problem to be solved by those skilled in the art how to provide a cold plate review method, system, computer readable storage medium and apparatus to solve the problems of low efficiency and low accuracy caused by manually comparing a cold plate drawing with a PCB by an engineer in the prior art.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a cold plate inspection method, system, computer-readable storage medium and device, which are used to solve the problems of low efficiency and low accuracy caused by manual comparison between a cold plate drawing and a PCB by an engineer in the prior art.
To achieve the above and other related objects, an aspect of the present invention provides a method of inspecting a cold plate, comprising: extracting at least one object from the input design information of the printed circuit board, and acquiring vector information of a cold plate; and step two, checking the corresponding relation of the vector information of the object and the cold plate according to a pre-created checking condition data structure so as to generate a checking grade report.
In an embodiment of the present invention, the object includes a component, a hole, a pad, a solder mask and/or a silk-screen text; the vector information of the cold plate includes the metal area and the hollowed area pattern size of the cold plate.
In an embodiment of the present invention, the pre-created examination condition data structure includes: an audit name; a subtype of the censored name; a description of the review item; whether this review is in effect; a recommended value of a correspondence of the vector information of the object and the cold plate; a screening condition of an object in the design information of the printed circuit board; and screening conditions of vector information of the cold plate.
In an embodiment of the present invention, the correspondence between the vector information of the object and the vector information of the cold plate includes a distance therebetween and a degree of coverage including collision therebetween; the second step comprises the following steps: screening out the object in the design information of the printed circuit board and the vector information of the cold plate according to the screening condition of the object in the design information of the printed circuit board and the screening condition of the vector information of the cold plate; measuring the distance between the object in the design information of the printed circuit board and the vector information of the cold plate or the degree of collision between the object and the vector information of the cold plate; a measurement result between the object in the design information of the printed circuit board and the vector information of the cold plate is obtained.
In an embodiment of the present invention, the second step further includes: determining a grade report result screening value matched with the measurement result according to the measurement result; the grade report result screening value is used to indicate that the measurement result is unacceptable, warning, or acceptable.
In an embodiment of the present invention, the step of generating the review level report includes: and compiling the description of the examination item, the object in the screened design information of the printed circuit board, the measurement result and the recommended value of the corresponding relation between the object and the vector information of the cold plate into a report result.
In an embodiment of the present invention, the method for examining the cold plate further includes performing step two in a loop until all objects are examined with respect to the corresponding relationship of the vector information of the cold plate.
In another aspect, the invention provides a cold plate audit system comprising: the extraction module is used for extracting at least one object from the input design information of the printed circuit board; the acquisition module is used for acquiring vector information of the cold plate; and the examination module is used for examining the corresponding relation between the vector information of the object and the cold plate according to a pre-created examination condition data structure so as to generate an examination grade report.
Yet another aspect of the present invention provides a computer readable storage medium having stored thereon a computer program that, when executed by a processor, performs the cold plate audit method.
A final aspect of the invention provides an apparatus comprising: a processor and a memory; the memory is configured to store a computer program and the processor is configured to execute the computer program stored by the memory to cause the apparatus to perform the cold plate audit method.
As described above, the cold plate audit method, system, computer readable storage medium and apparatus of the present invention have the following advantages:
the cold plate examination method, the cold plate examination system, the computer readable storage medium and the cold plate examination equipment can shorten the time for manually examining the cold plate from 1 to 3 hours to several minutes, avoid the omission of manual examination and improve the examination precision; the original manual spot check is changed into a comprehensive and non-exhaustive automatic check, so that an engineer can find problems possibly caused after the cold plate is installed on the PCB in time; the method is beneficial to improving the manufacturing quality and efficiency and reducing the production cost of electronic enterprises.
Drawings
Fig. 1A is a flow chart illustrating an exemplary cold plate inspection method according to the present invention.
Fig. 1B is a schematic flow chart illustrating the process of S13 in the cold plate inspection method according to the present invention.
Fig. 2 is an object diagram of the PCB graph of the present invention.
Fig. 3 shows a top view of the cold plate installation of the present invention.
Fig. 4 is a schematic structural diagram of an inspection system for cold plates according to an embodiment of the present invention.
Description of the element reference numerals
4 Cold plate audit System
41 extraction module
42 acquisition module
43 review Module
44 circulation module
S11-S14
S131 to 135
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
Example one
The embodiment provides an inspection method of a cold plate, which comprises the following steps:
extracting at least one object from the inputted design information of the printed circuit board, and acquiring vector information of the cold plate;
and according to a pre-created examination condition data structure, examining the corresponding relation between the object and the vector information of the cold plate so as to generate an examination grade report.
The method of examining the cold plate provided in the present embodiment will be described in detail below with reference to the drawings. Referring to fig. 1A, a flow chart of a cold plate inspection method in one embodiment is shown. As shown in fig. 1A, the method for inspecting a cold plate specifically includes the following steps:
s11, extracting at least one object from the inputted design information of the pcb. In this embodiment, the object includes a component, a hole, a pad, a solder mask, and/or silk-screen text, etc., as shown in the object diagram of the PCB graph shown in fig. 2.
And S12, acquiring vector information of the cold plate. In this embodiment, the vector information of the cold plate includes the metal area and the hollowed area pattern size of the cold plate.
Specifically, based on the design information of the printed circuit board, various items of size information such as the pin size of each contained heat dissipation element and the element size not requiring heat dissipation are determined, and the obtained size information is correspondingly amplified based on a predetermined amplification rule, so that vector information corresponding to the cold plate is generated based on the amplified various items of size information.
For example, based on the enlarged various dimensional information, the hollowed out area required to create a cold plate is determined.
And S13, checking the corresponding relation between the vector information of the object and the cold plate according to the pre-created checking condition data structure to generate a checking grade report.
In this embodiment, the pre-created examination condition data structure includes:
an audit name;
marking the beginning;
a subtype of the censored name;
a description of the review item;
whether this review is in effect;
a recommended value of a correspondence of the vector information of the object and the cold plate;
a screening condition of an object in the design information of the printed circuit board;
screening conditions of vector information of the cold plate;
a first grade report result screening value;
a second level report result screening value;
a third level reports the result screening value;
outputting a review grade report;
the marking is finished.
In this embodiment, the correspondence relationship between the vector information of the object and the cold plate includes the distance therebetween and the degree of collision between the two.
For example, the distance of components and parts to the cold drawing, the hole is to the distance of cold drawing, the pad is to the distance of cold drawing, hinder the distance of windowing to the cold drawing, silk screen printing characters are to the distance of cold drawing, the cold drawing covers the degree that contains collision silk screen printing characters, the cold drawing covers the degree that contains collision pad, the cold drawing covers the degree that contains collision hole, the cold drawing covers the degree that contains components and parts, the pin after the relevant DIP plug-in components installation stretches out PCB length (PCB thickness + cold plate thickness, only be applicable to the DIP plug-in components of installing on the cold plate entity), height (components and parts height + cold plate thickness) after the relevant DIP plug-in components installation etc..
Please refer to fig. 1B, which shows a schematic flow chart of S13. As shown in fig. 1B, the S13 includes the following steps:
s131, screening out the object in the design information of the printed circuit board and the vector information of the cold plate according to the screening condition of the object in the design information of the printed circuit board and the screening condition of the vector information of the cold plate.
And S132, measuring the distance between the object in the design information of the printed circuit board and the vector information of the cold plate or the degree of collision between the object and the vector information of the cold plate.
And S133, obtaining a measurement result between the object in the design information of the printed circuit board and the vector information of the cold plate.
S134, determining a grade report result screening value matched with the measurement result according to the measurement result; the grade report result screening value is used to indicate that the measurement result is unacceptable, warning, or acceptable. In this embodiment, the first level report result screening value indicates that the measurement result is unacceptable, the second level report result screening value indicates that the measurement result is warning, and the third level report result screening value indicates that the measurement result is acceptable.
And S135, compiling the description of the examination item, the object in the screened printed circuit board design information, the measurement result and the recommended value of the corresponding relation between the object and the vector information of the cold plate into a report result.
The following pre-created audit condition data structure exemplifies the audit of the device-to-cold plate distance:
[CompToFeature_Difflayer]
:STR
Subcategory＝CompToCool
CheckItem ═ inspection element to cold plate distance
Check＝True
RECValue＝<1.0mm(40mil)
CON1＝LAYER_TYPE{component},comptype{}
CON2＝LAYER_TYPE{COOLINGPLATE},FEATURE{Pad,Polygon}
COL1＝(0～1.0)
COL2＝
COL3＝
OUT1＝COMPTYPE{DIP,Fiducial,TP}
:END。
ComptoFeatur _ Difflayer is the censored name;
STR is the mark start;
subcateggory ═ ComptoCool is a sub-category of censored names;
CheckItem is a description of the censored item;
check states for True that checking is required and checks for False that this item can be skipped directly.
The CON1 is LAYER _ TYPE { component }, where LAYER _ TYPE { component } in the component { } represents all components in the component LAYER, and the component { } represents a TYPE, which is not limited. LAYER _ TYPE { component }, and component { } represents screening out all components on the PCB.
CON2 ═ LAYER _ TYPE { cooling gplate }, FEATURE { Pad, Polygon }. LAYER _ TYPE { cooling board } represents the cold plate LAYER, and FEATURE { Pad, Polygon } represents the object of all pads and polygons. The object names can be defined by self, and flexible screening can be performed conveniently.
Referring to FIG. 3, a top view of the cold plate installation is shown. As shown in fig. 3, objects screened by CON1 and CON2 are used to calculate the distance between the device U1 and the cold plate. For example, the metal distance D between the component and the cold plate is 0.8 mm.
The fact that the distance D between the component and the cold plate is 0.8mm belongs to a first-grade reported result screening value COL1 (0-1.0).
In the present embodiment, the reporting condition again requires OUT1 to be complete { DIP, five, TP }: the required report output of the plug-in, the optical point and the test point is contained. U1 is a DIP card.
Check item-check element-to-cold plate distance, element-U1, measurement 0.8, recommended value <1.0mm (40mil) compiled into report results.
The following pre-created audit condition data structure exemplifies an audit with a cold plate covering an impact pad:
[FeatureTouchFeature]
:STR
Subcategory＝CoolCoverFootprint
cold plate overlay pad
Check＝True
RECValue＝<1.0mm(40mil)
CON1＝LAYER_TYPE{pads},FEATURE{pad},usage{pin}
CON2＝LAYER_TYPE{COOLINGPLATE},FEATURE{Pad,Polygon}
COL1＝True
COL2＝
COL3＝
OUT1＝
:END
And S14, executing the step S13 in a circulating way until all the objects are examined to be in the corresponding relation with the vector information of the cold plate.
The present embodiments also provide a computer-readable storage medium having stored thereon a computer program that, when executed by a processor, performs the cold plate audit method. Those of ordinary skill in the art will understand that: all or part of the steps for implementing the above method embodiments may be performed by hardware associated with a computer program. The aforementioned computer program may be stored in a computer readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
The cold plate inspection method and the computer-readable storage medium for realizing the cold plate inspection method can shorten the time for manually inspecting the cold plate from 1 to 3 hours to several minutes, thereby avoiding the omission of manual inspection and improving the inspection precision; the original manual spot check is changed into a comprehensive and non-exhaustive automatic check, so that an engineer can find problems possibly caused after the cold plate is installed on the PCB in time; the method is beneficial to improving the manufacturing quality and efficiency and reducing the production cost of electronic enterprises.
Example two
The present embodiments provide a cold plate audit system comprising:
the extraction module is used for extracting at least one object from the input design information of the printed circuit board;
the acquisition module is used for acquiring vector information of the cold plate;
and the examination module is used for examining the corresponding relation between the vector information of the object and the cold plate according to a pre-created examination condition data structure so as to generate an examination grade report.
The cold plate audit system provided by the present embodiment will be described in detail below with reference to the drawings. It should be noted that the division of the modules in the above examination system is only a division of logical functions, and the actual implementation may be wholly or partially integrated into one physical entity or may be physically separated. And these modules can be realized in the form of software called by processing element; or may be implemented entirely in hardware; and part of the modules can be realized in the form of calling software by the processing element, and part of the modules can be realized in the form of hardware. For example, the x module may be a processing element that is set up separately, or may be implemented by being integrated in a chip of the apparatus, or may be stored in a memory of the apparatus in the form of program code, and the function of the x module may be called and executed by a processing element of the apparatus. Other modules are implemented similarly. In addition, all or part of the modules can be integrated together or can be independently realized. The processing element described herein may be an integrated circuit having signal processing capabilities. In implementation, each step of the above method or each module above may be implemented by an integrated logic circuit of hardware in a processor element or an instruction in the form of software.
For example, the above modules may be one or more integrated circuits configured to implement the above methods, such as: one or more Application Specific Integrated Circuits (ASICs), or one or more microprocessors (DSPs), or one or more Field Programmable Gate Arrays (FPGAs), etc. For another example, when some of the above modules are implemented in the form of a processing element calling program code, the processing element may be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. For another example, these modules may be integrated together and implemented in the form of a system-on-a-chip (SOC).
Referring to fig. 4, a schematic structural diagram of a cold plate audit system in one embodiment is shown. As shown in fig. 4, the cold plate audit system 4 includes: an extraction module 41, an acquisition module 42, an examination module 43, and a loop module 44.
The extracting module 41 is configured to extract at least one object from the inputted design information of the printed circuit board. In this embodiment, the object includes a component, a hole, a pad, a solder mask, and/or silk-screen text, etc., as shown in the object diagram of the PCB graph shown in fig. 2.
An acquisition module 42 coupled to the extraction module 41 is used to acquire vector information of the cold plate. In this embodiment, the vector information of the cold plate includes the metal area and the hollowed area pattern size of the cold plate.
Specifically, the obtaining module 42 determines various items of size information, such as the pin size of each included heat dissipation element and the size of an element that does not need heat dissipation, based on the design information of the printed circuit board, and performs corresponding amplification on the obtained size information based on a predetermined amplification rule, so as to generate vector information corresponding to the cold plate based on the amplified various items of size information.
For example, the acquisition module 42 determines the hollowed out area needed to create a cold plate based on the enlarged various dimensional information.
The examination module 43 coupled to the extraction module 41 and the acquisition module 42 is configured to examine the correspondence between the vector information of the object and the cold plate according to a pre-created examination condition data structure to generate an examination level report.
In this embodiment, the pre-created examination condition data structure includes:
an audit name;
marking the beginning;
a subtype of the censored name;
a description of the review item;
whether this review is in effect;
a recommended value of a correspondence of the vector information of the object and the cold plate;
a screening condition of an object in the design information of the printed circuit board;
screening conditions of vector information of the cold plate;
a first grade report result screening value;
a second level report result screening value;
a third level reports the result screening value;
outputting a review grade report;
the marking is finished.
In this embodiment, the correspondence relationship between the vector information of the object and the cold plate includes the distance therebetween and the degree of collision between the two.
For example, the distance of components and parts to the cold drawing, the hole is to the distance of cold drawing, the pad is to the distance of cold drawing, hinder the distance of windowing to the cold drawing, silk screen printing characters are to the distance of cold drawing, the cold drawing covers the degree that contains collision silk screen printing characters, the cold drawing covers the degree that contains collision pad, the cold drawing covers the degree that contains collision hole, the cold drawing covers the degree that contains components and parts, the pin after the relevant DIP plug-in components installation stretches out PCB length (PCB thickness + cold plate thickness, only be applicable to the DIP plug-in components of installing on the cold plate entity), height (components and parts height + cold plate thickness) after the relevant DIP plug-in components installation etc..
The examination module 43 is specifically configured to screen out the object in the design information of the printed circuit board and the vector information of the cold plate according to the screening condition of the object in the design information of the printed circuit board and the screening condition of the vector information of the cold plate; measuring the distance between the object in the design information of the printed circuit board and the vector information of the cold plate or the degree of collision between the object and the vector information of the cold plate; obtaining a measurement result between an object in the design information of the printed circuit board and the vector information of the cold plate; determining a grade report result screening value matched with the measurement result according to the measurement result; the grade report result screening value is used to indicate that the measurement result is unacceptable, warning, or acceptable. In this embodiment, the first level report result screening value indicates that the measurement result is unacceptable, the second level report result screening value indicates that the measurement result is warning, and the third level report result screening value indicates that the measurement result is acceptable; and compiling the description of the examination item, the object in the screened design information of the printed circuit board, the measurement result and the recommended value of the corresponding relation between the object and the vector information of the cold plate into a report result.
The circulation module 44 coupled to the examination module 43 is used for circularly calling the examination module 43 until all objects are examined to correspond to the vector information of the cold plate.
EXAMPLE III
The present embodiment provides an apparatus, comprising: a processor, a memory, a transceiver, a communication interface, and a system bus; the memory is used for storing the computer program, the communication interface is used for communicating with other equipment, and the processor and the transceiver are used for operating the computer program to enable the x device to execute the steps of the cold plate examination method according to the embodiment one.
The above-mentioned system bus may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The system bus may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one thick line is shown, but this does not mean that there is only one bus or one type of bus. The communication interface is used for realizing communication between the database access device and other equipment (such as a client, a read-write library and a read-only library). The memory may include a Random Access Memory (RAM), and may further include a non-volatile memory (non-volatile memory), such as at least one disk memory.
The processor may be a general-purpose processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the integrated circuit may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic device, or discrete hardware components.
In summary, the cold plate examination method, the cold plate examination system, the computer-readable storage medium and the cold plate examination device can shorten the time for manually examining the cold plate from 1 to 3 hours to several minutes, avoid the omission of manual examination and improve the examination precision; the original manual spot check is changed into a comprehensive and non-exhaustive automatic check, so that an engineer can find problems possibly caused after the cold plate is installed on the PCB in time; the method is beneficial to improving the manufacturing quality and efficiency and reducing the production cost of electronic enterprises. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (7)
1. A method of auditing a cold plate, comprising:
extracting at least one object from the input design information of the printed circuit board, and acquiring vector information of a cold plate; the vector information of the cold plate comprises the graphic size of a metal area and a hollowed area of the cold plate;
secondly, checking the corresponding relation between the vector information of the object and the cold plate according to a pre-established checking condition data structure to generate a checking grade report; the pre-created audit condition data structure comprises recommended values for the correspondence of the vector information of the object and the cold plate; a screening condition of an object in the design information of the printed circuit board; screening conditions of vector information of the cold plate; the corresponding relation of the vector information of the object and the cold plate comprises the distance between the object and the cold plate and the degree of collision between the object and the cold plate;
wherein, the step of examining the corresponding relation of the vector information of the object and the cold plate according to the pre-created examination condition data structure comprises the following steps:
screening out the object in the design information of the printed circuit board and the vector information of the cold plate according to the screening condition of the object in the design information of the printed circuit board and the screening condition of the vector information of the cold plate;
measuring the distance between the object in the design information of the printed circuit board and the vector information of the cold plate or the degree of collision between the object and the vector information of the cold plate;
obtaining a measurement result between an object in the design information of the printed circuit board and the vector information of the cold plate;
determining a grade report result screening value matched with the measurement result according to the measurement result; the grade report result screening value is used for indicating that the measurement result is not acceptable, warning or acceptable;
and circularly executing the second step until the corresponding relation between all the objects and the vector information of the cold plate is examined, so as to realize comprehensive and exhaustive automatic inspection.
2. The cold plate audit method according to claim 1,
the objects include components, holes, pads, solder masks and/or silk-screen text.
3. The cold plate audit method according to claim 1, wherein the pre-created audit condition data structure includes:
an audit name;
a subtype of the censored name;
a description of the review item;
this examination is in effect.
4. The cold plate audit method according to claim 1,
the step of generating a review grade report includes: and compiling the description of the examination item, the object in the screened design information of the printed circuit board, the measurement result and the recommended value of the corresponding relation between the object and the vector information of the cold plate into a report result.
5. An audit system for a cold plate comprising:
the extraction module is used for extracting at least one object from the input design information of the printed circuit board;
the acquisition module is used for acquiring vector information of the cold plate; the vector information of the cold plate comprises the graphic size of a metal area and a hollowed area of the cold plate;
the examination module is used for examining the corresponding relation between the vector information of the object and the cold plate according to a pre-established examination condition data structure so as to generate an examination grade report; the pre-created audit condition data structure comprises recommended values for the correspondence of the vector information of the object and the cold plate; a screening condition of an object in the design information of the printed circuit board; screening conditions of vector information of the cold plate; the corresponding relation of the vector information of the object and the cold plate comprises the distance between the object and the cold plate and the degree of collision between the object and the cold plate;
the examination module screens out the object in the design information of the printed circuit board and the vector information of the cold plate according to the screening condition of the object in the design information of the printed circuit board and the screening condition of the vector information of the cold plate; measuring the distance between the object in the design information of the printed circuit board and the vector information of the cold plate or the degree of collision between the object and the vector information of the cold plate; obtaining a measurement result between an object in the design information of the printed circuit board and the vector information of the cold plate; determining a grade report result screening value matched with the measurement result according to the measurement result; the grade report result screening value is used for indicating that the measurement result is not acceptable, warning or acceptable; and circularly calling the examination module until the corresponding relation between all the objects and the vector information of the cold plate is examined, so as to realize comprehensive and exhaustive automatic examination.
6. A computer-readable storage medium, on which a computer program is stored, which, when executed by a processor, implements the cold plate audit method according to any one of claims 1 to 4.
7. An apparatus, comprising: a processor and a memory;
the memory is configured to store a computer program and the processor is configured to execute the computer program stored by the memory to cause the apparatus to perform the cold plate audit method according to any one of claims 1 to 4.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711386769.1A CN108170918B (en) | 2017-12-20 | 2017-12-20 | Cold plate audit methods, systems, computer readable storage media and apparatus |
| PCT/CN2018/090383 WO2019119737A1 (en) | 2017-12-20 | 2018-06-08 | Cold plate examination method and system, computer-readable storage medium and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711386769.1A CN108170918B (en) | 2017-12-20 | 2017-12-20 | Cold plate audit methods, systems, computer readable storage media and apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000113005A (en) * | 1998-10-05 | 2000-04-21 | Nec Corp | Automatic component arrangement processing method |
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| CN1459716A (en) * | 2002-05-22 | 2003-12-03 | 华为技术有限公司 | Automatic checking device of printed-wiring board designing and its method |
| CN100541502C (en) * | 2007-12-13 | 2009-09-16 | 来新泉 | A kind of PCB analogue system and its implementation with error detection function |
| CN102073775B (en) * | 2011-01-18 | 2012-08-08 | 西安电子科技大学 | Method for checking electric fitting data of printed circuit board |
| CN102214261B (en) * | 2011-07-11 | 2014-03-12 | 西安电子科技大学 | Method for automatic check of process data of printed circuit board |
| CN103164544A (en) * | 2011-12-09 | 2013-06-19 | 鸿富锦精密工业（深圳）有限公司 | Detection system and detection method |
| CN103037670B (en) * | 2012-12-07 | 2015-08-05 | 陕西千山航空电子有限责任公司 | A kind of for printed circuit board heat radiation process |
| CN103870619A (en) * | 2012-12-13 | 2014-06-18 | 鸿富锦精密工业（深圳）有限公司 | Wiring checking system and method |
| CN104573243B (en) * | 2015-01-14 | 2020-04-07 | 上海泰齐电子科技咨询有限公司 | PCB design layout auditing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000113005A (en) * | 1998-10-05 | 2000-04-21 | Nec Corp | Automatic component arrangement processing method |
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| CN108170918A (en) | 2018-06-15 |
| WO2019119737A1 (en) | 2019-06-27 |
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