CN108170918A - Checking method, system, computer readable storage medium and the equipment of cold plate - Google Patents
Checking method, system, computer readable storage medium and the equipment of cold plate Download PDFInfo
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- CN108170918A CN108170918A CN201711386769.1A CN201711386769A CN108170918A CN 108170918 A CN108170918 A CN 108170918A CN 201711386769 A CN201711386769 A CN 201711386769A CN 108170918 A CN108170918 A CN 108170918A
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- cold plate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
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Abstract
The present invention provides a kind of checking method of cold plate, system, computer readable storage medium and equipment, including：Step 1 extracts at least one object from the design information of the printed circuit board inputted, and obtains the Vector Message of cold plate；Step 2 according to the examination condition data structure pre-created, examines the correspondence of the Vector Message of the object and cold plate, to generate examination level report.The existing time by hand inspection cold plate can be foreshortened to a few minutes by checking method, system, computer readable storage medium and the equipment of cold plate of the present invention by original 1 to 3 hours, avoided the omission of hand inspection, improved the precision of inspection；And original artificial sampling observation is become comprehensively exhaustively automatic and is checked, so as to make engineer find in time cold plate be installed to may be caused after PCB the problem of；Electronic enterprise is contributed to promote manufacture quality and efficiency, reduce production cost.
Description
Technical field
The invention belongs to technical field of circuit board detection, are related to a kind of checking method and system, more particularly to a kind of cold
Checking method, system, computer readable storage medium and the equipment of plate.
Background technology
The designer of electronics industry in Design PCB wiring board in order to which element radiating would generally design a cold plate,
It is mainly used for element radiating and supports PCBA and increase the purpose of intensity.Have in industry at present towards DIP plug-in elements and design
Cold plate and towards SMD sticking-elements design cold plate.
For the cold plate of DIP plug-in elements design, technological requirement is first to install cold plate, then install plug-in element.And this is cold
Plate is the consistent metallic plate of one piece of integral thickness, needs to be close to pcb board to fix；Below the DIP insert bodies to radiate to needs
It is close to cold plate installation, the plug-in element for being equivalent to DIP classes rides over and installed on cold plate item.For the plug-in unit member without heat dissipation
Part, such as plug-in unit capacitance, connector etc., cold plate can hollow out the installation site of element, allow it that can be equivalent to normal mounting
Installation with no cold plate is the same.
Existing method is directed to there are two types of the cold plate generations of more than DIP plug-in elements：
1st, region drafting is carried out by the position of components that designer is radiated as needed by hand：Such as which element area
It hollows out, which place is metallic plate, which plug-in unit bore region will hollow out；
2nd, cold plate figure is automatically generated by software.
The cold plate figure generated for both the above method may all bring the problems in actual production, such as pcb board
On have component and various pads etc., these are likely to cause to collide after actual assembled, interfere, repair etc. is asked
Topic.And it may be thrown into question with pcb board to check by engineer's artificial contrast's cold plate figure in these problem industries at present
Place could be found in actual assembled.Not only inefficiency, accuracy rate are low for such checking method, and also have very
More problems can not be found by the above method.
Therefore, a kind of checking method of cold plate, system, computer readable storage medium and equipment how are provided, to solve
The prior art checked by engineer's artificial contrast's cold plate figure with pcb board, caused by inefficiency, accuracy rate is low etc. various
Defect, it is real to have become the technical issues of those skilled in the art are urgently to be resolved hurrily.
Invention content
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of checking method of cold plate, be
System, computer readable storage medium and equipment, for solve the prior art by engineer's artificial contrast's cold plate figure and pcb board into
Row checks, caused by inefficiency, the problem of accuracy rate is low.
In order to achieve the above objects and other related objects, one aspect of the present invention provides a kind of checking method of cold plate, including：
Step 1 extracts at least one object from the design information of the printed circuit board inputted, and obtains the Vector Message of cold plate；Step
Rapid two, according to the examination condition data structure pre-created, the correspondence of the Vector Message of the object and cold plate is examined
It looks into, to generate examination level report.
In one embodiment of the invention, the object includes component, hole, pad, welding resistance and/or character silk printing；Institute
The Vector Message for stating cold plate includes the metallic region of cold plate and area of knockout dimension of picture.
In one embodiment of the invention, the examination condition data structure pre-created includes：Examine name；Examine name
Subtype；The explanation of inspection item；Whether this examination comes into force；The recommendation of the correspondence of the Vector Message of object and cold plate
Value；The screening conditions of object in the design information of printed circuit board；The screening conditions of the Vector Message of cold plate.
In one embodiment of the invention, the correspondence of the Vector Message of the object and cold plate include between the two away from
From, cover the degree containing collision between the two；The step 2 includes：The sieve of object in the design information of printed circuit board
The screening conditions of the Vector Message of condition and cold plate are selected, filter out the arrow of the object and cold plate in the design information of printed circuit board
Measure information；Measure printed circuit board design information in object and cold plate Vector Message between the two distance or both between cover
Degree containing collision；The measurement knot of the Vector Message of object and cold plate in the design information of acquisition printed circuit board between the two
Fruit.
In one embodiment of the invention, the step 2 further includes：According to measurement result, determine and the measurement result
The level report result screening value matched；The level report result screening value for representing that measurement result is unacceptable, warning or
It is acceptable.
In one embodiment of the invention, generate the step of examining level report and include：By the explanation of inspection item, screening
The correspondence of object, measurement result and the Vector Message of object and cold plate in the design information of the printed circuit board gone out pushes away
It recommends value and compiles report result.
In one embodiment of the invention, the checking method of the cold plate further includes cycle and performs step 2, until examining
The correspondence of the Vector Message of complete all objects and cold plate.
Another aspect of the present invention provides a kind of auditing system of cold plate, including：Extraction module, for from the printing inputted
At least one object is extracted in the design information of circuit board；Acquisition module, for obtaining the Vector Message of cold plate；It examines module, uses
In the examination condition data structure that basis pre-creates, the correspondence of the Vector Message of the object and cold plate is examined,
Level report is examined with generation.
Another aspect of the invention provides a kind of computer readable storage medium, is stored thereon with computer program, the program
The checking method of the cold plate is realized when being executed by processor.
Last aspect of the present invention provides a kind of equipment, including：Processor and memory；The memory is based on storing
Calculation machine program, the processor is used to perform the computer program of the memory storage, so that equipment execution is described cold
The checking method of plate.
As described above, the present invention cold plate checking method, system, computer readable storage medium and equipment, have with
Lower advantageous effect：
Checking method, system, computer readable storage medium and the equipment of cold plate of the present invention can pass through existing
The time of hand inspection cold plate foreshortened to a few minutes by original 1 to 3 hours, avoided the omission of hand inspection, improved inspection
The precision looked into；And original artificial sampling observation is become comprehensively exhaustively automatic and is checked, so as to which engineer be made to find cold plate in time
The problem of may causing, is installed to after PCB；Electronic enterprise is contributed to promote manufacture quality and efficiency, reduce production cost.
Description of the drawings
Figure 1A is shown as flow diagram of the checking method of the cold plate of the present invention in an embodiment.
Figure 1B is shown as the flow diagram of S13 in the checking method of the cold plate of the present invention.
Fig. 2 is shown as the object schematic diagram of the PCB figures of the present invention.
Fig. 3 is shown as the cold plate installation vertical view of the present invention.
Fig. 4 is shown as theory structure schematic diagram of the auditing system of the cold plate of the present invention in an embodiment.
Component label instructions
The auditing system of 4 cold plates
41 extraction modules
42 acquisition modules
43 examine module
44 loop modules
S11~S14 steps
The step of S131~135
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also be based on different viewpoints with application, without departing from
Various modifications or alterations are carried out under the spirit of the present invention.It should be noted that in the absence of conflict, following embodiment and implementation
Feature in example can be combined with each other.
It should be noted that the diagram provided in following embodiment only illustrates the basic structure of the present invention in a schematic way
Think, component count, shape and size when only display is with related component in the present invention rather than according to actual implementation in schema then
It draws, kenel, quantity and the ratio of each component can be a kind of random change during actual implementation, and its assembly layout kenel
It is likely more complexity.
Embodiment one
The present embodiment provides a kind of checking method of cold plate, including：
At least one object is extracted from the design information of the printed circuit board inputted, and obtains the Vector Message of cold plate；
According to the examination condition data structure pre-created, the correspondence of the Vector Message of the object and cold plate is carried out
It examines, to generate examination level report.
The checking method of cold plate provided below with reference to diagram the present embodiment is described in detail.Please refer to figure
1A is shown as flow diagram of the checking method of cold plate in an embodiment.As shown in Figure 1A, the checking method of the cold plate
Specifically include following steps：
S11 extracts at least one object from the design information of the printed circuit board inputted.In the present embodiment, it is described
Object includes component, hole, pad, welding resistance and/or character silk printing etc., the object schematic diagram of PCB figures as shown in Figure 2.
S12 obtains the Vector Message of cold plate.In the present embodiment, the Vector Message of the cold plate includes the metal of cold plate
Region and area of knockout dimension of picture.
Specifically, the design information based on the printed circuit board determines the pin ruler of each heat dissipation element included
Every dimension informations such as component size that is very little and being not required to heat dissipation, and the dimension information to being obtained, based on predetermined amplification rule
Amplified accordingly, Vector Message corresponding with cold plate is generated to be based on amplified every dimension information.
For example, based on amplified every dimension information, the area of knockout that generation cold plate needs is determined.
S13, according to the examination condition data structure pre-created, to the correspondence of the Vector Message of the object and cold plate
It is examined, to generate examination level report.
In the present embodiment, the examination condition data structure pre-created includes：
Examine name；
Label starts；
Examine the subtype of name；
The explanation of inspection item；
Whether this examination comes into force；
The recommendation of the correspondence of the Vector Message of object and cold plate；
The screening conditions of object in the design information of printed circuit board；
The screening conditions of the Vector Message of cold plate；
The first estate reports result screening value；
Second level report result screening value；
The tertiary gradient reports result screening value；
Output examines level report；
Label terminates.
In the present embodiment, the correspondence of the Vector Message of the object and cold plate include between the two distance, between the two
The degree containing collision of covering.
For example, distance of the component to cold plate, the distance in hole to cold plate, the distance of pad to cold plate, welding resistance open a window to cold
The distance of plate, the distance of character silk printing to cold plate, containing the degree for including collision character silk printing, cold plate covering, which includes, touches for cold plate covering
The degree of pad is hit, cold plate covering includes the degree in collision hole, and cold plate covers the degree for including component, related DIP plug-in units peace
Pin after dress stretches out PCB length (PCB thickness+cold plate thickness is only applicable to be mounted on the DIP plug-in units of cold plate physically), phase
Close height (component height+cold plate thickness) after the installation of DIP plug-in units etc..
B is please referred to Fig.1, is shown as the flow diagram of S13.As shown in Figure 1B, the S13 includes the following steps：
S131, the screening of the screening conditions of the object in the design information of printed circuit board and the Vector Message of cold plate
Condition filters out the Vector Message of the object and cold plate in the design information of printed circuit board.
S132 measures the Vector Message of object in the design information of printed circuit board and cold plate distance or both between the two
Between cover the degree containing collision.
S133 obtains the measurement knot of the Vector Message of object in the design information of printed circuit board and cold plate between the two
Fruit.
S134 according to measurement result, is determined and the matched level report result screening value of the measurement result；The grade report
Result screening value is accused for representing that measurement result is unacceptable, warning or acceptable.In the present embodiment, the first estate report knot
Fruit screening value represents that measurement result is unacceptable, and the second level report result screening value represents measurement result warning, the tertiary gradient
Report result screening value represents that measurement result is subjected to.
S135, by the explanation of inspection item, the design information of the printed circuit board filtered out object, measurement result and
The recommendation of the correspondence of the Vector Message of object and cold plate compiles report result.
The examination condition data structure pre-created by taking component to the examination of cold plate distance as an example below：
[CompToFeature_Difflayer]
:STR
Subcategory=CompToCool
CheckItem=checks element to cold plate distance
Check=True
RECValue=<1.0mm(40mil)
CON1=LAYER_TYPE { component }, comptype { }
CON2=LAYER_TYPE { COOLINGPLATE }, FEATURE { Pad, Polygon }
COL1=(0~1.0)
COL2=
COL3=
OUT1=COMPTYPE { DIP, Fiducial, TP }
:END。
CompToFeature_Difflayer is examines name；
:STR starts for label；
Subcategory=CompToCool is the subclass for examining name；
CheckItem is the explanation of inspection item；
Check illustrates to need to check, illustrates directly skip this examination for False for True.
LAYER_TYPE { component } represents first device in CON1=LAYER_TYPE { component }, comptype { }
All components of part layer, comptype { } represent that type does not limit.LAYER_TYPE { component }, comptype { } are represented
Filter out all components on PCB.
CON2=LAYER_TYPE { COOLINGPLATE }, FEATURE { Pad, Polygon }.LAYER_TYPE
{ COOLINGPLATE } represents cold plate layer, and FEATURE { Pad, Polygon } represents the object of all pads and polygon.More than
Object name can be good with self-defining, is flexibly screened after convenient.
Referring to Fig. 3, it is shown as cold plate installation vertical view.As shown in figure 3, the object meter that CON1 and CON2 are screened
Component U1 is calculated to the distance between cold plate.Such as component to cold plate metal distance D be 0.8mm.
Component belongs to the first estate for 0.8mm to cold plate metal distance D and reports result screening value COL1=(0~1.0).
In the present embodiment, reporting conditions again require that OUT1=COMPTYPE { DIP, Fiducial, TP }：Comprising slotting
Part, optical point, test point need report output.U1 is DIP plug-in units.
CheckItem=is checked into element to cold plate distance, element=U1, measurement result=0.8, recommendation=<1.0mm
(40mil) compiles report result.
The examination condition data structure pre-created by taking the examination that cold plate covers the pad containing collision as an example below：
[FeatureTouchFeature]
:STR
Subcategory=CoolCoverFootprint
CheckItem=cold plates cover pad
Check=True
RECValue=<1.0mm(40mil)
CON1=LAYER_TYPE { pads }, FEATURE { pad }, usage { pin }
CON2=LAYER_TYPE { COOLINGPLATE }, FEATURE { Pad, Polygon }
COL1=True
COL2=
COL3=
OUT1=
:END
S14, cycle perform S13, until having examined the correspondence of the Vector Message of all objects and cold plate.
The present embodiment also provides a kind of computer readable storage medium, is stored thereon with computer program, which is located
Reason device realizes the checking method of the cold plate when performing.One of ordinary skill in the art will appreciate that：Realize that above-mentioned each method is real
Applying all or part of step of example can be completed by the relevant hardware of computer program.Aforementioned computer program can be deposited
It is stored in a computer readable storage medium.The program when being executed, performs the step of including above-mentioned each method embodiment；It is and preceding
The storage medium stated includes：The various media that can store program code such as ROM, RAM, magnetic disc or CD.
The computer-readable storage medium of the checking method of cold plate described in the present embodiment and the checking method of the realization cold plate
The existing time by hand inspection cold plate can be foreshortened to a few minutes by matter by original 1 to 3 hours, avoid hand inspection
Omission, improve the precision of inspection；And original artificial sampling observation is become comprehensively exhaustively automatic and is checked, so as to make engineering
Teacher has found that cold plate is installed to after PCB the problem of may causing in time；Electronic enterprise is contributed to promote manufacture quality and efficiency, reduction
Production cost.
Embodiment two
The present embodiment provides a kind of auditing system of cold plate, including：
Extraction module, for extracting at least one object from the design information of the printed circuit board inputted；
Acquisition module, for obtaining the Vector Message of cold plate；
Module is examined, for the examination condition data structure that basis pre-creates, to the Vector Message of the object and cold plate
Correspondence examined, to generate examination level report.
The auditing system of cold plate provided below with reference to diagram the present embodiment is described in detail.Need what is illustrated
It is, it should be understood that the division of the modules of Yi Shang auditing system is only a kind of division of logic function, in actual implementation can be with
Completely or partially it is integrated on a physical entity, it can also be physically separate.And these modules can all be passed through with software
The form that processing element calls is realized；It can also all realize in the form of hardware；Can processing element be passed through with part of module
The form of software is called to realize, part of module is realized by the form of hardware.For example, x modules can be the processing individually set up
Element can also be integrated in some chip of above device and realize, in addition it is also possible to be stored in the form of program code
In the memory of above device, called by some processing element of above device and perform the function of more than x modules.Other moulds
The realization of block is similar therewith.In addition these modules can completely or partially integrate, and can also independently realize.It is described here
Processing element can be a kind of integrated circuit, have signal processing capacity.During realization, each step of the above method
Or more modules can be completed by the instruction of the integrated logic circuit of the hardware in processor elements or software form.
For example, the above module can be arranged to implement one or more integrated circuits of above method, such as：
One or more specific integrated circuits (ApplicationSpecificIntegratedCircuit, abbreviation ASIC) or, one
Or multi-microprocessor (digitalsingnalprocessor, abbreviation DSP) or, one or more field-programmable gate array
It arranges (FieldProgrammableGateArray, abbreviation FPGA) etc..For another example, when some above module is called by processing element
When the form of program code is realized, which can be general processor, such as central processing unit
(CentralProcessingUnit, abbreviation CPU) or it is other can be with the processor of caller code.For another example, these modules can
To integrate, realized in the form of system on chip (system-on-a-chip, abbreviation SOC).
Referring to Fig. 4, it is shown as theory structure schematic diagram of the auditing system of cold plate in an embodiment.As shown in figure 4,
The auditing system 4 of the cold plate includes：Extraction module 41, examines module 43 and loop module 44 at acquisition module 42.
The extraction module 41 is used to extract at least one object from the design information of the printed circuit board inputted.At this
In embodiment, the object includes component, hole, pad, welding resistance and/or character silk printing etc., PCB figures as shown in Figure 2
Object schematic diagram.
The acquisition module 42 coupled with the extraction module 41 is used to obtain the Vector Message of cold plate.In the present embodiment,
The Vector Message of the cold plate includes the metallic region of cold plate and area of knockout dimension of picture.
Specifically, the design information of the acquisition module 42 based on the printed circuit board determines to be included each scattered
The pin size of thermal element and the every dimension information such as component size for being not required to heat dissipation, and the dimension information to being obtained, base
Amplified accordingly in predetermined amplification rule, vector corresponding with cold plate is generated to be based on amplified every dimension information
Information.
For example, the acquisition module 42 is based on amplified every dimension information, hollowing out for generation cold plate needs is determined
Region.
The examination module 43 coupled with the extraction module 41 and acquisition module 42 is used for according to the examination condition pre-created
Data structure examines the correspondence of the Vector Message of the object and cold plate, to generate examination level report.
In the present embodiment, the examination condition data structure pre-created includes：
Examine name；
Label starts；
Examine the subtype of name；
The explanation of inspection item；
Whether this examination comes into force；
The recommendation of the correspondence of the Vector Message of object and cold plate；
The screening conditions of object in the design information of printed circuit board；
The screening conditions of the Vector Message of cold plate；
The first estate reports result screening value；
Second level report result screening value；
The tertiary gradient reports result screening value；
Output examines level report；
Label terminates.
In the present embodiment, the correspondence of the Vector Message of the object and cold plate include between the two distance, between the two
The degree containing collision of covering.
For example, distance of the component to cold plate, the distance in hole to cold plate, the distance of pad to cold plate, welding resistance open a window to cold
The distance of plate, the distance of character silk printing to cold plate, containing the degree for including collision character silk printing, cold plate covering, which includes, touches for cold plate covering
The degree of pad is hit, cold plate covering includes the degree in collision hole, and cold plate covers the degree for including component, related DIP plug-in units peace
Pin after dress stretches out PCB length (PCB thickness+cold plate thickness is only applicable to be mounted on the DIP plug-in units of cold plate physically), phase
Close height (component height+cold plate thickness) after the installation of DIP plug-in units etc..
It is described to examine that module 43 is specifically used for according to the screening conditions of the object in the design information of printed circuit board and cold
The screening conditions of the Vector Message of plate filter out the Vector Message of the object and cold plate in the design information of printed circuit board；It surveys
Measure printed circuit board design information in object and cold plate Vector Message between the two distance or both between covering containing collision
Degree；The measurement result of the Vector Message of object and cold plate in the design information of acquisition printed circuit board between the two；According to survey
Amount is as a result, determine and the matched level report result screening value of the measurement result；The level report result screening value is used for table
Show that measurement result is unacceptable, warning or acceptable.In the present embodiment, the first estate report result screening value represents to measure knot
Fruit is unacceptable, and the second level report result screening value represents measurement result warning, and tertiary gradient report result screening value represents
Measurement result is subjected to；By in the explanation of inspection item, the design information of the printed circuit board filtered out object, measurement result
And the recommendation of the correspondence of the Vector Message of object and cold plate compiles report result.
The loop module 44 coupled with the examination module 43 examines module 43 for recursive call, until having examined all
The correspondence of the Vector Message of object and cold plate.
Embodiment three
The present embodiment provides a kind of equipment, including：Processor, memory, transceiver, communication interface and system bus；It deposits
Reservoir and communication interface are connect with processor and transceiver by system bus and complete mutual communication, and memory is used to deposit
Computer program is stored up, communication interface is used for and other equipment communicates, and processor and transceiver are used to run computer program,
X devices is made to perform each step of the checking method of cold plate as described in embodiment one.
System bus mentioned above can be Peripheral Component Interconnect standard
(PeripheralPomponentInterconnect, abbreviation PCI) bus or expanding the industrial standard structure
(ExtendedIndustryStandardArchitecture, abbreviation EISA) bus etc..The system bus can be divided into address
Bus, data/address bus, controlling bus etc..It for ease of representing, is only represented in figure with a thick line, it is not intended that only one total
Line or a type of bus.Communication interface is used to implement database access device and other equipment (such as client, read-write library
And read-only library) between communication.Memory may include random access memory (RandomAccessMemory, abbreviation RAM),
Nonvolatile memory (non-volatilememory), for example, at least a magnetic disk storage may also be further included.
Above-mentioned processor can be general processor, including central processing unit (CentralProcessingUnit, letter
Claim CPU), network processing unit (NetworkProcessor, abbreviation NP) etc.；It can also be digital signal processor
(DigitalSignalProcessing, abbreviation DSP), application-specific integrated circuit
(ApplicationSpecificIntegratedCircuit, abbreviation ASIC), field programmable gate array (Field-
ProgrammableGateArray, abbreviation FPGA) either other programmable logic device, discrete gate or transistor logic device
Part, discrete hardware components.
In conclusion the checking method of cold plate of the present invention, system, computer readable storage medium and equipment can incite somebody to action
The existing time by hand inspection cold plate foreshortened to a few minutes by original 1 to 3 hours, avoided the omission of hand inspection,
Improve the precision of inspection；And original artificial sampling observation is become comprehensively exhaustively automatic and is checked, so as to make engineer timely
It was found that cold plate is installed to after PCB the problem of may causing；Electronic enterprise promotion manufacture quality and efficiency, reduction is contributed to be produced into
This.So the present invention effectively overcomes various shortcoming of the prior art and has high industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (10)
1. a kind of checking method of cold plate, which is characterized in that including：
Step 1 extracts at least one object from the design information of the printed circuit board inputted, and obtains the vector letter of cold plate
Breath；
Step 2, according to the examination condition data structure pre-created, to the correspondence of the Vector Message of the object and cold plate
It is examined, to generate examination level report.
2. the checking method of cold plate according to claim 1, which is characterized in that
The object includes component, hole, pad, welding resistance and/or character silk printing；
The Vector Message of the cold plate includes the metallic region of cold plate and area of knockout dimension of picture.
3. the checking method of cold plate according to claim 1, which is characterized in that the examination condition data knot pre-created
Structure includes：
Examine name；
Examine the subtype of name；
The explanation of inspection item；
Whether this examination comes into force；
The recommendation of the correspondence of the Vector Message of object and cold plate；
The screening conditions of object in the design information of printed circuit board；
The screening conditions of the Vector Message of cold plate.
4. the checking method of cold plate according to claim 3, which is characterized in that the Vector Message of the object and cold plate
Correspondence include between the two distance, cover the degree containing collision between the two；
The step 2 includes：
The screening conditions of the screening conditions of object in the design information of printed circuit board and the Vector Message of cold plate, screening
Go out the Vector Message of the object and cold plate in the design information of printed circuit board；
The Vector Message of the object and cold plate in the design information of printed circuit board is measured to cover and contain between distance or both between the two
The degree of collision；
The measurement result of the Vector Message of object and cold plate in the design information of acquisition printed circuit board between the two.
5. the checking method of cold plate according to claim 4, which is characterized in that the step 2 further includes：
According to measurement result, determine and the matched level report result screening value of the measurement result；The level report result sieve
Choosing value is for representing that measurement result is unacceptable, warning or acceptable.
6. the checking method of cold plate according to claim 4, which is characterized in that
Generation examines that the step of level report includes：By the explanation of inspection item, the design information of the printed circuit board filtered out
In object, measurement result and object and the recommendation of correspondence of Vector Message of cold plate compile report result.
7. the checking method of cold plate according to claim 1, which is characterized in that the checking method of the cold plate, which further includes, to follow
Ring performs step 2, until having examined the correspondence of the Vector Message of all objects and cold plate.
8. a kind of auditing system of cold plate, which is characterized in that including：
Extraction module, for extracting at least one object from the design information of the printed circuit board inputted；
Acquisition module, for obtaining the Vector Message of cold plate；
Module is examined, for the examination condition data structure that basis pre-creates, to pair of the Vector Message of the object and cold plate
It should be related to and be examined, to generate examination level report.
9. a kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the program is held by processor
The checking method of any one of claim 1 to 7 cold plate is realized during row.
10. a kind of equipment, which is characterized in that including：Processor and memory；
For the memory for storing computer program, the processor is used to perform the computer journey of the memory storage
Sequence, so that the equipment performs the checking method of the cold plate as described in any one of claim 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711386769.1A CN108170918B (en) | 2017-12-20 | 2017-12-20 | Cold plate audit methods, systems, computer readable storage media and apparatus |
| PCT/CN2018/090383 WO2019119737A1 (en) | 2017-12-20 | 2018-06-08 | Cold plate examination method and system, computer-readable storage medium and equipment |
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| CN201711386769.1A CN108170918B (en) | 2017-12-20 | 2017-12-20 | Cold plate audit methods, systems, computer readable storage media and apparatus |
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| CN108170918A true CN108170918A (en) | 2018-06-15 |
| CN108170918B CN108170918B (en) | 2021-03-05 |
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| JP2000113005A (en) * | 1998-10-05 | 2000-04-21 | Nec Corp | Automatic component arrangement processing method |
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN103870619A (en) * | 2012-12-13 | 2014-06-18 | 鸿富锦精密工业（深圳）有限公司 | Wiring checking system and method |
| CN104573243A (en) * | 2015-01-14 | 2015-04-29 | 上海泰齐电子科技咨询有限公司 | PCB design layout audit device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1459716A (en) * | 2002-05-22 | 2003-12-03 | 华为技术有限公司 | Automatic checking device of printed-wiring board designing and its method |
| CN100541502C (en) * | 2007-12-13 | 2009-09-16 | 来新泉 | A kind of PCB analogue system and its implementation with error detection function |
| CN102073775B (en) * | 2011-01-18 | 2012-08-08 | 西安电子科技大学 | Method for checking electric fitting data of printed circuit board |
| CN102214261B (en) * | 2011-07-11 | 2014-03-12 | 西安电子科技大学 | Method for automatic check of process data of printed circuit board |
| CN103164544A (en) * | 2011-12-09 | 2013-06-19 | 鸿富锦精密工业（深圳）有限公司 | Detection system and detection method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000113005A (en) * | 1998-10-05 | 2000-04-21 | Nec Corp | Automatic component arrangement processing method |
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN103870619A (en) * | 2012-12-13 | 2014-06-18 | 鸿富锦精密工业（深圳）有限公司 | Wiring checking system and method |
| CN104573243A (en) * | 2015-01-14 | 2015-04-29 | 上海泰齐电子科技咨询有限公司 | PCB design layout audit device |
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| CN108170918B (en) | 2021-03-05 |
| WO2019119737A1 (en) | 2019-06-27 |
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