CN109241681A - Simulation optimization method, system, computer storage medium and the equipment of Reflow Soldering - Google Patents
Simulation optimization method, system, computer storage medium and the equipment of Reflow Soldering Download PDFInfo
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- CN109241681A CN109241681A CN201811277969.8A CN201811277969A CN109241681A CN 109241681 A CN109241681 A CN 109241681A CN 201811277969 A CN201811277969 A CN 201811277969A CN 109241681 A CN109241681 A CN 109241681A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
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Abstract
The present invention provides simulation optimization method, system, computer storage medium and the equipment of a kind of Reflow Soldering, which comprises generates the threedimensional model of PCB circuit board to be optimized；Generate corresponding soldering paste threedimensional model；The component for needing reflow soldering process is picked out, it, will be in the setting to soldering paste threedimensional model of each component according to location information of the component picked out on the threedimensional model of PCB circuit board to be optimized；According to the analog parameter of preset Reflow Soldering, the component and pad that will be singled out carry out soldering paste welding simulation, form the Reflow Soldering simulation model of PCB circuit board to be optimized；PCB circuit board inspection is carried out to the Reflow Soldering simulation model of PCB circuit board to be optimized, to find problem to be optimized；For problem to be optimized, the optimization of corresponding design and processes is taken to modify.The technology that the present invention can be emulated in the design phase by Reflow Soldering, has found that it is likely that the Welding Problems of appearance in advance, and then technical staff is made to modify design and optimization technique.
Description
Technical field
The invention belongs to welding technology field, it is related to a kind of simulation optimization method and system, more particularly to a kind of reflux
Simulation optimization method, system, computer storage medium and the equipment of weldering.
Background technique
With economic and science and technology development, requirement of the people to electronic product is also higher and higher, should be able to satisfy more
Function, miniaturization, high density, high performance requirement, while also needing good product quality.Core as Electronic Assemblies
Technique --- SMT technique, the quality of welding quality directly affect the total quality and production cost of product.Therefore, for electricity
For sub- manufacturing, good welding quality is that basing oneself upon for product is originally product and capital and chip that others competes.
Currently, being all that could find welding defect by actual production link in industry, i.e., SMT attachment is returned again
The Welding Problems of SMD element could be found after fluid welding.The Welding Problems found at this time are caused by reflow soldering process
's；Because SMT welding quality is other than having direct relation with reflow soldering process (temperature curve), also manufactured with PCB pad
Property design, steel mesh design and layout, Component selection and PCB pad solderability, production equipment state, tin cream quality and per pass
The technological parameter of process and the operative skill close relation of operator；These factors interact, and change any one
It all may finally influence welding result.
Instantly, the similar systematic approach with the present invention, existing method are not all that technical staff is based on itself in industry
There is the reason of Welding Problems after carrying out judgement actual production in experience, and then modifies design or optimization technique；However these experiences
It both is from the summary to the production practices accumulated over a long period, therefore enterprise is difficult to be promoted in efficiency, and the dependence to technical staff
Property is very big.It so can be realized the actual production link energy for needing not move through the Reflow Soldering again of SMT patch either with or without a kind of method
Prevent welding defect in advance, by the method for pre-optimized design and processes, reduces test manufacture, promote product quality and production efficiency
?
Therefore, simulation optimization method, system, computer storage medium and the equipment of a kind of Reflow Soldering how are provided, with solution
Certainly the prior art needs the defects of could finding the welding of SMD element by the production link of SMT patch Reflow Soldering again, has become in fact
For those skilled in the art's technical problem urgently to be resolved.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of simulation optimization sides of Reflow Soldering
Method, system, computer storage medium and equipment need practical life by the Reflow Soldering again of SMT patch for solving the prior art
Produce the problem of link could find the welding of SMD element.
In order to achieve the above objects and other related objects, one aspect of the present invention provides a kind of simulation optimization side of Reflow Soldering
Method, comprising: generate the threedimensional model of PCB circuit board to be optimized；According to the thickness of the steel mesh opening read in one by one or according to weldering
The thickness for the steel mesh opening that disk generates, generates corresponding soldering paste threedimensional model；It is chosen from the threedimensional model of PCB circuit board to be optimized
Select the component for needing reflow soldering process, according to the component picked out the PCB circuit board to be optimized threedimensional model
On location information, will be in each component setting to soldering paste threedimensional model；According to the analog parameter of preset Reflow Soldering,
The component and pad that will be singled out carry out soldering paste welding simulation, form the Reflow Soldering simulation model of PCB circuit board to be optimized；It is right
The Reflow Soldering simulation model of the PCB circuit board to be optimized carries out PCB circuit board inspection, to find problem to be optimized；For institute
Problem to be optimized is stated, the optimization of corresponding design and processes is taken to modify.
In one embodiment of the invention, if after PCB circuit board inspection does not find problem to be optimized, the Reflow Soldering is imitated
True optimization method further includes the Reflow Soldering simulation model for exporting the PCB circuit board to be optimized.
In one embodiment of the invention, the threedimensional model for generating PCB circuit board to be optimized includes: that direct receive is used
The threedimensional model of the PCB circuit board to be optimized of family creation；Or EDA wiring data is come from according to obtaining, generate PCB circuit to be optimized
The threedimensional model of plate.
In one embodiment of the invention, described pick out from the threedimensional model of PCB circuit board to be optimized needs Reflow Soldering
Criteria for selection in the component of technique are as follows: according to the recommendation of component manufacturer or actual circuit-board processes situation；It is selected
Location information of the component out on the threedimensional model of the PCB circuit board to be optimized includes picked out component in institute
State the coordinate and angle on the threedimensional model of PCB circuit board to be optimized；The analog parameter of preset Reflow Soldering includes Reflow Soldering
Length, the temperature range in each section, the transmission speed in each section and/or the length in each section.
In one embodiment of the invention, after the step of forming the Reflow Soldering simulation model of PCB circuit board to be optimized, institute
The simulation optimization method for stating Reflow Soldering further includes that will weld the stress variation progress for neutralizing and after welding to component and PCB circuit board
It emulates and shows.
In one embodiment of the invention, problem to be optimized includes that the scolding tin distance in the PCB circuit board to be optimized is asked
Topic, solder bridge problem, component are set up a monument problem, component tilt problem, component offset problem and/or component and circuit
Plate stress deformation problem.
In one embodiment of the invention, the Reflow Soldering simulation model to the PCB circuit board to be optimized carries out PCB
The step of circuit board checks includes: to check the scolding tin distance in the PCB circuit board to be optimized；To described to be optimized
Solder bridge in PCB circuit board is checked；Inspection of setting up a monument is carried out to the component picked out in the PCB circuit board to be optimized
It looks into；Inclination inspection is carried out to the component picked out in the PCB circuit board to be optimized；To in the PCB circuit board to be optimized
The component picked out carries out offset inspection；And/or to the component and circuit board picked out in the PCB circuit board to be optimized
Carry out stress deformation inspection.
Another aspect of the present invention provides a kind of emulation optimizing system of Reflow Soldering, comprising: generation module, for generating to excellent
Change the threedimensional model of PCB circuit board；Generation module, for the thickness according to the steel mesh opening read in one by one or according to pad life
At steel mesh opening thickness, generate corresponding soldering paste threedimensional model；Setup module, for from the three of PCB circuit board to be optimized
The component for needing reflow soldering process is picked out on dimension module, according to the component picked out in the PCB circuit board to be optimized
Threedimensional model on location information, will be in each component setting to soldering paste threedimensional model；Emulation module is used for basis
The analog parameter of preset Reflow Soldering, the component that will be singled out and pad carry out soldering paste welding simulation, form PCB electricity to be optimized
The Reflow Soldering simulation model of road plate；It checks module, is carried out for the Reflow Soldering simulation model to the PCB circuit board to be optimized
PCB circuit board inspection, to find problem to be optimized；Optimize modified module, it is corresponding for being carried out for the problem to be optimized
The optimization of design and processes is modified.
Another aspect of the invention provides a kind of computer storage medium, is stored thereon with computer program, which is located
Reason device realizes the simulation optimization method of the Reflow Soldering when executing.
Last aspect of the present invention provides a kind of equipment, comprising: processor and memory；The memory is based on storing
Calculation machine program, the processor is used to execute the computer program of the memory storage, so that the equipment executes described return
The simulation optimization method of fluid welding.
As described above, the simulation optimization method of Reflow Soldering of the present invention, system, computer storage medium and equipment,
It has the advantages that
Simulation optimization method, system, computer storage medium and the equipment of Reflow Soldering provided by the invention can design
The technology that stage is emulated by Reflow Soldering, has found that it is likely that the Welding Problems of appearance in advance, so make technical staff modify design with
Originally the workload for needing complete for several days is completed within 1-2 short hour, greatly improves the system of product by optimization technique
Make quality and manufacture efficiency；And make electronics manufacturing enterprise by it is original to lag production result diagnosis and analysis become to
The problems in the emulation prevention of front end is designed, and can accomplish produce to put and prevent in advance；Therefore, it can be said that the present embodiment mentions
The simulation optimization method of the Reflow Soldering of confession is the effective scheme and technology branch that electronics manufacturing enterprise realizes intelligence manufacture and industry 4.0
Support.
Detailed description of the invention
Fig. 1 is shown as flow diagram of the simulation optimization method of Reflow Soldering of the invention in an embodiment.
Fig. 2 is shown as an exemplary diagram of the soldering paste threedimensional model that steel mesh opening brushes out in PCB circuit board through the invention.
Fig. 3 is shown as the exemplary diagram of the soldering paste threedimensional model formed through the invention.
Fig. 4 is shown as the exemplary diagram of Reflow Soldering simulation model through the invention.
Fig. 5 is shown as theory structure schematic diagram of the emulation optimizing system of Reflow Soldering of the invention in an embodiment.
Component label instructions
The emulation optimizing system of 5 Reflow Solderings
51 generation modules
52 generation modules
53 setup modules
54 choose module
55 emulation modules
56 check module
57 optimization modules
58 output modules
S11~S18 step
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.It should be noted that in the absence of conflict, following embodiment and implementation
Feature in example can be combined with each other.
It should be noted that illustrating the basic structure that only the invention is illustrated in a schematic way provided in following embodiment
Think, only shown in schema then with related component in the present invention rather than component count, shape and size when according to actual implementation
Draw, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its assembly layout kenel
It is likely more complexity.
Embodiment one
The present embodiment provides a kind of simulation optimization methods of Reflow Soldering, comprising:
Generate the threedimensional model of PCB circuit board to be optimized；
According to the thickness of the steel mesh opening read in one by one or the thickness of the steel mesh opening generated according to pad, correspondence is generated
Soldering paste threedimensional model；
The component for needing reflow soldering process is picked out from the threedimensional model of PCB circuit board to be optimized, according to being picked out
Location information of the component on the threedimensional model of the PCB circuit board to be optimized, by each component setting to weldering
On cream threedimensional model；
According to the analog parameter of preset Reflow Soldering, the component and pad that will be singled out carry out soldering paste welding simulation, shape
At the Reflow Soldering simulation model of PCB circuit board to be optimized；
PCB circuit board inspection is carried out to the Reflow Soldering simulation model of the PCB circuit board to be optimized, to find to be optimized ask
Topic；
For the problem to be optimized, the optimization of corresponding design and processes is taken to modify.
The simulation optimization method of Reflow Soldering provided by the present embodiment is described in detail below with reference to diagram.It please join
Fig. 1 is read, flow diagram of the simulation optimization method of Reflow Soldering in an embodiment is shown as.As shown in Figure 1, the Reflow Soldering
Simulation optimization method specifically include following steps:
S11 generates the threedimensional model of PCB circuit board to be optimized.In the present embodiment, the S11 includes directly receiving to use
The threedimensional model of the PCB circuit board to be optimized of family creation；Or EDA wiring data is come from according to obtaining, generate PCB circuit to be optimized
The threedimensional model of plate.
Specifically, according to packet the step of obtaining from EDA wiring data, generate the threedimensional model of PCB circuit board to be optimized
It includes:
The two-dimentional PCB graph data of PCB circuit board to be optimized is directly acquired from cadence allegro skill API,
The threedimensional model of PCB circuit board to be optimized is then generated according to every layer of PCB of thickness.The three-dimensional of the PCB circuit board to be optimized
Model includes each layer of circuit board of conductive materials thickness and material, thickness of insulating layer and material, layer and the direct intercommunicating pore of layer
With non-interconnected hole etc..
S12 is generated according to the thickness of the steel mesh opening read in one by one or the thickness of the steel mesh opening generated according to pad
Corresponding soldering paste threedimensional model.In the present embodiment, if PCB circuit board is dual platen, the face TOP of PCB circuit board and
It requires to generate corresponding soldering paste threedimensional model on the face BOTTOM, the soldering paste three-dimensional mould that steel mesh opening brushes out in PCB circuit board
One example of type is as shown in Figure 2.
S13 picks out the component for needing reflow soldering process from the threedimensional model of PCB circuit board to be optimized, according to being chosen
Location information of the component selected on the threedimensional model of the PCB circuit board to be optimized, by the three of each component
In dimension module setting to soldering paste threedimensional model.In the present embodiment, described to be selected from the threedimensional model of PCB circuit board to be optimized
Criteria for selection in the component of reflow soldering process is needed out are as follows: according to the recommendation of component manufacturer or actual circuit-board processes feelings
Condition.Location information of the component picked out on the threedimensional model of the PCB circuit board to be optimized includes being picked out
Coordinate and angle of the component on the threedimensional model of the PCB circuit board to be optimized.
Specifically, using the recommendation of component manufacturer or actual circuit-board processes situation as the member for needing reflow soldering process
The criteria for selection of device, picks out the component for needing reflow soldering process from the threedimensional model of PCB circuit board to be optimized, and according to
Coordinate and angle of the component picked out on the threedimensional model of the PCB circuit board to be optimized, by each first device
In the threedimensional model setting to soldering paste threedimensional model of part.The exemplary diagram of the soldering paste threedimensional model of formation is as shown in Figure 3.
S14 starts the database of the parameter of Reflow Soldering, chooses the analog parameter of preset Reflow Soldering, and can read in
Reflow Soldering curve before generates parameter, and (it is raw according to the analog parameter of preset Reflow Soldering that solder profile, which generates parameter,
At Visual Chart, parameter is then reduced by chart, so that it may directly generate parameter using solder profile).In this reality
It applies in example, according to the accuracy that Reflow Soldering emulates, the parameter of needs can be continuously increased.In the present embodiment, described preset
The analog parameter of Reflow Soldering includes the length of Reflow Soldering, the temperature range in each section, the transmission speed in each section and/or every
The length in a section etc. parameter.
S15, according to the analog parameter of preset Reflow Soldering, it is imitative that the component and pad that will be singled out carry out soldering paste welding
Very, the Reflow Soldering simulation model for forming PCB circuit board to be optimized, in the Reflow Soldering simulation model for generating PCB circuit board to be optimized
It (specifically, generates the welding threedimensional model of each solder joint in PCB circuit board to be optimized) afterwards, welding is neutralized after welding to first device
The stress variation of part and PCB circuit board (in the present embodiment, refers to the stress variation of component and PCB circuit board: which ground
Side's PCB circuit board when by Reflow Soldering has deformation, or/and component is caused to have the variation such as bending and the variation can
Lead to the damages such as component cracking) it is emulated and is shown, the exemplary diagram of Reflow Soldering simulation model is as shown in Figure 4.
S16 carries out PCB circuit board inspection to the Reflow Soldering simulation model of the PCB circuit board to be optimized, to find to excellent
Change problem.
In the present embodiment, problem to be optimized includes scolding tin distance problem in the PCB circuit board to be optimized, solder bridge
Connect problem, set up a monument problem, component tilt problem, component offset problem and/or component and circuit board stress of component becomes
The problems such as shape problem etc..
Specifically, the S16 includes:
Scolding tin distance in the PCB circuit board to be optimized is checked；
Solder bridge in the PCB circuit board to be optimized is checked；
Inspection of setting up a monument is carried out to the component picked out in the PCB circuit board to be optimized；
Inclination inspection is carried out to the component picked out in the PCB circuit board to be optimized；
Offset inspection is carried out to the component picked out in the PCB circuit board to be optimized；And/or
Stress deformation inspection etc. step is carried out to the component and circuit board picked out in the PCB circuit board to be optimized
Suddenly.
Such as one check problem, component scolding tin spacing is checked in Reflow Soldering simulation model as shown in Figure 4 and is less than
Default scolding tin spacing 0.127mm, then be reported out and, the threedimensional model of the PCB circuit board to be optimized before at this moment checking Reflow Soldering,
The scolding tin spacing as caused by the left side pad soldering paste of R2 is excessive is checked immediately is less than default scolding tin spacing.
Such as another inspection problem, the offset of component coordinate position is reported in Reflow Soldering simulation model as shown in Figure 4
More than preset offset value 0.005mm, check the threedimensional model of PCB circuit board to be optimized before Reflow Soldering, check immediately be due to
The copper foil on component one side is excessive, causes left side soldering paste welding too fast, and cooling welding is just completed the right soldering paste not yet, causes
Movement has occurred in component locations.
S17 takes the optimization of corresponding design and processes to modify for the problem to be optimized.
In the present embodiment, the optimization of corresponding design and processes, which is modified, includes:
1.PCB Wiring optimization: pad, route etc.；The problems such as optimization is excessive or very few for scolding tin.
2. components selection optimizes: replacement manufacturer, customization component etc.；The optimization for component's feet it is excessive/mistake
It is small, the problems such as failure welding caused by quality is overweight or too light.
3. steel mesh opening optimizes: opening redesigns etc.；The problems such as optimization is more for welding tin ball, short-circuit.
4. solder reflow device parameter optimization, or even customization Reflow Soldering function；The optimization is directed to the problems such as rosin joint.
5.SMT equipment optimization: chip mounter coordinate shift, AOI emphasis inspection increase technique fool proof means etc..The optimization needle
The problems such as equipment is optimized when can not optimizing to 1 to 4.
For example, checking problem for above-mentioned one, takes the optimization of corresponding design and processes to be revised as modification steel mesh and open
Mouth size；
For example, being directed to above-mentioned another inspection problem, takes the optimization of corresponding design and processes to be revised as modification PCB and set
Copper foil size is counted to optimize, the design of Cadence allegro skill API synchronous vacations can also be passed through.
In the present embodiment, above 5 kinds the problem to be optimized of welding can be optimized, only optimizing cost has height,
Optimization complexity has height.Successively priority are as follows: 4 > 3 > 1 > 5 > 2, actual conditions are also seen certainly.
S18, if after PCB circuit board inspection does not find problem to be optimized, exporting the Reflow Soldering of the PCB circuit board to be optimized
Simulation model.In the present embodiment, one piece of sample conduct of AOI on-line study is not necessarily to using the simulation optimization method of the Reflow Soldering
Standard test panel.
The present embodiment also provides a kind of computer storage medium (also known as computer readable storage medium), is stored thereon with
Computer program, the computer program realize the simulation optimization method of above-mentioned Reflow Soldering when being executed by processor.
Those of ordinary skill in the art will appreciate that: realize that all or part of the steps of above-mentioned each method embodiment can lead to
The relevant hardware of computer program is crossed to complete.Computer program above-mentioned can store in a computer readable storage medium
In.When being executed, execution includes the steps that above-mentioned each method embodiment to the program；And storage medium above-mentioned include: ROM,
The various media that can store program code such as RAM, magnetic or disk.
The technology that the simulation optimization method of Reflow Soldering provided in this embodiment can be emulated in the design phase by Reflow Soldering,
Have found that it is likely that the Welding Problems of appearance in advance, so make technical staff modify design and optimization technique, will need originally several days it is complete
At workload completed within 1-2 short hour, greatly improve the manufacture quality and manufacture efficiency of product；And make electricity
Sub- manufacturing enterprise is become in the emulation of design front end to prevent by the original diagnosis to lag production result and analysis, and can
Prevented in advance with the problems in accomplishing to produce point；Therefore, it can be said that the simulation optimization method of Reflow Soldering provided in this embodiment
It is the effective scheme and technical support that electronics manufacturing enterprise realizes intelligence manufacture and industry 4.0.
Embodiment two
The present embodiment provides a kind of emulation optimizing systems of Reflow Soldering, comprising:
Generation module, for generating the threedimensional model of PCB circuit board to be optimized；
Generation module, for according to the thickness of steel mesh opening read in one by one or the steel mesh opening generated according to pad
Thickness generates corresponding soldering paste threedimensional model；
Setup module, for picking out the component for needing reflow soldering process from the threedimensional model of PCB circuit board to be optimized,
According to location information of the component picked out on the threedimensional model of the PCB circuit board to be optimized, by each member
In device setting to soldering paste threedimensional model；
Emulation module, for the analog parameter according to preset Reflow Soldering, the component and pad that will be singled out are welded
Cream welding simulation forms the Reflow Soldering simulation model of PCB circuit board to be optimized；
It checks module, carries out PCB circuit board inspection for the Reflow Soldering simulation model to the PCB circuit board to be optimized,
To find problem to be optimized；
Optimize modified module, for carrying out the optimization modification of corresponding design and processes for the problem to be optimized.
The emulation optimizing system of Reflow Soldering provided by the present embodiment is described in detail below with reference to diagram.It needs
What is illustrated is, it should be understood that the division of the modules of following emulation optimizing system is only a kind of division of logic function, practical
It can be completely or partially integrated on a physical entity when realization, it can also be physically separate.And these modules can be whole
It is realized, can also be all realized in the form of hardware by way of processing element calls with software, it can be logical with part of module
Crossing processing element calls the form of software to realize that part of module passes through formal implementation of hardware.Such as: x module can be independent
The processing element set up also can integrate and realize in some chip of following emulation optimizing system.In addition, x module can also
To be called and be held by some processing element of above-mentioned apparatus in the memory for being stored in following apparatus in the form of program code
The function of the following x module of row.The realization of other modules is similar therewith.These modules completely or partially can integrate together,
It can independently realize.Processing element described here can be a kind of integrated circuit, the processing capacity with signal.It was realizing
Cheng Zhong, each step of the above method or following modules can by the integrated logic circuit of the hardware in processor elements or
The instruction of person's software form is completed.These modules can be arranged to implement the integrated electricity of one or more of above method below
Road, such as: one or more specific integrated circuit (Application Specific Integrated Circuit, abbreviations
ASIC), one or more microprocessors (Digital Singnal Processor, abbreviation DSP), one or more scene
Programmable gate array (Field Programmable Gate Array, abbreviation FPGA) etc..When some following module passes through processing
When the form of element calling program code is realized, which can be general processor, such as central processing unit (Central
Processing Unit, abbreviation CPU) or it is other can be with the processor of caller code.These modules can integrate one
It rises, is realized in the form of system on chip (System-on-a-chip, abbreviation SOC).
Referring to Fig. 5, being shown as theory structure schematic diagram of the emulation optimizing system of Reflow Soldering in an embodiment.Such as figure
Shown in 5, the emulation optimizing system 5 of the Reflow Soldering includes: generation module 51, generation module 52, setup module 53, chooses module
54, emulation module 55, inspection module 56, optimization module 57 and output module 58.
The generation module 51 is used to generate the threedimensional model of PCB circuit board to be optimized.In the present embodiment, the S11
Threedimensional model including directly receiving the PCB circuit board to be optimized of user's creation；Or EDA wiring data is come from according to obtaining, it is raw
At the threedimensional model of PCB circuit board to be optimized.
The generation module 51 is specifically used for directly acquiring PCB electricity to be optimized from cadence allegro skill API
The two-dimentional PCB graph data of road plate, then generates the threedimensional model of PCB circuit board to be optimized according to every layer of PCB of thickness.It is described
The threedimensional model of PCB circuit board to be optimized includes each layer of circuit board of conductive materials thickness and material, thickness of insulating layer and material
Matter, layer and the direct intercommunicating pore of layer and non-interconnected hole etc..
The generation module 52 coupled with the generation module 51 be used for according to the thickness of steel mesh opening read in one by one or
According to the thickness for the steel mesh opening that pad generates, corresponding soldering paste threedimensional model is generated.In the present embodiment, if PCB circuit board
When being dual platen, require to generate corresponding soldering paste threedimensional model on the face TOP and the face BOTTOM of PCB circuit board, in PCB circuit
One example of the soldering paste threedimensional model that steel mesh opening brushes out on plate is as shown in Figure 2.
The setup module 53 coupled with the generation module 51 and generation module 52 is used for from the three of PCB circuit board to be optimized
The component for needing reflow soldering process is picked out on dimension module, according to the component picked out in the PCB circuit board to be optimized
Threedimensional model on location information, will each component threedimensional model setting on soldering paste threedimensional model.In this reality
It applies in example, it is described that criteria for selection in the component for need reflow soldering process is picked out from the threedimensional model of PCB circuit board to be optimized
Are as follows: according to the recommendation of component manufacturer or actual circuit-board processes situation.The component picked out is described to be optimized
Location information on the threedimensional model of PCB circuit board includes picked out component the three of the PCB circuit board to be optimized
Coordinate and angle on dimension module.
Specifically, the setup module 53 is using the recommendation of component manufacturer or actual circuit-board processes situation as need
The criteria for selection of the component of reflow soldering process, picking out from the threedimensional model of PCB circuit board to be optimized needs reflow soldering process
Component, and coordinate and angle according to the component picked out on the threedimensional model of the PCB circuit board to be optimized,
It will be in the threedimensional model setting to soldering paste threedimensional model of each component.The exemplary diagram of the soldering paste threedimensional model of formation is as schemed
Shown in 3.
The selection module 54 coupled with the setup module 53 is used to start the database of the parameter of Reflow Soldering, chooses default
Reflow Soldering analog parameter, and the solder Reflow Soldering curve before can reading in generates parameter (solder profile is raw
It is that Visual Chart is generated according to the analog parameter of preset Reflow Soldering at parameter, parameter is then reduced by chart, so that it may is straight
It connects and generates parameter using solder profile).In the present embodiment, the accuracy emulated according to Reflow Soldering, can constantly increase
Add the parameter of needs.In the present embodiment, the analog parameter of the preset Reflow Soldering includes the length of Reflow Soldering, each section
Temperature range, the transmission speed in each section and/or length etc. the parameter in each section.
The emulation module 55 coupled with the setup module 53 and selection module 54 is used for the mould according to preset Reflow Soldering
Quasi- parameter, the component that will be singled out and pad carry out soldering paste welding simulation, form the Reflow Soldering emulation of PCB circuit board to be optimized
Model (specifically, generates each in PCB circuit board to be optimized after the Reflow Soldering simulation model for generating PCB circuit board to be optimized
The welding threedimensional model of solder joint), welding is neutralized after welding to the stress variation of component and PCB circuit board (in the present embodiment
In, refer to the stress variation of component and PCB circuit board: which place PCB circuit board when by Reflow Soldering has change
Shape, and/or component is caused to have the variation such as bending and the variation to can lead to the damages such as component cracking) emulated and shown
Show, the exemplary diagram of Reflow Soldering simulation model is as shown in Figure 4.
The inspection module 56 coupled with the emulation module 55 is used for the Reflow Soldering to the PCB circuit board to be optimized and emulates
Model carries out PCB circuit board inspection, to find problem to be optimized.
In the present embodiment, problem to be optimized includes scolding tin distance problem in the PCB circuit board to be optimized, solder bridge
Connect problem, set up a monument problem, component tilt problem, component offset problem and/or component and circuit board stress of component becomes
The problems such as shape problem etc..
Specifically, the inspection module 56 is for checking the scolding tin distance in the PCB circuit board to be optimized；It is right
Solder bridge in the PCB circuit board to be optimized is checked；To the component picked out in the PCB circuit board to be optimized
Carry out inspection of setting up a monument；Inclination inspection is carried out to the component picked out in the PCB circuit board to be optimized；To described to be optimized
The component picked out in PCB circuit board carries out offset inspection；And/or to the member picked out in the PCB circuit board to be optimized
Device and circuit board carry out stress deformation inspection etc..
The optimization module 57 coupled with the inspection module 56 is used to take corresponding design for the problem to be optimized
Optimization with technique is modified.
In the present embodiment, the optimization of the corresponding design and processes of the optimization module 57, which is modified, includes:
1.PCB Wiring optimization: pad, route etc.；The problems such as optimization is excessive or very few for scolding tin.
2. components selection optimizes: replacement manufacturer, customization component etc.；The optimization for component's feet it is excessive/mistake
It is small, the problem of failure welding caused by quality is overweight or too light.
3. steel mesh opening optimizes: opening redesigns etc.；The problems such as optimization is more for welding tin ball, short-circuit.
4. solder reflow device parameter optimization, or even customization Reflow Soldering function；The optimization is directed to the problems such as rosin joint.
5.SMT equipment optimization: chip mounter coordinate shift, AOI emphasis inspection increase technique fool proof means etc..The optimization needle
The problems such as equipment is optimized when can not optimizing to 1 to 4.
If the output module 58 coupled with the optimization module 57 does not find problem to be optimized for PCB circuit board inspection
Afterwards, the Reflow Soldering simulation model of the PCB circuit board to be optimized is exported.In the present embodiment, using the emulation of the Reflow Soldering
Optimization system is without one piece of sample of AOI on-line study as standard test panel.
Embodiment three
The present embodiment provides a kind of equipment, which includes: processor, memory, transceiver, communication interface or/and is
System bus；Memory and communication interface pass through system bus and mutual communication are connect and completed with processor and transceiver, deposit
Reservoir is for storing computer program, and communication interface is used for and other equipment are communicated, and processor and transceiver are for running
Computer program makes equipment execute each step of the simulation optimization method of Reflow Soldering as described in embodiment one.
System bus mentioned above can be Peripheral Component Interconnect standard (Peripheral Component
Interconnect, abbreviation PCI) bus or expanding the industrial standard structure (Extended Industry Standard
Architecture, abbreviation EISA) bus etc..The system bus can be divided into address bus, data/address bus, control bus etc..
Communication interface is for realizing the communication between database access device and other equipment (such as client, read-write library and read-only library).
Memory may include random access memory (Random Access Memory, abbreviation RAM), it is also possible to further include non-volatile
Property memory (non-volatile memory), for example, at least a magnetic disk storage.
Above-mentioned processor can be general processor, including central processing unit (Central Processing Unit,
Abbreviation CPU), network processing unit (Network Processor, abbreviation NP) etc.；It can also be digital signal processor
(Digital Signal Processing, abbreviation DSP), specific integrated circuit (Application Specific
Integrated Circuit, abbreviation ASIC), field programmable gate array (Field Programmable Gate Array,
Abbreviation FPGA) either other programmable logic device, discrete gate or transistor logic, discrete hardware components.
The protection scope of the simulation optimization method of Reflow Soldering of the present invention is not limited to the present embodiment the step of enumerating and holds
The increase and decrease of the step of row sequence, the prior art that all principles according to the present invention are done, step are replaced realized scheme and are all wrapped
It includes within the scope of the present invention.
The present invention also provides a kind of emulation optimizing system of Reflow Soldering, the emulation optimizing system of the Reflow Soldering be may be implemented
The simulation optimization method of Reflow Soldering of the present invention, but the realization device of the simulation optimization method of Reflow Soldering of the present invention
Including but not limited to the structure of the emulation optimizing system of Reflow Soldering enumerated of the present embodiment, all principles according to the present invention are done
The prior art malformation and replacement, be included in protection scope of the present invention.
In conclusion the simulation optimization method of Reflow Soldering provided by the invention, system, computer storage medium and equipment can
With the technology emulated in the design phase by Reflow Soldering, the Welding Problems of appearance are had found that it is likely that in advance, and then repair technical staff
Change design and optimization technique, the workload for needing complete originally for several days is completed within 1-2 short hour, is greatly improved
The manufacture quality and manufacture efficiency of product；And make electronics manufacturing enterprise by original diagnosis and analysis to lag production result
The problems in become to the emulation prevention in design front end, and can accomplish produce to put and prevent in advance；Therefore, it can be said that this
The simulation optimization method for the Reflow Soldering that embodiment provides is the effective scheme that electronics manufacturing enterprise realizes intelligence manufacture and industry 4.0
And technical support.The present invention effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (10)
1. a kind of simulation optimization method of Reflow Soldering characterized by comprising
Generate the threedimensional model of PCB circuit board to be optimized；
According to the thickness of the steel mesh opening read in one by one or the thickness of the steel mesh opening generated according to pad, corresponding weldering is generated
Cream threedimensional model；
The component for needing reflow soldering process is picked out from the threedimensional model of PCB circuit board to be optimized, according to the member picked out
Location information of the device on the threedimensional model of the PCB circuit board to be optimized, by each component setting to soldering paste three
On dimension module；
According to the analog parameter of preset Reflow Soldering, the component and pad that will be singled out carry out soldering paste welding simulation, formed to
Optimize the Reflow Soldering simulation model of PCB circuit board；
PCB circuit board inspection is carried out to the Reflow Soldering simulation model of the PCB circuit board to be optimized, to find problem to be optimized；
For the problem to be optimized, the optimization of corresponding design and processes is taken to modify.
2. the simulation optimization method of Reflow Soldering according to claim 1, which is characterized in that if PCB circuit board inspection is not sent out
After existing problem to be optimized, the simulation optimization method of the Reflow Soldering further includes the Reflow Soldering for exporting the PCB circuit board to be optimized
Simulation model.
3. the simulation optimization method of Reflow Soldering according to claim 1, which is characterized in that described to generate PCB electricity to be optimized
The threedimensional model of road plate includes:
Directly receive the threedimensional model of the PCB circuit board to be optimized of user's creation；Or
EDA wiring data is come from according to obtaining, generates the threedimensional model of PCB circuit board to be optimized.
4. the simulation optimization method of Reflow Soldering according to claim 1, which is characterized in that
It is described that criteria for selection in the component for need reflow soldering process is picked out from the threedimensional model of PCB circuit board to be optimized are as follows:
According to the recommendation of component manufacturer or actual circuit-board processes situation；
Location information of the component picked out on the threedimensional model of the PCB circuit board to be optimized includes being picked out
Coordinate and angle of the component on the threedimensional model of the PCB circuit board to be optimized；
The analog parameter of preset Reflow Soldering includes the transmission of the length of Reflow Soldering, the temperature range, each section in each section
Speed and/or the length in each section.
5. the simulation optimization method of Reflow Soldering according to claim 1, which is characterized in that forming PCB circuit to be optimized
After the step of Reflow Soldering simulation model of plate, the simulation optimization method of the Reflow Soldering further includes after welding neutralization welding to member
The stress variation of device and PCB circuit board is emulated and is shown.
6. the simulation optimization method of Reflow Soldering according to claim 1, which is characterized in that problem to be optimized include it is described to
Scolding tin distance problem, solder bridge problem, component in optimization PCB circuit board are set up a monument problem, component tilt problem, first device
Part offset problem and/or component and circuit board stress deformation problem.
7. the simulation optimization method of Reflow Soldering according to claim 6, which is characterized in that described to the PCB to be optimized
The Reflow Soldering simulation model of circuit board carries out the step of PCB circuit board inspection and includes:
Scolding tin distance in the PCB circuit board to be optimized is checked；
Solder bridge in the PCB circuit board to be optimized is checked；
Inspection of setting up a monument is carried out to the component picked out in the PCB circuit board to be optimized；
Inclination inspection is carried out to the component picked out in the PCB circuit board to be optimized；
Offset inspection is carried out to the component picked out in the PCB circuit board to be optimized；And/or
Stress deformation inspection is carried out to the component and circuit board picked out in the PCB circuit board to be optimized.
8. a kind of emulation optimizing system of Reflow Soldering characterized by comprising
Generation module, for generating the threedimensional model of PCB circuit board to be optimized；
Generation module, for according to the thickness of the steel mesh opening read in one by one or the thickness of the steel mesh opening generated according to pad
Degree, generates corresponding soldering paste threedimensional model；
Setup module, for picking out the component for needing reflow soldering process from the threedimensional model of PCB circuit board to be optimized, according to
Location information of the component picked out on the threedimensional model of the PCB circuit board to be optimized, by each component
It is arranged onto soldering paste threedimensional model；
Emulation module, for the analog parameter according to preset Reflow Soldering, the component and pad that will be singled out carry out soldering paste weldering
Emulation is connect, the Reflow Soldering simulation model of PCB circuit board to be optimized is formed；
It checks module, PCB circuit board inspection is carried out for the Reflow Soldering simulation model to the PCB circuit board to be optimized, with hair
Existing problem to be optimized；
Optimize modified module, for carrying out the optimization modification of corresponding design and processes for the problem to be optimized.
9. a kind of computer storage medium, is stored thereon with computer program, which is characterized in that when the program is executed by processor
Realize the simulation optimization method of Reflow Soldering described in any one of claims 1 to 7.
10. a kind of equipment characterized by comprising processor and memory；
The memory is used to execute the computer journey of the memory storage for storing computer program, the processor
Sequence, so that the equipment executes the simulation optimization method of the Reflow Soldering as described in any one of claims 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811277969.8A CN109241681B (en) | 2018-10-30 | 2018-10-30 | Reflow soldering simulation optimization method and system, computer storage medium and equipment |
| PCT/CN2019/082638 WO2020087874A1 (en) | 2018-10-30 | 2019-04-15 | Reflow soldering simulation optimization method and system, computer storage medium, and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811277969.8A CN109241681B (en) | 2018-10-30 | 2018-10-30 | Reflow soldering simulation optimization method and system, computer storage medium and equipment |
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| WO2020087874A1 (en) * | 2018-10-30 | 2020-05-07 | 上海望友信息科技有限公司 | Reflow soldering simulation optimization method and system, computer storage medium, and device |
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| CN111753458A (en) * | 2020-07-03 | 2020-10-09 | 北京航天微电科技有限公司 | Reflow soldering temperature field analysis method and device, and computer equipment |
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| WO2020087874A1 (en) | 2020-05-07 |
| CN109241681B (en) | 2020-09-08 |
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