CN111274697A - Simulation method and device for welding tension, electronic equipment and storage medium - Google Patents
Simulation method and device for welding tension, electronic equipment and storage medium Download PDFInfo
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- 238000003466 welding Methods 0.000 title claims abstract description 403
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000004088 simulation Methods 0.000 title claims abstract description 42
- 238000003860 storage Methods 0.000 title claims abstract description 13
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 86
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- 238000005476 soldering Methods 0.000 claims abstract description 79
- 238000004590 computer program Methods 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 14
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- 238000013461 design Methods 0.000 description 28
- 229910000679 solder Inorganic materials 0.000 description 19
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
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Abstract
The invention discloses a simulation method of welding tension, a simulation device, electronic equipment and a storage medium, wherein the simulation method of the welding tension comprises the steps of obtaining the welding tension through the size information of pins, and comparing the obtained welding tension with preset conditions to judge whether the designed openings of soldering paste and a steel mesh meet the welding conditions.
Description
Technical Field
The invention belongs to the technical field of SMT (surface mount technology) mounting, and particularly relates to a welding tension simulation method, a welding tension simulation device, electronic equipment and a storage medium.
Background
SMT is an abbreviation of Surface Mounted Technology (Surface Mounted Technology) and is currently one of the most popular techniques and processes in the electronic assembly industry. The surface mount technology is a circuit mounting technology for directly attaching and soldering a surface mount device to a predetermined position on a surface of a Printed Circuit Board (PCB) without drilling a Board hole in the PCB. The surface mount technology is a new generation of electronic assembly technology, which compresses the traditional electronic devices into devices with a volume of only one dozen times, thereby realizing high density, high reliability, miniaturization, low cost and production automation of electronic product assembly.
In PCB design production, device soldering is an extremely important link. With the development of systematization and integration of device packaging, the quality of devices is also larger and larger, and the quality of the welding quality of the devices directly affects the yield of production, so how to ensure the welding quality of the devices becomes a crucial part.
In the existing PCB design production flow, the welding quality detection of the device is generally carried out after production, and the simulation analysis is not carried out on the welding quality of the device in the early stage of design, so that the qualification rate of PCB production and manufacturing is directly influenced.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a simulation method and a simulation apparatus for welding tension, an electronic device, and a storage medium. The technical problem to be solved by the invention is realized by the following technical scheme:
a simulation method of welding tension comprises the following steps:
obtaining a total welding area according to the effective welding area of the pins and the number of the pins;
obtaining welding tension according to the total welding area and the tensile strength of the soldering paste;
and completing the welding simulation of the device according to the welding tension and preset conditions.
In one embodiment of the present invention, before obtaining the total bonding area according to the effective bonding area of the leads and the number of the leads, the method further comprises:
acquiring size information of the pin, wherein the size information of the pin comprises first size information of the pin or second size information of the pin;
and obtaining the effective welding area of the pin according to the size information of the pin.
In one embodiment of the present invention, obtaining the effective soldering area of the lead according to the size information of the lead includes:
acquiring the welding area of the first welding disc;
obtaining a first bottom surface projection area of the pin according to the first size information and the projection proportion of the pin;
obtaining a first maximum welding contact area of the pin according to the welding area of the first welding disc and the first bottom surface projection area of the pin;
and obtaining the effective welding area of the pin according to the first maximum welding contact area of the pin, the opening area of the first steel mesh and the effective welding area of the side surface of the pin.
In one embodiment of the present invention, obtaining a first maximum soldering contact area of the lead according to the soldering area of the first pad and the first bottom surface projection area of the lead includes:
judging the size of the welding area of the first pad and the first bottom surface projection area of the pin, if the welding area of the first pad is smaller than the first bottom surface projection area of the pin, obtaining the first maximum welding contact area of the pin according to the welding area of the first pad, and if the first bottom surface projection area of the pin is smaller than the welding area of the first pad, obtaining the first maximum welding contact area of the pin according to the first bottom surface projection area of the pin.
In one embodiment of the present invention, obtaining the effective soldering area of the lead according to the first maximum soldering contact area of the lead, the first steel mesh opening area and the side effective soldering area of the lead comprises:
obtaining the effective welding area of the bottom surface of the pin according to the first maximum welding contact area of the pin and the opening area of the first steel mesh;
obtaining the side surface effective welding height of the pin according to the bottom surface effective welding area of the pin, the opening area of the first steel mesh, the thickness of the first steel mesh and a first proportional parameter;
obtaining the effective welding area of the side surface of the pin according to the effective welding height of the side surface of the pin and the first size information of the pin;
and obtaining the effective welding area of the pin according to the effective welding area of the bottom surface of the pin and the effective welding area of the side surface of the pin.
In one embodiment of the present invention, obtaining the effective soldering area of the lead according to the size information of the lead includes:
acquiring size information of the second bonding pad;
obtaining the effective welding height of the pins;
obtaining a second maximum welding contact area of the pin according to the size information of the second bonding pad and the second size information of the pin;
obtaining a third maximum welding contact area of the pin according to the second maximum welding contact area of the pin and the opening area of the second steel mesh;
and obtaining the effective welding area of the pin according to the third maximum welding contact area of the pin, the effective welding height of the pin and the exposed height of the pin.
In one embodiment of the present invention, obtaining the effective solder height of the lead comprises:
and obtaining the effective welding height of the pin according to the bottom surface projection area of the pin, the opening area of the second steel mesh, the thickness of the second steel mesh and a second proportion parameter.
In one embodiment of the present invention, obtaining a second maximum soldering contact area of the lead according to the size information of the second pad and the second size information of the lead includes:
judging the size of the size information of the second bonding pad and the size of the second size information of the pin, if the size information of the second bonding pad is smaller than the second size information of the pin, obtaining the second maximum welding contact area of the pin according to the welding area of the second bonding pad, and if the second size information of the pin is smaller than the size information of the second bonding pad, obtaining the second maximum welding contact area of the pin according to the second size information of the pin and the ball planting proportion.
An embodiment of the present invention further provides a simulation apparatus for welding tension, including:
the total area processing module is used for obtaining a total welding area according to the effective welding area of the pins and the number of the pins;
the welding tension processing module is used for obtaining welding tension according to the total welding area and the tensile strength of the soldering paste;
and the detection module is used for finishing the welding simulation of the device according to the welding tension and the preset condition.
An embodiment of the present invention further provides an electronic device, including a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface, and the memory complete communication with each other through the communication bus;
a memory for storing a computer program;
a processor for implementing the steps of the simulation method of welding tension according to any of the above embodiments when executing the computer program.
An embodiment of the present invention further provides a storage medium, in which a computer program is stored, and the computer program is executed by a processor to implement the simulation method steps of the welding tension according to any one of the above embodiments.
The invention has the beneficial effects that:
according to the method, the total welding area of the pins corresponding to the device is obtained according to the effective welding area of the pins, the welding tension is obtained according to the total welding area of the pins and the tensile strength of the soldering paste, and the obtained welding tension is compared with the preset conditions, so that whether the designed soldering paste and the steel mesh opening meet the welding conditions or not is judged.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic flow chart of a simulation method of welding tension according to an embodiment of the present invention;
fig. 2 is a schematic flow chart of a data acquisition method according to an embodiment of the present invention;
FIG. 3 is a schematic flow chart of another simulation method of welding tension according to an embodiment of the present invention;
FIG. 4 is a front view of a device provided by an embodiment of the present invention;
FIG. 5 is a top view of a bond pad provided by an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a device provided by an embodiment of the present invention;
FIG. 7 is a schematic structural view of a steel mesh opening provided by an embodiment of the present invention;
FIG. 8 is a top view of another bond pad provided by an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of another device provided by an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of a welding tension simulation apparatus according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.
Example one
Referring to fig. 1, fig. 1 is a schematic flow chart of a simulation method of welding tension according to an embodiment of the present invention. The embodiment of the invention provides a simulation method of welding tension, which specifically comprises the following steps:
step 1, obtaining a total welding area according to the effective welding area of the pins and the number of the pins;
step 2, obtaining welding tension according to the total welding area and the tensile strength of the soldering paste;
and 3, completing welding simulation of the device according to the welding tension and preset conditions.
Specifically, the effective soldering area of the lead represents the total area of the lead in contact with solder paste (e.g., solder paste). After the effective soldering area of the pins is obtained, the total soldering area of all pins corresponding to the device and the soldering paste can be obtained according to the number of the pins and the effective soldering area of each pin, namely: total bonding area is the effective bonding area by the number of pins. After the total welding area is obtained, welding tension can be obtained according to the total welding area and the tensile strength of the welding paste, namely the product of the total welding area and the tensile strength of the welding paste is the tensile tension (namely the welding tension) of a device after welding, and finally whether the selected welding paste and the steel mesh opening meet the design requirements or not is judged according to the relation between the welding tension and the preset conditions, if not, the model of the welding paste and/or the steel mesh opening need to be adjusted until the obtained welding tension meets the design requirements, and then the welding simulation in the design stage is completed.
Specifically, the relation between the welding tension and the preset condition can be judged, if the welding tension is greater than or equal to the preset condition, the welding simulation of the device is completed, it is indicated that the selected type of the soldering paste and the steel mesh opening meet the design requirements, and if the welding tension is smaller than the preset condition, the soldering paste and/or the steel mesh opening need to be adjusted until the welding tension is greater than or equal to the preset condition, and then the welding detection of the device can be completed.
In this embodiment, the preset condition may be, for example, the gravity of the device, or an industry standard value of the device pulling force, for example, the industry standard value of the pulling force required by a chip 0402 device is 5.39N, or may also be F (G, V), where F (G, V) is a function related to the gravity and the speed of the device, or may be another condition that can be used to determine whether the welding pulling force meets the requirement, which is not specifically limited in this embodiment, and a person skilled in the art may select different preset conditions according to actual requirements to compare with the welding pulling force.
In addition, in order to better illustrate the effective soldering area of the lead of the present embodiment, the present embodiment illustrates the method for obtaining the effective soldering area of the lead in a specific manner, and therefore, step 1-1 and step 1-2 may be further included before step 1, wherein,
step 1-1, obtaining size information of a pin, wherein the size information of the pin comprises first size information of the pin or second size information of the pin;
and 1-2, obtaining the effective welding area of the pin according to the size information of the pin.
The present embodiment first obtains size information of a pin corresponding to a device to be soldered to a circuit board, where the size information reflects information related to the size of the pin of the device, and the size information of the pin of the present embodiment may include first size information of the pin or second size information of the pin, where the first size information of the pin is size information of the pin whose outer surface in the height direction of the pin is a straight surface, for example, the pin is square, rectangular, T-shaped, and the like, and the second size information of the pin is size information of the pin whose outer surface in the height direction of the pin is a curved surface, for example, the pin is spherical, ellipsoidal, and the like, and therefore, in an actual manufacturing process, an effective soldering area of the pin may be obtained according to the size information of the pin. Therefore, through the mode, a designer can perform simulation analysis on the welding quality of the device in the design stage, so that the welding quality of the device can be optimized in the design stage, the condition that the welding quality of the device is influenced because the selected soldering paste and/or steel mesh opening does not meet the condition in the design stage is avoided, and the qualified rate of PCB production and manufacturing is improved. In addition, because the welding quality can be optimally designed in the design stage, the production efficiency can be improved, and the problem that the welding quality does not meet the requirement and needs to be redesigned and remanufactured is solved.
Example two
In this embodiment, a simulation method of the welding tension in the first embodiment is specifically described on the basis of the above embodiments. This embodiment is mainly used to describe a simulation method of a bonding tension of a lead having a straight outer surface in a height direction of the lead.
Referring to fig. 2 and fig. 3, fig. 2 is a schematic flow chart of a data acquisition method according to an embodiment of the present invention, and fig. 3 is a schematic flow chart of another welding tension simulation method according to an embodiment of the present invention. In a specific embodiment, the embodiment first exemplifies a method for acquiring the first size information of the lead on the basis of the above embodiment, and specifically, the step 1-1 in the first embodiment may specifically include steps 1-1.1 to 1-1.3:
step 1-1.1, acquiring PCB design data;
step 1-1.2, acquiring device information from PCB design data;
and 1-1.3, obtaining first size information of the pins from a device 3D physical library according to the device information.
Specifically, the PCB Design data of this embodiment may be obtained by those skilled in the art using EDA (electronic Design Automation) Design software according to requirements of a final product, for example, the PCB Design data is CAD data + BOM data or Gerber data + BOM data, and after the PCB Design data is obtained, device information of each device on a circuit board may be obtained, where the device information includes material codes and supplier information of the devices, this embodiment is described by taking a specific device as an example, the device is set as a first device to be soldered on the circuit board, and it is assumed that the material code of the device is AD5306 BRUZ-regel 7 and the supplier information is anal; in addition, in this embodiment, a device 3D physical library is established by collecting device information of each type in the circuit board according to a commonly used device type, where the device 3D physical library is used to store physical three-dimensional data of the device (such as model data of the device, manufacturer, device type, material code, and the like), actual working parameter data (such as quality, material, power consumption, and the like of the device), soldering parameters (type of soldering paste, volume of soldering paste required by each pin), pin size, and the like, and each device is named according to a device supplier material code, that is, the device 3D physical library records physical information of each device, so this embodiment obtains device informationThen, the physical information of the corresponding device can be directly obtained from the device 3D physical library according to the material code corresponding to the device information, for example, the first device type is SOP16, the lead shape is rectangular, the lead size is 0.25mm by 0.5mm by 0.1mm, and the volume of the solder paste required by a single lead is 0.063mm3Therefore, the first size information of the pin can be obtained from the device 3D physical library.
In a specific embodiment, the method for obtaining the effective soldering area of the lead is exemplified based on the above embodiments in the present embodiment, specifically, the step 1-2 in the first embodiment may specifically include steps 1-2.1 to 1-2.4, where:
step 1-2.1, obtaining the welding area of a first welding disc;
step 1-2.2, obtaining a first bottom surface projection area of the pin according to the first size information and the projection proportion of the pin;
step 1-2.3, obtaining a first maximum welding contact area of the pin according to the welding area of the first bonding pad and the first bottom surface projection area of the pin;
and 1-2.4, obtaining the effective welding area of the pin according to the first maximum welding contact area of the pin, the opening area of the first steel mesh and the effective welding height of the side surface of the pin.
Specifically, the first pad of the present embodiment is a pad suitable for a pin whose outer surface in the height direction of the pin is a straight surface, so that the present embodiment can obtain relevant size information of the first pad corresponding to the device through PCB design data, and can obtain the bonding area of the first pad according to the relevant size information of the first pad. The effective soldering area of each pin with solder paste is different for each pin due to the different shape and type of the pin. In practice, the first bottom surface projected area of each lead is the maximum bottom surface area of the lead that may contact with the solder paste, for example, please refer to fig. 4, the type of the device in fig. 4 is SOP16, and the first bottom surface projected area of the lead of the device is the area projected to the bottom surface by the portion corresponding to the projection size, so this embodiment can improve the accuracy of the final soldering tension detection by selecting a value closer to the effective soldering area of the bottom surface of the lead from the soldering area of the first pad and the first bottom surface projected area of the lead as the first maximum soldering contact area of the lead, thereby improving the accuracy of the final soldering tension detection, wherein the effective soldering area of the bottom surface of the lead represents the effective area of the bottom surface of the lead that contacts with the solder paste (e.g., solder paste). After the first maximum welding contact area of the pin is determined, a numerical value which is closer to the effective welding area of the bottom surface of the pin can be selected from the first maximum welding contact area and the opening area of the first steel mesh to be used as the effective welding area of the bottom surface of the pin, so that the effective welding area of the pin can be obtained after the effective welding area of the bottom surface and the effective welding area of the side surface of the pin are obtained, the accuracy of the finally obtained total welding area can be further improved, and the accuracy of the detection of the final welding tension is further improved. The effective welding area of the side surface of the pin represents the contact area of the side surface of the pin and the soldering paste, the obtaining mode of the effective welding area of the side surface of the pin is not specifically limited in the embodiment, and technicians in the embodiment can obtain the effective welding area of the side surface of the pin according to different modes according to design requirements.
Therefore, the effective soldering area of the bottom surface of the pin and the effective soldering area of the side surface of the pin are obtained through the steps 1-2.1-1-2.4, the accuracy of the obtained effective soldering area of the bottom surface of the pin and the accuracy of the obtained effective soldering area of the side surface of the pin can be ensured through the method, and the accuracy of the obtained total soldering area is improved, so that the accuracy of the soldering tension obtained through the total soldering area and the tensile strength of the soldering paste is ensured, the type of the soldering paste finally determined through the simulation method of the embodiment and the accuracy of the steel mesh opening can be ensured, the problem that redesign and remanufacturing are needed because the soldering quality does not meet the requirement is avoided, the phenomenon that the soldering quality of the PCB is problematic in the production process is avoided, and the qualified rate of PCB production and manufacturing is improved.
Further, the steps 1 to 2.2 in the first embodiment may specifically be: for different types of pins, the first bottom projection area of the pin can be obtained according to the first size information and the projection ratio of the pin, and it should be understood that the projection ratio should be different for different types of pins, and all the projection ratios for solving the first bottom projection area of the pin belong to the projection ratio described in this embodiment.
For example SOP16 for the device type; the shape of the pin is rectangular, and the size information of the pin is as follows: the width is 0.25mm, the length is 0.5mm, the height is 0.1mm, and the projection ratio is 1.12, then the calculation formula of the first bottom surface projection area of the pin is:
the first bottom surface projection area of the pin is equal to the bottom surface area projection ratio of the pin
Length of the lead and width of the lead
＝0.25mm*0.5mm*1.12＝0.14mm2。
Further, the steps 1 to 2.3 in the first embodiment may specifically be: judging the sizes of the welding area of the first bonding pad and the first bottom surface projection area of the pin, if the welding area of the first bonding pad is smaller than the first bottom surface projection area of the pin, obtaining the first maximum welding contact area of the pin according to the welding area of the first bonding pad, and if the first bottom surface projection area of the pin is smaller than the welding area of the first bonding pad, obtaining the first maximum welding contact area of the pin according to the first bottom surface projection area of the pin.
That is, the present embodiment needs to determine the size of the bonding area of the first bonding pad and the projected area of the first bottom surface of the lead, thereby selecting a value from the bonding area of the first pad and the projected area of the first bottom surface of the lead that is closer to the effective bonding area of the bottom surface of the lead, therefore, when the bonding area of the first bonding pad is smaller than the projection area of the first bottom surface of the pin, the bonding area of the first bonding pad is a value closer to the effective bonding area of the bottom surface of the pin, the bonding area of the first bonding pad is taken as the first maximum bonding contact area of the lead to be obtained, when the first bottom surface projection area of the lead is smaller than the bonding area of the first bonding pad, it means that the first bottom surface projected area of the lead is a value closer to the effective soldering area of the bottom surface of the lead, the first bottom surface projected area of the lead is taken as the first maximum soldering contact area of the lead to be obtained.
Further, the steps 1 to 2.4 in the first embodiment may specifically include the steps 1 to 2.4.1 to 1 to 2.4.4, wherein:
and 1-2.4.1, obtaining the effective welding area of the bottom surface of the pin according to the first maximum welding contact area of the pin and the opening area of the first steel mesh.
Specifically, the first maximum welding contact area of the pin and the size of the first steel mesh opening area are judged, if the first maximum welding contact area of the pin is smaller than the first steel mesh opening area, the bottom surface effective welding area of the pin is obtained according to the first maximum welding contact area of the pin, and if the first steel mesh opening area is smaller than the first maximum welding contact area of the pin, the bottom surface effective welding area of the pin is obtained according to the first steel mesh opening area.
In this embodiment, the first steel mesh is a steel mesh suitable for the leads with straight outer surfaces in the height direction of the leads. In this embodiment, the first maximum welding contact area of the pin and the opening area of the first steel mesh need to be determined, so that a value closer to the effective welding area of the bottom surface of the pin is selected from the first maximum welding contact area of the pin and the opening area of the first steel mesh, therefore, when the first maximum welding contact area of the pin is smaller than the opening area of the first steel mesh, it is determined that the first maximum welding contact area of the pin is a value closer to the effective welding area of the bottom surface of the pin, and the first maximum welding contact area of the pin is used as the effective welding area of the bottom surface of the pin to be obtained; when the opening area of the first steel mesh is smaller than the first maximum welding contact area of the pin, the opening area of the first steel mesh is a numerical value closer to the effective welding area of the bottom surface of the pin, and the opening area of the first steel mesh is used as the effective welding area of the bottom surface of the pin to be obtained.
Step 1-2.4.2, obtaining the side surface effective welding height of the pin according to the bottom surface effective welding area of the pin, the opening area of the first steel mesh, the thickness of the first steel mesh and the first proportional parameter, namely obtaining the side surface effective welding height of the pin according to a side surface effective welding height calculation formula of the pin, wherein the side surface effective welding height of the pin is as follows:
the effective welding height of the side surface (effective welding area of the bottom surface/opening area of the first steel mesh) is the thickness of the first steel mesh and is a first proportional parameter.
The first scaling parameter needs to be selected according to the type of the pin, which is not specifically limited in this embodiment, for example, the first scaling parameter is 1.0 to 1.5.
And 1-2.4.3, obtaining the effective welding area of the side surface of the pin according to the effective welding height of the side surface of the pin and the first size information of the pin.
Specifically, the area of each side surface (the side surface is a straight surface) can be obtained according to the effective welding height of the side surface of the pin and the length of the bottom edge of each side surface of the pin, the sum of the areas of all the side surfaces of the pin is the effective welding area of the side surface of the pin, and for the pin of which the outer surface in the height direction is the straight surface, the side surface close to the device is generally an arc surface and is not included in the effective welding area of the side surface of the pin. For example, the effective soldering area for a side of a rectangular-shaped lead is:
the effective side bonding area is the effective side bonding height (lead length + lead width 2).
Step 1-2.4.4, obtaining the effective welding area of the pin according to the effective welding area of the bottom surface of the pin and the effective welding area of the side surface of the pin, namely the sum of the effective welding area of the bottom surface of the pin and the effective welding area of the side surface of the pin is the effective welding area of the pin, namely: the effective welding area is equal to the effective welding area of the bottom surface plus the effective welding area of the side surface.
In the embodiment, a value closer to an effective welding area of the bottom surface of the pin is selected from a welding area of the first pad and a first bottom surface projection area of the pin as a first maximum welding contact area of the pin, then a value closer to an effective welding area of the bottom surface of the pin is selected from the first maximum welding contact area of the pin and an opening area of the first steel mesh as a final effective welding area of the bottom surface of the pin, and finally an effective welding area of the pin with the outer surface of the pin in the height direction as the straight surface is obtained through calculation of the effective welding area of the bottom surface of the pin and the effective welding area of the side surface of the pin.
EXAMPLE III
In this embodiment, a method for simulating a bonding tension of a lead having a straight outer surface in a lead height direction is described as a specific example on the basis of the second embodiment.
Step 1, deriving PCB design data from EDA design software. Circularly acquiring device information from PCB design data, such as: the material code for the first device is: AD5306BRUZ-REEL7, supplier information: ANALOG. And looking up the size information of the first pad of the device in the PCB design data, see fig. 5, where the size information of the first pad is 0.5mm x 1.2 mm.
The method for searching the physical information of the corresponding device from the 3D physical library of the device according to the device information comprises the following steps: for example, referring to fig. 6, the first device type is SOP16, the shape of the lead is rectangular, the size of the lead is 0.25mm by 0.5mm by 0.1mm, the weight of the device is 2mg, and the number of the leads is 16.
And 2, welding area of the first welding pad is 0.5mm and 1.2mm and 0.6mm2。
Step 3, the first bottom surface projection area of the pin is equal to the bottom surface area of the pin, i.e. the projection proportion
Length of the lead and width of the lead
＝0.25mm*0.5mm*1.12＝0.14mm2。
In summary, the welding area of the first pad is larger than the first bottom surface projection area of the pin, and the first maximum welding contact area of the pin is the first bottom surface projection area of the pin.
Step 4, searching the opening information of the first steel mesh corresponding to the device from the steel mesh opening design according to the device information, wherein the opening information of the first steel mesh comprises: opening shape, opening size, thickness, etc., for example: referring to fig. 7, the first device type is SOP16, the opening shape of the first steel net is a rectangle with rounded corners, and the first steel net has the dimensions of 0.41mm wide, 1.10mm long and 0.15mm high.
The area of the bottom surface of the opening of the first steel mesh is 0.41mm and 1.10mm and 0.451mm2。
In summary, the area of the bottom surface of the opening of the first steel mesh is larger than the first maximum welding contact area of the pin, and the first maximum welding contact area of the pin is the effective welding area of the bottom surface of the pin.
Step 5, the effective welding height of the side surface (effective welding area of the bottom surface/area of the bottom surface of the opening of the first steel mesh) and the thickness of the first steel mesh are first proportional parameters (0.14 mm)2/(0.41mm*1.10mm)】*0.15mm*1.3＝0.0608mm。
Step 6, the effective welding area of the side face is equal to the effective welding height of the side face (the length of the pin + the width of the pin is 2)
＝0.0608mm*(0.25mm+0.5mm*2)＝0.076mm2。
Step 7, total welding area (bottom surface effective welding area + side surface effective welding area) is equal to the number of pins
＝(0.14mm2+0.076mm2)*16＝3.458mm2。
Step 8, the soldering paste is solder paste for example, and the model, the tin content, the tensile strength and other parameters of the solder paste can be obtained from the parameters of the solder paste, for example, the tensile strength is 0.63N/mm2。
The welding tension μ generated after welding is then:
mu-total weld area tensile strength 3.458mm2*0.63N/mm2＝2.179N。
Step 9, presetting a condition, such as gravity of the device, and then the gravity T is:
T＝2mg*G＝2mg*9.8N/KG＝19.6*10-6N。
in summary, the welding tension μ is greater than the gravity T of the device, and the welding is satisfactory.
Example four
In this embodiment, a simulation method of the welding tension in the first embodiment is specifically described on the basis of the above embodiments. This embodiment is mainly used to describe a simulation method for a soldering pull force of a lead having a curved outer surface in a height direction of the lead.
In a specific embodiment, the method for obtaining the effective soldering area of the lead is exemplified based on the above embodiments in the present embodiment, specifically, the step 1-2 in the first embodiment may specifically include steps 1-2.5 to 1-2.9, where:
step 1-2.5, obtaining size information of a second bonding pad;
step 1-2.6, obtaining the effective welding height of the pin;
step 1-2.7, obtaining a second maximum welding contact area of the pin according to the size information of the second bonding pad and the second size information of the pin;
step 1-2.8, obtaining a third maximum welding contact area of the pin according to the second maximum welding contact area of the pin and the opening area of the second steel mesh;
and 1-2.9, obtaining the effective welding area of the pin according to the third maximum welding contact area of the pin, the effective welding height of the pin and the exposed height of the pin.
Specifically, the second pad of the present embodiment is a pad suitable for a pin whose outer surface in the height direction of the pin is a curved surface, so that the present embodiment can obtain relevant size information of the second pad corresponding to the device through PCB design data, for example, if the second pad is a circle, the size information is the radius thereof. In addition, the effective soldering height of the lead of the embodiment is the height of the lead contacting with the solder paste in the height direction of the lead. According to the embodiment, the second maximum welding contact area of the pin is obtained according to the size information of the second pad and the second size information of the pin, namely, the second maximum welding contact area is a numerical value which is selected from the welding area of the second pad and the exposed surface area of the pin and is closer to the third maximum welding contact area, and then a numerical value which is selected from the second maximum welding contact area and the opening area of the second steel mesh and is closer to the third maximum welding contact area is selected, wherein the second steel mesh is a steel mesh suitable for the pin with the curved surface on the outer surface in the height direction of the pin. And finally, obtaining the effective welding area of the pin according to the third maximum welding contact area of the pin, the effective welding height of the pin and the exposed height of the pin, wherein the exposed height of the pin is the height of the pin exposed outside the pin. Therefore, in the embodiment, a numerical value closer to the third maximum welding contact area of the pin is selected from the welding area of the second bonding pad and the exposed surface area of the pin as the second maximum welding contact area of the pin, so that the accuracy of the finally obtained total welding area can be improved, and the accuracy of the detection of the final welding tension is improved. After the second maximum welding contact area of the pin is determined, a value which is closer to the third maximum welding contact area of the pin can be selected from the second maximum welding contact area and the second steel mesh opening area to be used as the third maximum welding contact area of the pin, so that the effective welding area of the pin can be obtained after the third maximum welding contact area of the pin is obtained, the accuracy of the finally obtained total welding area can be further improved, and the accuracy of the detection of the final welding tension is further improved.
Further, the steps 1 to 2.6 in the first embodiment may specifically be: obtain the effective welding height of pin according to the bottom surface projected area of pin, the thickness and the second proportional parameter of second steel mesh opening area, second steel mesh, obtain the effective welding height of pin promptly according to the effective welding height computational formula of pin, wherein, the effective welding height computational formula of pin is:
the effective welding height (bottom surface projection area/second steel mesh opening area) and the second steel mesh thickness are the second proportional parameter.
The bottom surface projection area is the projection area of the bottom surface of the pin, and the second proportional parameter needs to be selected according to the type of the pin, which is not specifically limited in this embodiment, for example, the second proportional parameter is 1.0 to 1.5.
Further, the steps 1 to 2.7 in the first embodiment may specifically be: and judging the size of the size information of the second bonding pad and the size of the second size information of the pin, if the size information of the second bonding pad is smaller than the second size information of the pin, obtaining the second maximum welding contact area of the pin according to the welding area of the second bonding pad, and if the second size information of the pin is smaller than the size information of the second bonding pad, obtaining the second maximum welding contact area of the pin according to the second size information of the pin and the ball planting proportion.
Specifically, in this embodiment, it is necessary to determine the size of the size information of the second pad and the size of the second size information of the pin, for example, determine the size of the radius of the second pad and the radius of the pin, and when the size information of the second pad is smaller than the second size information of the pin, it indicates that the soldering area of the second pad is closer to the third maximum soldering contact area, the soldering area of the second pad is the second maximum soldering contact area, and when the second size information of the pin is smaller than the size information of the second pad, it indicates that the exposed surface area of the pin is closer to the third maximum soldering contact area, the exposed surface area of the pin is the second maximum soldering contact area, for example, the device type is BGA; the shape of the pin is spherical, and the size information of the pin is as follows: the radius r is 0.5mm, the ball-planting ratio is 2/3, and the calculation formula of the exposed surface area of the pin is as follows:
exposed surface area of pin is 4 pi r2The ball planting ratio is pi 0.5mm 2/3 mm 2.093mm2。
The ball-mounting ratio can be set according to different pin types, and this embodiment does not specifically limit this.
Further, the steps 1 to 2.8 in the first embodiment may specifically be: judging the second maximum welding contact area of the pin and the opening area of the second steel mesh, if the second maximum welding contact area of the pin is smaller than the opening area of the second steel mesh, the second maximum welding contact area of the pin is closer to the third maximum welding contact area of the pin, and at the moment, taking the second maximum welding contact area of the pin as the third maximum welding contact area of the pin, if the opening area of the second steel mesh is smaller than the second maximum welding contact area of the pin, the opening area of the second steel mesh is closer to the third maximum welding contact area of the pin, and at the moment, taking the opening area of the second steel mesh as the third maximum welding contact area of the pin.
Further, the steps 1 to 2.9 in the first embodiment may specifically be: obtaining the effective welding area of the pin according to an effective welding area calculation formula of the pin, wherein the effective welding area calculation formula of the pin is as follows:
effective solder area (effective solder height/exposed height of the pin) third maximum solder contact area.
The embodiment mainly describes a pin with a curved outer surface in the height direction of the pin, and the embodiment selects a second maximum welding contact area closer to the third maximum welding contact area from the welding area of the second pad and the exposed surface area of the pin as the second maximum welding contact area of the pin, then selects a third maximum welding contact area closer to the third maximum welding contact area from the second maximum welding contact area and the opening area of the second steel mesh as the final third maximum welding contact area, and finally calculates the effective welding area of the pin with the curved outer surface in the height direction of the pin through the third maximum welding contact area, the effective welding height and the exposed height of the pin.
EXAMPLE five
In this embodiment, a method for simulating a bonding tension of a lead having a curved outer surface in a lead height direction is described as a specific example based on the fourth embodiment.
Step 1, deriving PCB design data from EDA design software. Circularly acquiring device information from PCB design data, such as: the material code for the first device is: A3P1000-FG144M, supplier information: MICROSOFMI. And looking up the size information of the second bonding pad of the device in the PCB design data, please refer to fig. 8, where the size information of the second bonding pad is 0.8mm in radius, and the second bonding pad is circular in shape.
The method for searching the physical information of the corresponding device from the 3D physical library of the device according to the device information comprises the following steps: referring to fig. 9, the physical information of the corresponding device can be directly obtained from the device 3D physical library according to the material code corresponding to the device information, for example, the first device type is BGA, the pin shape is spherical, the pin size is 0.5mm in radius, the weight of the device is 50mg, and the number of the pins is 144.
In summary, the radius of the second pad is larger than the radius of the lead, so the second maximum soldering contact area of the lead is the exposed surface area of the lead, that is:
exposed surface area of pin is 4 pi r2The ball planting ratio is pi 0.5mm 2/3 mm 2.093mm2。
Step 2, searching the opening information of a second steel mesh corresponding to the device from the steel mesh opening design according to the device information, wherein the opening information of the second steel mesh comprises: opening shape, opening size, thickness, etc., for example: the first device type is BGA, the opening of the second steel mesh is rectangular, and the second steel mesh has dimensions of 1.5mm width, 1.5mm length and 0.5mm height.
The area of the bottom surface of the opening of the second steel mesh is 1.5mm 2.25mm2。
In summary, the exposed surface area of the pin is smaller than the area of the bottom surface of the opening of the second steel mesh, and the exposed surface area of the pin is the third largest welding contact area of the pin.
And 3, setting the effective welding height (the bottom surface projection area/the opening bottom surface area of the second steel mesh) and the thickness of the second steel mesh as second proportion parameters (0.5mm pi)/(1.5 mm) 0.5mm 1.15 mm 0.2 mm.
Step 4, the effective welding area (effective welding height/exposed height of the pin) and the third maximum welding contact area (0.2 mm/(0.5mm 2/3)) are 2.093mm2＝1.268mm2
Step 5, the total welding area is the effective welding area and the number of the pins is 1.268mm2*144＝182.592mm2。
Step 6, the soldering paste is solder paste for example, and the model, the tin content, the tensile strength and other parameters of the solder paste can be obtained from the parameters of the solder paste, for example, the tensile strength is 0.63N/mm2。
The welding tension μ generated after welding is then:
mu-total weld area tensile strength 182.592mm2*0.63N/mm2＝115.033N。
Step 7, presetting a condition, such as the gravity of the device, wherein the gravity T is as follows:
T＝50mg*G＝50mg*9.8N/KG＝490*10-6N。
in summary, the welding tension μ is greater than the gravity T of the device, and the welding is satisfactory.
EXAMPLE six
Referring to fig. 10, fig. 10 is a schematic structural diagram of a welding tension simulation apparatus according to an embodiment of the present invention. The simulation apparatus includes:
the total area processing module is used for obtaining a total welding area according to the effective welding area of the pins and the number of the pins;
the welding tension processing module is used for obtaining welding tension according to the total welding area and the tensile strength of the soldering paste;
and the detection module is used for finishing the welding simulation of the device according to the welding tension and the preset conditions.
In one embodiment of the present invention, the simulation apparatus for welding tension may further include an obtaining module and an effective welding area processing module, wherein,
the device comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring the size information of the pins, and the size information of the pins comprises first size information of the pins or second size information of the pins;
and the effective welding area processing module is used for obtaining the effective welding area of the pin according to the size information of the pin.
In an embodiment of the present invention, the effective soldering area processing module is specifically configured to obtain a soldering area of the first pad; obtaining a first bottom surface projection area of the pin according to the first size information and the projection proportion of the pin; obtaining a first maximum welding contact area of the pin according to the welding area of the first welding disc and the first bottom surface projection area of the pin; and obtaining the effective welding area of the pin according to the first maximum welding contact area of the pin, the opening area of the first steel mesh and the effective welding area of the side surface of the pin.
In one embodiment of the present invention, obtaining a first maximum soldering contact area of a lead according to a soldering area of a first pad and a first bottom projection area of the lead includes:
judging the sizes of the welding area of the first bonding pad and the first bottom surface projection area of the pin, if the welding area of the first bonding pad is smaller than the first bottom surface projection area of the pin, obtaining the first maximum welding contact area of the pin according to the welding area of the first bonding pad, and if the first bottom surface projection area of the pin is smaller than the welding area of the first bonding pad, obtaining the first maximum welding contact area of the pin according to the first bottom surface projection area of the pin.
In one embodiment of the present invention, obtaining the effective soldering area of the lead according to the first maximum soldering contact area of the lead, the first steel mesh opening area and the side effective soldering area of the lead comprises:
obtaining the effective welding area of the bottom surface of the pin according to the first maximum welding contact area of the pin and the opening area of the first steel mesh;
obtaining the side surface effective welding height of the pin according to the bottom surface effective welding area of the pin, the opening area of the first steel mesh, the thickness of the first steel mesh and the first proportional parameter;
obtaining the effective welding area of the side surface of the pin according to the effective welding height of the side surface of the pin and the first size information of the pin;
and obtaining the effective welding area of the pin according to the effective welding area of the bottom surface of the pin and the effective welding area of the side surface of the pin.
In an embodiment of the present invention, the effective soldering area processing module may be further specifically configured to obtain size information of the second pad; obtaining the effective welding height of the pins; obtaining a second maximum welding contact area of the pin according to the size information of the second bonding pad and the second size information of the pin;
obtaining a third maximum welding contact area of the pin according to the second maximum welding contact area of the pin and the opening area of the second steel mesh;
and obtaining the effective welding area of the pin according to the third maximum welding contact area of the pin, the effective welding height of the pin and the exposed height of the pin.
In one embodiment of the present invention, obtaining an effective solder height of a pin comprises:
and obtaining the effective welding height of the pin according to the bottom surface projection area of the pin, the opening area of the second steel mesh, the thickness of the second steel mesh and the second proportional parameter.
In one embodiment of the present invention, obtaining a second maximum soldering contact area of the lead according to the size information of the second pad and the second size information of the lead includes:
and judging the size of the size information of the second bonding pad and the size of the second size information of the pin, if the size information of the second bonding pad is smaller than the second size information of the pin, obtaining the second maximum welding contact area of the pin according to the welding area of the second bonding pad, and if the second size information of the pin is smaller than the size information of the second bonding pad, obtaining the second maximum welding contact area of the pin according to the second size information of the pin and the ball planting proportion.
The welding tension simulation device provided by the embodiment of the invention can execute the method embodiment, the realization principle and the technical effect are similar, and the details are not repeated.
EXAMPLE seven
Referring to fig. 11, fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. The electronic device 1100 comprises: the system comprises a processor 1101, a communication interface 1102, a memory 1103 and a communication bus 1104, wherein the processor 1101, the communication interface 1102 and the memory 1103 are communicated with each other through the communication bus 1104;
a memory 1103 for storing a computer program;
the processor 1101 is configured to implement the above-mentioned method steps when executing the computer program.
The processor 1101, when executing the computer program, implements the steps of:
obtaining size information of the pin, wherein the size information of the pin comprises first size information of the pin or second size information of the pin;
obtaining the effective welding area of the pin according to the size information of the pin;
obtaining a total welding area according to the effective welding area of the pins and the number of the pins;
obtaining welding tension according to the total welding area and the tensile strength of the soldering paste;
and completing the welding simulation of the device according to the welding tension and preset conditions.
The electronic device provided by the embodiment of the present invention can execute the above method embodiments, and the implementation principle and technical effect are similar, which are not described herein again.
Example eight
Yet another embodiment of the present invention provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of:
obtaining size information of the pin, wherein the size information of the pin comprises first size information of the pin or second size information of the pin;
obtaining the effective welding area of the pin according to the size information of the pin;
obtaining a total welding area according to the effective welding area of the pins and the number of the pins;
obtaining welding tension according to the total welding area and the tensile strength of the soldering paste;
and completing the welding simulation of the device according to the welding tension and preset conditions.
The computer-readable storage medium provided by the embodiment of the present invention may implement the above method embodiments, and the implementation principle and technical effect are similar, which are not described herein again.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, apparatus (device), or computer program product. Accordingly, this application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects that may all generally be referred to herein as a "module" or "system. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-readable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein. A computer program stored/distributed on a suitable medium supplied together with or as part of other hardware, may also take other distributed forms, such as via the Internet or other wired or wireless telecommunication systems.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (11)
1. A simulation method of welding tension is characterized by comprising the following steps:
obtaining a total welding area according to the effective welding area of the pins and the number of the pins;
obtaining welding tension according to the total welding area and the tensile strength of the soldering paste;
and completing the welding simulation of the device according to the welding tension and preset conditions.
2. The method for simulating welding tension according to claim 1, wherein before obtaining the total welding area according to the effective welding area of the pins and the number of the pins, the method further comprises:
acquiring size information of the pin, wherein the size information of the pin comprises first size information of the pin or second size information of the pin;
and obtaining the effective welding area of the pin according to the size information of the pin.
3. The method for simulating welding tension according to claim 2, wherein obtaining the effective welding area of the pin according to the size information of the pin comprises:
acquiring the welding area of the first welding disc;
obtaining a first bottom surface projection area of the pin according to the first size information and the projection proportion of the pin;
obtaining a first maximum welding contact area of the pin according to the welding area of the first welding disc and the first bottom surface projection area of the pin;
and obtaining the effective welding area of the pin according to the first maximum welding contact area of the pin, the opening area of the first steel mesh and the effective welding area of the side surface of the pin.
4. The method for simulating welding tension according to claim 3, wherein obtaining the first maximum welding contact area of the pin according to the welding area of the first bonding pad and the first bottom surface projection area of the pin comprises:
judging the size of the welding area of the first pad and the first bottom surface projection area of the pin, if the welding area of the first pad is smaller than the first bottom surface projection area of the pin, obtaining the first maximum welding contact area of the pin according to the welding area of the first pad, and if the first bottom surface projection area of the pin is smaller than the welding area of the first pad, obtaining the first maximum welding contact area of the pin according to the first bottom surface projection area of the pin.
5. The method for simulating the welding tension according to claim 3, wherein obtaining the effective welding area of the lead according to the first maximum welding contact area of the lead, the first steel mesh opening area and the side effective welding area of the lead comprises:
obtaining the effective welding area of the bottom surface of the pin according to the first maximum welding contact area of the pin and the opening area of the first steel mesh;
obtaining the side surface effective welding height of the pin according to the bottom surface effective welding area of the pin, the opening area of the first steel mesh, the thickness of the first steel mesh and a first proportional parameter;
obtaining the effective welding area of the side surface of the pin according to the effective welding height of the side surface of the pin and the first size information of the pin;
and obtaining the effective welding area of the pin according to the effective welding area of the bottom surface of the pin and the effective welding area of the side surface of the pin.
6. The method for simulating welding tension according to claim 2, wherein obtaining the effective welding area of the pin according to the size information of the pin comprises:
acquiring size information of the second bonding pad;
obtaining the effective welding height of the pins;
obtaining a second maximum welding contact area of the pin according to the size information of the second bonding pad and the second size information of the pin;
obtaining a third maximum welding contact area of the pin according to the second maximum welding contact area of the pin and the opening area of the second steel mesh;
and obtaining the effective welding area of the pin according to the third maximum welding contact area of the pin, the effective welding height of the pin and the exposed height of the pin.
7. The method for simulating welding tension according to claim 6, wherein obtaining the effective welding height of the pin comprises:
and obtaining the effective welding height of the pin according to the bottom surface projection area of the pin, the opening area of the second steel mesh, the thickness of the second steel mesh and a second proportion parameter.
8. The method for simulating welding tension according to claim 6, wherein obtaining the second maximum welding contact area of the pin according to the size information of the second bonding pad and the second size information of the pin comprises:
judging the size of the size information of the second bonding pad and the size of the second size information of the pin, if the size information of the second bonding pad is smaller than the second size information of the pin, obtaining the second maximum welding contact area of the pin according to the welding area of the second bonding pad, and if the second size information of the pin is smaller than the size information of the second bonding pad, obtaining the second maximum welding contact area of the pin according to the second size information of the pin and the ball planting proportion.
9. A simulation device of welding tension is characterized by comprising:
the total area processing module is used for obtaining a total welding area according to the effective welding area of the pins and the number of the pins;
the welding tension processing module is used for obtaining welding tension according to the total welding area and the tensile strength of the soldering paste;
and the detection module is used for finishing the welding simulation of the device according to the welding tension and the preset condition.
10. An electronic device is characterized by comprising a processor, a communication interface, a memory and a communication bus, wherein the processor and the communication interface are used for realizing mutual communication by the memory through the communication bus;
a memory for storing a computer program;
a processor for implementing the method steps of any of claims 1-8 when executing the computer program.
11. A storage medium, characterized in that a computer program is stored in the storage medium, which computer program, when being executed by a processor, carries out the method steps of any one of claims 1 to 8.
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