CN102186313A - SMT (Surface Mounted Technology) circuit board quality monitoring method - Google Patents
SMT (Surface Mounted Technology) circuit board quality monitoring method Download PDFInfo
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Abstract
The invention relates to an SMT (Surface Mounted Technology) circuit board quality monitoring method which comprises the following steps: (a) arranging temperature-measuring elements on at least one welding spot with the maximum heat absorption capacity and one welding spot with the minimum heat absorption capacity on a welded circuit board; (b) setting preset values of process factors of the welding spots; (c) based on the actual measurement values Pw1 of the process factors of the welding spots, calculating process quality window indices (QWI) corresponding to the process factors; (d) if QWIs corresponding to all the process factors of each welding spot are within +/-99%, indicating that the furnace temperature curve setting of a reflow welding furnace of the circuit board is reasonable; and (e) carrying out reflow welding according to the reasonably set furnace temperature curve obtained in the step (d). By using the SMT circuit board quality monitoring method, the quality of the whole circuit board is judged based on the preset values and real-time measurement actual values of the process factors, and the furnace temperature curve of the reflow welding furnace is set as reasonably as possible, thereby improving the quality and reliability of the SMT circuit board product to the greatest extent.
Description
Technical field
The present invention relates to surface installation technique (SMT, Surface Mounted Technology), particularly relate to SMT board quality method for supervising.
Background technology
SMT is most popular a kind of technology and a technology in the present electronics assembling industry.Its processing step mainly comprises: (a) scolder is printed to the solder joint of circuit board, for the components and parts welding is prepared; (b) electronic component is mounted on the circuit board bond pad locations; (c) reflow soldering, the circuit board that is pasted with electronic component through reflow soldering furnace, melt scolder under the drive that transmits guide rail, thereby make electronic component and circuit board bonding; (d) cooling circuit board, thus make electronic component be bonded in circuit board securely.
Wherein the step of reflow soldering is the core technology of SMT, and the temperature control in its technological process of production is most important, because different scolders has different compositions and proportioning, their fusing point has nothing in common with each other, and needs the Reflow Soldering temperature of employing also different.On producing, the welding furnace temperature curve of setting or adjust a circuit board is the comparatively work of very complicated.Usually, can improve preheating and reflux temperature by appropriateness to comparatively complicated circuit board, or prolong preheating and return time, make on the circuit board each electronic component temperature even, reflux fully, thereby reduce open defect.The revision of welding furnace temperature temperature curve is generally carried out according to operating personnel's experience, does not have the standard of determining.Therefore, sometimes seem on such circuit board surface that the solder joint outward appearance is good, in fact because overlong time that stops in the high-temperature region or the temperature that stands are too high, the mechanical property of electronic component and electrical property meeting variation, welding spot reliability can descend, this hidden danger can't be discovered aborning, and needs through just showing after the use of an end time, and this may cause the loss that can't retrieve to the user.
But in the process of reflow soldering, can not directly at solder joint temperature probe be set, have no way of learning the preheating and the reflux temperature of solder joint, the reflux temperature curve that also is in no position to take possession of is so the quality monitoring of circuit board is a difficult problem.
Summary of the invention
The objective of the invention is to avoid weak point of the prior art and a kind of SMT board quality method for supervising is provided, it can judge the quality of the circuit board that SMT produces according to default a plurality of process factor, sets the as far as possible reasonably furnace temperature curve of reflow soldering furnace.
Purpose of the present invention realizes by following technical measures.
SMT board quality method for supervising, step comprises:
(a) in welding the circuit board of finishing, select maximum solder joint of caloric receptivity and the minimum solder joint of caloric receptivity that temperature element is set at least;
(b) according to the furnace temperature curve of the temperature curve setting reflow soldering furnace of the scolder that adopts; Set the interval Sw1～Sw2 of preset value of the process factor of described solder joint, described process factor comprises the slope of the temperature curve of each solder joint, and described slope comprises the maximum rate of rise and maximum descending slope; Furnace temperature curve according to the reflow soldering furnace of setting carries out reflow soldering;
(c) calculate the processing quality window index QWI of process factor correspondence according to the actual measured value Pw1 of the process factor of described solder joint, QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%;
(d) all in ± 99%, then the furnace temperature curve setting of the reflow soldering furnace of the setting of this circuit board is reasonable for the QWI of all process factor correspondences of each solder joint; If the QWI of arbitrary process factor correspondence of arbitrary solder joint surpasses ± 99%, then the furnace temperature curve setting of the reflow soldering furnace of the setting of this circuit board is unreasonable, and reset the furnace temperature curve of reflow soldering furnace, re-execute step (a) (b) (c) and (d) again;
(e) the rational furnace temperature curve of setting that obtains according to step (d) carries out reflow soldering.
Process factor described in the step (b) also comprises preheating zone temperature-time, heat preservation zone temperature-time, recirculating zone temperature-time and total heating time.
Process factor also comprises peak temperature and travelling speed described in the step (b).
The maximum solder joint of described caloric receptivity comprises the thickest solder joint of electronic component pin, and the solder joint of described caloric receptivity minimum comprises the pin that is positioned at the electronic component middle part, the solder joint that the electronic component pin is the thinnest.
SMT board quality method for supervising of the present invention is according to the preset value of process factor and measure actual value in real time, judge the quality of entire circuit plate, make the setting of the furnace temperature curve of reflow soldering furnace break away from the conventional form of setting by rule of thumb, provide and judged whether reasonably standard of furnace temperature curve, thereby improved the quality and the reliability of products of the circuit board of SMT product to the full extent.
Embodiment
The invention will be further described with the following Examples.
Embodiment 1
The SMT board quality method for supervising of present embodiment, step comprises:
(a) in welding the circuit board of finishing, select maximum solder joint of caloric receptivity and the minimum solder joint of caloric receptivity that temperature element is set at least.
In the welding process, when the maximum solder joint of caloric receptivity absorbs heat deficiency, this solder joint welding built on the sand, the minimum solder joint of caloric receptivity may absorb heat excessively simultaneously, cause the scolder oxidation, there is hidden danger equally in welding, therefore selects caloric receptivity maximum and the minimum solder joint of caloric receptivity to carry out thermometric, just the welding quality of all solder joints of energy standard entire circuit plate.
Having welded the caloric receptivity of each solder joint of the circuit board of finishing determines, factors such as the pin of caloric receptivity and spot size, electronic component and bond pad locations are relevant, the maximum solder joint of described caloric receptivity comprises the thickest solder joint of electronic component pin, and the solder joint of described caloric receptivity minimum comprises the pin that is positioned at the electronic component middle part, the solder joint that the electronic component pin is the thinnest.
(b) according to the furnace temperature curve of the temperature curve setting reflow soldering furnace of the scolder that adopts; Set the interval Sw1～Sw2 of preset value of the process factor of described solder joint, described process factor comprises the slope of the temperature curve of each solder joint, and described slope comprises the maximum rate of rise and maximum descending slope; Furnace temperature curve according to the reflow soldering furnace of setting carries out reflow soldering.
The maximum rate of rise comes across heat preservation zone, has characterized programming rate, and maximum descending slope comes across the cooling zone, has characterized cooling rate.
(c) calculate the processing quality window index QWI of process factor correspondence according to the actual measured value Pw1 of the process factor of described solder joint, QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%.
(d) all in ± 99%, then the furnace temperature curve setting of the reflow soldering furnace of the setting of this circuit board is reasonable for the QWI of all process factor correspondences of each solder joint; If the QWI of arbitrary process factor correspondence of arbitrary solder joint surpasses ± 99%, then the furnace temperature curve setting of the reflow soldering furnace of the setting of this circuit board is unreasonable, and reset the furnace temperature curve of reflow soldering furnace, re-execute step (a) (b) (c) and (d) again.
(e) the rational furnace temperature curve of setting that obtains according to step (d) carries out reflow soldering, that is, with the same design of having welded the circuit board of finishing in the step (a) soldered circuit board not, set rational furnace temperature curve according to step (d) and weld.
This method is according to the set point of the furnace temperature of the default reflow soldering furnace of temperature curve of different soldering paste, quantitative para meter---the process factor of the sign reflux temperature curve quality degree that proposes by this method, instruct the setting and the adjustment of reflux temperature curve, to reach the purpose that improves welding quality and product reliability.
The optimum temperature curve of every kind of scolder is that supplier provides in advance, with 60Sn40Pb (molten Xi Wendu: 183～190 ℃, reflux temperature: 210～220 ℃ 1, the maximum rate of rise of temperature: 0.0～3.0 ℃/s; 2, the maximum descending slope of temperature :-4.0～-1.0 ℃/s) scolder is an example, best temperature curve is:
). heating zone: circuit board is heated to 100 ℃ by room temperature
2). the preheating zone: from 100～150 ℃ be the preheating zone, purpose is to make PCB and soldering paste preheating, avoids circuit board and soldering paste to be subjected to thermal shock, if programming rate is too fast, it is too fast on the one hand components and parts and PCB to be heated, and fragile components and parts, causes the PCB distortion.On the other hand, the solvent evaporates speed in the soldering paste is too fast, easily causes metal dust to spill, and produces the tin ball.If preheat temperature is too high, overlong time easily makes the metal dust oxidation, influences welding quality.
3). heat preservation zone: from 150～210 ℃ is heat preservation zone, when temperature was raised to 150～160 ℃, the scaling powder in the soldering paste began to decompose rapidly activation, if overlong time can make scaling powder lose efficacy in advance, influence the liquid solder wettability, influence the generation of intermetallic alloy layer.
4). the recirculating zone: from 210～220 ℃ for recirculating zone (approximately needing 60～90 s), it is the highest that this regional temperature is provided with, scolder reaches fusing point for liquid, the temperature of SMA rapidly increases to peak temperature.At the backflow welding zone, the welding peak temperature is looked the difference of used soldering paste and difference, is generally 30～40 ℃ of soldering paste melting temperature increases.The solder powder of using for us is the soldering paste of 63Sn37Pb, peak temperature generally is set at 210～230 ℃ (approximately needing 7～15 s), and peak temperature is low or return time short, can make welding insufficient, intermetallic alloy layer too thin (＜0.5 μ m) can cause soldering paste not molten when serious; Peak temperature is too high or return time is long, causes the metal dust severe oxidation, alloy-layer blocked up (〉 4 μ m), influence Joint Strength, also can damage components and parts and circuit board when serious, from outside watch, circuit board can serious discoloration.
5). cooling zone: from 220～175 ℃, in this zone, slicker solder powder in the soldering paste has fully melted and the wetting surface that is connected, should cool off with fast as far as possible speed, to help to obtain smooth solder joint like this and good profile and low contact angle are arranged, slowly cooling can cause circuit board to produce gloomy, crude solder joint, under extreme case, it can cause that the bad and solder joint adhesion of tin sticky weakens.
6). slope has characterized the speed of variations in temperature, and the maximum rate of rise is meant that temperature rises to peak temperature from normal temperature, and maximum descending slope is meant that furnace temperature drops to normal temperature from peak temperature.If the rate of rise is excessive, programming rate is very fast, and it is too fast on the one hand components and parts and PCB to be heated, and fragile components and parts, causes the PCB distortion.On the other hand, the solvent evaporates speed in the scolder is too fast, easily causes metal dust to spill, and produces the tin ball.If descending slope is excessive, cooling can slowly cause circuit board to produce gloomy, crude solder joint.The present invention (comprises the maximum rate of rise and maximum descending slope to the slope of several warm areas described above in process of production, slope section I, slope section II, slope section III), monitor in real time, if find that the slope of a curve of certain solder joint is unusual, then the slope of this product does not just reach requirement, thereby declares to such an extent that this product is just failed.
Embodiment 2
The SMT board quality method for supervising of present embodiment, step comprises:
(a) in welding the circuit board of finishing, select two maximum solder joint, two minimum solder joint and the solder joints of a caloric receptivity between the above two of caloric receptivity of caloric receptivity that temperature element is set.
(b) according to the furnace temperature curve of the temperature curve setting reflow soldering furnace of the scolder that adopts; Set the interval Sw1～Sw2 of preset value of the process factor of described solder joint, described process factor comprises slope, preheating zone temperature-time, heat preservation zone temperature-time, recirculating zone temperature-time, total heating time, peak temperature and the travelling speed of the temperature curve of each solder joint, and described slope comprises the maximum rate of rise and maximum descending slope.
(c) calculate the processing quality window index QWI of process factor correspondence according to the actual measured value Pw1 of the process factor of described solder joint, QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%.
(d) all in ± 99%, then the furnace temperature curve setting of the reflow soldering furnace of the setting of this circuit board is reasonable for the QWI of all process factor correspondences of each solder joint; If the QWI of arbitrary process factor correspondence of arbitrary solder joint surpasses ± 99%, then the furnace temperature curve setting of the reflow soldering furnace of the setting of this circuit board is unreasonable, and reset the furnace temperature curve of reflow soldering furnace, re-execute step (a) (b) (c) and (d) again.
(e) the rational furnace temperature curve of setting that obtains according to step (d) carries out reflow soldering.
Can intuitively draw the quality of the furnace temperature curve of SMT according to the numerical value of QWI, in the described reflow soldering furnace slope of the temperature curve of each solder joint, preheating zone temperature-time, heat preservation zone temperature-time, recirculating zone temperature-time, total heating time, peak temperature and the corresponding QWI of travelling speed have each exceed ± may there be hidden danger of quality in the circuit board of 99% this batch of explanation SMT.
With scolder Sn62Pb36Ag2 is example, and its temperature curve is:
1, the maximum rate of rise of temperature: 0.0～3.0 ℃/s;
Should remain on during work: 2.0 ℃/s;
2, the maximum descending slope of temperature :-4.0～-1.0 ℃/s;
3, preheating zone temperature: 40.0 ℃/s～150.0 ℃, time 60.0～90.0s;
4, heat preservation zone temperature: 150.0 ℃～170.0 ℃, time 60.0～90.0s;
5, recirculating zone temperature: 179.0 ℃, time 45.0～75.0s;
6, peak temperature: 205.0 ℃～225.0 ℃;
The time period of slope calculations is 20.0s.
(1). actual to record the maximum rate of rise Pw1 of certain weld point temperature be 2.0 ℃/s, and preset value is Sw2=3 ℃/s, Sw1=1 ℃/s.
Maximum rate of rise QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[2-（3+1）/2]/[(3+1)/2]×100%
=0%
(2). actual to record the maximum descending slope Pw1 of certain weld point temperature be-2 ℃/s, and preset value is Sw2=-1 ℃/s, Sw1=-4.0 ℃/s.
Maximum descending slope QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[-2-（-1.0+（-4.0））/2]/[(-1.0+（-4.0）)/2]×100%
=-60%
(3). actual to record certain solder joint preheating zone temperature-time Pw1 be 80S, and preset value is Sw2=90s, Sw1=60s.
Preheating zone temperature-time QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[90-（90+60）/2]/[(90+60)/2]×100%
=20%
(4). actual to record certain solder joint heat preservation zone temperature-time Pw1 be 85S, and preset value is Sw2=90s, Sw1=60s.
Heat preservation zone temperature-time QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[85-（90+60）/2]/[(90+60)/2]×100%=14%
(5). actual certain the solder joint recirculating zone temperature-time process factor Pw1 (time when temperature reaches preset temperature interval mid point) that records is 55S, and preset value is Sw2=75, Sw1=45.
Recirculating zone temperature-time QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[55-（75+45）/2]/[(75+45)/2]×100%
=-8%
(6). the actual travelling speed process factor Pw1 that records transmission track is 980mm/s, and preset value is Sw2=1100, Sw1=900.
Travelling speed QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2]
=?[980-(1100+900)/2]/[(1100+900)/2]
=-2%
From the absolute value of above QWI, select the QWI of the QWI of a maximum as this solder joint, maximum descending slope QWI is-60% by temperature, thus the QWI of this solder joint is 60%, it is less than 99%, so this circuit board product is up-to-standard.
Embodiment 3
As embodiment 2, be example still with scolder Sn62Pb36Ag2.
(1). actual to record the maximum rate of rise Pw1 of certain weld point temperature be 2.0 ℃/s, and preset value is Sw2=3 ℃/s, Sw1=1 ℃/s.
Maximum rate of rise QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[2-（3+1）/2]/[(3+1)/2]×100%
=0%
(2). it is actual that to record the maximum descending slope Pw1 of certain weld point temperature be-2 ℃/s, Sw2=-1 ℃/s, Sw1=-4.0 ℃/s.
Maximum descending slope QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[-2-（-1.0+（-4.0））/2]/[(-1.0+（-4.0）)/2]×100%
=-60%
(3). actual to record certain solder joint preheating zone temperature-time Pw1 be 190S, and preset value is Sw2=90s, Sw1=60s.
Preheating zone temperature-time QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[190-（90+60）/2]/[(90+60)/2]×100%
=153%
(4). actual to record certain solder joint heat preservation zone temperature-time Pw1 be 85S, and preset value is Sw2=90s, Sw1=60s.
Heat preservation zone temperature-time QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[85-（90+60）/2]/[(90+60)/2]×100%=14%
(5). actual certain the solder joint recirculating zone temperature-time Pw1 (time when temperature reaches preset temperature interval mid point) that records is 55S, and preset value is Sw2=75s, Sw1=45s.
Recirculating zone temperature-time QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%:
=[55-（75+45）/2]/[(75+45)/2]×100%
=-8%
(6). the actual travelling speed Pw1 that records transmission track is 980mm/s, and preset value is Sw2=1100s, Sw1=900s.
Travelling speed QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2]:
=?[980-(900+1100)/2]/[(900+1100)/2]
=-2%
From the absolute value of above QWI, select the QWI of the QWI of a maximum as this solder joint, be 153% by preheating zone temperature-time QWI, thereby the QWI of this solder joint is 153%, it is greater than 99%, so this circuit board product is off quality.
From this product, choose several weld points (maximum and solder joint that caloric receptivity is minimum), try to achieve the QWI of each selected solder joint of this product respectively, therefrom choose the QWI of maximum QWI as this product with said method comprising caloric receptivity.
If the QWI of product is less than 100%, this product is just passed, if greater than 100%, this product is just failed.
Should be noted that at last; above embodiment only is used to illustrate technical scheme of the present invention but not limiting the scope of the invention; although the present invention has been done detailed description with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the essence and the scope of technical solution of the present invention.
Claims (4)
1.SMT the board quality method for supervising is characterized in that: step comprises:
(a) in welding the circuit board of finishing, select maximum solder joint of caloric receptivity and the minimum solder joint of caloric receptivity that temperature element is set at least;
(b) according to the furnace temperature curve of the temperature curve setting reflow soldering furnace of the scolder that adopts; Set the interval Sw1～Sw2 of preset value of the process factor of described solder joint, described process factor comprises the slope of the temperature curve of each solder joint, and described slope comprises the maximum rate of rise and maximum descending slope; Furnace temperature curve according to the reflow soldering furnace of setting carries out reflow soldering;
(c) calculate the processing quality window index QWI of process factor correspondence according to the actual measured value Pw1 of the process factor of described solder joint, QWI=[Pw1-(Sw2+Sw1)/2]/[(Sw2+Sw1)/2] * 100%;
(d) all in ± 99%, then the furnace temperature curve setting of the reflow soldering furnace of the setting of this circuit board is reasonable for the QWI of all process factor correspondences of each solder joint; If the QWI of arbitrary process factor correspondence of arbitrary solder joint surpasses ± 99%, then the furnace temperature curve setting of the reflow soldering furnace of the setting of this circuit board is unreasonable, and reset the furnace temperature curve of reflow soldering furnace, re-execute step (a) (b) (c) and (d) again;
(e) the rational furnace temperature curve of setting that obtains according to step (d) carries out reflow soldering.
2. SMT board quality method for supervising according to claim 1 is characterized in that: process factor described in the step (b) also comprises preheating zone temperature-time, heat preservation zone temperature-time, recirculating zone temperature-time and total heating time.
3. SMT board quality method for supervising according to claim 2 is characterized in that: process factor also comprises peak temperature and travelling speed described in the step (b).
4. SMT board quality method for supervising according to claim 1, it is characterized in that: the maximum solder joint of described caloric receptivity comprises the thickest solder joint of electronic component pin, and the solder joint of described caloric receptivity minimum comprises the pin that is positioned at the electronic component middle part, the solder joint that the electronic component pin is the thinnest.
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| CN103376761A (en) * | 2012-04-24 | 2013-10-30 | 珠海格力电器股份有限公司 | SMT line body transformation data recorder |
| CN104425389A (en) * | 2013-09-03 | 2015-03-18 | 千住金属工业株式会社 | Bump electrode, board which has bump electrodes, and method for manufacturing the board |
| CN108132369A (en) * | 2017-12-21 | 2018-06-08 | 江苏丽阳电子仪表有限公司 | A kind of production technology of single-phase intelligent ammeter |
| CN109241681A (en) * | 2018-10-30 | 2019-01-18 | 上海望友信息科技有限公司 | Simulation optimization method, system, computer storage medium and the equipment of Reflow Soldering |
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| CN114700575A (en) * | 2022-04-19 | 2022-07-05 | 江西兆驰半导体有限公司 | Method for optimizing reflux curve of back-brushed tin product |
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| CN103376761A (en) * | 2012-04-24 | 2013-10-30 | 珠海格力电器股份有限公司 | SMT line body transformation data recorder |
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| CN111459210A (en) * | 2020-04-15 | 2020-07-28 | 苏州市杰煜电子有限公司 | PCB reflow temperature control method |
| CN111459210B (en) * | 2020-04-15 | 2021-06-29 | 苏州市杰煜电子有限公司 | PCB reflow temperature control method |
| CN114700575A (en) * | 2022-04-19 | 2022-07-05 | 江西兆驰半导体有限公司 | Method for optimizing reflux curve of back-brushed tin product |
| CN114700575B (en) * | 2022-04-19 | 2024-01-19 | 江西兆驰半导体有限公司 | Reflow curve optimization method for back tin brushing product |
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