CN100469231C - Control method for reflux welding curve on surface sticking process rpoduction line - Google Patents
Control method for reflux welding curve on surface sticking process rpoduction line Download PDFInfo
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- CN100469231C CN100469231C CNB2007100391344A CN200710039134A CN100469231C CN 100469231 C CN100469231 C CN 100469231C CN B2007100391344 A CNB2007100391344 A CN B2007100391344A CN 200710039134 A CN200710039134 A CN 200710039134A CN 100469231 C CN100469231 C CN 100469231C
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Abstract
The method comprises: the total temperature rise length of the target backflow curve is divided by the backflow oven heating length to get the belt speed of the oven; using each heating area length of the oven to divide the belt speed to get the stay time of the assembled electronic product in each heat area; according to the trace of the backflow curve, determining the temperature rise in the stay time of each heating area; using the temperature rise of the target backflow curve in each heating time interval as the difference value of each heating area temperature in backflow oven in order to set the heat source temperature parameters of each heat interval into a combined parameter; the combined parameters is represented by the temperature of the last heat area in adjacent cooling area, and is set at a temperature being 5-25deg.c higher than the peak temperature of the target backflow curve; the risen temperature value is adjusted based on the bounding point character; the temperature at cooling area can be set as 100-120deg.c lower than the fusion point of soldering past so as to get a complete control parameter setting of the backflow oven.
Description
Technical field
The present invention relates to how to control on a kind of surface mount process production line with the forced air convection current is the method that the reflow ovens of main heat transfer mechanism realizes reflow soldering between SMD electronic component and the printed circuit board (PCB), be particularly useful for to contain the various surface mount elements reflow solderings of BGA Package on same printed circuit board (PCB), and be applicable to pb-free solder, belong to the microelectronic packaging technology field.
Background technology
In the Reflow Soldering operation, the control of rework profile is determining the success or not of reflow soldering basically.Rework profile is the curve that the solder joint between SMD integrated circuit component and the printed circuit board (PCB) should experience in solder reflow process.Along with the enforcement of lead-free solder in the microelectronics process industry, the backflow windows narrow makes that the control of rework profile is difficult increasingly.The welding method of how controlling rework profile and finishing electronic component and printed circuit board (PCB) is just perplexing industrial quarters.
The control of rework profile depends primarily on the characteristic of the soldering paste that adopts, common manufacturer recommendation by corresponding soldering paste.General, following requirement is arranged for the rework profile of a certain lead-free solder paste: the peak temperature of each solder joint exceeds certain value than soldering paste melting temperature, the time that solder joint keeps more than liquidus curve should be in certain limit, the rework profile of each solder joint under liquidus curve near a certain temperature to satisfying a scope surely between the liquidus temperature, the heating rate of solder joint and cold-zone speed are between certain limit.Realize such rework profile, must realize by the reflow ovens that is equipped with a plurality of independent heating intervals.
Obviously, this is the problem of a multiple-objection optimization, allow all solder joints satisfy above-mentioned five optimization aim simultaneously on the same printed circuit board (PCB), is a stubborn problem really.The rework profile forecasting software that adopts on industrial quarters at present mainly utilizes Principle of Statistics, and each interval parameter of auxiliary adjustment reflow ovens realizes above-mentioned a plurality of optimization aim.But because the complexity of Reflow Soldering operation, even also be difficult to realize simultaneously this a plurality of targets by means of forecasting software.When reflow soldering, when adjusting the stove Control Parameter, all can change other desired value at each optimization aim (such as the adjusting of peak temperature) of rework profile, make that the reflow soldering curve that satisfies whole technology controlling and process target calls is difficult to realize.Particularly: reflow soldering is not certain any welding, but hundreds of solder joint welds simultaneously; Solder joint is distributed in below the electronic component of different caloics, always there is temperature contrast when being heated, (even the solder joint below the identity element also can also can be different) owing to the temperature in when welding of not coexisting that is subjected to thermal site, the difference of rework profile in reflux course of different solder joints always exists, and it is difficult more that this requirement that makes the rework profile of each solder joint must satisfy a plurality of optimization aim simultaneously becomes.
In fact, it is a kind of metallurgical binding process that solder joint connects, and is to diffuse to form intermetallic compound (IMC) mutually by the alloy that melts on weld interface to guarantee.The essence of reflow soldering is exactly that the solder ball of SMD electronic component and the pad on the printed circuit board (PCB) are wetting and generate IMC when refluxing, thereby forms machinery and be electrically connected.The generation of IMC is the necessary condition that realizes welding, and discovers that the thickness of IMC is the most remarkable to the reliability effect that forms solder joint, and thick more IMC is easy to generate the fragility of solder joint more, so IMC must generate in reflux course but approaching of will trying one's best.IMC thickness depends on peak temperature and its time of being experienced of reflux temperature curve, particularly rework profile consumingly more than fusing point.If controlled the above time of the peak temperature of rework profile and fusing point, just can control the thickness of IMC, can be thin so that it is tried one's best, also just realized the high reliability of welding.Heating factor combines the influence of above time of two target component-peak temperatures and liquidus curve to IMC, the control of liquid phase stage binary target component is converted into the control of monobasic target component.Heating factor Q is the integration (unit: s ℃) of the temperature T (t) of reflux temperature curve on liquidus curve (melting temperature of scolder) to time t, is formulated as:
Wherein, t
1And t
2Be respectively the time started and the concluding time that reach melting temperature; T
mFusing point for solder alloy.The reliability of Q and solder joint links together closely like this, can obtain the solder joint of high reliability by control Q.On the other hand, take place because the essence-IMC of reflow soldering is created on the liquid phase stage, like this shape of heating period rework profile just needn't strict be controlled, this has brought very big flexibility for the control of rework profile.But this does not also mean that the shape of heating period rework profile needn't consider, the heating period of rework profile is mainly used in guarantees soldering paste performance demands-such as the reactivity of scaling powder, and as the basis of heating factor control, the rework profile of definite shape still will be followed the recommendation of soldering paste manufacturer substantially.
There is not at present the achievement in research of carrying out around above-mentioned realization of goal openly to report as yet.
Summary of the invention
The objective of the invention is at the deficiencies in the prior art, a kind of control method of reflux welding curve on surface sticking process rpoduction line is provided, make the shape that the rework profile of each solder joint approaches the rework profile of soldering paste manufacturer recommendation on the printed circuit board (PCB), and can obtain a certain size heating factor, for the further adjustment of heating factor lays the foundation, improve quality and efficient that Reflow Soldering is produced.
For achieving the above object, the thickness that the present invention is based on key-intermetallic compound formation of reflow soldering can obtain suitable thickness by the control to heating factor (temperature of reflux temperature curve on liquidus curve (melting temperature of scolder) is to the integration of time), thereby guarantees the high reliability of solder joint.The present invention obtains the belt speed of stove with the overall temperature rise length of target rework profile divided by the total heated length of used reflow ovens, and the time that stops in each thermal treatment zone divided by belt speed electron gain completed knocked down products with each thermal treatment zone length of stove; Determine that according to the track of rework profile its temperature in each thermal treatment zone time of staying increases then; With the target rework profile each heating time section temperature increase the relative difference that is provided with as each Heating Zone Temperature of reflow ovens, thereby each heating interval heat source temperature parameter setting of stove is combined into a parameter, this combination parameter is provided with expression with the temperature of last thermal treatment zone of being close to the cooling zone, and it is set to exceed value and be adjusted accordingly according to the solder joint thermal characteristics than high about 5～25 ℃ of the peak temperature of target rework profile.And the temperature setting between the cooling zone can be hanged down 100-120 ℃ than soldering paste melting temperature, thereby obtains complete reflow ovens Control Parameter setting.
Method concrete steps of the present invention are as follows:
1, with the reflow soldering curve of soldering paste manufacturer recommendation as the target rework profile, utilize the target rework profile to rise to the required total time length of its peak temperature and remove the total length of each thermal treatment zone of reflow ovens of adopting, obtain the tape running speed of reflow ovens from ambient temperature.
2, determine the length of each thermal treatment zone of reflow ovens of adopting, and, obtain the time of electronics completed knocked down products each thermal treatment zone stop in reflow ovens in the reflux course with the length of each thermal treatment zone tape running speed divided by this reflow ovens.
3, the temperature rise part (rising to peak temperature from ambient temperature) with the target rework profile is divided into each time period by the electronics completed knocked down products in the time that each thermal treatment zone stops, and each time period is each thermal treatment zone of corresponding reflow ovens respectively; Determine the temperature added value that the target rework profile should obtain in each time period according to the track of target rework profile temperature rise part then.
4, make the relative difference of each heating interval temperature setting of reflow ovens equal the temperature added value of target rework profile in each corresponding time period, thereby by the determined relative difference of the shape of utilizing the target rework profile temperature setting of each heating interval of reflow ovens is combined into a parameter, this parameter that is combined into is represented with the temperature setting of last thermal treatment zone of contiguous cooling zone.
5, the parameter that makes combinations thereof the become peak temperature that equals the target rework profile adds the temperature setting of an offset as each thermal treatment zone of reflow ovens, the relative difference that each Heating Zone Temperature is provided with is constant, and each top, thermal treatment zone thermal source is consistent with the temperature of bottom thermal source; Described offset is about 5～25 ℃, and its size depends on the thermal capacitance of the maximum heat volume element of assembling on the printed circuit board (PCB), greatly then big it.Reflow ovens cooling zone temperature can be arranged on the following 100-120 of soldering paste fusing point ℃, is generally about 110 ℃, and the thermal characteristics of printed circuit board (PCB) is depended in its setting, if the plank number of plies is many, thicker, then can hang down than 110 ℃, on the contrary can be higher.
6, obtain reflow ovens tape running speed, the setting of Heating Zone Temperature parameter and cooling zone temperature parameter setting gradually by above-mentioned steps, thereby obtain complete reflow ovens Control Parameter setting.
The method of utilizing the present invention to propose, can obtain the arbitrary shape rework profile fast is being the controlling Design that realizes in the reflow ovens of main heat-transfer mechanism with forced convertion arbitrarily, and can obtain a certain size heating factor, lay the foundation for the further adjustment of heating factor obtains its optimized scope, be particularly useful for unleaded reflow soldering.Further can obtain the intermetallic compound of suitable thickness, thereby reach the high reliability of reflow soldering by the control of heating factor optimized scope.
Description of drawings
The a certain lead-free solder paste curve that Fig. 1 adopts for the embodiment of the invention.
Fig. 2 has illustrated total temperature rise partial-length of target rework profile.
Fig. 3 has illustrated the division of temperature curve.
Fig. 4 has illustrated being oppositely arranged of each Heating Zone Temperature parameter of reflow ovens.
Embodiment
Below by specific embodiment also in conjunction with the accompanying drawings, technical scheme of the present invention is further described.In many warm areas reflow ovens of a full hot blast, be embodied as example with a certain target rework profile, set forth the step method of determining reflow ovens thermal control parameter according to the given shape rework profile.Specific as follows:
1, with the soldering paste manufacturer recommendation, a certain lead-free solder paste rework profile as shown in Figure 1 is as the aim curve in the embodiment of the invention, and it adopts heating factor to summarize and characterizes peak temperature and liquid phase time.Utilize aim curve to rise to the required total time length of its peak temperature, L as shown in Figure 2 from room temperature
H, remove the total length of each thermal treatment zone of reflow ovens of adopting, obtain the tape running speed of reflow ovens.
2, determine the length of each thermal treatment zone of reflow ovens of adopting, and, obtain the time of electronics completed knocked down products each thermal treatment zone stop in stove in the reflux course with the length of each thermal treatment zone tape running speed divided by this reflow ovens.
3, with the temperature rise partial L of target rework profile
HBe divided into the n interval according to the electronics completed knocked down products in the time that each heating interval of reflow ovens stops, n equals the number (this routine n=4) of total thermal treatment zone of the reflow ovens that adopts, and each interval time period is each thermal treatment zone of corresponding reflow ovens respectively.As shown in Figure 3, estimate the temperature added value δ H that solder joint should obtain in each interval according to the track of target rework profile
1(i=1,2 ..., n).
4, according to rework profile at each interval temperature rise δ H
1, each thermal treatment zone heat source temperature parameter of calculating reflow ovens is provided with the relative difference Δ H with combination parameter
1(i=1,2 ..., n): make Δ H
n=0, Δ H
N-1=δ H
n, Δ H
N-2=δ H
n+ δ H
N-1..., Δ H
1=δ H
n+ δ H
N-1+ ...+δ H
2Obtain the temperature setting of each warm area of stove: H thus
n, H
N-1=H
n-Δ H
N-1, H
N-2=H
n-Δ H
N-2..., H
1=H
n-Δ H
1Use H
nRepresent the temperature setting of each warm area, as shown in Figure 4, H is set thereby the heat source temperature setting of each thermal treatment zone of reflow ovens is combined into a parameter
n, wherein the relative difference of each warm area temperature parameter setting always equals the temperature added value of target rework profile in each corresponding time period.
5, the peak temperature that makes the combinations thereof parameter equal the target rework profile adds the temperature setting of an offset as each thermal treatment zone of reflow ovens, the relative difference that each Heating Zone Temperature is provided with is constant, and each top, thermal treatment zone thermal source is consistent with the temperature of bottom thermal source; Described offset generally is about 5～25 ℃, and its size depends on the thermal capacitance of the maximum heat volume element of assembling on the printed circuit board (PCB), greatly then big it.Reflow ovens cooling zone temperature can be arranged on the following 100-120 of soldering paste fusing point ℃, and generally about 110 ℃, the thermal characteristics of printed circuit board (PCB) is depended in its setting, if the plank number of plies is many, thicker, then can hang down than 110 ℃, on the contrary can be higher.
6, obtain the reflow ovens belt speed gradually by above-mentioned steps, the Heating Zone Temperature parameter is provided with and the cooling zone temperature parameter is provided with, thereby obtains complete reflow ovens Control Parameter setting.
Each reflow ovens Control Parameter operation reflow ovens that obtains with the inventive method will make each solder joint on the printed circuit board (PCB) can obtain a certain size heating factor.Further, can obtain the intermetallic compound of suitable thickness, thereby reach the high reliability of reflow soldering by the control of heating factor optimized scope.
Claims (1)
1, a kind of control method of reflux welding curve on surface sticking process rpoduction line is characterized in that comprising the steps:
1) with the reflow soldering curve of soldering paste manufacturer recommendation as the target rework profile, utilize the target rework profile to rise to the required total time length of its peak temperature and remove the total length of each thermal treatment zone of reflow ovens of adopting, obtain the tape running speed of reflow ovens from ambient temperature;
2) determine the length of each thermal treatment zone of reflow ovens of adopting, and, obtain the time of electronics completed knocked down products each thermal treatment zone stop in reflow ovens in the reflux course with the length of each thermal treatment zone tape running speed divided by this reflow ovens;
3) the target rework profile is divided into each time period by the electronics completed knocked down products in the time that each thermal treatment zone stops from the temperature rise part that ambient temperature rises to peak temperature, each time period is each thermal treatment zone of corresponding reflow ovens respectively; Determine the temperature added value that the target rework profile should obtain in each time period according to the track of target rework profile temperature rise part then;
4) make the relative difference of each heating interval temperature setting of reflow ovens equal the temperature added value of target rework profile in each corresponding time period, thereby by the determined relative difference of the shape of utilizing the target rework profile temperature setting of each heating interval of reflow ovens is combined into a parameter, this parameter that is combined into is represented with the temperature setting of last thermal treatment zone of contiguous cooling zone;
5) parameter that makes combinations thereof the become peak temperature that equals the target rework profile adds the temperature setting of an offset as each thermal treatment zone of reflow ovens, the relative difference that each Heating Zone Temperature is provided with is constant, and each top, thermal treatment zone thermal source is consistent with the temperature of bottom thermal source; Described offset is 5～25 ℃, and its size depends on the thermal capacitance of the maximum heat volume element of assembling on the printed circuit board (PCB); Reflow ovens cooling zone temperature is arranged on the following 100-120 of soldering paste fusing point ℃, and the thermal characteristics of printed circuit board (PCB) is depended in its setting;
6) obtain reflow ovens tape running speed, the setting of Heating Zone Temperature parameter and cooling zone temperature parameter setting gradually by above-mentioned steps, thereby obtain complete reflow ovens Control Parameter setting.
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| CNB2007100391344A CN100469231C (en) | 2007-04-05 | 2007-04-05 | Control method for reflux welding curve on surface sticking process rpoduction line |
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| CNB2007100391344A CN100469231C (en) | 2007-04-05 | 2007-04-05 | Control method for reflux welding curve on surface sticking process rpoduction line |
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| CN100469231C true CN100469231C (en) | 2009-03-11 |
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| CN101426344B (en) * | 2007-11-02 | 2011-03-16 | 上海华为技术有限公司 | Reflux temperature curve setting method and apparatus thereof |
| CN101686634B (en) * | 2008-09-27 | 2014-10-15 | 松下电器产业株式会社 | Component mounting production line, production line and component mounting method |
| CN103028802A (en) * | 2012-12-31 | 2013-04-10 | 北京中科同志科技有限公司 | Temperature control method for reflow welding machine |
| CN104202918B (en) * | 2014-08-28 | 2017-04-05 | 华中科技大学 | A kind of control method of laser soldering scolding tin temperature |
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| CN108594902A (en) * | 2018-04-18 | 2018-09-28 | 成都迅生电子科技有限公司 | A kind of ideal warm stove curve creation method of Reflow Soldering and its application process |
| CN108848627B (en) * | 2018-07-13 | 2019-12-17 | 珠海格力电器股份有限公司 | method and device for dividing temperature zone of reflow oven and computer readable storage medium |
| CN109241681B (en) * | 2018-10-30 | 2020-09-08 | 上海望友信息科技有限公司 | Reflow soldering simulation optimization method and system, computer storage medium and equipment |
| CN109332841A (en) * | 2018-12-20 | 2019-02-15 | 安徽华东光电技术研究所有限公司 | The method for establishing ROGERS plate Yu case weld thermal reflow profile |
| CN109688727B (en) * | 2018-12-26 | 2020-11-03 | 无锡市同步电子制造有限公司 | Lead-containing and lead-free welding method |
| CN110826282B (en) * | 2019-11-12 | 2023-06-06 | 桂林电子科技大学 | Reflow soldering process simulation model correction method based on heating factors |
| CN112935449A (en) * | 2019-12-10 | 2021-06-11 | 伊利诺斯工具制品有限公司 | Reflow furnace |
| CN111459210B (en) * | 2020-04-15 | 2021-06-29 | 苏州市杰煜电子有限公司 | PCB reflow temperature control method |
| CN111770636B (en) * | 2020-06-16 | 2023-08-22 | 江门崇达电路技术有限公司 | Circuit board character baking method capable of saving electric energy |
| CN112756728B (en) * | 2021-01-25 | 2022-09-23 | 北京遥测技术研究所 | Method for determining reflow soldering process parameters |
| CN112951730B (en) * | 2021-01-26 | 2024-03-29 | 北京遥感设备研究所 | Three-dimensional stacking process method for substrate |
| CN114083073B (en) * | 2021-10-21 | 2022-11-29 | 杭州电子科技大学 | Improved reflow furnace temperature optimization method |
| CN114700575B (en) * | 2022-04-19 | 2024-01-19 | 江西兆驰半导体有限公司 | Reflow curve optimization method for back tin brushing product |
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