CN104507269A - Method for heated welding of surface-mounted electronic elements placed on circuit light boards - Google Patents
Method for heated welding of surface-mounted electronic elements placed on circuit light boards Download PDFInfo
- Publication number
- CN104507269A CN104507269A CN201410758205.6A CN201410758205A CN104507269A CN 104507269 A CN104507269 A CN 104507269A CN 201410758205 A CN201410758205 A CN 201410758205A CN 104507269 A CN104507269 A CN 104507269A
- Authority
- CN
- China
- Prior art keywords
- circuit
- tabula rasa
- temperature
- circuit light
- light boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a method for heated welding of surface-mounted electronic elements placed on circuit light boards. The method comprises the following steps: A, placing, namely placing the circuit light boards on which various electronic elements are placed on an assembly line; B, preheating, wherein the temperature at a preheating region is 50-150 DEG C in a heating furnace, the circuit light boards slowly pass through the preheating region to be gradually heated so that the temperature can finally reach 150 DEG C; C, smelting at high temperature, wherein the circuit light boards are conveyed to a melt welding region of the heating furnace, the temperature of the melt welding region is 150-255 DEG C, and the circuit light boards slowly pass through the melt welding region to be continuously heated so that the temperature of the circuit light boards can finally reach 255 DEG C and molten tin between the various electronic elements and the circuit light boards is fully melted; D, cooling, wherein the circuit light boards are conveyed to a cooling region, the temperature of the cooling region is 255-100 DEG C, and the circuit light boards slowly pass through the cooling region to be gradually cooled so that the temperature of the circuit light boards finally reaches 100 DEG C, the molten tin is cooled and solidified and the various electronic elements are fully welded to the circuit light boards.
Description
[technical field]
The invention relates to and add the method for thermal weld by being placed on patch electronics element on circuit tabula rasa.
[background technology]
Soldering of electronic components on the circuit tabula rasa with circuit function, such as sticks IC chip, electric capacity etc. on circuit tabula rasa.Existing way is generally blow weldering with heat gun, but the heating of this way is uneven, and efficiency is not high, also there is the risk of rosin joint.
[summary of the invention]
The object of the invention is to overcome the deficiencies in the prior art and provide a kind of welding effect good add the method for thermal weld by being placed on patch electronics element on circuit tabula rasa.
For above-mentioned purpose, the present invention by the following technical solutions:
Adding the method for thermal weld by being placed on patch electronics element on circuit tabula rasa, it is characterized in that including following steps, A, blowing, the circuit tabula rasa being placed with various electronic component is placed on streamline;
B, preheat, in heating furnace, the temperature of preheated volumes is Celsius temperature 50 DEG C-150 DEG C, is placed on circuit tabula rasa on streamline slowly through preheated volumes, circuit tabula rasa is heated up gradually, makes the temperature of circuit tabula rasa finally can reach 150 DEG C;
C, high-temperature fusion, streamline band circuit tabula rasa is behind preheated volumes, come the fusion weld district of heating furnace, temperature in fusion weld district is Celsius temperature 150 DEG C-255 DEG C, be placed on circuit tabula rasa on streamline slowly through fusion weld district, make circuit tabula rasa continue to heat up, make the temperature of circuit tabula rasa finally can reach 255 DEG C, make the complete melting of the tin liquor between various electronic component and circuit tabula rasa, make the pin of electronic component and the complete electrical links of circuit tabula rasa top connection;
D, cooling down, streamline band circuit tabula rasa is after fusion weld district, come cooling down district, temperature in cooling down district is Celsius temperature 255 DEG C-100 DEG C, be placed on circuit tabula rasa on streamline slowly through cooling down district, circuit tabula rasa lowered the temperature gradually, makes the temperature of circuit tabula rasa finally can reach 100 DEG C, make tin liquor cooled and solidified, various electronic component is welded on circuit tabula rasa completely.
Adding the method for thermal weld by being placed on patch electronics element on circuit tabula rasa as above, it is characterized in that described electronic component comprises and has IC chip, electric capacity.
Adding the method for thermal weld by being placed on patch electronics element on circuit tabula rasa as above, it is characterized in that described circuit tabula rasa is 25s-30s in the time of preheated volumes; Circuit tabula rasa is 50s-120s in the time of high-temperature fusion; Circuit tabula rasa is 30s-70s in the time in cooling down district.
Beneficial effect of the present invention has:
The present invention adopts stage mode of heating, makes circuit tabula rasa respectively through preheating, high-temperature fusion, cooling three phases, such homogeneous heating, and tin liquor melting is even, and welding effect is good, cools gradually more afterwards, makes suitable good of its welding effect.
[embodiment]
Embodiment elaborates to the present invention below:
Adding the method for thermal weld by being placed on patch electronics element on circuit tabula rasa, including following steps, A, blowing, the circuit tabula rasa being placed with various electronic component is placed on streamline.
B, preheat, in heating furnace, the temperature of preheated volumes is Celsius temperature 50 DEG C-150 DEG C, is placed on circuit tabula rasa on streamline slowly through preheated volumes, circuit tabula rasa is heated up gradually, makes the temperature of circuit tabula rasa finally can reach 150 DEG C.
C, high-temperature fusion, streamline band circuit tabula rasa is behind preheated volumes, come the fusion weld district of heating furnace, temperature in fusion weld district is Celsius temperature 150 DEG C-255 DEG C, be placed on circuit tabula rasa on streamline slowly through fusion weld district, make circuit tabula rasa continue to heat up, make the temperature of circuit tabula rasa finally can reach 255 DEG C, make the complete melting of the tin liquor between various electronic component and circuit tabula rasa, make the pin of electronic component and the complete electrical links of circuit tabula rasa top connection.
D, cooling down, streamline band circuit tabula rasa is after fusion weld district, come cooling down district, temperature in cooling down district is Celsius temperature 255 DEG C-100 DEG C, be placed on circuit tabula rasa on streamline slowly through cooling down district, circuit tabula rasa lowered the temperature gradually, makes the temperature of circuit tabula rasa finally can reach 100 DEG C, make tin liquor cooled and solidified, various electronic component is welded on circuit tabula rasa completely.
Like this, adopt stage mode of heating, make circuit tabula rasa respectively through preheating, high-temperature fusion, cooling three phases, such homogeneous heating, tin liquor melting is even, and welding effect is good, cools gradually more afterwards, makes suitable good of its welding effect.
In the present embodiment, described electronic component comprises IC chip, electric capacity, mainly welds various more flat electronic component.
In addition, described circuit tabula rasa is 25s-30s in the time of preheated volumes, and generally this time period can make circuit tabula rasa heat gradually, is unlikely to again intensification too fast.Circuit tabula rasa is 50s-120s in the time of high-temperature fusion, and this time period can make tin liquor obtain sufficient melting, and the electronic component between it is fully contacted.Circuit tabula rasa is 30s-70s in the time in cooling down district, makes tin liquor cooled and solidified, and various electronic component is welded on circuit tabula rasa completely.
Claims (3)
1. adding the method for thermal weld by being placed on patch electronics element on circuit tabula rasa, it is characterized in that including following steps, A, blowing, the circuit tabula rasa being placed with various electronic component is placed on streamline;
B, preheat, in heating furnace, the temperature of preheated volumes is Celsius temperature 50 DEG C-150 DEG C, is placed on circuit tabula rasa on streamline slowly through preheated volumes, circuit tabula rasa is heated up gradually, makes the temperature of circuit tabula rasa finally can reach 150 DEG C;
C, high-temperature fusion, streamline band circuit tabula rasa is behind preheated volumes, come the fusion weld district of heating furnace, temperature in fusion weld district is Celsius temperature 150 DEG C-255 DEG C, be placed on circuit tabula rasa on streamline slowly through fusion weld district, make circuit tabula rasa continue to heat up, make the temperature of circuit tabula rasa finally can reach 255 DEG C, make the complete melting of the tin liquor between various electronic component and circuit tabula rasa, make the pin of electronic component and the complete electrical links of circuit tabula rasa top connection;
D, cooling down, streamline band circuit tabula rasa is after fusion weld district, come cooling down district, temperature in cooling down district is Celsius temperature 255 DEG C-100 DEG C, be placed on circuit tabula rasa on streamline slowly through cooling down district, circuit tabula rasa lowered the temperature gradually, makes the temperature of circuit tabula rasa finally can reach 100 DEG C, make tin liquor cooled and solidified, various electronic component is welded on circuit tabula rasa completely.
2. according to claim 1ly adding the method for thermal weld by being placed on patch electronics element on circuit tabula rasa, it is characterized in that described electronic component comprises and has IC chip, electric capacity.
3. according to claim 1 and 2ly adding the method for thermal weld by being placed on patch electronics element on circuit tabula rasa, it is characterized in that described circuit tabula rasa is 25s-30s in the time of preheated volumes; Circuit tabula rasa is 50s-120s in the time of high-temperature fusion; Circuit tabula rasa is 30s-70s in the time in cooling down district.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410758205.6A CN104507269A (en) | 2014-12-11 | 2014-12-11 | Method for heated welding of surface-mounted electronic elements placed on circuit light boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410758205.6A CN104507269A (en) | 2014-12-11 | 2014-12-11 | Method for heated welding of surface-mounted electronic elements placed on circuit light boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104507269A true CN104507269A (en) | 2015-04-08 |
Family
ID=52948962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410758205.6A Pending CN104507269A (en) | 2014-12-11 | 2014-12-11 | Method for heated welding of surface-mounted electronic elements placed on circuit light boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104507269A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252237A (en) * | 2016-06-15 | 2016-12-21 | 爱普科斯科技（无锡）有限公司 | A kind of thin-film package plant ball technique |
| CN111482670A (en) * | 2020-05-27 | 2020-08-04 | 东莞市点精电子有限公司 | Electronic component soldering method |
-
2014
- 2014-12-11 CN CN201410758205.6A patent/CN104507269A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252237A (en) * | 2016-06-15 | 2016-12-21 | 爱普科斯科技（无锡）有限公司 | A kind of thin-film package plant ball technique |
| CN106252237B (en) * | 2016-06-15 | 2019-03-01 | 全讯射频科技(无锡)有限公司 | A kind of plant ball technique of thin-film package |
| CN111482670A (en) * | 2020-05-27 | 2020-08-04 | 东莞市点精电子有限公司 | Electronic component soldering method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104325205B (en) | A kind of reflow soldering method of surface mount elements | |
| CN103345539A (en) | Method for setting reflow soldering loading curve parameters | |
| CN108594902A (en) | A kind of ideal warm stove curve creation method of Reflow Soldering and its application process | |
| CN103144300A (en) | Photovoltaic module and welding method of photovoltaic module | |
| CN104507269A (en) | Method for heated welding of surface-mounted electronic elements placed on circuit light boards | |
| CN106238848B (en) | Non-contact type heating tin brazing method for metal structural part and PCB | |
| CN102581424A (en) | Welding method for copper wire and aluminum wire | |
| CN104625299A (en) | Tin soldering jig and laser tin soldering method | |
| CN109604754A (en) | A kind of reflow soldering method improving device thermal expansion deformation | |
| CN201702484U (en) | Soldering bit | |
| CN104084659A (en) | Production method for preparing transistor through hot-gas welding | |
| CN106612592A (en) | Pre-plated tin molding system and pre-plated tin molding method | |
| CN106255344A (en) | A kind of pcb board wicking soldering equipment | |
| CN204090333U (en) | A kind of novel solder reflow device | |
| CN103464932B (en) | Soldering flux for solder wires for robotic automatic welding and preparation method thereof | |
| CN105772889A (en) | Reflow soldering improving technology | |
| CN103660279A (en) | Plastic welding method | |
| CN212239515U (en) | Constant-temperature tin soldering system between metal pieces | |
| CN102248242B (en) | Aluminum alloy vacuum welding method capable of eliminating silicon segregation | |
| SE1751364A1 (en) | Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna | |
| CN102935535B (en) | Manual electric soldering bit capable of increasing welding efficiency of lead and bonding pad and improving welding reliability of lead and bonding pad | |
| CN207592989U (en) | A kind of Black King Kong environmental protection solder horn | |
| CN109511232A (en) | Foil gauge electronic sensor pasting method | |
| CN207615828U (en) | B22D lamp cap scolding tin Special welding heads | |
| CN204657686U (en) | Vapour phase welder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150408 |