Non-contact type heating tin brazing method for metal structural part and PCB
Technical Field
The invention relates to the technical field of processing, in particular to a welding related technology in the technical field of communication, and particularly relates to a non-contact integral heating tin brazing method for a metal structural part and a PCB.
Background
The base station antenna is a key part covered by a mobile communication network, the base station antenna is formed by connecting a main feed end and a plurality of terminal parts, an assembly formed by a metal structural part and a PCB is an intermediate bridge of the main feed end and the terminal parts, and the connection of the metal structural part and the PCB is generally tin soldering. The combination of the PCB and the metal structure is a grounding function, which is an important indicator in the communication industry. The grounding technology is an important technology which must be adopted when any electronic and electrical equipment or system normally works, and not only is a necessary means for protecting equipment and personal safety, but also is an important technical measure for inhibiting electromagnetic interference, ensuring the electromagnetic compatibility of the equipment or system and improving the reliability of the equipment or system. If the grounding is poor, the whole base station antenna has instability, and the whole base station system is harmed even if the whole base station antenna is not well processed. In order to ensure good electrical connection conductivity and structural connection stability, strict requirements are imposed on the consistency of tin content of a welding spot, the permeability of the welding spot and the mechanical strength.
As is well known, the conventional soldering process is a local heating soldering method, in which a soldering iron heats up to contact a soldered point to conduct heat, and simultaneously, the soldering iron assists in filling solder. The welding mode of the metallic structure of communication trade, adopt this kind of electric iron welding basically, however, because the endothermic effect of metallic structure, can satisfy the welding demand in order to make its heating, need higher temperature transmission or long-time contact welding, just must select powerful welding stage for use, and because long-time high temperature, accelerate soldering iron oxidation, electric iron life reduces by a wide margin, the uniformity that the solder joint is heated inhomogeneous can't guarantee welding temperature has simultaneously aggravated and has caused welding quality reliability to descend, on the other hand, adopt manual welding mode, can't guarantee the uniformity of welding time and send the tin volume, quality uniformity is poor, the operation mode inefficiency.
The subassembly that metal structure spare and PCB constitute, in a pair base station antenna, the quantity is many, and the solder joint quantity of single product is intensive moreover, and manual welding is because its limitation, can hard to avoid the phenomenon that rosin joint, hourglass weld appear. And the full-automatic welding is basically impossible on the basis of the prior art.
Some attempts are also made in the industry, adopt three-dimensional manipulator to drive the flatiron promptly and carry out the fixed-position welding, can solve to a certain extent and send the quantification management and control of tin and soldering time, nevertheless still can't solve the endothermic influence that brings of metal structure spare from the principle, the solder joint reliability problem of production.
Disclosure of Invention
The invention aims to provide a non-contact type heating tin brazing method for a metal structural part and a PCB, which improves the welding efficiency and ensures the welding quality.
In order to achieve the purpose, the invention provides the following technical scheme:
a non-contact type heating tin brazing method for a metal structural part and a PCB comprises an integral heating welding device with a transmission system, a heating system and a cooling system, wherein the heating system and the cooling system are sequentially arranged along the transmission direction of a workpiece, and the method comprises the following steps: placing a workpiece on a transmission system, and transmitting the workpiece to a heating system through the transmission system, wherein the workpiece is a community consisting of a metal structural part, a PCB (printed circuit board), a solder and a turnover clamp; carrying out non-contact heat radiation integral heating on the workpiece to melt the solder on the workpiece; and cooling the workpiece after the heating welding is finished, so that the molten solder is quickly solidified into the required welding point.
Further, the tin brazing method further comprises the step of presetting the workpiece, and specifically comprises the following steps: placing a metal structural part on a turnover fixture with limiting and positioning functions, and limiting and positioning the metal structural part; assembling the PCB and the metal structural part in a clearance way; solder presetting is carried out on a welding spot between the metal structural member and the PCB; and after the solder presetting is finished, carrying out secondary assembly on the metal structural part and the PCB.
Preferably, in the step of gap-fitting the PCB with the metal structural member, the PCB is stably fixed to the metal structural member by means of the support member.
Preferably, in the step of assembling the PCB and the metal structural member with a gap, the front and back sides of the plurality of PCBs are placed into a press-molding tool with a predetermined gap, and then the whole PCB is assembled with the metal structural member.
Preferably, the solder is added to the welding point between the metal structural part and the PCB through a three-dimensional automatic solder adding device.
Preferably, in the step of performing non-contact thermal radiation integral heating on the workpiece, the heating area is set in a partitioning manner, so that the temperature of the area where the non-welding point part of the PCB is located is lower than the temperature of the area where the welding point part is located.
Furthermore, the heating areas are arranged in a layered mode, so that the temperature of a layer on the lower surface of the PCB is lower than that of a layer on the upper surface of the PCB.
Preferably, the tin brazing method further comprises the following steps, in particular: and taking down the welded finished product from the turnover fixture, and returning the welded finished product to the turnover fixture through the transmission system.
Compared with the prior art, the scheme of the invention has the following advantages:
1. according to the non-contact integral heating welding method for the metal structural part and the PCB, the welding device is fixed, the welding flux is added, the heating welding is split, different procedures are set, and the automation of each procedure is facilitated through fine division of labor, so that the modular management is realized.
2. In the tin soldering method, after the relative position of the metal part structural part and the PCB is fixed, the solder joint is uniformly pre-added with solder, then the whole body is heated in a non-contact program control way, the preheating, melting, soldering and cooling of the solder are integrally completed in the whole heating and soldering device, the tin soldering joint is not influenced by the number of the solder joints and the size of a soldering device, the solder flows more uniformly and wets more fully, the soldering quality of the metal structural part and the PCB is ensured, and the soldering efficiency is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of one embodiment of a workpiece being heat welded in an integral heat welding apparatus of the present invention;
fig. 2 is a schematic view of another embodiment of the invention for heat welding workpieces in an integral heat welding apparatus.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.
The invention relates to a non-contact integral heating tin soldering method (hereinafter referred to as a tin soldering method) for a metal structural part and a coaxial cable, which mainly comprises four steps of presetting a workpiece (containing solder adding), heating the workpiece in a non-contact manner, cooling the workpiece and disassembling the workpiece.
The solder is added in the three-dimensional automatic solder adding equipment, so that the synchronous multi-point addition of the solder at the welding points needing to be welded can be realized, the solder has accurate quantification and the shape of the solder is changed to ensure the consistency of the flowing distance of the solder in the welding process.
Non-contact heating is gone on in whole heating welding set, this whole heating welding set has the transmission system who is used for transmitting the work piece and sets gradually heating system and cooling system along work piece transmission direction, and heating system is used for carrying out 360 degrees all-round thermal radiation to the work piece, make every position of product, the position all can the thermally equivalent, thereby make the solder on the solder joint fully absorb heat and melt, and then wet between the solder joint between metallic structure spare and coaxial cable, flow, then cool off and make the liquid solder of solder joint department solidify fast and form required solder joint.
The integral heating welding device adopts a heat radiation transfer mode to transfer heat, the heating element of the integral heating welding device comprises but is not limited to infrared heating, heating tube heating, laser heating and other heating modes, the heating direction is not limited to upper heating, lower heating or upper and lower heating, and the integral heating welding device can heat in multiple directions simultaneously.
Example one
The workpiece presetting step specifically comprises the following steps:
and taking out the metal structural part from the turnover box, and putting the metal structural part on a turnover fixture with limiting and positioning functions to enable the metal structural part to be placed according to preset positions.
Inserting gap assembly between the PCB and the metal structural part; after the assembly is ensured to be in place, the periphery of the PCB adopts a platform type supporting piece to stably fix the PCB on the metal structural member. The supporting piece adopts a multi-array fixing mode of an integral structure, can ensure the state of each PCB after being assembled with a metal structural part, and provides effective and reliable fixity in a plurality of directions to ensure the consistency of welding effect. The support has high temperature resistance, and the support failure in the whole heating process due to the expansion with heat and contraction with cold of the object is prevented; meanwhile, the support has the characteristic of quick taking and placing.
And placing the metal structural part with the fixed PCB and the turnover fixture into a three-dimensional automatic solder adding device for solder presetting. The automatic solder adding equipment can perform synchronous multi-point addition of the solder on the welding points to be welded, so that the addition of the solder has accurate quantification and consistent shape of the solder, and the consistency of the flowing distance of the soldering tin in the welding process is ensured.
And (4) assembling the metal structural part subjected to solder presetting and the PCB semi-finished product for the second time.
Thus, the preset process of the workpiece is completed, wherein the workpiece is a community consisting of a metal structural part, a PCB, a welding flux and a turnover clamp.
The semi-finished product after the secondary assembly is put into an integral heating welding device together with a turnover fixture, and is heated by a heating system according to the principle of heat radiation, and is cooled by a cooling system.
As shown in fig. 1, the heating system performs 360-degree omnibearing heat transfer on the metal structural member and the PCB, so that each position and part of the product can be uniformly heated, the solder on the welding spot can be fully melted by heat absorption, and the metal structural member and the welding spot of the PCB can be wetted and flowed; in addition, the solder flows through the other surface of the PCB through the via hole flow channel on the PCB and the via hole, and element diffusion is carried out between the metal structural member and the through hole of the PCB and between the welding point and the plating layer, so as to generate a corresponding tin-copper alloy layer.
The cooling system of the integral heating welding device cools the workpiece after heating welding in an air cooling mode, and the whole non-contact tin soldering joint is completed.
This kind of integral heating welding device can set up welding parameters (temperature, time, etc.). And in order to ensure the temperature resistance of the PCB, the temperature of the welding area is reasonably set in a layered and partitioned manner. Firstly, the temperature of the peripheral heat at the non-welding point part of the PCB is 5-10 ℃ lower than that of the welding point area (the area where the welding point 3 and the welding point 4 in figure 1) so as to avoid the deformation of the PCB caused by excessive heating; secondly, the temperature of the welding point on the layer of the upper surface of the PCB is higher than that of the welding point on the layer of the lower surface of the PCB by about 5 ℃. The solder has a certain range of fluidity from low temperature to high temperature by a small range of temperature difference.
In addition, the method also comprises the step of taking off the finished product of the metal structural part welded with the PCB from the turnover fixture and returning the finished product to the turnover fixture through a production line, thereby completing the whole single-cycle flow.
Example two
As shown in fig. 2, the tin brazing method of the first embodiment is similar to that of the first embodiment, except for the preset process of the workpiece. The concrete expression is as follows:
in this embodiment, the PCB is first taken out of the turnover box and the corresponding front and back sides are distinguished. And then placing the side of the PCB to be welded into a turnover fixture with a pre-positioning function. And simultaneously, all the PCB boards are integrally positioned correspondingly through the die pressing tool. Through this whole prepositioned structure frock of moulding-die frock, can guarantee the effective reliable fixity of a plurality of PCBs, guarantee simultaneously that mutual position between the PCB is no longer than 0.1mm to guarantee the uniformity of welding effect. This moulding-die frock of prepositioning function possesses high temperature resistant characteristic, prevents to cause the good PCB deformation of location because of the expend with heat and contract with cold effect of object itself.
Correspondingly, after the solder presetting process is completed and before the secondary assembly, a demolding treatment process is also included.
And similarly, in order to ensure the temperature resistance of the PCB, the temperature of the welding area is reasonably set in a layered and partitioned manner. Firstly, the temperature of the peripheral heat of the PCB non-welding point part is 5-10 ℃ lower than that of a welding point area (the area where welding points 3-10 are located in figure 1), so that the PCB is prevented from being deformed due to excessive heating; secondly, the temperature of the welding points on the upper surface of the PCB is higher than that of the welding points on the lower surface of the PCB by about 5 ℃. The solder has a certain range of fluidity from low temperature to high temperature by a small range of temperature difference.
The foregoing is only a partial embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.