CN116197477B - Method and device for assembling circuit board - Google Patents
Method and device for assembling circuit board Download PDFInfo
- Publication number
- CN116197477B CN116197477B CN202310280487.2A CN202310280487A CN116197477B CN 116197477 B CN116197477 B CN 116197477B CN 202310280487 A CN202310280487 A CN 202310280487A CN 116197477 B CN116197477 B CN 116197477B
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- circuit board
- target circuit
- structural member
- pressing
- soldering tin
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- 238000000034 method Methods 0.000 title claims abstract description 77
- 238000005476 soldering Methods 0.000 claims abstract description 72
- 238000003466 welding Methods 0.000 claims abstract description 65
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 57
- 238000003825 pressing Methods 0.000 claims abstract description 50
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 claims abstract description 29
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000002390 adhesive tape Substances 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 17
- 229910052742 iron Inorganic materials 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000002360 preparation method Methods 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 239000011087 paperboard Substances 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 5
- 229910000833 kovar Inorganic materials 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 26
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 19
- 238000013461 design Methods 0.000 description 12
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- 238000009434 installation Methods 0.000 description 5
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- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a method and a device for assembling a circuit board. The target circuit board to be assembled is provided with electronic components, the method comprising: adhering the structural member of the target circuit board through the adhesive tape; fixing a target circuit board, and plating soldering tin on a solder mask layer of the target circuit board; preheating the structural member, and coating the soldering tin wires on the steps of the inner cavity of the structural member through an electric soldering iron; heating the structural member; placing the target circuit board into the structural member, and pressing the target circuit board through a pressing sheet; stopping pressing when the target circuit board sinks to a preset position, taking out the structural member from the heating table, and pressing the target circuit board again through the pressing sheet until the soldering tin is cooled to obtain a welding product; and if the welding product meets the preset conditions, determining that the welding product is qualified. The conventional process for fastening the PCBA by the screws is abandoned, the PCBA is directly welded on the structure by soldering tin, the grounding characteristic of a radio frequency circuit can be ensured, the space utilization rate of the PCBA can be improved, and the volume is reduced.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a method and a device for assembling a circuit board.
Background
The multichannel filtering component can be a switch filtering component, and the function of the multichannel filtering component is to switch filters with different working frequency bands or bandwidths through a high-speed radio frequency switch to perform signal gating filtering, so that the multichannel filtering component is applied to radar and secret communication systems; the number of the component channels is closely related to the requirements of users, and applications are applied from two paths to dozens of paths; the out-of-band interference signal has strong rejection capability, which is generally more than 50dBc.
Along with the technical progress, the whole system has more complex functions and higher integration level, and higher requirements are also put forward on miniaturization of the multichannel filter assembly, and the conventional PCBA (Printed Circuit Board Assembly, assembly printed circuit board) for assembling the multichannel filter assembly selectively distributes radio frequency components on the front surface of the PCB, does not distribute the components on the back surface, is only used as a circuit ground reference layer, and has lower space utilization rate.
For this, in the prior art, a process of fastening the PCBA by using screws is generally adopted, and a recessed area can be reserved in a corresponding position in the structural member by distributing components on the back surface of the PCB (Printed Circuit Board ); screw mounting positions are left at proper positions at the edge and the middle position of the PCB, and enough safety space is required to be left in consideration of deformation caused to the PCBA during screw mounting; correspondingly, the corresponding screw positions, and the machining space are designed structurally. Although this approach improves the space utilization of the PCB, it introduces other problems:
(1) The mounting position of the screw is the contact point of the PCBA and the structural member, the contact area is limited, the grounding characteristic of the component is affected, and the filtering characteristic is deteriorated;
(2) The mounting positions of the screws are in discrete distribution, so that the loop distance between the components and the structure ground in the PCBA is increased, uncertainty exists in the contact between the PCBA and the structural part due to metal oxidization, the signal loop path is uncontrollable, the grounding characteristic of the components is affected, and the filtering characteristic is also deteriorated;
(3) As the frequency increases above 1GHz, the number of screw holes needs to be increased in order to secure the grounding characteristic. This occupies a large amount of space, and is difficult to further miniaturize.
In summary, the PCBA assembled with the multi-channel filter assembly in the prior art has low space utilization, is difficult to be miniaturized, and has large volume.
Disclosure of Invention
Accordingly, the present invention is directed to a method and apparatus for assembling a circuit board, which can not only ensure the grounding characteristic of a radio frequency circuit, but also improve the space utilization of a PCBA and reduce the volume.
In a first aspect, an embodiment of the present invention provides a method for assembling a circuit board, where a target circuit board to be assembled is provided with an electronic component, the method including: adhering the structural member of the target circuit board through the adhesive tape; fixing a target circuit board, and plating soldering tin on a solder mask layer of the target circuit board; preheating the structural member, and coating the soldering tin wires on the steps of the inner cavity of the structural member through an electric soldering iron; heating the structural member; placing the target circuit board into the structural member, and pressing the target circuit board through a pressing sheet; stopping pressing when the target circuit board sinks to a preset position, taking out the structural member from the heating table, and pressing the target circuit board again through the pressing sheet until the soldering tin is cooled to obtain a welding product; and if the welding product meets the preset conditions, determining that the welding product is qualified.
In an alternative embodiment of the present application, before the step of taping the structural member of the target circuit board, the method further includes: and performing electrical performance debugging on the target circuit board.
In an alternative embodiment of the present application, after the step of taping the structural member of the target circuit board, the method further includes: the tape is cut off along the edges of the structural walls of the structural members by a blade.
In an alternative embodiment of the present application, after the step of plating the solder on the solder mask layer of the target circuit board, the method further includes: and trimming the edge burrs of the soldering tin by using a file.
In an alternative embodiment of the present application, the preset condition includes at least one of the following: sinking the target circuit board to a preset position; the soldering tin amount of the welding area of the target circuit board is larger than a preset threshold value; the welding area of the target circuit board is free from short circuit to the ground; the electrical property of the welding product meets the preset requirement.
In an alternative embodiment of the present application, the method further includes: and if the welding product does not meet the preset conditions, separating the structural member and the target circuit board, and overhauling the structural member and the target circuit board.
In an alternative embodiment of the present application, the step of separating the structural member and the target circuit board includes: placing the welded product in a heating station; lifting the target circuit board, and repeatedly heating along the edge of the target circuit board through a hot air gun until the target circuit board is lifted out of the structural member; and respectively placing the target circuit board and the structural part on the warm paper board, and cleaning soldering tin at the edge of the target circuit board.
In an alternative embodiment of the present application, the electronic component provided on the target circuit board includes: and the filter assembly is arranged on the front surface and the back surface of the target circuit board.
In an alternative embodiment of the present application, the structure of the target circuit board includes, in order from top to bottom: a top layer of the radio frequency wiring, a top layer of the radio frequency ground wire, a middle layer of the power supply wiring, a middle layer of the control wiring, a bottom layer of the radio frequency ground wire and a bottom layer of the radio frequency wiring; a solder mask layer is arranged at the edge of the bottom layer of the target circuit board; the edge of the target circuit board is provided with a metallized wrapping edge; the target circuit board is also provided with a through hole for moving the target circuit board.
In a second aspect, an embodiment of the present invention further provides a device for assembling a circuit board, where a target circuit board to be assembled is provided with an electronic component, the device including: a preparation module for adhering the structural member of the target circuit board by an adhesive tape; fixing a target circuit board, and plating soldering tin on a solder mask layer of the target circuit board; preheating the structural member, and coating the soldering tin wires on the steps of the inner cavity of the structural member through an electric soldering iron; the welding module is used for heating the structural member; placing the target circuit board into the structural member, and pressing the target circuit board through a pressing sheet; stopping pressing when the target circuit board sinks to a preset position, taking out the structural member from the heating table, and pressing the target circuit board again through the pressing sheet until the soldering tin is cooled to obtain a welding product; and the checking module is used for determining that the welding product is qualified if the target circuit board meets the preset conditions.
The embodiment of the invention has the following beneficial effects:
The embodiment of the invention provides a method and a device for assembling a circuit board, which eliminate the conventional process of fastening a PCBA by screws, and adopt a mode of directly welding the PCBA on a structure by soldering tin, so that the grounding characteristic of a radio frequency circuit can be ensured, the space utilization rate of the PCBA can be improved, and the volume is reduced.
Additional features and advantages of the disclosure will be set forth in the description which follows, or in part will be obvious from the description, or may be learned by practice of the techniques of the disclosure.
The foregoing objects, features and advantages of the disclosure will be more readily apparent from the following detailed description of the preferred embodiments taken in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of an assembly method of a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a filtering component principle according to an embodiment of the present invention;
Fig. 3 is a schematic diagram of a top layout and a bottom layout of a PCB according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an assembly method of a PCBA and a structural member according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a typical frequency response of a product according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a circuit stack according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of an edge placement holder layer according to an embodiment of the present invention;
fig. 8 is a schematic diagram of edge metallization connection of a PCB board according to an embodiment of the present invention;
FIG. 9 is a schematic view of a step in a structural cavity according to an embodiment of the present invention;
fig. 10 is a flowchart of another method for assembling a circuit board according to an embodiment of the present invention;
FIG. 11 is a schematic view of a concave triangle for solder buildup according to an embodiment of the present invention;
Fig. 12 is a schematic view of a tablet pressing according to an embodiment of the present invention;
Fig. 13 is a schematic structural diagram of an assembly device for a circuit board according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The multi-channel filter assembly is a switch filter assembly, and the multi-channel filter assembly has the functions of normally switching filters with different working frequency bands or bandwidths through a high-speed radio frequency switch to perform signal gating and filtering, and is applied to radar and secret communication systems; the number of the component channels is closely related to the requirements of users, and applications are applied from two paths to dozens of paths; the out-of-band interference signal has strong rejection capability, which is generally more than 50dBc.
With the technical progress, the whole system has more complex functions and higher integration level, and higher requirements are also put on miniaturization of the multi-channel filter assembly, and under the technical background, the embodiment provides a method for installing the PCBA of the multichannel filter assembly, which fully utilizes the installation space of the PCBA on the premise of not affecting the electrical performance, improves the space utilization rate and has very important significance for the miniaturization of the multichannel filter assembly.
At present, miniaturization is always a constant requirement for users on the premise of keeping the electrical performance and reliability unchanged. In order to ensure the radio frequency characteristics (particularly the filtering characteristics), the traditional radio frequency circuit selects to distribute radio frequency components on the front surface of the PCB, and does not distribute the components on the back surface, and is only used as a circuit grounding reference layer; selecting windowing to expose the back gold plating layer during PCB processing; the PCBA is fastened by a screw. The method ensures that the reference ground of the component is close to the structure, the PCBA and the structural member have sufficient grounding area, have very good grounding characteristics, and ensure the radio frequency characteristics of the radio frequency circuit, but the space utilization rate of the PCB board is lower in the mode, and the assembly is difficult to further miniaturize.
In order to reduce the volume, components are also distributed on the back surface of the PCB, and a concave area is reserved at a corresponding position in the structural part; screw mounting positions are left at proper positions at the edge and the middle position of the PCB, and enough safety space is required to be left in consideration of deformation caused to the PCBA during screw mounting; correspondingly, the corresponding screw positions, and the machining space are designed structurally. Although this approach improves the space utilization of the PCB, it introduces other problems:
(1) The mounting position of the screw is the contact point of the PCBA and the structural member, the contact area is limited, the grounding characteristic of the component is affected, and the filtering characteristic is deteriorated;
(2) The mounting positions of the screws are in discrete distribution, so that the distance between the components in the PCBA and the structural ground is increased, uncertainty exists in the contact between the PCBA and the structural part due to metal oxidization, the signal loop path is uncontrollable, the grounding characteristic of the components is influenced, and the filtering characteristic is also deteriorated;
(3) As the frequency increases above 1GHz, the number of screw holes needs to be increased in order to secure the grounding characteristic. Thus occupying a large amount of space and being difficult to further miniaturize
Based on the above, the embodiment of the invention provides a method and a device for assembling a circuit board, in particular to a novel method for installing a multi-channel filter component PCBA, which eliminates the conventional process of fastening the PCBA by screws, adopts a mode of directly welding the PCBA on a structure by soldering tin, can ensure the grounding characteristic of a radio frequency circuit, and can improve the space utilization rate of the component, thereby realizing smaller volume of the component.
In addition, the embodiment not only provides a method for installing the multi-channel filter assembly PCBA, but also relates to the corresponding printed board design, structural design and the like. The embodiment specifically includes: the design key points and details of the printed board in the installation method; the structural design key points and details in the installation method; specific technological processes and parameters in the installation method.
For the convenience of understanding the present embodiment, a method for assembling a circuit board disclosed in the embodiment of the present invention will be described in detail.
Embodiment one:
The embodiment of the invention provides a method for assembling a circuit board, referring to a flow chart of the method for assembling the circuit board shown in fig. 1, the method for assembling the circuit board comprises the following steps:
Step S102, adhering a structural member of a target circuit board through an adhesive tape; fixing a target circuit board, and plating soldering tin on a solder mask layer of the target circuit board; and preheating the structural part, and coating the soldering tin wire on the step of the inner cavity of the structural part by using an electric soldering iron.
The target circuit board to be assembled in this embodiment is provided with an electronic component, which may be a multi-channel filter assembly, i.e. PCBA. In this embodiment, when the PCBA and the structural member are welded, a certain preparation is required.
In this embodiment, the structural member may be adhered first, and the blade is used to cut off the redundant adhesive tape, and the adhesive tape in this embodiment may be a high temperature resistant adhesive tape. And then plating soldering tin on a solder mask layer (a holder layer) of the target circuit board, wherein the thickness of the soldering tin needs to just cover a reserved area of the target circuit board, and the file can be used for correcting edge burrs of the soldering tin. Finally, the structural member can be placed in a heating table for preheating, and the normal-temperature soldering tin wire is coated at the step of the inner cavity of the structural member by using an electric soldering iron.
Step S104, heating the structural member; placing the target circuit board into the structural member, and pressing the target circuit board through a pressing sheet; stopping pressing when the target circuit board sinks to a preset position, taking out the structural member from the heating table, and pressing the target circuit board again through the pressing sheet until the soldering tin is cooled, so that a welding product is obtained.
The present embodiment may perform soldering after completing the preparation process of the PCBA. In this embodiment, the structure member plated with the solder may be placed in a heating table to be heated. When the solder begins to melt, the target circuit board is placed into the structure and pressed gently downward in place (typically on the same height device) using a press tab.
In the pressing process, the moving condition of the PCBA is determined, if the PCBA is sunk to a preset position, the pressing is stopped, the structural part is quickly taken down from the heating table, and the pressing sheet is used again for pressing until the soldering tin is cooled. The temperature difference of solder melting can be fully utilized, and the welding of the PCBA and the structural member is completed before the solder is melted on the PCBA.
And S106, if the welding product meets the preset conditions, determining that the welding product is qualified.
After the welding process of the PCBA is completed, the welded welding product can be checked, and if the welding product meets the preset condition, the welding product can be considered to be qualified. Wherein the welding product is a product obtained by welding a target circuit board to a structural member.
The embodiment of the invention provides a method for assembling a circuit board, which omits the conventional process of fastening PCBA by screws, adopts a mode of directly welding PCBA on a structure by soldering tin, can ensure the grounding characteristic of a radio frequency circuit, can improve the space utilization rate of the PCBA, and reduces the volume.
Embodiment two:
The embodiment of the invention provides another method for assembling a circuit board, which is realized on the basis of the embodiment, and the embodiment takes a specific product (16-way switch filter assembly) as an example for describing the specific design process and the application effect of the printed board clearly.
Referring to a schematic diagram of a filter component principle shown in fig. 2, the product has a working frequency range of 950-1250 MHz, and is required to inhibit more than or equal to 50dBc in a band of 1300-2400 MHz, and has an external dimension of 35mm multiplied by 24mm multiplied by 6mm. The 16-channel filter is a surface acoustic wave filter, and an LC low-pass filter is respectively connected in series at the input end and the output end of the component in order to inhibit spurious signals in the range of 1300 MHz-240MHz.
The design dimensions of the PCB design are 33mm by 22.5mm by 3.5mm after the minimum required dimensions for the construction process are removed due to the construction profile requirements. The PCB in this embodiment may be a blank printed circuit board where no electronic components are provided. Referring to fig. 3, which is a schematic diagram of a top layout and a bottom layout of a PCB and fig. 4, which is a schematic diagram of an assembly mode of a PCBA and a structural member, an electronic component provided by a target circuit board of this embodiment includes: and the filter assembly is arranged on the front surface and the back surface of the target circuit board.
According to the process of fastening PCBA by using screws in the prior art, a minimum of 5 screws are required to fasten the PCBA, so that 120 components which cannot accommodate the whole circuit are caused; by using the method of the invention, the positions of the screw mounting holes are saved, not only all components of the circuit are contained in the inner cavity of the structure, but also the electrical connection characteristic of the PCBA and the structure is ensured.
In addition, the schematic diagram of the typical frequency response characteristic of a product shown in fig. 5 can be also seen, and the high-band out-of-band rejection is more than or equal to 70dBc. The reliability of the product is verified by the whole machine test of the user, and the use requirement of the airborne equipment can be met.
The structure of the target circuit board of the embodiment sequentially includes, from top to bottom: a top layer of the radio frequency wiring, a top layer of the radio frequency ground wire, a middle layer of the power supply wiring, a middle layer of the control wiring, a bottom layer of the radio frequency ground wire and a bottom layer of the radio frequency wiring; a solder mask layer is arranged at the edge of the bottom layer of the target circuit board; the edge of the target circuit board is provided with a metallized wrapping edge; the target circuit board is also provided with a large-diameter through hole for moving the target circuit board.
The design points of the printed board of the multi-channel filter assembly are described later. The structure of the target circuit board of the embodiment sequentially includes, from top to bottom: a top layer of the radio frequency wiring, a top layer of the radio frequency ground wire, a middle layer of the power supply wiring, a middle layer of the control wiring, a bottom layer of the radio frequency ground wire and a bottom layer of the radio frequency wiring; a solder mask layer is arranged at the edge of the bottom layer of the target circuit board; the target circuit board is also provided with a large-diameter through hole for moving the target circuit board.
Referring to the schematic diagram of a circuit stack shown in fig. 6, the printed board stack selects a 6-layer structure, and is not wired in the radio frequency "ground" layer to ensure signal integrity, so as to avoid splitting the signal ground, and the device layout and wiring are designed according to the radio frequency circuit requirements without special requirements.
In the embodiment, when the forbidden wiring layer (keep-out layer) of the PCBA defines the drawing area, the boundary of the defined area should be reduced inwards by 0.1mm so as to ensure that enough operation space exists in the structural cavity when the PCBA is welded with the structure; the distance between the metal and the key-out is set to be 0mm when copper is coated.
Referring to a schematic diagram of a holder layer with edge arrangement shown in fig. 7, a holder layer with width of 0.9mm can be arranged at the edge position of the bottom layer of the printed board, taking care of avoiding the positions of the ports, the vias and the wirings; through holes with the diameter of 1.3mm are arranged at the positions of the printed board, which are close to the middle and have no components and components within the range of 3mm in diameter of the bottom layer, and are reserved for product maintenance and disassembly of the printed board, namely the circular ring mark position of the 3D view in fig. 7.
In the process of printed board processing, the following requirements need to be noted: the plating process selects 'gold deposition'; the edges of the plates are free from copper cutting; board edge "bag Jin Chuli". This causes the printed board sidewalls to also have metal attached to them that is "ground" connected to the printed board internal references, which can be seen in the schematic diagram of an edge metallization connection of a PCB board as shown in fig. 8.
The design points of the structure of the multi-channel filter assembly are described later in this embodiment. The structure material is kovar material (alloy), and in order to ensure the welding performance of PCBA and the structure, the surface of the structure is subjected to gold plating treatment, and the thickness of a gold layer is more than 1.5 mu m. In the inner cavity of the structure, a step with the width of 0.75mm is designed close to the wall, and the height of the step is determined by the highest component on the PCBA as shown in figure 8. It should be noted that the step is adjusted to be concave in time according to the distance between the components, the wiring and the via hole on the PCBA and the structural wall.
Referring to the schematic diagram of the steps in the structural cavity shown in fig. 9, the positions of the steps are irregular, so that the components, wires and non-grounding through holes on the PCBA can be ensured to have enough safety distance from the structural metal wall, and the problem of circuit short circuit caused by welding the PCBA and the structure is avoided.
Referring to a flowchart of another method of assembling a circuit board shown in fig. 10, the method of assembling a circuit board includes the steps of:
Step S1002, adhering a structural member of a target circuit board through an adhesive tape; fixing a target circuit board, and plating soldering tin on a solder mask layer of the target circuit board; and preheating the structural part, and coating the soldering tin wire on the step of the inner cavity of the structural part by using an electric soldering iron.
In this embodiment, the electrical performance of the target circuit board may be debugged first, and then the PCBA may be assembled. The assembly process occurs after the PCBA completes electrical property debugging, and the whole process comprises the following steps: a preparation process, a welding inspection process and a reworking and repairing process (when applicable).
In preparation, the structural appearance can be adhered by using the high-temperature-resistant adhesive tape, and the adhesive tape is cut off along the edge of the structural wall of the structural member by the blade. The blade is used for redundant adhesive tape, and the redundant adhesive tape is cut off along the edge of the structural wall, so that the redundant adhesive tape can be prevented from polluting the structural appearance and causing mechanical damage to the structural appearance in the welding process.
This embodiment can use the PCB to press from both sides fixed PCBA, uses electric iron and normal atmospheric temperature soldering tin silk to plate the soldering tin at the holder layer that PCBA edge reserved, and soldering tin thickness just covers reserved area can, can pass through the edge burr of file trimming soldering tin after plating the soldering tin, for example: the small file is used for trimming the edge burrs, and the mounting is not affected.
In the embodiment, the shell with good appearance protection can be placed on a heating table with the setting temperature of 180 ℃ for preheating; the normal temperature soldering tin wire is coated at the step of the inner cavity by using an electric soldering iron, the soldering tin amount needs to cover the area of the step and has a little allowance, a concave triangle can be formed with the wall, and the section can be seen from a schematic diagram of a concave triangle for soldering tin accumulation shown in fig. 11.
Step S1004, heating the structural member; placing the target circuit board into the structural member, and pressing the target circuit board through a pressing sheet; stopping pressing when the target circuit board sinks to a preset position, taking out the structural member from the heating table, and pressing the target circuit board again through the pressing sheet until the soldering tin is cooled, so that a welding product is obtained.
In the welding process, the temperature of a heating table is set to be 250 ℃, and after the temperature is stable, a structure part plated with soldering tin is placed on the heating table for heating; observing the melting condition of soldering tin in the structural member, placing PCBA in the structural member when the soldering tin begins to melt (the soldering tin color is changed from dark to bright), and selecting a proper position (generally on the same height device) by using a pressing sheet, lightly pressing downwards, and preventing the PCBA from deforming. See a schematic diagram of a patch press shown in fig. 12, where the press may be on a saw filter.
In the pressing process, the moving condition of the PCBA is sensed; when the PCBA is perceived to sink and the PCBA sinks to a design position, pressing is stopped, the structural member is quickly moved down from the heating table by using a tool, the moving process is quick and stable, and the components on the PCBA can be shifted due to severe movement; after the structural member is removed, the pressing is performed again by using the pressing sheet until the solder is cooled. The temperature difference of solder melting can be fully utilized, and the welding of the PCBA and the structural part is completed before the solder is melted on the PCBA.
Step S1006, if the welding product meets the preset condition, determining that the welding product is qualified.
The preset conditions in this embodiment at least include one of the following: sinking the target circuit board to a preset position; the soldering tin amount of the welding area of the target circuit board is larger than a preset threshold value; the welding area of the target circuit board is free from short circuit to the ground; the electrical property of the welding product meets the preset requirement.
After the welding process is completed, the welding effect needs to be checked, and the checking contents are as follows: observing whether the PCBA sinks to the design position, and if not, carrying out reworking and repairing; observing whether the soldering tin amount of the welding area is full, and supplementing tin in the area which is not full by using an electric soldering iron; checking whether a circuit near a welding area is short-circuited to the ground by using a universal meter, and when the short circuit exists, reworking and repairing are needed; and testing the electrical property of the welded product, and if the electrical property does not meet the requirement, reworking and repairing are needed. If the inspection content has no problem, the welding qualification, namely the welding product qualification, can be determined.
And step S1008, if the welding product does not meet the preset conditions, separating the structural member and the target circuit board, and overhauling the structural member and the target circuit board.
Specifically, the present embodiment can place the soldering product in the heating stage while separating the structural member and the target circuit board; lifting the target circuit board, and repeatedly heating along the edge of the target circuit board through a hot air gun until the target circuit board is lifted out of the structural member; and respectively placing the target circuit board and the structural part on the warm paper board, and cleaning soldering tin at the edge of the target circuit board.
For example, the heating station temperature may be set to 250 ℃; after the temperature of the heating table is stable, starting a hot air gun, and setting the temperature to 320 ℃; placing the components to be disassembled (the bottom can be protected by a high-temperature-resistant adhesive tape) on a heating table and fixing the components so that the components cannot move; a hook with the diameter of 0.8mm passes through a small hole with the diameter of 1.3mm on the PCBA (the direction of the curved needle is noted to avoid touching back components), the left hand is lifted upwards slightly, and the right hand-held hot air gun moves along the edge of the PCBA to heat repeatedly (the moving speed is not required to be too fast) until the PCBA is lifted to be in a structure; lightly placing the PCBA on the high-temperature-resistant paperboard, and then moving the structural part from the heating table to the high-temperature-resistant paperboard; and cleaning the solder on the edge of the PCBA by using an electric soldering iron and a solder suction wire.
The method provided by the embodiment establishes a new multi-channel filter assembly PCBA installation method, and particularly relates to a specific collocation design of the edge of a PCB and a structural inner cavity, and a technological process and specific technological parameters of welding the PCBA to the structural inner cavity. The method is proved to be effective and reliable by specific collocation design of the edge of the PCB and the inner cavity of the structure, and fumbling and arrangement of the technological process and specific parameters of welding the PCBA into the inner cavity of the structure, application and verification on specific products and verification results.
Embodiment III:
corresponding to the above-described method embodiments, an embodiment of the present invention provides a circuit board assembling device, in which a target circuit board to be assembled is provided with electronic components, referring to a schematic structural diagram of a circuit board assembling device shown in fig. 13, the circuit board assembling device includes:
A preparation module 1301 for adhering a structural member of the target circuit board by an adhesive tape; fixing a target circuit board, and plating soldering tin on a solder mask layer of the target circuit board; preheating the structural member, and coating the soldering tin wires on the steps of the inner cavity of the structural member through an electric soldering iron;
A welding module 1302 for heating the structural member; placing the target circuit board into the structural member, and pressing the target circuit board through a pressing sheet; stopping pressing when the target circuit board sinks to a preset position, taking out the structural member from the heating table, and pressing the target circuit board again through the pressing sheet until the soldering tin is cooled to obtain a welding product;
and the checking module 1303 is used for determining that the welding product is qualified if the target circuit board meets the preset condition.
The embodiment of the invention provides an assembly device of a circuit board, which omits the conventional process of fastening PCBA by screws, adopts a mode of directly welding PCBA on a structure by soldering tin, can ensure the grounding characteristic of a radio frequency circuit, can improve the space utilization rate of the PCBA, and reduces the volume.
The preparation module is also used for carrying out electrical performance debugging on the target circuit board.
The preparation module is also used for cutting the adhesive tape along the edge of the structural wall of the structural member by a blade.
The preparation module is also used for trimming the edge burrs of the soldering tin through the file.
The preset conditions at least comprise one of the following: sinking the target circuit board to a preset position; the soldering tin amount of the welding area of the target circuit board is larger than a preset threshold value; the welding area of the target circuit board is free from short circuit to the ground; the electrical property of the welding product meets the preset requirement.
The device further comprises: and the repair module is used for separating the structural member from the target circuit board and overhauling the structural member and the target circuit board if the welded product does not meet the preset conditions.
The repair module is used for placing the welding product in the heating table; lifting the target circuit board, and repeatedly heating along the edge of the target circuit board through a hot air gun until the target circuit board is lifted out of the structural member; and respectively placing the target circuit board and the structural part on the warm paper board, and cleaning soldering tin at the edge of the target circuit board.
The electronic component provided with the target circuit board comprises: and the filter assembly is arranged on the front surface and the back surface of the target circuit board.
The structure of the target circuit board sequentially comprises the following components from top to bottom: a top layer of the radio frequency wiring, a top layer of the radio frequency ground wire, a middle layer of the power supply wiring, a middle layer of the control wiring, a bottom layer of the radio frequency ground wire and a bottom layer of the radio frequency wiring; a solder mask layer is arranged at the edge of the bottom layer of the target circuit board; the edge of the target circuit board is provided with a metallized wrapping edge; the target circuit board is also provided with a through hole for moving the target circuit board.
It will be clear to those skilled in the art that, for convenience and brevity of description, the specific working process of the assembly device of the circuit board described above may refer to the corresponding process in the foregoing embodiment of the assembly method of the circuit board, which is not repeated herein.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above examples are only specific embodiments of the present invention, and are not intended to limit the scope of the present invention, but it should be understood by those skilled in the art that the present invention is not limited thereto, and that the present invention is described in detail with reference to the foregoing examples: any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or perform equivalent substitution of some of the technical features, while remaining within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. A method of assembling a circuit board, characterized in that a target circuit board to be assembled is provided with electronic components, the electronic components provided by the target circuit board comprising: the filter assembly is arranged on the front surface and the back surface of the target circuit board; the structure of the target circuit board sequentially comprises the following components from top to bottom: a top layer of the radio frequency wiring, a top layer of the radio frequency ground wire, a middle layer of the power supply wiring, a middle layer of the control wiring, a bottom layer of the radio frequency ground wire and a bottom layer of the radio frequency wiring; a solder mask layer is arranged at the edge of the bottom layer of the target circuit board; the edge of the target circuit board is provided with a metallized wrapping edge; the target circuit board is further provided with a through hole, and the through hole is used for moving the target circuit board; the structure material of the filter component is kovar material, the surface of the structure is subjected to gold plating treatment, the thickness of a gold layer is more than 1.5 mu m, and a step with the width of 0.75mm is designed on the close wall of the inner cavity of the structure; the method comprises the following steps:
Adhering the structural member of the target circuit board through an adhesive tape; fixing the target circuit board, and plating soldering tin on a solder mask layer of the target circuit board; preheating the structural member, and coating soldering wires on the step of the inner cavity of the structural member through an electric soldering iron;
Heating the structural member; placing the target circuit board into the structural member, and pressing the target circuit board through a pressing sheet; stopping pressing when the target circuit board sinks to a preset position, taking out the structural member from the heating table, and pressing the target circuit board again through the pressing sheet until the soldering tin is cooled to obtain a welding product;
And if the welding product meets the preset condition, determining that the welding product is qualified.
2. The method of claim 1, wherein prior to the step of taping the structural member of the target circuit board, the method further comprises:
and performing electrical performance debugging on the target circuit board.
3. The method of claim 1, wherein after the step of taping the structural member of the target circuit board, the method further comprises:
the tape is cut by a blade along the edge of the structural wall of the structural member.
4. The method of claim 1, wherein after the step of solder plating the solder mask layer of the target circuit board, the method further comprises:
and trimming the edge burrs of the soldering tin by using a file.
5. The method of claim 1, wherein the preset conditions include at least one of:
The target circuit board sinks to the preset position;
the soldering tin amount of the welding area of the target circuit board is larger than a preset threshold value;
The welding area of the target circuit board is free from short circuit to the ground;
The electrical property of the welding product meets the preset requirement.
6. The method according to claim 1, wherein the method further comprises:
And if the welding product does not meet the preset condition, separating the structural member and the target circuit board, and overhauling the structural member and the target circuit board.
7. The method of claim 6, wherein the step of separating the structural member and the target circuit board comprises:
Placing the welded product in a heating station;
Lifting the target circuit board, and repeatedly heating along the edge of the target circuit board through a hot air gun until the target circuit board is lifted out of the structural part;
and respectively placing the target circuit board and the structural part on a warm paper board, and cleaning soldering tin at the edge of the target circuit board.
8. An assembling apparatus for a circuit board, characterized in that a target circuit board to be assembled is provided with electronic components, the electronic components provided by the target circuit board comprising: the filter assembly is arranged on the front surface and the back surface of the target circuit board; the structure of the target circuit board sequentially comprises the following components from top to bottom: a top layer of the radio frequency wiring, a top layer of the radio frequency ground wire, a middle layer of the power supply wiring, a middle layer of the control wiring, a bottom layer of the radio frequency ground wire and a bottom layer of the radio frequency wiring; a solder mask layer is arranged at the edge of the bottom layer of the target circuit board; the edge of the target circuit board is provided with a metallized wrapping edge; the target circuit board is further provided with a through hole, and the through hole is used for moving the target circuit board; the structure material of the filter component is kovar material, the surface of the structure is subjected to gold plating treatment, the thickness of a gold layer is more than 1.5 mu m, and a step with the width of 0.75mm is designed on the close wall of the inner cavity of the structure; the device comprises:
The preparation module is used for adhering the structural part of the target circuit board through an adhesive tape; fixing the target circuit board, and plating soldering tin on a solder mask layer of the target circuit board; preheating the structural member, and coating soldering wires on the step of the inner cavity of the structural member through an electric soldering iron;
A welding module for heating the structural member; placing the target circuit board into the structural member, and pressing the target circuit board through a pressing sheet; stopping pressing when the target circuit board sinks to a preset position, taking out the structural member from the heating table, and pressing the target circuit board again through the pressing sheet until the soldering tin is cooled to obtain a welding product;
And the checking module is used for determining that the welding product is qualified if the target circuit board meets preset conditions.
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| JPH07335814A (en) * | 1994-06-13 | 1995-12-22 | Akira Kitahara | Surface mount parts including semiconductor integrated circuit and fabrication thereof |
| CN100487882C (en) * | 2006-12-08 | 2009-05-13 | 中兴通讯股份有限公司 | Integrated circuit and heat radiation member connecting method |
| CN103737135B (en) * | 2013-12-09 | 2016-01-13 | 成都赛英科技有限公司 | A kind of metal shell soldering method |
| CN205229726U (en) * | 2015-12-24 | 2016-05-11 | 安徽润谷网络科技有限公司 | Agricultural quick -witted intelligent terminal's PCB layout structure |
| CN106238848B (en) * | 2016-08-22 | 2019-12-27 | 京信通信技术(广州)有限公司 | Non-contact type heating tin brazing method for metal structural part and PCB |
| CN106301223B (en) * | 2016-08-31 | 2019-03-12 | 安徽华东光电技术研究所 | Method for manufacturing voltage-controlled oscillator module |
| CN207969077U (en) * | 2018-02-26 | 2018-10-12 | 北京新能源汽车股份有限公司 | Printed circuit board |
| CN109769352B (en) * | 2019-03-14 | 2021-12-24 | 安徽华东光电技术研究所有限公司 | Manufacturing method of 80W power amplifier module |
| CN211557661U (en) * | 2019-12-06 | 2020-09-22 | 成都芯通软件有限公司 | Solder mask net of PCB and PCB |
| CN114094348B (en) * | 2020-06-29 | 2023-06-09 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | PCB substrate antenna and carrier structural member assembling process method |
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