CN103737135B - A kind of metal shell soldering method - Google Patents
A kind of metal shell soldering method Download PDFInfo
- Publication number
- CN103737135B CN103737135B CN201310660242.9A CN201310660242A CN103737135B CN 103737135 B CN103737135 B CN 103737135B CN 201310660242 A CN201310660242 A CN 201310660242A CN 103737135 B CN103737135 B CN 103737135B
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- Prior art keywords
- solder
- printed board
- metal shell
- flatiron
- welding
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/06—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for positioning the molten material, e.g. confining it to a desired area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of metal shell soldering method, comprising: step 1: be fixing, printed board is positioned in box body, allows between welded printed board and box body and can not have relative movement; Step 2: preheating, the printed board fix location and box body are positioned on temperature control heating platform and carry out preheating, and preheat temperature, at 130 DEG C to 180 DEG C, is not less than 3 minutes preheating time.Step 3: prefluxing; Step 4: welding, step 5: cleaning.After printed board is welded with box body by metal shell soldering method of the present invention, owing to both can be formed seamless integrative-structure, therefore product has better shock resistance reliability, and product design centre halfback designs screw is fixed, save the space in product design process, less Total Product size.Owing to using solder double-clad board and box body to be carried out large-area welding, can ensure that product has good earthing effect.
Description
Technical field
The present invention relates to a kind of welding method, be specifically related to a kind of printed board and shielded metal housing soldering method.
Background technology
Existing frequency microwave product printed board fixed form is mostly adopted and is screwed or is fixed in metal shell by single-sided printed board by the mode of Reflow Soldering in conjunction with tin cream.
Screw fixation method is reserved screw in printed board first, itself and metal shell is fixed in installation process with screw.This screw fixed RF microwave printed board is adopted to there will be following problem:
1) be ensure that printed board can be fixed in metal shell in printed board design process, need reserved screw mounting hole in printed board, this directly increases the printed board area of product, as brought certain difficulty to designer in layout when printed board area is fixed, and often there is certain difficulty in product in fixation procedure.
2) printed board that area is larger, when fixing, printed board exists the screw hole of some, and therefore screw hole mounting means can play a role for the anti-vibration of product in this type of situation, impact capacity; And small size printed board is due to the requirement of product design layout aspect, middle part often cannot reserve screw hole and periphery screw number also cannot be guaranteed, and be often small dimension sized screws for fixing screw, often have some limitations in the reliability tests such as resistance vibrations, impact.
3) frequency microwave series products often requires reliably earthing effect, and earthing effect is bad often affects properties of product.
And adopt tin cream printed board Reflow Soldering fixed form to have following limitation:
In conjunction with tin cream, metal shell internal type is fixed in printed board with Reflow Soldering and is only applicable to single-sided printed board, the printed board of portion radio frequency microwave series products often needs to be designed to two panels to save product space, for fixing often helpless on metal shell of double-clad board.
Summary of the invention
The present invention is directed to the problems of the prior art, a kind of reliable in quality, the printing that can be applied to double-clad board and shielded metal housing soldering method are provided.
The present invention is achieved in that
A kind of metal shell soldering method, is characterized in that:
Step 1: fixing
Printed board is positioned in metal shell, by printed board and metal casing body scolding tin tentatively fixing;
Effect: before welding the printed board of welding and metal shell are fixed on the positioning.
Step 2: preheating
The printed board fix location and metal shell are positioned on temperature control heating platform and carry out preheating, and preheat temperature, at 130 DEG C to 180 DEG C, is not less than 3 minutes preheating time.
Effect: metal shell and printed board are heated, improves the solderability of large-area metal case weld, and damaging appears in strong temperature shock printed board and components and parts can be avoided to occur in follow-up welding by the mode of preheating.For preventing electrostatic damage components and parts, pre-heating station and temperature adjustment flatiron must ground connection.
Step 3: be coated with rosin flux
Solder joint is coated with rosin flux;
Effect: the width being coated with rosin flux is determined according to spot size, but this width is less than the width that solder is finally expanded, because can spread towards periphery under the high temperature of scaling powder when welding, solder spreads with the diffusion of rosin flux, to smearing position without the printed board of solder mask or metallic plate in welding process, require to carry out according to product design.This step mainly determines the particular problem of metal shell and soldering of printed boards, and before metal shell welding, improves the solderability of welding position with rosin flux, and improves the quality of welding.
Step 4: welding
Temp. controllable flatiron is adjusted to 300 DEG C to 380 DEG C, the solder horn cotton wiped clean of wet foam, upper appropriate solder (solder do not fall down till), solder horn is near metal shell side, because metal shell thermal capacity is large, then flatiron is adjusted to 450 DEG C, allows solder horn maximum area contacting metal housing as far as possible, treat that metal shell temperature is raised to solder melt point, flatiron is again near printed board;
Solder joint is consecutive hours, some solders can be added in right amount, but amount of solder is less than or equal to solder total amount needed for weldering this section of line, being tilted a little by metal shell after solder fusing, (welding starting point is upper, weld seam and workbench about 15 degree), allow solder liquid toward direction to be welded flowing, now flatiron only plays drainage and the effect of heating;
When the straight line solder joint that weld seam is slightly large welds, when can not complete with gradient method, this section of weld seam solder side all can be allowed solder, printed board working face and workbench are miter angle, weld seam is parallel to workbench, flatiron moves back and forth on this solder joint, allows the solder on solder joint become liquid, wetting good, time seamless and uneven, withdraw flatiron, after by the welding of printed board one side, weld printed board another side by designing requirement again, weld rear cooling naturally;
Effect: use the instruments such as temperature control pre-heating station, temperature control electric soldering iron, solder is melted, printed board and metal shell form complete, reliably integrative-structure the most at last, be that by means of pre-heating station heats welded part with traditional difference of welding, and this welding to belong to bonding area larger, welding temperature is higher, and operating personnel need to properly protect in welding process in order to avoid scald.
Step 5: cleaning
After metal shell welding is cooled to normal temperature completely, is positioned in rinse bath to soak 3 to 10 minutes and open ultrasonic wave and it is tentatively cleaned, tentatively cleaned rear hairbrush and the fouls such as remaining residual flux, greasy dirt, dust are finally cleaned.Can not clean with supersonic wave cleaning machine after the soldering of printed boards of components and parts is housed, manual type can only be adopted to scrub clean.
Effect: cleaned by the integrative-structure that metal shell scolding tin completes, for ensureing cleaning performance, also needs to scrub it except needs use ultrasonic drilling machine.
Indicate: some product components and parts needs to assemble components and parts with reflow soldering, printed board and metal shell are carried out soldering and are connected by the order again according to step 1 after therefore first components and parts can being assemblied in printed board, note not touched by electric soldering bit in welding process on components and parts in order to avoid cause component damage or solder joint to come off cause rosin joint.
The present invention utilizes temperature control electric soldering iron to be melted by scolding tin, and temperature control heating platform plays the temperature of preheating, the ground hole of printed board surrounding is welded on metal shell inwall surrounding, and metal shell and printed board are formed complete integrative-structure.Utilize this technology mode printed board and metal shell can be formed complete, reliable integrative-structure, and effectively can ensure the requirement of product ground connection aspect.
Be with traditional-handwork welding manner difference, printed board and metal shell contact position must design the ground hole of one fixed width, and with pre-heating station to its guarantee welding quality of heating.
1), after using metal shell soldering tin technique printed board to be welded with metal shell, owing to both can be formed seamless integrative-structure, therefore product has better shock resistance reliability.
2) and do not design screw in product design and be fixed, the space in product design process has been saved, less Total Product size.
3) weld because to have used solder double-clad board and metal shell to be carried out large-area, can ensure that product has good earthing effect.
For solving produced problem in above-mentioned background, reduce designer's difficulty in the design process, ensure the reliability of product, my company is through practical experience for many years, in conjunction with traditional manual welding process of tin mode (fixing---heating------cooling---cleans to add solder), find out soldering of printed boards in metal shell soldering tin technique mode, this technological requirement designer is at printed board surrounding design ground hole, ensure product can be complete be welded on metal shell inwall, limited and when requiring that earthing effect is good in interiors of products layout, this technique has advantageous effect significantly.
Accompanying drawing explanation
Fig. 1 to Fig. 7 is the process drawing of metal shell soldering method.
Wherein 1 is ground connection weld for printed board, 2 is box body, 3.
Drawings illustrate the basic ideas in this technique, in the design process printed board surrounding is designed to ground structure, convenient welding, utilizes the equipment and materials that specifies in this technique and technical process that scolding tin merging is carried out in printed board and metal shell, after merging, printed board and box body is formed integrative-structure.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention will be further described.
As shown in drawings, a kind of metal shell soldering method, for:
Step 1: fixing, is positioned printed board 1 in metal shell 2, by tentatively fixing with scolding tin to printed board 1 and metal shell 2; Printed board surrounding has ground hole;
Step 2: preheating
The printed board fix location and metal shell are positioned on temperature control heating platform and carry out preheating, and preheat temperature, at 130 DEG C to 180 DEG C, is not less than 3 minutes preheating time.
Step 3: be coated with rosin flux
Solder joint is coated with rosin flux;
Step 4: welding
Temp. controllable flatiron is adjusted to 300 DEG C to 380 DEG C, the solder horn cotton wiped clean of wet foam, upper appropriate solder (solder do not fall down till), solder horn is near metal shell side, because metal shell thermal capacity is large, then flatiron is adjusted to 450 DEG C, allows solder horn maximum area contacting metal housing as far as possible, treat that metal shell temperature is raised to solder melt point, flatiron is again near printed board;
Solder joint is consecutive hours, some solders can be added in right amount, but amount of solder is less than or equal to solder total amount needed for weldering this section of line, being tilted a little by metal shell after solder fusing, (welding starting point is upper, weld seam and workbench about 15 degree), allow solder liquid toward direction to be welded flowing, now flatiron only plays drainage and the effect of heating;
When the straight line solder joint that weld seam is slightly large welds, when can not complete with gradient method, this section of weld seam solder side all can be allowed solder, printed board working face and workbench are miter angle, weld seam is parallel to workbench, flatiron moves back and forth on this solder joint, allows the solder on solder joint become liquid, wetting good, time seamless and uneven, withdraw flatiron, after by the welding of printed board one side, weld printed board another side by designing requirement again, weld rear cooling naturally;
Step 5: cleaning
After metal shell welding is cooled to normal temperature completely, is positioned in rinse bath to soak 3 to 10 minutes and open ultrasonic wave and it is tentatively cleaned, tentatively cleaned rear hairbrush and the fouls such as remaining residual flux, greasy dirt, dust are finally cleaned.Can not clean with supersonic wave cleaning machine after the soldering of printed boards of components and parts is housed, manual type can only be adopted to scrub clean.
Effect: cleaned by the integrative-structure that metal shell scolding tin completes, for ensureing cleaning performance, also needs to scrub it except needs use ultrasonic drilling machine.
Indicate: some product components and parts needs to assemble components and parts with reflow soldering, printed board and metal shell are carried out soldering and are connected by the order again according to step 1 after therefore first components and parts can being assemblied in printed board, note not touched by electric soldering bit in welding process on components and parts in order to avoid cause component damage or solder joint to come off cause rosin joint.
During welding, the ground hole that printed board itself carries can be used, ground hole and metal shell are also welded together, form ground connection weld 3.
Claims (1)
1. a metal shell soldering method, is characterized in that:
Step 1: fixing
Printed board is positioned in metal shell, by printed board and metal casing body scolding tin tentatively fixing;
Step 2: preheating
The printed board fix location and metal shell are positioned on temperature control heating platform and carry out preheating, and preheat temperature, at 130 DEG C to 180 DEG C, is not less than 3 minutes preheating time;
Step 3: be coated with rosin flux
Solder joint is coated with rosin flux;
Step 4: welding
Temp. controllable flatiron is adjusted to 300 DEG C to 380 DEG C, the solder horn cotton wiped clean of wet foam, upper appropriate solder, solder horn is near metal shell side, because metal shell thermal capacity is large, then flatiron is adjusted to 450 DEG C, allows solder horn maximum area contacting metal housing, treat that metal shell temperature is raised to solder melt point, flatiron is again near printed board;
Solder joint is consecutive hours, can add some solders, but amount of solder is less than or equal to solder total amount needed for weldering this section of line, is tilted a little by metal shell after solder fusing, and allow solder liquid toward direction to be welded flowing, now flatiron only plays drainage and the effect of heating;
When the straight line solder joint that weld seam is slightly large welds, when can not complete with gradient method, this section of weld seam solder side all can be allowed solder, printed board working face and workbench are miter angle, weld seam is parallel to workbench, flatiron moves back and forth on this solder joint, allows the solder on solder joint become liquid, wetting good, time seamless and uneven, withdraw flatiron, after by the welding of printed board one side, weld printed board another side by designing requirement again, weld rear cooling naturally;
Step 5: cleaning
After metal shell welding is cooled to normal temperature completely, is positioned in rinse bath to soak 3 to 10 minutes and open ultrasonic wave and it is tentatively cleaned, tentatively cleaned rear hairbrush and remaining residual flux, greasy dirt, dust are finally cleaned; Can not clean with supersonic wave cleaning machine after the soldering of printed boards of components and parts is housed, manual type can only be adopted to scrub clean.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310660242.9A CN103737135B (en) | 2013-12-09 | 2013-12-09 | A kind of metal shell soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310660242.9A CN103737135B (en) | 2013-12-09 | 2013-12-09 | A kind of metal shell soldering method |
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| CN103737135A CN103737135A (en) | 2014-04-23 |
| CN103737135B true CN103737135B (en) | 2016-01-13 |
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| CN106270870A (en) * | 2016-08-31 | 2017-01-04 | 太仓市华盈电子材料有限公司 | A kind of Chip-R welding method |
| CN107498126B (en) * | 2017-06-26 | 2020-02-21 | 安徽华东光电技术研究所 | Method for enameling tin on deep cavity or narrow cavity |
| CN109412286A (en) * | 2018-12-13 | 2019-03-01 | 上海盘毂动力科技股份有限公司 | A kind of motor in axial magnetic field and installation method |
| CN111774682B (en) * | 2020-07-28 | 2021-12-28 | 贵州航天电子科技有限公司 | Welding method for special-shaped porous printed board |
| CN112743175A (en) * | 2020-12-28 | 2021-05-04 | 北京滨松光子技术股份有限公司 | Method for welding vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit of petroleum logging |
| CN116197477B (en) * | 2023-03-22 | 2024-08-09 | 北京中科飞鸿科技股份有限公司 | Method and device for assembling circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036499A (en) * | 2009-11-17 | 2011-04-27 | 苏州明富自动化设备有限公司 | Crest welder |
| CN102083281A (en) * | 2010-10-27 | 2011-06-01 | 北京遥测技术研究所 | Method for enhancing welding reliability of high-frequency quad flat no lead (QFN) device |
| DE102010019709A1 (en) * | 2010-05-07 | 2011-11-10 | Hella Kgaa Hueck & Co. | Device for electrical interconnection of electrical contact area of e.g. direct copper bonded ceramic substrate, with electrical contacting area of printed circuit board, has contacting region contacting contacting area at or in board |
| CN102773575A (en) * | 2012-07-17 | 2012-11-14 | 贵州航天电子科技有限公司 | Microwave printed board and cushion block soldering process method |
| DE102011118370A1 (en) * | 2011-11-14 | 2013-05-16 | Stannol Gmbh | Fluxing agent, useful e.g. to coat desired surface areas of a compactly formed solder material, comprises a marking agent, which can visualize a complete wetting of the desired surface areas with the agent after a coating process |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030019912A1 (en) * | 2001-07-11 | 2003-01-30 | Dennis Shiau | Outer cover shell and plate member soldering method |
-
2013
- 2013-12-09 CN CN201310660242.9A patent/CN103737135B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036499A (en) * | 2009-11-17 | 2011-04-27 | 苏州明富自动化设备有限公司 | Crest welder |
| DE102010019709A1 (en) * | 2010-05-07 | 2011-11-10 | Hella Kgaa Hueck & Co. | Device for electrical interconnection of electrical contact area of e.g. direct copper bonded ceramic substrate, with electrical contacting area of printed circuit board, has contacting region contacting contacting area at or in board |
| CN102083281A (en) * | 2010-10-27 | 2011-06-01 | 北京遥测技术研究所 | Method for enhancing welding reliability of high-frequency quad flat no lead (QFN) device |
| DE102011118370A1 (en) * | 2011-11-14 | 2013-05-16 | Stannol Gmbh | Fluxing agent, useful e.g. to coat desired surface areas of a compactly formed solder material, comprises a marking agent, which can visualize a complete wetting of the desired surface areas with the agent after a coating process |
| CN102773575A (en) * | 2012-07-17 | 2012-11-14 | 贵州航天电子科技有限公司 | Microwave printed board and cushion block soldering process method |
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| CN103737135A (en) | 2014-04-23 |
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