CN112743175A - Method for welding vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit of petroleum logging - Google Patents
Method for welding vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit of petroleum logging Download PDFInfo
- Publication number
- CN112743175A CN112743175A CN202011581771.6A CN202011581771A CN112743175A CN 112743175 A CN112743175 A CN 112743175A CN 202011581771 A CN202011581771 A CN 202011581771A CN 112743175 A CN112743175 A CN 112743175A
- Authority
- CN
- China
- Prior art keywords
- temperature
- resistant
- circuit board
- soldering iron
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a method for welding a vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit in petroleum logging, which comprises the steps of firstly, adjusting the temperature of a soldering iron by using a temperature detector; then, preheating the voltage division circuit board by using a soldering iron head at a position without devices and wiring on the voltage division circuit board; and finally, placing the soldering bit point on a bonding pad, and then uniformly feeding tin to a connection point of the tube needle and the bonding pad for welding.
Description
Technical Field
The invention relates to a welding method for external packaging of a photoelectric vacuum device, in particular to a welding method for a vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit of an oil logging.
Background
In order to operate the photomultiplier, a high voltage of about 500 to 3000V is applied between a cathode and an anode, and a photoelectron focusing electrode, a dynode system, or an accelerating electrode of different types is supplied. The voltage divider packaged by the photomultiplier tube mainly supplies power to each electrode of the photomultiplier tube through each tube pin.
The package of the anti-vibration high-temperature-resistant photomultiplier is mainly applied to petroleum logging or geological exploration in severe environments, extremely high requirements are provided for the welding firmness between a pipe needle and a partial pressure circuit board, and in order to meet the requirements of products used at high temperature, soldering tin used for welding needs to be silver-containing soldering tin with a high melting point. And for the requirement of temperature resistance and withstand voltage, the high temperature photomultiplier encapsulation bleeder circuit board uses ceramic circuit board, but ceramic circuit board's heat dissipation is very fast, easily appears the rosin joint phenomenon in the welding process.
The traditional tube pin welding method is to solve the problems of fast heat dissipation of a ceramic circuit board, uniformity of welding spots and passing rate of welding holes by increasing the temperature of soldering iron (generally over 430 ℃, the temperature of the soldering iron needs to be increased to 480 ℃ when more electronic devices are used), so as to ensure the connection firmness of the pressure distributing plate and the tube pins. However, the local heating of the circuit board is too high due to the over-high temperature of the soldering iron, so that the circuit board is cracked, and the phenomenon is not easy to be identified by naked eyes; and the other phenomenon is that the contact part of the tube needle and the welding point is seriously oxidized in the welding process, and even the welding pad is separated. Due to the fact that the temperature of the soldering iron is too high, dark noise is increased when the whole photomultiplier tube packaging product is used due to uneven heating, and the overall performance of the product is affected.
Disclosure of Invention
In order to overcome the defects of the existing welding method, the invention aims to: the welding method with simple steps is provided, so that under the condition that the temperature of the soldering iron is not increased, soldering tin can smoothly pass through hole welding pads on the circuit board and is uniformly distributed on two sides of the through holes to be welded with the tube pins, the firmness degree of the tube pins and the voltage division circuit board is improved, and the service performance of the photomultiplier in the high-temperature and vibration severe environment of oil logging is effectively ensured.
In order to solve the technical problem in the background art, the invention provides a welding method of a vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit, which is characterized by comprising the following steps: including photomultiplier encapsulation shell, photomultiplier tube needle, pottery bleeder circuit board, through-hole pad, preheating point position, solder joint, still include following step:
s1, adjusting the temperature of a soldering iron by using a temperature detector;
s2, preheating the partial pressure circuit board by using a soldering iron head at a position without devices and wires on the partial pressure circuit board;
s3, placing the soldering iron head point on the pad, and then uniformly feeding tin to the connection point of the tube needle and the pad for soldering;
and S4, welding the device on the next voltage division circuit, and repeating S1-S3.
Further: the soldering iron tip of the step S1 is a high-temperature lead-containing soldering iron tip, and the temperature of the soldering iron is 370 ℃.
Further: the step S2 is to divide the voltage of the circuit board by the ceramic circuit board.
Further: in the step S2, the positions are three points around the pad of the solder joint, and the solder joint is preheated by placing the soldering iron head with the temperature of 370 ℃ at the three points, wherein the time is 5 to 7 seconds.
Further: in the step S3, the tin is a high melting point silver-containing lead-free solder having a melting point of 268 ℃.
The invention has the beneficial effects that: the technical problem that the contact part of a welding spot is seriously oxidized due to overhigh temperature of the soldering iron is solved, the problem of firmness in the welding process of a photomultiplier tube pin and a ceramic circuit board is solved by controlling the soldering iron at a lower temperature and increasing the preheating step of the ceramic voltage division circuit board, and the oxidation of the photomultiplier tube pin around the welding spot is not aggravated in the process.
Drawings
FIG. 1 is a schematic diagram of the high temperature photomultiplier package configuration.
FIG. 2 is a schematic view of a preheating position in an embodiment of the welding method of the present invention.
FIG. 3 is a cross-sectional view of a pin joint of a high temperature photomultiplier tube divider of the present invention.
In the figure: a photomultiplier tube package housing 1; a photomultiplier tube 2; a photomultiplier tube needle 3; a ceramic voltage dividing circuit board 4; a via pad 5; preheat point position schematic 6; and a solder point 7.
Detailed Description
The following describes embodiments of the present invention in detail with reference to the accompanying drawings.
1-3 oil logging vibration-proof high temperature resistant photomultiplier packaging bleeder circuit welding method, including photomultiplier packaging shell 1; a photomultiplier tube 2; a photomultiplier tube needle 3; a ceramic voltage dividing circuit board 4; a via pad 5; preheat point location 6; and a solder point 7.
Fig. 2 is a schematic diagram showing a preheating position in a specific embodiment of the soldering method of the present invention, including a through-hole pad 5, after a photomultiplier tube pin passes through the through-hole pad, a soldering iron is used to preheat three points 6 around the through-hole pad for 5 to 7 seconds, then the soldering iron is placed on the pad, and then the solder is sent to a connection point between the tube pin and the through-hole pad for soldering.
Fig. 3 is a schematic cross-sectional view of a welding spot of a high-temperature photomultiplier tube divider pin after welding, wherein silver-containing solder 7 with a high melting point is uniformly distributed on two sides of a through hole pad of a ceramic voltage divider plate, so that the pin 3 and the ceramic pad 4 can be fully connected, and the overall vibration and impact resistance of the photomultiplier tube package is improved.
In order to solve the problems, the invention solves the problem of firmness in the welding process of the photomultiplier tube pin and the ceramic circuit board by controlling the temperature of the soldering iron to be 370 ℃ which is a lower temperature and adding a preheating step of the ceramic voltage division circuit board, and ensures that the oxidation of the photomultiplier tube pin around a welding spot is not intensified in the process.
The existing preheating mode is obtained by gradually searching, a soldering iron head with the temperature controlled at 370 ℃ is used for preheating a through hole pad for about 12 seconds, but the soldering iron can often generate the phenomenon that the pad falls off in the soldering process due to the fact that the soldering iron preheats the pad for too long time. The preheating time was shorter than 5 seconds and no weld could be applied.
Then, the high-melting-point silver-containing soldering tin is tried to be preheated, the soldering iron is firstly melted and then sent into the through hole bonding pad, but the ceramic circuit board is not preheated, so that the soldering tin has poor flowability in the through hole bonding pad and cannot be uniformly distributed on two sides of the through hole to ensure the firmness, and the possibility of insufficient soldering between the tube pin and the bonding pad is greatly increased by the method.
And finally, preheating three points around the through hole bonding pad by using a soldering iron with the temperature controlled at 370 ℃ for 5-7 seconds, then placing the soldering iron on the bonding pad, and then sending tin to the connection point of the tube pin and the through hole bonding pad for soldering. Therefore, the problems of the prior art are solved, and the problems of pad falling and insufficient soldering are not caused. The advantages of such preheating and welding are also less tools, short time, simple operation and easy implementation.
In the pre-heating and welding stage, the existing common lead-free welding method (welding at 350 ℃ for less than 3 seconds) is adopted for welding, the welding spot is not uniform, and 100 percent of unqualified welding spots are judged by naked eyes; and secondly, the welding method for improving the welding temperature and the welding time (welding at the temperature of 430 ℃ for 10 seconds) is adopted, wherein 10-20% of welding spots are subjected to cold welding, about 10% of welding pads fall off, and only about 40% of products with qualified appearance inspection pass the test in the final product test process. When the vibration of 20grms is carried out, the phenomena of pad looseness, welding spot cracking and the like of partial products occur, and the phenomena of overproof dark noise, poor plateau characteristics and the like of partial products occur in performance tests.
At present, the photomultiplier welded by the invention has finished the test of 200 products, and all passes the 30grms vibration and 1000g/0.5ms impact test. The vibration magnitude of the high-temperature photomultiplier welded by the method can reach 30grms, the impact pulse is 1000g/0.5ms, and the welding pad and the welding spot are qualified before and after testing.
Of course, the present invention may have other embodiments, and those skilled in the art can make corresponding changes to the preheating process of the present invention without departing from the essence of the present invention, for example, there are other preheating modes: preheating stage preheating, oven preheating, hot air blower preheating, etc., but such modifications are intended to fall within the scope of the claims.
Claims (5)
1. A welding method for a voltage division circuit packaged by a vibration-resistant and high-temperature-resistant photomultiplier is applied to the field of petroleum logging, and is characterized by comprising the following steps:
s1, adjusting the temperature of a soldering iron by using a temperature detector;
s2, preheating the partial pressure circuit board by using a soldering iron head at a position without devices and wires on the partial pressure circuit board;
s3, placing the soldering iron head point on the pad, and then uniformly feeding tin to the connection point of the tube needle and the pad for soldering;
and S4, welding the device on the next voltage division circuit, and repeating S1-S3.
2. The soldering method for vibration and high temperature resistant photomultiplier tube packaged voltage divider circuit as claimed in claim 1, wherein said soldering iron is a high temperature lead-free soldering iron, and the temperature of said soldering iron is 370 ℃.
3. The welding method for the voltage dividing circuit packaged by the vibration-resistant and high-temperature-resistant photomultiplier according to claim 1, wherein the voltage dividing circuit board is made of a ceramic circuit board.
4. The method as claimed in claim 1, wherein the preheating positions are three points without devices on the circuit board, the circuit board is preheated by placing the soldering iron with the temperature of 370 ℃ on the preheating points, and each preheating point is preheated in turn, and the preheating time is 5-7 seconds in total.
5. The method of claim 1, wherein the tin is a high melting point silver-containing lead-free solder with a melting point of 268 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011581771.6A CN112743175A (en) | 2020-12-28 | 2020-12-28 | Method for welding vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit of petroleum logging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011581771.6A CN112743175A (en) | 2020-12-28 | 2020-12-28 | Method for welding vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit of petroleum logging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112743175A true CN112743175A (en) | 2021-05-04 |
Family
ID=75646457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011581771.6A Pending CN112743175A (en) | 2020-12-28 | 2020-12-28 | Method for welding vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit of petroleum logging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112743175A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101877297A (en) * | 2009-04-30 | 2010-11-03 | 北京滨松光子技术股份有限公司 | Spot welding technology of vibration-proof photomultiplier lead |
| CN103567685A (en) * | 2012-07-25 | 2014-02-12 | 上海联影医疗科技有限公司 | Welding device for photomultiplier and voltage divider |
| CN103737135A (en) * | 2013-12-09 | 2014-04-23 | 成都赛英科技有限公司 | Metal shell soldering method |
| CN104319214A (en) * | 2014-09-30 | 2015-01-28 | 北京空间机电研究所 | Packaging method of anti-vibration type photoelectric detector |
| CN105252094A (en) * | 2015-10-23 | 2016-01-20 | 北京卫星制造厂 | High-reliability installation method for high-voltage welding spots |
| CN107553014A (en) * | 2016-07-01 | 2018-01-09 | 北京滨松光子技术股份有限公司 | The spot-welding technology of used in oil well logging high-temp-resisting vibration-resisting photomultiplier lead |
| JP2020087941A (en) * | 2018-11-14 | 2020-06-04 | トヨタ自動車株式会社 | Circuit board and manufacturing method thereof |
| CN111906400A (en) * | 2020-07-28 | 2020-11-10 | 长乐巧通工业设计有限公司 | LED circuit structural member and welding process thereof |
-
2020
- 2020-12-28 CN CN202011581771.6A patent/CN112743175A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101877297A (en) * | 2009-04-30 | 2010-11-03 | 北京滨松光子技术股份有限公司 | Spot welding technology of vibration-proof photomultiplier lead |
| CN103567685A (en) * | 2012-07-25 | 2014-02-12 | 上海联影医疗科技有限公司 | Welding device for photomultiplier and voltage divider |
| CN103737135A (en) * | 2013-12-09 | 2014-04-23 | 成都赛英科技有限公司 | Metal shell soldering method |
| CN104319214A (en) * | 2014-09-30 | 2015-01-28 | 北京空间机电研究所 | Packaging method of anti-vibration type photoelectric detector |
| CN105252094A (en) * | 2015-10-23 | 2016-01-20 | 北京卫星制造厂 | High-reliability installation method for high-voltage welding spots |
| CN107553014A (en) * | 2016-07-01 | 2018-01-09 | 北京滨松光子技术股份有限公司 | The spot-welding technology of used in oil well logging high-temp-resisting vibration-resisting photomultiplier lead |
| JP2020087941A (en) * | 2018-11-14 | 2020-06-04 | トヨタ自動車株式会社 | Circuit board and manufacturing method thereof |
| CN111906400A (en) * | 2020-07-28 | 2020-11-10 | 长乐巧通工业设计有限公司 | LED circuit structural member and welding process thereof |
Non-Patent Citations (1)
| Title |
|---|
| 彭建中等: "一种新型高可靠光电倍增管的研制", 《电子器件》 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5907187A (en) | Electronic component and electronic component connecting structure | |
| US3561110A (en) | Method of making connections and conductive paths | |
| JP2590450B2 (en) | Method of forming bump electrode | |
| CN101965632B (en) | Semiconductor mounting structure and method for manufacturing same | |
| KR20120094850A (en) | Electroconductive bonding material and method for bonding conductor | |
| KR20100071968A (en) | Method for low temperature bonding of electronic components | |
| JPH06296080A (en) | Substrate and method for mounting electronic part | |
| KR100279133B1 (en) | Method for producing electronic circuit device, jig for making solder residue uniform, jig for transferring solder paste, and apparatus for producing electronic circuit device | |
| CN101483978A (en) | Method of repair of electronic device and repair system | |
| KR20190115193A (en) | method for fabricating micro LED display pannel | |
| CN112247300B (en) | Electronic component welding method and surface-mounted electronic component welding method | |
| US6881906B2 (en) | Printed circuit board comprising a contact sleeve that is mounted thereon | |
| Raj et al. | Comparative study on impact of various low creep doped lead free solder alloys | |
| CN112743175A (en) | Method for welding vibration-resistant and high-temperature-resistant photomultiplier packaging voltage division circuit of petroleum logging | |
| CN102593067B (en) | Interconnection structure for LGA (Land grid array) packaging with controllable welding spot height and manufacturing method of interconnection structure | |
| CN111390314A (en) | Improvement method of FMC device assembling process | |
| US5868304A (en) | Socketable bump grid array shaped-solder on copper spheres | |
| US6531663B1 (en) | Solder stop for an electrical connection and method therefor | |
| CN107950082B (en) | For the heating element of SMD installation, the electronic building brick with the heating element and the method for manufacturing electronic building brick | |
| JPH0258793B2 (en) | ||
| CN112820652B (en) | Method for removing Jin Tang tin from L-shaped welding terminal of QFN packaging device | |
| TW201545173A (en) | Anisotropic conductive adhesive agent | |
| CN111556667A (en) | Mixed loading welding method for backward compatibility of lead-free BGA device | |
| US20060035412A1 (en) | Semiconductor attachment method | |
| He et al. | Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210504 |