CN209785945U - Surface-mounted diode - Google Patents
Surface-mounted diode Download PDFInfo
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- CN209785945U CN209785945U CN201920877519.6U CN201920877519U CN209785945U CN 209785945 U CN209785945 U CN 209785945U CN 201920877519 U CN201920877519 U CN 201920877519U CN 209785945 U CN209785945 U CN 209785945U
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- pin
- top surface
- transverse section
- tin
- section
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Abstract
The utility model discloses a paster diode, including first pin piece, second pin piece, sealing insulation layer and chip, first pin piece includes first horizontal segment, first L type section and first tin piece, the tip of first L type section is equipped with first pin, first horizontal segment be equipped with first pin sliding connection's first through-hole, the bottom surface of first tin piece with the top surface welding of first pin, the bottom surface of first tin piece with the top surface welding of first horizontal segment, the second pin piece includes second horizontal segment, second L type section and second tin piece, the tip of second L type section is equipped with the second pin. Compared with the prior art, the utility model, it is convenient to change.
Description
Technical Field
The utility model relates to a diode technical field, concretely relates to diode that easily changes.
Background
Prior art 1(CN203423190U) discloses a chip diode including a first lead sheet, a second lead sheet, an encapsulating insulating layer, and a chip. When the surface mount device is installed, the surface mount diode is welded on a bonding pad of the circuit board through electric soldering iron. The weak point, damage the back when this paster diode, when needing to be changed, will melt the tin that first pin piece and second pin piece are connected on the pad through the electric iron, just can take out the paster diode, and will remain the tin on the pad and clear away moreover to with new paster diode welding on this pad, complex operation, it is inconvenient to change.
SUMMERY OF THE UTILITY MODEL
to the defect among the prior art, the utility model provides a paster diode that easily changes.
The utility model provides a paster diode, includes first pin piece, second pin piece, sealing insulation layer and chip, first pin piece includes first horizontal segment, first L type section and first tin piece, the tip of first L type section is equipped with first pin, first horizontal segment be equipped with first pin sliding connection's first through-hole, the bottom surface of first tin piece with the top surface welding of first pin, the bottom surface of first tin piece with the top surface welding of first horizontal segment, the second pin piece includes second horizontal segment, second L type section and second tin piece, the tip of second L type section is equipped with the second pin, the second horizontal segment be equipped with second pin sliding connection's second through-hole, the bottom surface of second tin piece with the top surface welding of second pin, the bottom surface of second tin piece with the top surface welding of second horizontal segment.
Preferably, the top surface of the first stud is at the same level as the top surface of the first cross section.
Preferably, the top surface of the second pin is on the same horizontal plane as the top surface of the second cross section.
Preferably, the first through hole is located in the middle of the first transverse section.
Preferably, the second through hole is located in the middle of the second cross section.
The beneficial effects of the utility model are embodied in: when the tin bar is replaced, the first tin block and the second tin block are heated and removed by the electric iron, and the top surface of the first pin and the top surface of the first transverse section are on the same horizontal plane, and the top surface of the second pin and the top surface of the second transverse section are on the same horizontal plane, so that the first tin block or the second tin block can be heated and removed only by sliding the electric iron along the top surfaces of the first transverse section or the second transverse section. After the first tin block and the second tin block are removed by heating, because the first pin is in sliding connection with the first through hole of the first transverse section and the second pin is in sliding connection with the second through hole of the second transverse section, the first transverse section, the second transverse section, the sealing insulating layer and the chip can be separated from the bonding pad, then the new first transverse section, the second transverse section, the sealing insulating layer and the chip are installed, during installation, the first through hole of the new first transverse section is matched with the first pin and the first through hole of the new second transverse section is matched with the second pin, then the new first tin block and the new second tin block are formed by soldering tin with an electric soldering iron, and the new first transverse section is welded with the first pin and the new second transverse section is welded with the second pin respectively, so that the replacement of the new surface mount diode is completed. Compared with the prior art, the tin that first pin piece and second pin piece are connected on the pad need not be melted through the electric iron and still will remain on the pad and remove, only need clear away first tin piece and the heating of second tin piece, and clear away the convenience to it is convenient to change.
drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a front view of the present invention;
Fig. 2 is a top view of a first cross section of the present invention;
Fig. 3 is a front view of a first L-shaped section of the present invention;
Fig. 4 is a top view of a second cross section of the present invention;
Fig. 5 is a front view of a second L-shaped section of the present invention;
Fig. 6 is a schematic view of the structure of the first tin block of the present invention being removed by heating the electric iron.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
As shown in fig. 1 to 5, a chip diode includes a first lead sheet 1, a second lead sheet 2, a sealing insulation layer 3 and a chip (not shown), wherein the first lead sheet 1 includes a first transverse section 11, a first L-shaped section 12 and a first solder bump 13, an end of the first L-shaped section 12 is provided with a first stud 121, the first transverse section 11 is provided with a first through hole 111 slidably connected with the first stud, a bottom surface of the first solder bump 13 is welded with a top surface of the first stud 121, a bottom surface of the first solder bump 13 is welded with a top surface of the first transverse section 11, the second lead sheet 2 includes a second transverse section 21, a second L-shaped section 22 and a second solder bump 23, an end of the second L-shaped section 22 is provided with a second stud 221, the second transverse section 21 is provided with a second through hole 211 slidably connected with the stud, a bottom surface of the second solder bump 23 is welded with a top surface of the stud 221, the bottom surface of the second tin block 23 is welded with the top surface of the second transverse section 21, and the first tin block 13 and the second tin block 23 are formed by soldering tin through an electric soldering iron.
the top surface of the first pin 121 is on the same level as the top surface of the first horizontal section 11, and the top surface of the second pin 221 is on the same level as the top surface of the second horizontal section 21. Through the structure, the top surface of the first pin and the top surface of the first transverse section are on the same horizontal plane, and the top surface of the second pin and the top surface of the second transverse section are on the same horizontal plane, so that the first tin block or the second tin block can be heated and removed only by sliding the electric soldering iron 4 along the top surfaces of the first transverse section or the second transverse section, and the cleaning is simple.
The first through hole 111 is located in the middle of the first transverse section 11, and the second through hole 211 is located in the middle of the second transverse section 21. Through the structure, the electric soldering iron 4 has enough position to be easily positioned on the top surface of the first transverse section or the second transverse section before the first tin block or the second tin block is removed, so that when the first tin block or the second tin block is removed, the electric soldering iron moves forwards along the top surface of the first transverse section or the second transverse section to heat and remove the first tin block or the second tin block.
The utility model discloses a theory of operation is: when the replacement is performed, the first solder bump 13 and the second solder bump 23 are removed by heating with the electric iron 4, as shown in fig. 6. After the first solder bump 13 and the second solder bump 23 are removed by heating, because the first pin 121 is slidably connected to the first through hole 111 of the first horizontal section and the second pin 221 is slidably connected to the second through hole 211 of the second horizontal section, the first horizontal section 11, the second horizontal section 21, the sealing insulating layer 3 and the chip can be separated from the pad, and then the new first horizontal section, the second horizontal section, the sealing insulating layer and the chip are mounted, during mounting, the first through hole of the new first horizontal section is matched with the first pin and the first through hole of the new second horizontal section is matched with the second pin, and then the new first solder bump and the new second solder bump are formed by soldering tin of the electric iron 4, and the new first horizontal section is welded to the first pin and the new second horizontal section is welded to the second pin respectively, thus completing the replacement of the new chip diode. Compared with the prior art, the tin that first pin piece and second pin piece are connected on the pad need not be melted through the electric iron and still will remain on the pad and remove, only need clear away first tin piece and the heating of second tin piece, and clear away the convenience to it is convenient to change.
finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (5)
1. The utility model provides a paster diode, includes first pin piece, second pin piece, sealing insulation layer and chip, its characterized in that: the first pin piece comprises a first transverse section, a first L-shaped section and a first tin block, the end of the first L-shaped section is provided with a first pin, the first transverse section is provided with a first through hole connected with the first pin in a sliding manner, the bottom surface of the first tin block is welded with the top surface of the first pin, the bottom surface of the first tin block is welded with the top surface of the first transverse section, the second pin piece comprises a second transverse section, a second L-shaped section and a second tin block, the end of the second L-shaped section is provided with a second pin, the second transverse section is provided with a second through hole connected with the second pin in a sliding manner, the bottom surface of the second tin block is welded with the top surface of the second pin, and the bottom surface of the second tin block is welded with the top surface of the second transverse section.
2. A patch diode according to claim 1 wherein: the top surface of the first pin and the top surface of the first transverse section are on the same horizontal plane.
3. A patch diode according to claim 1 wherein: the top surface of the second pin and the top surface of the second transverse section are on the same horizontal plane.
4. A patch diode according to claim 2 wherein: the first through hole is located in the middle of the first transverse section.
5. A patch diode according to claim 3 wherein: the second through hole is located in the middle of the second transverse section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920877519.6U CN209785945U (en) | 2019-06-12 | 2019-06-12 | Surface-mounted diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920877519.6U CN209785945U (en) | 2019-06-12 | 2019-06-12 | Surface-mounted diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209785945U true CN209785945U (en) | 2019-12-13 |
Family
ID=68788733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920877519.6U Active CN209785945U (en) | 2019-06-12 | 2019-06-12 | Surface-mounted diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209785945U (en) |
-
2019
- 2019-06-12 CN CN201920877519.6U patent/CN209785945U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A chip diode Effective date of registration: 20210121 Granted publication date: 20191213 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: DONGGUAN TONGKE ELECTRONIC Co.,Ltd. Registration number: Y2021980000597 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| CP02 | Change in the address of a patent holder |
Address after: No.3, 3rd Street, aichayuan Road, Dalingshan Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN TONGKE ELECTRONIC Co.,Ltd. Address before: 523000 3rd floor, building B, No.3 Industrial Zone, Dalingshan Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN TONGKE ELECTRONIC Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |