JPH07335814A - Surface mount parts including semiconductor integrated circuit and fabrication thereof - Google Patents

Abstract

PURPOSE:To automatically correct mounting error upon melting a solder and hereby prevent exfoliation by providing independent larger joint parts of a minimum number joined with a wiring board not conducted and coupled with electrodes of an IC chip independently of a plurality of ultrafine joint parts. CONSTITUTION:An electrode of an IC chip 1 and a lead wire 2 comprising a conductive metal plate lead frame are conducted and coupled through wire bonding 3 and are packaged with sealing resin 4. Independently of a plurality of ultrafine outer leads 6 protruded outwardly of the package 5 from the lead 2 a die pad support lead 7 is formed into a gullwing and is protruded as independent large joint parts of a minimum number not conducted and coupled with the electrodes of the IC chip 1. Even when there is any mounting error, and even when there is slightly displaced connection surfaces of the independent large junction parts 34 of a minimum number independent of a solder paste 32 and a solder precoating 33 on the wiring board, the connection surface are large areas so that exfoliation is prevented and hence surface packaging parts are pulled nearer to the pad upon the solder being solidified for automatic correction of the mounting error.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board which is conductively connected to the electrodes of one or more IC chips (hereinafter abbreviated as IC chips) having a semiconductor integrated circuit built therein and which is projected outward. The present invention relates to a high-density surface mount component provided with an array of a plurality of extremely fine joints to be connected and a manufacturing method thereof.

[0002]

2. Description of the Related Art With the recent increase in the integration of semiconductor components on a printed wiring board (hereinafter abbreviated as a wiring board), the mounting method of a semiconductor package on a wiring board is such that a plurality of outer leads that are joints are used. From the lead insertion mounting method of inserting into the hole of the wiring board, the surface mounting method of directly connecting the joint portion to the pad (conductor pattern) formed on the surface of the wiring board is becoming mainstream.

As the IC package and the LSI package (hereinafter abbreviated as IC package) which are the surface mount components, SOP, SOJ, QFP, QFJ (PLC) are available.
C), TCP, PGA, LCC, module, hybrid IC, COB, etc. are typically known.

By the way, conventionally, a plurality of outer leads, which are conductively connected to the electrodes of the IC chip and project outwardly and which are to be connected to a wiring board, are connected at their tips by insulating connecting members. Connected to each other, the connecting members being immediately or other connecting members (bridges, frames, etc.)
In the IC chip main body or the package in which the main body is sealed via the IC chip and the surface mount component integrally connected (hereinafter, abbreviated as an integrally connected surface mount component), at a plurality of locations separated from the outer lead. In some cases, an independent bonding pad with a wiring board is formed, which is not electrically connected to the electrode of the IC chip. (JP-A-6-2934
(See 8)

Apart from the above, among the plurality of joints to be connected to the wiring board electrically connected to the electrodes of the IC chip, a very small number of joints have different connection areas with the wiring board. There is a surface mount component (hereinafter, abbreviated as a surface mount component having a conductive large joint) characterized in that the large joint is formed several times to several tens of times as large as the joint. (See patent application date, May 26, 1994)

[0006]

Recently, in particular, in response to market demands for electronic equipment such as lightness, thinness, shortness, high functionality, and multi-functionality,
LSIs, VLSIs, ULSI packages (hereinafter collectively referred to as IC packages) incorporating large-scale semiconductor integrated circuits have been developed, and high-density surface mounting is being performed.

In the high-density surface mounting, a plurality of joints to be connected to the wiring board have become increasingly narrower in connection pitch with the wiring board due to the increase in the number of pins.
QFP with a pitch of 5 mm and TCP with a pitch of 0.3 mm have been introduced, and the development of a high-density surface mounting technique for an even finer joint with a narrower pitch is underway.

However, there are many problems in high-density mounting. The plurality of joints are extremely fine, and the pad of the wiring board is also extremely fine, and a solder paste (cream-like) or a solder precoat (solidified after melting) which is a solder layer mounted on the pad. Is a very small amount and has a narrow pitch (an extremely narrow lead interval).

Therefore, even with a slight mounting error in the mounting machine, as shown in FIG.
Has a problem of falling off from the solder paste 32 or the solder precoat 33. Further, as shown in FIG. 12, the solder paste 32 has a problem such as a solder touch or a solder connection in the collapse of the solder paste 32 due to a mounting error, lead floating, or variation of pads on the wiring board.

After high-density surface mounting, the connection area with the wiring board is very small and the amount of solder is very small. Therefore, the connection strength is extremely low. Therefore, there is a problem of market complaints due to detachment of solder, which is vulnerable to shocks such as transportation and accidental fall.

Further, in the case of mounting a light and thin IC package without using TAB (a thermocompression mounting technique), when all the connection surfaces of the package body and the plurality of ultrafine joints are not flat, the package Due to insufficient weight of the main body, there is a problem that floating and deviation of each of the ultra-fine joints, and further, floating of the whole of the ultra-fine joints and poor solder connection due to inclination and the like occur. Even if the above-mentioned TAB is used, there are problems of mounting error and pad precision of the wiring board, and since the outer leads are thermocompression-bonded while they are detached, this is an even greater problem.

An object of the present invention is to connect the integrally mounted surface mount components or the conductive large joints when connecting the plurality of ultrafine joints having a narrow pitch to a wiring board. It is possible to provide a surface mount component that does not have the above-mentioned problem even if a means limited to the surface mount component has, and further corrects the mounting error automatically at the time of solder melting and enables accurate high-density surface mount. is there.

[0013]

In order to achieve the above object, in the surface mount component according to the present invention, in the other surface mount components other than the integrally connected ones, Separately from the joint portion, a small number of independent large joint portions which are not electrically connected to the electrodes of the IC chip and are to be joined to the wiring board (hereinafter abbreviated as independent small number of large joint portions). ) Is provided.

The small number of independent large junctions are
Depending on the type of the C package, the lead may be a lead frame made of a metal plate or a die pad support lead, a lead made of a metal foil or a bonding pad, or a pad lead described later. Alternatively, it is formed of a joint portion formed by a combination thereof.

The number of independent large number of large joints is several times to several tens of times larger than the area of connection with the wiring board, as compared with the plurality of extremely fine joints. The larger the connection area of the large joint portion, the better for the reason described below.

In reality, the number of the plurality of extremely fine joints is about 100 to 500, whereas the number of the extremely small number of large joints is about 4 to 8, which will be described later. The effect to do is demonstrated.

It is preferable that the dead space (a place that is not normally used) in the corner portion of the IC package is utilized to provide the independent small number of large joint portions at the corner portion or its periphery.

However, it is needless to say that the extremely small number of independent large-sized joints can be formed not only at the corners but also at optimum places as needed.

As the distance between the plurality of extremely fine joints becomes narrower, the die for punching the lead frame becomes more difficult, and it is preferable to form the metal foil by photo-etching or the like. It is preferable that the large joint portion and the plurality of ultrafine joint portions are simultaneously formed of the same material, for example, copper foil.

It is to be noted that each of the connection surfaces of the independent small number of large-sized joint portions with the wiring board is formed at the position facing each other so as to have the same shape and area as the opposite side of each pad surface on the wiring board. Is preferred. This is the reason why the mounting error described below is automatically corrected during solder melting.

[0021]

Since the surface mount component is constructed as described above, as shown in FIG. 13A, even if there is a mounting error in the mounting machine, the solder paste 3 on the wiring board 3
Even if the connection surface of the small number of independent large-sized joint portions 34 from the soldering precoat 33 or the solder precoat 33 slightly shifts, it does not fall off because it has a large area. Therefore, the connection surfaces of the plurality of extremely fine joint portions 6 also do not fall off. That is, this is because both the independent small number of large joint portions 34 and the plurality of ultrafine joint portions 6 are both supported by the package 5 or the frame 13 described later.

Since there is no drop-out problem as described above, even if the plurality of extremely fine joints 6 are completely separated from the pads 9 on the wiring board 8, the larger joints 34 are separated from each other. If there is no large mounting error, the above collapse problem does not occur, and solder connection is possible for automatic correction and positioning during solder melting described later.

Even in the event of a shock such as transportation or inadvertent drop, since the connection strength between the independent small number of large joints 34 and the wiring board is large, the upward and downward movement of the package body due to the shock is neglected. Therefore, the very small number of the large number of large joint portions 34 which are independent from each other are not separated. Therefore package 5
Alternatively, since it is supported by the frame 13, a shock given to the plurality of ultra-fine joints 6 can be neglected and there is no problem, and the occurrence of defective solder detachment is prevented.

As shown in FIG. 13B, the solder paste 3
2, when the independent small number of large joints 34 are connected, the entire surface mount component is placed on the wiring board 8 in a process in which the volume of the solder paste 32 is halved when it solidifies during melting by reflow processing. Since it has the effect of attracting to the pad 9, even if the flatness of the surface mounting component body (package) or the connecting surfaces of the joints is not maintained, the connecting surfaces of the independent small number of large joints 34 are Since it is large, it is forcibly drawn to the pad 9 on the wiring board 8, and solder connection progresses in a chain manner between adjacent ultrafine joints 6 (not shown), and finally all joints are connected. Therefore, it is possible to prevent the occurrence of connection failure. However, this force cannot be exerted only with an extremely fine joint as in the conventional case without a large joint. Further, as shown in FIG. 13A, even when the connecting surface of one of the large joints 34 is floated (inclined) from the solder paste 32 as shown by the arrow C, the chain connection causes The floating interval shown by the arrow C also becomes narrower, and as shown by the arrow D in FIG. 13 (b), together with the amount that the center rises up, finally all the joints are soldered. The solder paste 32 on the pad 9 of the wiring board 8 facing the connection surface of the large joint 34 does not have to be mounted on the entire surface, and the area may be slightly reduced and the same height may be mounted. it can. In this case, the entire surface mount component is further lowered by the amount of reduction, and the wiring board 8
It exerts the effect of forcibly drawing to the pad 9.

[0025]

As shown in FIG. 13 (b), when the solder paste 32 is further melted by the reflow process, the center of gravity is gathered at the center D as shown by the arrow D, and there is a characteristic that it attracts. Even when the surface-mounted component is displaced from the predetermined mounting position, the displacement is corrected in the direction E as indicated by the arrow E, that is, the connection surface of the large joint 34 is forced to the center of the pad 9 on the wiring board 8. In the direction to match
It exerts the effect of attracting the entire surface mount component. Therefore, even if the connection surface of each ultra-fine joint portion 6 is completely separated from the pad of the wiring board, the connection surface is accurately positioned on the corresponding solder layer, without causing connection deviation.
It will be soldered securely. Incidentally, if the connection area of the large joint portion was sufficiently large by utilizing the dead space of the corner portion, the above-mentioned effect was sufficiently obtained even at the four experimental results. Therefore, it is possible to form as many as possible the above-mentioned ultrafine junctions at high density.

As described above, the surface mounting component of the present invention is characterized in that the connecting surface of the independent small number of large joints has an extremely large area. By effectively utilizing it, even in high-density surface mounting, the above problems can be solved and soldering can be performed accurately. When the frame 13 as the insulating connecting member is used in combination with the present invention, the outer leads as the ultra-fine joints have stable flatness due to the support of the frame 13, and the effect of the present invention is further enhanced. Exerts.

Conventionally, the arrangement of the very small number of large joints electrically connected to the electrodes of the IC chip is limited because they are electrically connected. In addition, since the solder flows out to the conductive connection lead during melting, it is necessary to previously prepare a solder insulating film (solder resist) in order to automatically correct the solder. In this case, the cost will increase. Therefore, since the independent small number of large joints are independent, there is an advantage that there is no problem of the arrangement limitation or solder resist on the conductive connection lead.

In the surface mount component of the present invention, since there is no drop-out problem due to the mounting error, the plurality of extremely fine outer leads are not separated from the solder layer on the wiring board,
If it is slightly displaced, it can be used in TAB mounting by thermocompression bonding. In addition, even if the pads on the wiring board are inaccurate and there are slight variations, the package is moved to the optimum midpoint position and soldered in a fuzzy (FUZZY) mode, enabling reliable surface mounting. is there.

[0029]

EXAMPLES Examples will be described with reference to the drawings.
In the embodiment shown in FIG. 1, the electrodes of the IC chip 1 and the leads 2 made of a lead frame made of a conductive metal plate are conductively connected by wire bonding 3, and a package 5 is formed by a sealing resin 4.
In addition to the plurality of extremely fine outer leads 6 projecting from the leads 2 to the outside of the package 5, a small number of independent large joints that are not electrically connected to the electrodes of the IC chip 1 are provided. The die pad support lead 7 is a surface mounted component of the QFP type of the present invention in which the die pad support lead 7 is protruded to the outside of the package 5. The outer lead 6 and the die pad support lead 7 are each formed into a gull wing type (bending process).

While melting through the solder layer 10 mounted on the pad 9 on the wiring board 8, a very small number of die pad support leads 7 which are independent of the plurality of extremely fine outer leads 6 and are connected to the wiring board. It is soldered to the pad 9 on 8 and is surface-mounted.

The die pad support leads 7 are not cut out at the corners of the conventional package 5 and do not project outside the package 5, and are not connected to the pads 9 on the wiring board 8. Therefore, the die pad support lead 7 according to the present invention
Is not cut at the corners of the package 5, but is projected outward and is formed into a gull wing shape for solder connection with the pad of the wiring board.

In the embodiment shown in FIG. 2, the outer lead 6 and the die pad support lead 7 are surface-mounted components in another embodiment of the QFP type in which the outer lead 6 and the die pad support lead 7 are not formed. As shown in FIG. 2B, the convex portion of the package 5 is dropped (inserted) and solder-connected to the multilayer wiring board 11 having a concave portion to be surface-mounted. It is needless to say that a wiring board having a cavity may be used instead of the multilayer wiring board 11 having a recess.

In the embodiment shown in FIG. 3, the outer lead 6 and the die pad support lead 7 are formed after being packaged 5 with an encapsulating resin with the same internal structure as the QFP.
As shown in FIG. 3 (b), each of them is a QFJ type surface-mounted component of the present invention formed into a J type.

In the embodiment shown in FIG. 4, a copper foil (metal foil) lead 2 formed by photoetching or the like on a package 5 which is an electrically insulating film and an electrode of the IC chip 1 are bumps 12 which are a bonding layer. Outer leads 6 made of a plurality of extremely fine copper foils, which are electrically connected to each other via a cable, are fixed by a sealing resin 4, and project from the leads 2 to the outside of the package 5.
A frame 13, which is an electrically insulating connecting member, is attached to the tip of the frame. Further, in the frame 13, I
It is a TCP type surface mount component of the present invention, which is provided with respective bonding pads 14 which are a very small number of independent large bonding portions which are not electrically connected to the C chip 1.

It should be noted that it is possible to provide the bonding pads 15 and 16 that are a very small number of independent large bonding portions, which are not conductively connected to the IC chip 1, at the corners of the package 5 in various shapes. It is an example shown.

Pad 9 on multilayer wiring board 11 having a recess
A plurality of extremely fine outer leads 6 are connected to any one of the independent bonding pads 14, 15 and 16 which are a very small number of large bonding portions via the solder layer 10 mounted on the surface mounting. The pattern 50 on the multilayer wiring board 11 facing the package 5 is used for other purposes as in the conventional case.

FIG. 5 (a) shows the independent small number of large joints on the lower surface of the frame 13 attached to the tip of the outer fine outer lead 6, that is, the surface facing the wiring board. A certain bonding pad 17 is formed. Furthermore, the outer lead 6 is formed as shown in FIG. 5 (b) and is mounted on the surface of the wiring board in the TCP type. Further, an embodiment is shown in which the reinforcing material 90 can be attached to the upper surfaces of the package 5 and the frame 13. Incidentally, the illustration in which the reinforcing material 90 is replaced with the package 5 and the frame 13 is omitted.

The frame 13 can be separately formed and attached, but as shown in FIG. 8, the outer lead 6 and the independent pad 14 are formed by partially modifying the conventional TCP manufacturing process. It is preferable that they are simultaneously formed. That is, the portion corresponding to the frame 13 can be left and cut along the broken lines A and B in the figure to form the above simultaneously.

In the embodiment shown in FIG. 6, the plurality of extremely fine outer leads 60 projecting outward from the package 5 are formed to be extremely short (about 50 to 100 μ) and project. Furthermore, it is still another embodiment of the TCP type surface mount component of the present invention in which the bonding pads 18 to 20 which are the independent large joints are provided at the corners of the package 5. Note that the pad 20 is an embodiment showing that it can be divided into a plurality of pieces in one place.

In the pad lead 21, the bonding pads, which are the small number of independent large-sized bonding portions arranged at the corners of the package 5, partially protrude outside the package 5 and are projected in a very short and small size. FIG. 9 shows an example of yet another surface mount component of the present invention of TCP type.

The protruding portion of the outer lead 60 and the bonding pad lead 21 which are extremely small and small protruding outwardly of the package 5 are also very short and short. This is because the outer lead is cut when it is cut as a conventional outer lead. The longer the length, the higher the floating and the greater the variation such as open (uneven lead intervals). Therefore, as the length is made extremely short, one side of the outer lead 60 is supported by the package 5, and thus the variation is less likely to occur.

The outer lead 60 and the pad lead 2
Even if the protruding portion of 1 is extremely small (about 50 to 100 μ), the appearance camera inspection for solder joint confirmation can be performed, there is no fear of the joint strength, and the area occupied by the entire surface mount component is small. There are advantages. Therefore, reliable and stable surface mounting can be performed without the frame 13. Further, it is preferable to provide a solder resist 22 on the ultrafine lead 2.

In the embodiment shown in FIG. 7, a plurality of IC chips 1 and a plurality of other electronic components 70 are mounted, and an insulating connection is attached to the tip ends of a plurality of ultrafine outer leads 6. A modular type surface mount component of the present invention is shown in which a frame 17, which is a member, is provided with a pad 17 that is a very small number of independent large joints on a surface facing a wiring board. Incidentally, it goes without saying that a hybrid IC in which the plurality of IC chips 1 and the entire electronic component 70 are collectively resin-sealed and packaged can be similarly applied (not shown).

The solder layer 10 on the wiring board 8, the leads 6 and the pads 17 are connected to each other and surface-mounted.

FIG. 8 shows a conventional TCP in which an outer window 80 is punched out, by cutting along the broken lines A and B in the figure to form the plurality of extremely fine outer leads 6 and the independent minute numbers. This is an embodiment showing a manufacturing method capable of simultaneously forming the pad 14 which is a large joint portion, and further the frame 13 and the like. Of course, in this same manufacturing method, it is of course possible to simultaneously form and manufacture the TCP type surface mount components of various embodiments of the present invention shown in FIGS. 4 to 7, and various independent pads and manufacturing methods of various shapes. The drawings and description in FIG.

In FIG. 9, a package 23 accommodating an IC chip is provided, and a plurality of non-leads 24, which are electrically connected (not shown) to the electrodes of the IC chip and are provided on the side surface of the package 23, Back side 2 of package 23
5, that is, apart from a plurality of extremely fine pads 26 that are provided on the surface facing the wiring board and are conductively connected, as a small number of independent large joints that are not conductively connected to the electrodes of the IC chip. LCC with pad 27 formed
(QFN) type It is an example of the surface mount component of the present invention.

In FIG. 10, there is shown a package 28 in which an IC chip is housed, which is electrically connected (not shown) to the electrodes of the IC chip, and the back surface 2 of the package 28.
9, that is, the pad 31 which is a very small number of independent large-joint portions which are not conductively connected to the electrodes of the IC chip, apart from the plurality of ultra-fine joining terminals 30 protruding on the surface facing the wiring board. It is an example of the surface mount component of the present invention formed PGA type.

In the description of the above embodiment, FIGS.
In the above, the plurality of ultrafine outer leads 6 except for the ultrafine short outer leads 60, the IC chip 1, the leads 2, the sealing resin 4, the package 5, and the frame 13 are abbreviated as the same symbols.

The base material of the TCP type package 5 or the frame 13 of the present invention does not have to be a conventional soft film and may be made of any suitable material. For example, a hard glass base material may not be used. It is also preferable for maintaining flatness.

TC composed of a soft film base material
P type Package 5 and frame 1 of the surface mount component of the present invention
In order to maintain the flatness of each of the upper surface and the lower surface of 3, it is possible to attach a hard glass base material or the like as the reinforcing material 90 to each. Incidentally, when the reinforcing material 90 is disposed on the surface (lower surface) facing the wiring board, it is of course possible to provide the reinforcing material 90 with the independent large joint portion.

Conventionally, the tips of the fine outer leads protruding outward from the package are usually cut and soldered (bonded) to the pads on the wiring board via the solder layer. Each of the cut outer leads (copper foil leads if finer) is a light foil and has a weak hardness, so that the upper and lower floats individually, or variations in openness (inconsistency between adjacent intervals) occur. Even more so when it comes to forming leads. In the case of a narrow pitch, the height of the solder layer is also very small, so that solder connection failure will occur even with the slight variations. Therefore, since the above-mentioned variations are prevented and the hardness of the light foil is weak, the tip of each outer lead should be attached to the frame 13
This is the reason for adopting it in order to hold it down.

Even if each variation is suppressed, it is not 100% perfect. That is, there is a problem that the frame 13 is slightly inclined and the entire package is made of a light foil, and the weight is insufficient, so that it slightly floats from the pad on the wiring board. In addition, there are problems of mounting error of the mounting machine and pad precision of the wiring board. Further, there is a problem that the solder paste may fall off from the solder layer or the solder paste may collapse, resulting in poor solder connection with a wiring board in high-density mounting. In TAB mounting by thermocompression bonding, the problem is even greater.

The surface mount component of the present invention does not have the above problem. Although the examples are listed above, in any case, a lead, a pad, a pad lead, or the like, which is a very small number of independent large junctions which are not conductively connected to the electrodes of one or more chips containing a semiconductor integrated circuit, etc. Is an extreme feature that it has such a large area that the connection area with the wiring board is incomparable compared to the other plurality of extremely fine joints. It goes without saying that the configuration of each part in the embodiment can be adopted as much as possible in any package of the surface mount component of the present invention.

The above description of the embodiments is for explaining the present invention, and other embodiments such as IC packages and the arrangement of the very small number of large joints are not limited to the corners but also to the central portion. Examples of other arrangements or various shapes such as a star shape, or examples of the lead having a large number of independent small junctions are omitted. It should not be construed as limiting the invention or limiting the scope of the invention. Further, the configuration of each part of the present invention is not limited to the above embodiment,
It goes without saying that various changes can be made within the technical scope described in the claims.

For example, the present invention is a hybrid I packaged together with electronic components other than SOP, SOJ and IC chips (including LSI, VLSI, ULSI chips, etc.).
Even C is applicable. It is also possible to apply the configuration example of the present invention to the IC chip body. That is, the IC
COB (Chip On Bo) for surface-mounting the chip body on the surface-mounting substrate, which is the base material of the package, or the wiring board.
It is also applicable to the surface mount component of the present invention.

[Brief description of drawings]

FIG. 1A is a plan view of a QFP type surface mount component according to the present invention. (B) It is a fracture | rupture front view which shows the mounting example of this surface mount component. (C) It is a perspective view in a partially broken cross section of the surface mount component.

FIG. 2A is a plan view of another embodiment of the QFP type surface mount device according to the present invention. (B) It is a fracture | rupture front view which shows the mounting example of this surface mount component.

FIG. 3A is a plan view of a PLCC (QFJ) type surface mount component according to the present invention. (B) It is a fracture | rupture front view of this surface mount component.

FIG. 4A is a TCP type surface mount component according to the present invention. (B) It is a partially broken front view showing a mounting example of the surface mount component.

5 (a) is a perspective view showing a main part of the insulating frame 13 according to the present invention. FIG. (B) Using the insulating frame 13, and further a reinforcing material 9
It is a partially broken front view showing a mounting example of another TCP type surface mount component according to the present invention to which 0 is attached.

FIG. 6A is a plan view of still another TCP type surface mount component according to the present invention. (B) It is a partially broken front view showing a mounting example of the surface mount component.

FIG. 7 (a) is a partial plan view showing a main part of the module-type surface mount component according to the present invention. (B) It is a fracture | rupture front view which shows the mounting example of this surface mount component.

FIG. 8 is a perspective view showing a method of manufacturing a TCP type surface mount component according to the present invention.

FIG. 9 is a plan view and a cutaway front view of an LCC (QFN) type surface mount component according to the present invention.

FIG. 10 is a plan view and a cutaway front view of a PGA type surface mount component according to the present invention.

FIG. 11 is a partial cross-sectional view showing a main part for explaining a problem in the conventional surface mounting method.

FIG. 12 is a partial cross-sectional view showing a main part for explaining still another problem in the conventional surface mounting method.

FIG. 13 is a partial cross-sectional view showing the main parts for explaining the operation and effect in the surface mounting method of the surface mounting component according to the present invention.

[Explanation of symbols]

1 IC chip 5, 23, 25, 28, 29 Package 6 Ultrafine outer lead 7 Die pad support lead (not electrically connected to the electrode of the IC chip) 13 as an independent large joint 13 Insulating frame 14 to 20, 27 , 31 Bonding pad as an independent large bonding portion 21 Bonding pad lead as an independent large bonding portion 26 Ultrafine bonding pad 30 Ultrafine bonding terminal 60 Ultrafine short and small outer lead 90 Reinforcing material

Claims (12)

[Claims] 1. An array of a plurality of extremely fine joints to be connected to a wiring board, which are conductively connected to electrodes of one or more IC chips containing a semiconductor integrated circuit and project outwardly. Among the types of surface mount components provided with, the outer leads as the plurality of ultra-fine joints are connected at their tips to each other by an insulating connecting member, and the connecting member is directly or The surface mount component other than those integrally connected to the chip body or the package in which the body is sealed via the connecting member of, separately from the plurality of ultrafine joints. A surface mount component, characterized in that a very small number of independent large joints which are not electrically connected to the electrodes of the IC chip and are to be joined to a wiring board are provided. 2. The surface mount component according to claim 1, wherein the very small number of independent large joints are leads or a die pad support made of a lead frame made of a metal plate. 3. The surface mount component according to claim 1, wherein the very small number of independent large joints are leads or joint pads made of metal foil. 4. The surface mount component according to claim 1, wherein the extremely small number of independent large joints are formed and combined with any one of the large joints according to claim 2 or 3. 5. The bonding pad, which is a very small number of independent large bonding portions, is provided on the surface of the IC chip body or the package sealing the body facing the wiring board. Item 5. The surface mount component according to item 4. 6. The outer leads as the plurality of ultra-fine joints are surface-mounted components whose tip ends are connected to a frame 13 which is an insulating connecting member, and are independent of the frame 13. The surface mount component according to claim 1, further comprising a bonding pad that is a very small number of large bonding portions. 7. The package and the frame 13 are provided with an insulating reinforcing material 90, and the reinforcing material 90 is provided with the independent small number of large joint portions. The surface mount component according to claim 6. 8. The independent very small number of pads independent of the pads 26 as the plurality of ultrafine bonding parts that are conductively connected to the electrodes of the IC chip via the non-leads 24 provided on the side surface of the package. The surface-mounted component according to claim 1, wherein a bonding pad 27 is provided as a large bonding portion of. 9. In addition to the bonding terminals 30 as the plurality of ultrafine bonding portions provided on the surface of the package facing the wiring board, the bonding terminals as the independent small number of large bonding portions. The surface mount component according to claim 1, wherein a pad 31 is provided. 10. The surface according to claim 1, wherein the bonding pads as the independent small number of large-sized joints are formed in a plurality of large-joint portions in one place. Mounting parts. 11. The small number of independent pads as large joints protrude from the package or the frame 13 toward the outside, and are provided with protruding pad leads 21. Claims 1 to 1
The surface mount component described in 0. 12. The frame 13 as the insulating connecting member is formed separately, and the frame 1 is not attached.
The method according to claim 6 or 10, wherein a part corresponding to No. 3 is left, a part of the conventional TCP manufacturing process is changed, and the TCP is cut along the broken lines A and B shown in FIG. Or 1
1. The surface mount component according to 1 and a method for manufacturing the same.