CN105436825A - Manufacturing method of LED constant current source driving circuit module - Google Patents
Manufacturing method of LED constant current source driving circuit module Download PDFInfo
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- CN105436825A CN105436825A CN201510845872.2A CN201510845872A CN105436825A CN 105436825 A CN105436825 A CN 105436825A CN 201510845872 A CN201510845872 A CN 201510845872A CN 105436825 A CN105436825 A CN 105436825A
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- circuit board
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- current source
- constant current
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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Abstract
A manufacturing method of an LED constant current source driving circuit module comprises a shell, a cover plate, a circuit board and a lead, and further comprises the following steps: 1) processing and manufacturing the circuit board; 2) processing and manufacturing the shell and the cover plate; 3) cleaning the circuit board and the shell; 4) pre-coating tin on the bottom surface of the cavity of the shell; 5) solder on a pad of the circuit board; 6) mounting components; 7) welding the circuit board and the shell in a large area and welding components; 8) the circuit board is welded with the lead; 9) cleaning pollutants generated by welding; 10) and (7) sealing the cover. The product has good heat dispersion and high reliability; the product has small volume, is packaged by all metals and has good electromagnetic compatibility; the manufacturing method is simple to operate and can be used for batch production.
Description
Technical field
The invention belongs to power supply product technical field, particularly constant-current source actuation techniques field, be mainly used in LED illumination industry, is a kind of broad-spectrum circuit module.
Background technology
Along with the fast development of electronic product, energy-conservationly become instantly very popular topic.In this context, LED industry is developed rapidly, and comprises the industries such as civilian and military illumination.
Do you how to guarantee that LED normally, stably works?
Constant current source driving circuit is that the problems referred to above provide answer, along with the continuous progress of science and technology, constantly proposes new, higher requirement to the design of constant current source driving circuit and the production process of product.
Summary of the invention
According to above-mentioned requirements, the object of this invention is to provide a kind of preparation method of LED constant current source drive circuit module, product circuit, structural design are combined closely, for a kind ofly having better electromagnetic compatibility characteristic, the mass of LED constant current source drive circuit module of good heat radiating characteristic provides powerful guarantee.
For achieving the above object, the present invention is realized by following technological means:
A preparation method for LED constant current source drive circuit module, is characterized in that: comprise shell, cover plate, circuit board, wire, further comprising the steps of:
1) processing and fabricating of circuit board;
2) processing and fabricating of shell and cover plate;
3) cleaning circuit plate and shell;
4) the pre-coated tin in enclosure cavity bottom surface;
5) solder on the pad of circuit board;
6) components and parts attachment;
7) circuit board welds with shell large area and components and parts weld;
8) circuit board and wire bonds;
9) pollutant that welding produces cleans;
10) capping.
Further:
Described step 1) comprises, and according to the PCB domain of circuit board, utilizes DBC process for manufacturing circuit board to complete the processing of ceramic copper-clad DBC circuit board.
Described step 2) comprise, select can valve nickel-plated metal as shell and cover plate materials, according to the structure chart of shell and cover plate, complete structural member processing.
Described step 3) comprise, DBC circuit board and shell are divided to open into and fill in the container of alcohol, scrub DBC circuit board and shell respectively with brush pen, then put into baking oven and toast, temperature is set to 100 ~ 120 DEG C, 5 ~ 20 minutes time.
Described step 4) comprise,
41) selecting fusing point to be 183 DEG C of compositions is the scolding tin of Pb37Sn63;
42) be positioned on heating platform by shell, the temperature of heating platform is set to 230 DEG C ~ 250 DEG C, preheating 3 ~ 5 minutes;
43) temperature of electric iron is set to 350 ~ 450 DEG C, the type of splitting selected by solder horn, guarantees that solder horn and surface of shell have sufficient contact surface;
44) at enclosure cavity bottom surface coating scaling powder, on housing, Xi Chu places solder, and utilize solder horn to heat 10 ~ 20 seconds on upper tin face, the activation rapidly along a direction by scaling powder completes tin process on the surface fast;
45) utilize suction tin rope to remove solder unnecessary on upper tin face, desheathing from heating platform, completes whole pre-coated tin process.
Described step 5) comprise,
51) select fusing point to be 183 DEG C, composition is the solder(ing) paste of Pb37Sn63;
52) silk-screen soldering paste is carried out by means of the weld of frock screen printing net plate to DBC back of circuit board, front components and parts;
53) the DBC circuit board of soldering paste is had by silk-screen to be positioned in shell.
Described step 6) comprise, according to circuits assembly figure, components and parts drawing being marked with C1, C2, R1, U1, D1, Q1, L1 are positioned on the DBC circuit board in shell one by one.
Described step 7) comprise,
71) prepare two heating platforms, the temperature of is set to 210 DEG C ~ 220 DEG C, and other one is set to 120 DEG C ~ 150 DEG C;
72) by step 6) in the shell mounting first device DBC circuit board that is equipped be positioned on the heating platform of 210 DEG C ~ 220 DEG C;
73) observe welding process, when solder paste melts, DBC circuit board is also ajusted eventually to utilize tweezers " to rub pressure " back and forth, and components and parts occur that the tweezers that also utilize of skew are ajusted;
74) by step 73) module that obtains takes off from the heating platform of 210 DEG C ~ 220 DEG C, is positioned on the heating platform of 120 DEG C ~ 150 DEG C.
Described step 8) comprise, the temperature of electric iron is set to 300 ~ 400 DEG C, on the heating platform of 120 DEG C ~ 150 DEG C, according to installation diagram requirement, utilizes " hook weldering " technique to complete DBC circuit board and weld with " the bridge line " of wire.
Described step 10) comprise, adopt parallel seam welding technique to carry out soldering and sealing housing and cover plate.
The invention has the beneficial effects as follows: product perfect heat-dissipating, highly reliable; Small product size is little, metal package, and electromagnetic compatibility characteristic is good; Preparation method is simple to operate, can mass production.
Accompanying drawing explanation
Fig. 1 is the LED constant current source drive circuit module schematic diagram that the present invention relates to; Fig. 2 is the LED constant current source drive circuit module outer casing construction drawing that the present invention relates to, and wherein, (1) is front view, and (2) are left view; Fig. 3 is the LED constant current source drive circuit module covering plate structure figure that the present invention relates to, and wherein, (1) is front view, and (2) are top view; Fig. 4 is the LED constant current source drive circuit module circuit board figure that the present invention relates to, and wherein, (1) is the back side, and (2) are front; Fig. 5 is the LED constant current source drive circuit module assembling schematic diagram that the present invention relates to.
Detailed description of the invention
Below in conjunction with Figure of description, the present invention is further illustrated.
A preparation method for LED constant current source drive circuit module, is characterized in that: comprise shell 1, cover plate 2, circuit board 3, wire 4, further comprising the steps of:
1) processing and fabricating of circuit board 3;
2) processing and fabricating of shell 1 and cover plate 2;
3) cleaning circuit plate 3 and shell 1;
4) the pre-coated tin in shell 1 cavity bottom surface;
5) solder on the pad of circuit board 3;
6) components and parts attachment;
7) circuit board 3 welds with shell 1 large area and components and parts weld;
8) circuit board 3 welds with wire 4;
9) pollutant that welding produces cleans;
10) capping.
Further:
Described step 1) comprises, and according to the PCB domain of circuit board 3, utilizes DBC process for manufacturing circuit board to complete the processing of ceramic copper-clad DBC circuit board 3.Compared with the circuit board of traditional F R-4, the perfect heat-dissipating of this circuit board; Simultaneously compared with thick film circuit board, this circuit board processing cost is low.
Described step 2) comprise, select can valve nickel-plated metal as shell 1 and cover plate 2 material, according to the structure chart of shell 1 and cover plate 2, complete structural member processing.
Described step 3) comprise, DBC circuit board 3 and 1 point, shell being opened into fills in the container of alcohol, scrubs respectively, then put into baking oven and toast with fine arts brush pen to DBC circuit board 3 and shell 1, temperature is set to 100 ~ 120 DEG C, 5 ~ 20 minutes time.
Described step 4) comprise,
41) selecting fusing point to be 183 DEG C of compositions is the scolding tin of Pb37Sn63;
42) be positioned on heating platform by shell 1, the temperature of heating platform is set to 230 DEG C ~ 250 DEG C, preheating 3 ~ 5 minutes;
43) temperature of electric iron is set to 350 ~ 450 DEG C, the type of splitting selected by solder horn, guarantees that solder horn and surface of shell have sufficient contact surface;
44) at shell 1 cavity bottom surface coating scaling powder, on housing, Xi Chu places solder, and utilize solder horn to heat 10 ~ 20 seconds on upper tin face, the activation rapidly along a direction by scaling powder completes tin process on the surface fast;
45) utilize suction tin rope to remove solder unnecessary on upper tin face, desheathing 1 from heating platform, completes whole pre-coated tin process.
Described step 5) comprise,
51) select fusing point to be 183 DEG C, composition is the solder(ing) paste of Pb37Sn63;
52) silk-screen soldering paste is carried out by means of the weld of frock screen printing net plate to DBC circuit board 3 back side, front components and parts;
53) the DBC circuit board 3 of soldering paste is had by silk-screen to be positioned in shell 1.
Described step 6) comprise, according to circuits assembly figure, components and parts drawing being marked with C1, C2, R1, U1, D1, Q1, L1 are positioned on the DBC circuit board 3 in shell one by one.
Described step 7) comprise,
71) prepare two heating platforms, the temperature of is set to 210 DEG C ~ 220 DEG C, and other one is set to 120 DEG C ~ 150 DEG C;
72) by step 6) in the shell 1 mounting first device DBC circuit board 3 that is equipped be positioned on the heating platform of 210 DEG C ~ 220 DEG C;
73) observe welding process, when solder paste melts, DBC circuit board 3 is also ajusted eventually to utilize tweezers " to rub pressure " back and forth, and components and parts occur that the tweezers that also utilize of skew are ajusted;
74) by step 73) module that obtains takes off from the heating platform of 210 DEG C ~ 220 DEG C, is positioned on the heating platform of 120 DEG C ~ 150 DEG C.
Described step 8) comprise, the temperature of electric iron is set to 300 ~ 400 DEG C, on the heating platform of 120 DEG C ~ 150 DEG C, according to installation diagram requirement, utilizes " hook weldering " technique to complete DBC circuit board 3 and weld with " the bridge line " of wire 4.
Described step 10) comprise, adopt parallel seam welding technique to carry out soldering and sealing housing 1 and cover plate 2.This shell 1 adopts parallel seam welding technique to carry out soldering and sealing with cover plate 2, shell 1 has four lead-in wires be utilize glass sintering to fix, considers that there is welding requirements in the housing later stage, shell 1 and cover plate 2 all Nickel Plating Treatment; Shell 1 and cover plate 2 can external coordination customized in the producer making parallel seam welding housing specially.
More than show and describe general principle of the present invention, principal character and advantage.The technical staff of the industry should understand; the design is not restricted to the described embodiments; the principle that the design is just described described in above-described embodiment and description; under the prerequisite not departing from the design's spirit and scope; the design also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the design.The claimed scope of the design is defined by appending claims and equivalent thereof.
Claims (10)
1. a preparation method for LED constant current source drive circuit module, is characterized in that: comprise shell, cover plate, circuit board, wire, further comprising the steps of:
1) processing and fabricating of circuit board;
2) processing and fabricating of shell and cover plate;
3) cleaning circuit plate and shell;
4) the pre-coated tin in enclosure cavity bottom surface;
5) solder on the pad of circuit board;
6) components and parts attachment;
7) circuit board welds with shell large area and components and parts weld;
8) circuit board and wire bonds;
9) pollutant that welding produces cleans;
10) capping.
2. the preparation method of a kind of LED constant current source drive circuit module as claimed in claim 1, is characterized in that: described step 1) comprises, and according to the PCB domain of circuit board, utilizes DBC process for manufacturing circuit board to complete the processing of ceramic copper-clad DBC circuit board.
3. the preparation method of a kind of LED constant current source drive circuit module as claimed in claim 1, it is characterized in that: described step 2) comprise, select can valve nickel-plated metal as shell and cover plate materials, according to the structure chart of shell and cover plate, complete structural member processing.
4. the preparation method of a kind of LED constant current source drive circuit module as claimed in claim 1, it is characterized in that: described step 3) comprise, DBC circuit board and shell being divided to open into fills in the container of alcohol, respectively DBC circuit board and shell are scrubbed with brush pen, then put into baking oven to toast, temperature is set to 100 ~ 120 DEG C, 5 ~ 20 minutes time.
5. the preparation method of a kind of LED constant current source drive circuit module as claimed in claim 1, is characterized in that: described step 4) comprise,
41) selecting fusing point to be 183 DEG C of compositions is the scolding tin of Pb37Sn63;
42) be positioned on heating platform by shell, the temperature of heating platform is set to 230 DEG C ~ 250 DEG C, preheating 3 ~ 5 minutes;
43) temperature of electric iron is set to 350 ~ 450 DEG C, the type of splitting selected by solder horn, guarantees that solder horn and surface of shell have sufficient contact surface;
44) at enclosure cavity bottom surface coating scaling powder, on housing, Xi Chu places solder, and utilize solder horn to heat 10 ~ 20 seconds on upper tin face, the activation rapidly along a direction by scaling powder completes tin process on the surface fast;
45) utilize suction tin rope to remove solder unnecessary on upper tin face, desheathing from heating platform, completes whole pre-coated tin process.
6. the preparation method of a kind of LED constant current source drive circuit module as claimed in claim 1, is characterized in that: described step 5) comprise,
51) select fusing point to be 183 DEG C, composition is the solder(ing) paste of Pb37Sn63;
52) silk-screen soldering paste is carried out by means of the weld of frock screen printing net plate to DBC back of circuit board, front components and parts;
53) the DBC circuit board of soldering paste is had by silk-screen to be positioned in shell.
7. the preparation method of a kind of LED constant current source drive circuit module as claimed in claim 1, it is characterized in that: described step 6) comprise, according to circuits assembly figure, components and parts drawing being marked with C1, C2, R1, U1, D1, Q1, L1 are positioned on the DBC circuit board in shell one by one.
8. the preparation method of a kind of LED constant current source drive circuit module as claimed in claim 1, is characterized in that: described step 7) comprise,
71) prepare two heating platforms, the temperature of is set to 210 DEG C ~ 220 DEG C, and other one is set to 120 DEG C ~ 150 DEG C;
72) by step 6) in the shell mounting first device DBC circuit board that is equipped be positioned on the heating platform of 210 DEG C ~ 220 DEG C;
73) observe welding process, when solder paste melts, DBC circuit board is also ajusted eventually to utilize tweezers " to rub pressure " back and forth, and components and parts occur that the tweezers that also utilize of skew are ajusted;
74) by step 73) module that obtains takes off from the heating platform of 210 DEG C ~ 220 DEG C, is positioned on the heating platform of 120 DEG C ~ 150 DEG C.
9. the preparation method of a kind of LED constant current source drive circuit module as claimed in claim 1, it is characterized in that: described step 8) comprise, the temperature of electric iron is set to 300 ~ 400 DEG C, on the heating platform of 120 DEG C ~ 150 DEG C, according to installation diagram requirement, utilize " hook weldering " technique to complete DBC circuit board and weld with " the bridge line " of wire.
10. the preparation method of a kind of LED constant current source drive circuit module as claimed in claim 1, is characterized in that: described step 10) comprise, adopt parallel seam welding technique to carry out soldering and sealing housing and cover plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510845872.2A CN105436825B (en) | 2015-11-26 | 2015-11-26 | Manufacturing method of LED constant current source driving circuit module |
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| CN201510845872.2A CN105436825B (en) | 2015-11-26 | 2015-11-26 | Manufacturing method of LED constant current source driving circuit module |
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| CN105436825B CN105436825B (en) | 2017-09-29 |
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| CN106017602A (en) * | 2016-06-20 | 2016-10-12 | 安徽华东光电技术研究所 | Manufacturing method of liquid level sensor |
| CN107498126A (en) * | 2017-06-26 | 2017-12-22 | 安徽华东光电技术研究所 | Method for enameling tin on deep cavity or narrow cavity |
| CN109688725A (en) * | 2018-12-10 | 2019-04-26 | 安徽华东光电技术研究所有限公司 | The production method of K1 audio range frequency source module |
| CN110213925A (en) * | 2019-06-04 | 2019-09-06 | 安徽华东光电技术研究所有限公司 | A kind of frequency pressure conversion module production method and its frequency pressure conversion module |
| CN113808964A (en) * | 2021-09-23 | 2021-12-17 | 华东光电集成器件研究所 | Heterogeneous eutectic method based on small size of multiple chips |
| CN116197477A (en) * | 2023-03-22 | 2023-06-02 | 北京中科飞鸿科技股份有限公司 | Method and device for assembling circuit board |
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| CN110767645A (en) * | 2019-10-25 | 2020-02-07 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Hybrid integrated circuit module and manufacturing method thereof |
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| CN113808964A (en) * | 2021-09-23 | 2021-12-17 | 华东光电集成器件研究所 | Heterogeneous eutectic method based on small size of multiple chips |
| CN113808964B (en) * | 2021-09-23 | 2024-04-26 | 华东光电集成器件研究所 | Heterogeneous eutectic method based on multiple chips and small size |
| CN116197477A (en) * | 2023-03-22 | 2023-06-02 | 北京中科飞鸿科技股份有限公司 | Method and device for assembling circuit board |
| CN116197477B (en) * | 2023-03-22 | 2024-08-09 | 北京中科飞鸿科技股份有限公司 | Method and device for assembling circuit board |
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