CN107498126A - Method for enameling tin on deep cavity or narrow cavity - Google Patents
Method for enameling tin on deep cavity or narrow cavity Download PDFInfo
- Publication number
- CN107498126A CN107498126A CN201710491567.7A CN201710491567A CN107498126A CN 107498126 A CN107498126 A CN 107498126A CN 201710491567 A CN201710491567 A CN 201710491567A CN 107498126 A CN107498126 A CN 107498126A
- Authority
- CN
- China
- Prior art keywords
- cavity
- tin
- warded
- chamber
- narrow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Molten Solder (AREA)
Abstract
The invention discloses a method for enameling tin on a deep cavity or a narrow cavity, which comprises the following steps of manufacturing a gold-plated copper sheet; secondly, removing oxides in advance before tin coating; preheating on a hot table, spraying soldering flux, wherein the type of the soldering flux is as follows: EF-9301, solder is added, the cavity is placed on a hot table with the temperature of 240 +/-5 ℃ for preheating, and then a layer of soldering flux is sprayed on the area to be enameled of the cavity, wherein the type of the soldering flux is as follows: EF-9301, and then adding solder wires to the area of the cavity to be subjected to tin coating; fourthly, clamping a gold-plated copper sheet by using tweezers, placing the gold-plated copper sheet on the molten solder, and rubbing the gold-plated copper sheet in the area to be tin-plated in the cavity back and forth to enable the cavity to be tin-plated; and step five, cleaning the cavity after tin coating. Compared with the traditional electric iron mode, the invention has the advantages of simpler operation, convenience, high efficiency and no dead angle of tin coating. The invention is suitable for mass production and is worth popularizing.
Description
Technical field
Tin method is warded off on deep chamber or narrow chamber the present invention relates to one kind, belongs to electronic product machining technical field.
Background technology
With the development of microwave technology, the frequency more and more higher of microwave module, the cavity used in microwave module engenders
Deep chamber or narrow cavity configuration, deep chamber or narrow cavity configuration cavity effectively shield electromagnetic interference, improve the transmission quality of microwave signal.
In existing process, to improve cavity and microwave circuit boards burn-back penetration rate, conventional electric iron wards off tin on cavity, and deep chamber or
The appearance of narrow cavity configuration cavity, is limited by cavity body structure part, can not be warded off tin in deep chamber or narrow cavity edge with electric iron, be warded off tin not
In place, influence cavity and microwave circuit boards burn-back penetration rate, the final quality for influenceing product, in addition, with electric iron in deep chamber or
Operate and its inconvenient, add heavily to the difficulty of the work on narrow chamber.
To solve the deficiency of existing process, tin method is warded off on deep chamber or narrow chamber the invention provides one kind, this method is led to
Cross setting and rationally effectively ward off process of tin flow, by the gold plated copper sheets of suitable size, deep chamber or narrow cavity edge is warded off tin completely,
Guarantee is provided for follow-up cavity and microwave circuit boards burn-back penetration rate, ensure that the quality of product.The letter of the inventive method step
It is single, easy to operate, can produce in enormous quantities, in the case where not increasing equipment investment, improve the quality of product.
The content of the invention
The deficiency of tin can not be effectively warded off in the cavity of deep chamber or narrow cavity configuration to solve existing process with electric iron, this
Invention provides one kind and wards off tin method on deep chamber or narrow chamber.This method mainly includes：
Step 1: make gold plated copper sheets.According to deep chamber or narrow cavity configuration and size, make what is be engaged with cavity body structure and size
Copper sheet, then copper sheet surface gold-plating.
Step 2: before tin is warded off, oxide is removed in advance.Cavity is placed in plasma cleaner, set clear
Parameter is washed, with strong cleaning, removes cavity tin region surface oxide to be warded off.
Step 3: being preheated in thermal station, scaling powder, model are sprayed：EF-9301, upper solder, the solder compositions percentage
Than：Sn96.5%, Ag3%, Cu0.5%.Cavity is placed in the thermal station that temperature is 240 ± 5 DEG C and preheated, then to cavity
Spray one layer of scaling powder, model in tin region to be warded off：EF-9301, then add appropriate solder stick to cavity tin region to be warded off again.
Step 4: gripping gold plated copper sheets with tweezers, it is placed on the solder of fusing, is rubbed back and forth in cavity tin region to be warded off
Wipe, its cavity is warded off tin.
Step 5: cleaned the cavity after tin is warded off.The cavity after tin will be warded off and be first put into that to fill ABZOL CEG CLEANER clear
Hot brew cleaning, scavenging period 300-350s in the vapour phase cleaning groove of lotion, then be cleaned by ultrasonic, scavenging period is
100-120s, finally it is put into absolute ethyl alcohol and carries out hairbrush scrub, naturally dry.
Beneficial effect：One kind provided by the invention wards off tin method on deep chamber or narrow chamber, the advantage is that, tin is warded off in cavity
Before, cavity adhesive force is improved, is improved weldering with the oxide in the strong cleaning model removal cavity of plasma cleaner in advance
The wellability of tin, ward off tin for follow-up cavity and provide suitable environment, eliminating influences the undesirable element that cavity wards off tin quality；Separately
It is outer it is used in the present invention carries out cavity with tweezers gripping gold plated copper sheets and wards off tin mode, use electric iron mode relative to tradition, behaviour
Work is more simple, convenient, efficient, wards off tin without dead angle.The present invention is adapted to produce in enormous quantities, is worthy to be popularized.
Brief description of the drawings
Fig. 1 is flow chart of the method for the present invention.
Embodiment
The present invention is further described below in conjunction with the accompanying drawings.
Tin method is warded off on deep chamber or narrow chamber as shown in figure 1, a kind of, including step is as follows：
Step 1: make gold plated copper sheets.According to deep chamber or narrow cavity configuration and size, make what is be engaged with cavity body structure and size
Copper sheet, then copper sheet surface gold-plating.
Step 2: before tin is warded off, oxide is removed in advance.Cavity is placed in plasma cleaner, set clear
Parameter is washed, with strong cleaning, removes cavity tin region surface oxide to be warded off.
Step 3: being preheated in thermal station, scaling powder, model are sprayed：EF-9301, upper solder, the solder compositions percentage
Than：Sn96.5%, Ag3%, Cu0.5%.Cavity is placed in the thermal station that temperature is 245 DEG C and preheated, waits to ward off then to cavity
Spray one layer of scaling powder, model in tin region：EF-9301, then add appropriate solder stick to cavity tin region to be warded off again.
Step 4: gripping gold plated copper sheets with tweezers, it is placed on the solder of fusing, is rubbed back and forth in cavity tin region to be warded off
Wipe, its cavity is warded off tin.
Step 5: cleaned the cavity after tin is warded off.The cavity after tin will be warded off and be first put into that to fill ABZOL CEG CLEANER clear
Hot brew cleaning, scavenging period 300s in the vapour phase cleaning groove of lotion, then be cleaned by ultrasonic, scavenging period 100s, most
After be put into absolute ethyl alcohol carry out hairbrush scrub, naturally dry.
Described above is only the preferred embodiment of the present invention, it should be pointed out that：For the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (6)
1. one kind wards off tin method on deep chamber or narrow chamber, it is characterised in that：It is as follows including step：
Step 1: make gold plated copper sheets；
Step 2: before tin is warded off, oxide is removed in advance；
Step 3: being preheated in thermal station, scaling powder, scaling powder model are sprayed：EF-9301, upper solder, cavity is placed on temperature
To be preheated in 240 ± 5 DEG C of thermal station, one layer of scaling powder, scaling powder model are sprayed then to cavity tin region to be warded off：EF-
9301, then add solder stick to cavity tin region to be warded off again；
Step 4: gripping gold plated copper sheets with tweezers, it is placed on the solder of fusing, back and forth in cavity tin region friction to be warded off, makes
Its cavity wards off tin；
Step 5: cleaned the cavity after tin is warded off.
2. one kind according to claim 1 wards off tin method on deep chamber or narrow chamber, it is characterised in that：The step 1 bag
Include：According to deep chamber or narrow cavity configuration and size, the copper sheet being engaged with cavity body structure and size is made, then copper sheet surface is plated
Gold.
3. one kind according to claim 1 wards off tin method on deep chamber or narrow chamber, it is characterised in that：The step 2 bag
Include：Cavity is placed in plasma cleaner, sets cleaning parameterses, with strong cleaning, removes cavity tin region surface to be warded off
Oxide.
4. one kind according to claim 1 wards off tin method on deep chamber or narrow chamber, it is characterised in that：Welded in the step 3
Expect percentage composition：Sn96.5%, Ag3%, Cu0.5%.
5. one kind according to claim 1 wards off tin method on deep chamber or narrow chamber, it is characterised in that：It is hot in the step 3
Platform preheating temperature is 245 DEG C.
6. one kind according to claim 1 wards off tin method on deep chamber or narrow chamber, it is characterised in that：The step 5 bag
Include：The cavity after tin will be warded off and be first put into hot brew cleaning in the vapour phase cleaning groove for filling ABZOL CEG CLEANER cleaning agents, clearly
It is 300-350s to wash the time, then is cleaned by ultrasonic, scavenging period 100-120s, is finally put into absolute ethyl alcohol and carries out hairbrush brush
Wash, naturally dry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710491567.7A CN107498126B (en) | 2017-06-26 | 2017-06-26 | Method for enameling tin on deep cavity or narrow cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710491567.7A CN107498126B (en) | 2017-06-26 | 2017-06-26 | Method for enameling tin on deep cavity or narrow cavity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107498126A true CN107498126A (en) | 2017-12-22 |
| CN107498126B CN107498126B (en) | 2020-02-21 |
Family
ID=60678997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710491567.7A Active CN107498126B (en) | 2017-06-26 | 2017-06-26 | Method for enameling tin on deep cavity or narrow cavity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107498126B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108971681A (en) * | 2017-06-02 | 2018-12-11 | 特变电工沈阳变压器集团有限公司 | Shield lead welding technique to a kind of transformer copper |
| CN110369822A (en) * | 2019-06-27 | 2019-10-25 | 中国航天时代电子有限公司 | A kind of efficient reliable small deep hole rotation wards off tin and goes golden method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144401A (en) * | 1999-11-12 | 2001-05-25 | Denso Corp | Controlling device |
| CN103369857A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | A method for processing a testing board before a conductive anodic filament experiment |
| CN103447646A (en) * | 2013-09-05 | 2013-12-18 | 中国电子科技集团公司第十研究所 | Method for realizing welding between soft base chip circuit board and metal base body without special tool |
| CN103737135A (en) * | 2013-12-09 | 2014-04-23 | 成都赛英科技有限公司 | Metal shell soldering method |
| CN103934534A (en) * | 2014-04-15 | 2014-07-23 | 北京卫星制造厂 | Vacuum welding method for thick film substrate and power shell |
| CN105436825A (en) * | 2015-11-26 | 2016-03-30 | 安徽华东光电技术研究所 | Manufacturing method of LED constant current source driving circuit module |
| CN106413285A (en) * | 2016-11-22 | 2017-02-15 | 株洲天微技术有限公司 | Microcircuit module back side pre-soldering and pre-soldering heating device |
| CN106572607A (en) * | 2016-06-23 | 2017-04-19 | 安徽华东光电技术研究所 | Process manufacturing method of solid-state microwave source |
| CN107350585A (en) * | 2017-06-26 | 2017-11-17 | 安徽华东光电技术研究所 | A kind of method of flat gold plated lead manual welding |
-
2017
- 2017-06-26 CN CN201710491567.7A patent/CN107498126B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144401A (en) * | 1999-11-12 | 2001-05-25 | Denso Corp | Controlling device |
| CN103369857A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | A method for processing a testing board before a conductive anodic filament experiment |
| CN103447646A (en) * | 2013-09-05 | 2013-12-18 | 中国电子科技集团公司第十研究所 | Method for realizing welding between soft base chip circuit board and metal base body without special tool |
| CN103737135A (en) * | 2013-12-09 | 2014-04-23 | 成都赛英科技有限公司 | Metal shell soldering method |
| CN103934534A (en) * | 2014-04-15 | 2014-07-23 | 北京卫星制造厂 | Vacuum welding method for thick film substrate and power shell |
| CN105436825A (en) * | 2015-11-26 | 2016-03-30 | 安徽华东光电技术研究所 | Manufacturing method of LED constant current source driving circuit module |
| CN106572607A (en) * | 2016-06-23 | 2017-04-19 | 安徽华东光电技术研究所 | Process manufacturing method of solid-state microwave source |
| CN106413285A (en) * | 2016-11-22 | 2017-02-15 | 株洲天微技术有限公司 | Microcircuit module back side pre-soldering and pre-soldering heating device |
| CN107350585A (en) * | 2017-06-26 | 2017-11-17 | 安徽华东光电技术研究所 | A kind of method of flat gold plated lead manual welding |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108971681A (en) * | 2017-06-02 | 2018-12-11 | 特变电工沈阳变压器集团有限公司 | Shield lead welding technique to a kind of transformer copper |
| CN110369822A (en) * | 2019-06-27 | 2019-10-25 | 中国航天时代电子有限公司 | A kind of efficient reliable small deep hole rotation wards off tin and goes golden method |
| CN110369822B (en) * | 2019-06-27 | 2021-05-11 | 中国航天时代电子有限公司 | Efficient and reliable small deep hole rotary tin-coating and gold-removing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107498126B (en) | 2020-02-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104227268B (en) | A kind of preparation method of medicine core weld-ring | |
| CN107498126A (en) | Method for enameling tin on deep cavity or narrow cavity | |
| CN101123129A (en) | A production method for copper-coated aluminum material | |
| CN203448433U (en) | Special cleaning device for enameled wires | |
| CN106167419B (en) | Heat-stable ceramic casserole and preparation method with metal magnetic conducting film | |
| CN105405601B (en) | One kind metallization FERRITE CORE and preparation method thereof | |
| CN103545698B (en) | Hyperconductive cable surface tining and moulding method | |
| CN1029207C (en) | Copper basis soldering paste and brazing method for copper ornaments | |
| CN101913055B (en) | Machining technology of redriving aluminum alloy pan | |
| CN107350585A (en) | A kind of method of flat gold plated lead manual welding | |
| CN103395330A (en) | Process method capable of enabling copper product surface to have black-copper-based silver or gold pattern effect | |
| CN108257717A (en) | A kind of new energy inverter big flakiness ratio polyimides enameling copper strap wire | |
| CN108866532B (en) | Surface treatment method for enabling copper ware to have slurry coating effect | |
| CN101378636B (en) | Technique processing method for plating nickel on the inner and spraying paint on the outer of metal case | |
| CN108971681A (en) | Shield lead welding technique to a kind of transformer copper | |
| CN107498128A (en) | For covering the manufacture craft of tin copper sheet during Microwave Measurement And Adjustment | |
| CN108078361B (en) | Electromagnetic heating ceramic pot and manufacturing method thereof | |
| CN108048646A (en) | A kind of stainless steel kitchen ventilator surface treatment method | |
| CN107460429A (en) | A kind of plasma spray process | |
| CN102732109B (en) | Coating and method for eliminating electromagnetic radiation generated by using electrical appliance | |
| CN100581322C (en) | Method of welding varnished wire and plated circuit soft plate in electronic component | |
| CN111332058A (en) | Processing technology of cloisonne water jet mosaic | |
| CN105562873A (en) | Method for welding circuit components | |
| CN108727878A (en) | A kind of hair clip new coating material | |
| CN110408920A (en) | A kind of automobile Hardware fitting process of surface treatment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 241002 Huaxia science and Technology Park, hi tech Development Zone, Yijiang District, Wuhu, Anhui Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd. Address before: 241002 Huaxia science and Technology Park, hi tech Development Zone, Yijiang District, Wuhu, Anhui Patentee before: Anhui Huadong Polytechnic Institute |
|
| CP01 | Change in the name or title of a patent holder |