CN105405601B - One kind metallization FERRITE CORE and preparation method thereof - Google Patents

One kind metallization FERRITE CORE and preparation method thereof Download PDF

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Publication number
CN105405601B
CN105405601B CN201510946887.8A CN201510946887A CN105405601B CN 105405601 B CN105405601 B CN 105405601B CN 201510946887 A CN201510946887 A CN 201510946887A CN 105405601 B CN105405601 B CN 105405601B
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ferrite core
nickel
copper alloy
chrome
alloy layer
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CN105405601A (en
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朱小东
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Shenzhen Kangci Electronic Co Ltd
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Shenzhen Kangci Electronic Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/18Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/032Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
    • H01F1/10Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites, e.g. [(Ba,Sr)O(Fe2O3)6] ferrites with hexagonal structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Hard Magnetic Materials (AREA)

Abstract

The embodiments of the invention provide one kind metallization FERRITE CORE, including FERRITE CORE, electrode zone is provided with the FERRITE CORE, formed with the coat of metal for being connected with other devices on the electrode zone, the coat of metal includes stacking gradually the layers of chrome, nickel-copper alloy layer and silver layer to be formed in the electrode area surfaces, and the layers of chrome, nickel-copper alloy layer and silver layer are prepared by magnetron sputtering.The coat of metal of present invention metallization FERRITE CORE has adhesive force height, heat resistance is strong, solderability is good, and low cost and other advantages.The embodiment of the present invention additionally provides the preparation method of the metallization FERRITE CORE, and this method spatter film forming speed is fast, and technique whole process is pollution-free, and cost is low.

Description

One kind metallization FERRITE CORE and preparation method thereof
Technical field
The present invention relates to paster power magnetic core manufacture field, more particularly to one kind metallization FERRITE CORE and its preparation Method.
Background technology
Under current smart mobile phone, the spring tide of tablet personal computer, electronic component is miniaturized, the requirement of Surface Mounting Technology is more and more stronger Strong, power inductance is even more to stand in the breach.And also more and more higher, all products must cross ROSH and halogen for the environmental requirement of product Tested Deng items.
Traditional ferrite paster power magnetic core metallization process is mainly stained with silver paste, high temperature sintering, electricity including magnetic core end points The processes such as nickel plating, tin, there is the shortcomings that high energy consumption, pollution big, costly, poor reliability in it, with current construction economizing type society It can be disagreed with the development trend of green process technology, the unsuitable processing for continuing to apply to ferrite paster power magnetic core Production.Therefore, seek a kind of friendly process ferrite paster power magnetic core metallize it is imperative.
The content of the invention
In consideration of it, the embodiments of the invention provide one kind metallization FERRITE CORE and preparation method thereof, it is existing to solve FERRITE CORE metallization process high energy consumption, pollution layer of metallized film poor reliability that is big, costly, and obtaining, performance is not The problem of good.
In a first aspect, the embodiments of the invention provide one kind metallization FERRITE CORE, including FERRITE CORE, the iron Electrode zone is provided with ferrite core, formed with the coat of metal for being connected with other devices, institute on the electrode zone Stating the coat of metal includes stacking gradually the layers of chrome, nickel-copper alloy layer and silver layer to be formed in the electrode area surfaces, the layers of chrome, Nickel-copper alloy layer and silver layer are prepared by magnetron sputtering.
Present invention metallization FERRITE CORE uses layers of chrome bottoming, can improve coat of metal adhesive force;The shape in layers of chrome again Into nickel-copper alloy layer, to form weld layer;The silver layer is arranged on outermost layer, forms protective layer, can protect nickel-copper alloy layer not It is oxidized;Simultaneously because silver is good with scolding tin compatibility, thus solderability can be improved.The present invention is by using above-mentioned special construction The coat of metal, coating adhesion is high, heat resistance is strong, solderability is good, and cost is low.
Preferably, the thickness of the layers of chrome is 0.1-1.0 microns.It is highly preferred that the thickness of the layers of chrome is that 0.2-0.3 is micro- Rice.
Preferably, the thickness of the nickel-copper alloy layer is 0.7-2.0 microns.It is highly preferred that the thickness of the nickel-copper alloy layer Spend for 1.2-1.5 microns.
Preferably, in the nickel-copper alloy layer, the mass content of nickel is more than 70%.
Preferably, the thickness of the silver layer is 0.1-1.0 microns.It is highly preferred that the thickness of the silver layer is that 0.2-0.3 is micro- Rice.
Because the metallic coating mass of special construction of the present invention is high, therefore the setting thickness of coating can be accordingly reduced, so as to Welding quality is not only increased, and substantially increases production efficiency, reduces metallization cost.
To play good anti-oxidation effect, it is preferable that the silver-colored purity of the silver layer is more than 3N.
The concrete shape of present invention metallization FERRITE CORE is unlimited, such as can be I-shaped.Present invention metallization iron Ferrite core is specifically as follows a magnetic core electrode.
A kind of metallization FERRITE CORE that first aspect of the embodiment of the present invention provides, its coat of metal include stacking gradually Layers of chrome, nickel-copper alloy layer and silver layer, layers of chrome can improve coating adhesion, and nickel-copper alloy layer forms weld layer, and silver layer can be protected Nickel-copper alloy layer is not oxidized, while can improve solderability;The final coat of metal has that adhesive force is high, heat resistance is strong, can Weldering property is good, and low cost and other advantages.
Second aspect, the embodiments of the invention provide a kind of preparation method of above-mentioned metallization FERRITE CORE, including with Lower step:
(1) FERRITE CORE is taken, the FERRITE CORE is cleaned and dried, electrode is provided with the FERRITE CORE Region;
(2) coat of metal is prepared in the electrode area surfaces by the way of magnetron sputtering, obtains the ferrite that metallizes Magnetic core, the coat of metal include stacking gradually the layers of chrome, nickel-copper alloy layer and silver layer to be formed in the electrode area surfaces.
The operation of the cleaning is to remove the powder on magnetic core surface and stain.
Preferably, the step of cleaning specifically includes:Alcohol-pickled 5-10 minutes are first used, then in 40-60 DEG C of temperature Degree lower ultrasonic wave cleaning 10-20 minutes, then 1-3 minutes are rinsed with clear water, then normal temperature ultrasonic wave cleans 10-20 minutes, finally 1-3 minutes are rinsed with 50-80 DEG C of hot water.
The drying operation is to remove the moisture content on magnetic core surface, can be carried out in an oven.Preferably, oven temperature is 130-170 DEG C, minute time 10-20.
Magnetron sputtering of the present invention is carried out using magnetron vacuum coating machine, and its detailed process parameter is not done particular determination, can obtained Obtain each coat of metal.
Preferably, during preparing the layers of chrome using magnetron sputtering:Using crome metal as target, the thickness of the layers of chrome For 0.1-1.0 microns.Preferably, the electric current that the metal chromium target is passed through is 20-25A.
Preferably, during preparing the nickel-copper alloy layer using magnetron sputtering:Using monel as target, the nickel The thickness of copper alloy layer is 0.7-2.0 microns.Preferably, the electric current that the monel target is passed through is 20-25A.Preferably, In the nickel-copper alloy layer, the mass content of nickel is more than 70%.
Preferably, during preparing the silver layer using magnetron sputtering:Using argent as target, the thickness of the silver layer For 0.1-1.0 microns.Preferably, the electric current that the silver-colored target is passed through is 15-20A.
Preferably, in the present invention, the vacuum in magnetron sputtering process is 0.1-10Pa, Sputtering power density 0.1- 20W/cm2.The time of magnetron sputtering is depending on default thickness of coating.
The preparation method for the metallization FERRITE CORE that second aspect of the embodiment of the present invention provides, utilizes magnetron sputtering skill Art, metallization solder joint is formed with metal targets chromium target, monel target and silver target sputtering, coat of metal adhesive force is high, heat resistance By force, solderability is good, and spatter film forming speed is fast, and technique whole process is pollution-free, and cost is low, thus magnetic core electrode pads can be made to expire The requirement of sufficient solderability, soldering resistance and adhesive force, and can enough ensure environmental protection, without any pollution and economy.
Brief description of the drawings
Fig. 1 is present invention metallization ferrite core structure figure;
Fig. 2 is the section amplification figure of Fig. 1 a-quadrant;
The upward view for the metallization FERRITE CORE that Fig. 3 is Fig. 1;
Fig. 4 is the process chart of the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is part of the embodiment of the present invention, rather than whole embodiments.Based on this hair Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained under the premise of creative work is not made Example, belongs to the scope of protection of the invention.
Fig. 1-Fig. 3 is referred to, the embodiments of the invention provide one kind metallization FERRITE CORE, including FERRITE CORE 100, the side of the FERRITE CORE 100 is provided with electrode zone 101, and the electrode zone is one contacted with pcb board paster Face, formed with the coat of metal for being connected with other devices on the electrode zone 101, Fig. 2 show a-quadrant in Fig. 1 Section structure enlarged drawing, shown in compares figure 3, the coat of metal includes stacking gradually to be formed on the surface of electrode zone 101 Layers of chrome 10, nickel-copper alloy layer 20 and silver layer 30, the layers of chrome 10, nickel-copper alloy layer 20 and silver layer 30 are prepared by magnetron sputtering.
Preferably, the thickness of the layers of chrome is 0.1-1.0 microns.It is highly preferred that the thickness of the layers of chrome is that 0.2-0.3 is micro- Rice.
Preferably, the thickness of the nickel-copper alloy layer is 0.7-2.0 microns.It is highly preferred that the thickness of the nickel-copper alloy layer Spend for 1.2-1.5 microns.Preferably, in the nickel-copper alloy layer, the mass content of nickel is more than 70%.
Preferably, the thickness of the silver layer is 0.1-1.0 microns.It is highly preferred that the thickness of the silver layer is that 0.2-0.3 is micro- Rice.
The coat of metal of the above-mentioned special construction of the present invention has that adhesive force is high, heat resistance is strong, solderability is good, and cost is low etc. Advantage.
The metallization FERRITE CORE of the embodiment of the present invention can use as the magnetic core of chip inductor.The shape of the coat of metal According to the shape of electrode zone and it can be actually needed and be arranged to rectangle, circle or other shapes.
Referring to Fig. 4, the embodiments of the invention provide a kind of preparation method of above-mentioned metallization FERRITE CORE, including with Lower step:
(1) FERRITE CORE is taken, the FERRITE CORE is cleaned and dried, electrode is provided with the FERRITE CORE Region;
The operation of the cleaning is to remove the powder on magnetic core surface and stain.
Preferably, the step of cleaning specifically includes:Alcohol-pickled 5-10 minutes are first used, then in 40-60 DEG C of temperature Degree lower ultrasonic wave cleaning 10-20 minutes, then 1-3 minutes are rinsed with clear water, then normal temperature ultrasonic wave cleans 10-20 minutes, finally 1-3 minutes are rinsed with 50-80 DEG C of hot water.
The drying operation is to remove the moisture content on magnetic core surface, can be carried out in an oven.Preferably, oven temperature is 130-170 DEG C, minute time 10-20.
(2) coat of metal is prepared in the electrode area surfaces by the way of magnetron sputtering, obtains the ferrite that metallizes Magnetic core, the coat of metal include stacking gradually the layers of chrome, nickel-copper alloy layer and silver layer to be formed in the electrode area surfaces.
Magnetron sputtering of the present invention is carried out using magnetron vacuum coating machine, and its detailed process parameter is not done particular determination, can obtained Obtain each coat of metal.
Specifically, the magnetic-core arranging after drying is put into special tool well, fixed, only expose electrode zone i.e. Can, then it is attached on the horse of vacuum coating, promotes vacuum machine, vacuumize, then argon gas is inputted into vacuum chamber, and remain true The pressure of argon gas is 2 × 10 in cavity-1Pa-8×10-1In the range of Pa.
Preferably, during preparing the layers of chrome using magnetron sputtering:Using crome metal as target, the thickness of the layers of chrome For 0.1-1.0 microns.Preferably, the electric current that the metal chromium target is passed through is 20-25A.
Preferably, during preparing the nickel-copper alloy layer using magnetron sputtering:Using monel as target, the nickel The thickness of copper alloy layer is 0.7-2.0 microns.Preferably, the electric current that the monel target is passed through is 20-25A.
Preferably, during preparing the silver layer using magnetron sputtering:Using argent as target, the thickness of the silver layer For 0.1-1.0 microns.Preferably, the electric current that the silver-colored target is passed through is 15-20A.
Preferably, in the present invention, the vacuum in magnetron sputtering process is 0.1-10Pa, Sputtering power density 0.1- 20W/cm2.The time of magnetron sputtering is depending on default thickness of coating.
The preparation method of the above-mentioned metallization FERRITE CORE of the embodiment of the present invention, spatter film forming speed is fast, technique whole process nothing Pollution, cost are low.
The present invention is further elaborated below by way of more specifically embodiment.
Embodiment one
A kind of preparation method of above-mentioned metallization FERRITE CORE, comprises the following steps:
(1) FERRITE CORE is taken, the FERRITE CORE is cleaned and dried, electrode is provided with the FERRITE CORE Region;
Its cleaning operation is specially:FERRITE CORE is placed in stainless steel basket, first soaks 5 minutes in alcohol, so Cleaned 10 minutes after 50 DEG C of ultrasonic waves;Rinsed 1 minute with clear water again;Then normal temperature ultrasonic wave cleans 20 minutes;Finally with heat Water rinses 2 minutes;Dried up with blowing hot wind, then shakeout and be placed in Dropbox, it is to be dried;
The drying operation is carried out in an oven, and specifically, magnetic core is divided in Dropbox, put into baking oven, baking oven temperature Degree is set as 150 DEG C, 15 minutes time;It is dried to no steam;
(2) coat of metal is prepared in the electrode area surfaces by the way of magnetron sputtering, obtains the ferrite that metallizes Magnetic core, the coat of metal include stacking gradually the layers of chrome, nickel-copper alloy layer and silver layer to be formed in the electrode area surfaces.
Sputter layers of chrome:Magnetic-core arranging is got well and is put into special tool, is fixed, only exposes electrode zone, then It is attached on the horse of vacuum coating, promotes vacuum machine, vacuumize, background vacuum is more than 5 × 10-3Pa, by metal chromium target On power supply is logical, argon gas is filled with, starts sputter, the logical current settings of chromium target are 20A, and the thickness of gained layers of chrome is 0.1 micron;
Before sputter, chromium target is splashed in advance, peels off the oxide or debris on surface.
Sputter nickel-copper alloy layer:The power supply of chromium target is closed, opens the power supply of monel target, what monel target led to Current settings are 20A, and the thickness of gained nickel-copper alloy layer is 0.8 micron;
Sputter silver layer:The power supply of monel target is closed, opens the power supply of argent target, the logical current settings of silver-colored target For 15A, the thickness of gained silver layer is 0.1 micron.
Embodiment two
A kind of preparation method of above-mentioned metallization FERRITE CORE, comprises the following steps:
(1) FERRITE CORE is taken, the FERRITE CORE is cleaned and dried, electrode is provided with the FERRITE CORE Region;
Its cleaning operation is specially:FERRITE CORE is placed in stainless steel basket, first soaks 10 minutes in alcohol, so Cleaned 20 minutes after 40 DEG C of ultrasonic waves;Rinsed 2 minutes with clear water again;Then normal temperature ultrasonic wave cleans 15 minutes;Finally with heat Water rinses 3 minutes;Dried up with blowing hot wind, then shakeout and be placed in Dropbox, it is to be dried;
The drying operation is carried out in an oven, and specifically, magnetic core is divided in Dropbox, put into baking oven, baking oven temperature Degree is set as 170 DEG C, 10 minutes time;It is dried to no steam;
(2) coat of metal is prepared in the electrode area surfaces by the way of magnetron sputtering, obtains the ferrite that metallizes Magnetic core, the coat of metal include stacking gradually the layers of chrome, nickel-copper alloy layer and silver layer to be formed in the electrode area surfaces.
Sputter layers of chrome:Magnetic-core arranging is got well and is put into special tool, is fixed, only exposes electrode zone, then It is attached on the horse of vacuum coating, promotes vacuum machine, vacuumize, background vacuum is more than 5 × 10-3Pa, by metal chromium target On power supply is logical, argon gas is filled with, starts sputter, the logical current settings of chromium target are 25A, and the thickness of gained layers of chrome is 0.5 micron;
Sputter nickel-copper alloy layer:The power supply of chromium target is closed, opens the power supply of monel target, what monel target led to Current settings are 25A, and the thickness of gained nickel-copper alloy layer is 2.0 microns;
Sputter silver layer:The power supply of monel target is closed, opens the power supply of argent target, the logical current settings of silver-colored target For 20A, the thickness of gained silver layer is 0.6 micron.
Embodiment three
A kind of preparation method of above-mentioned metallization FERRITE CORE, comprises the following steps:
(1) FERRITE CORE is taken, the FERRITE CORE is cleaned and dried, electrode is provided with the FERRITE CORE Region;
Its cleaning operation is specially:FERRITE CORE is placed in stainless steel basket, first soaks 8 minutes in alcohol, so Cleaned 15 minutes after 60 DEG C of ultrasonic waves;Rinsed 1 minute with clear water again;Then normal temperature ultrasonic wave cleans 15 minutes;Finally with heat Water rinses 1 minute;Dried up with blowing hot wind, then shakeout and be placed in Dropbox, it is to be dried;
The drying operation is carried out in an oven, and specifically, magnetic core is divided in Dropbox, put into baking oven, baking oven temperature Degree is set as 130 DEG C, 20 minutes time;It is dried to no steam;
(2) coat of metal is prepared in the electrode area surfaces by the way of magnetron sputtering, obtains the ferrite that metallizes Magnetic core, the coat of metal include stacking gradually the layers of chrome, nickel-copper alloy layer and silver layer to be formed in the electrode area surfaces.
Sputter layers of chrome:Magnetic-core arranging is got well and is put into special tool, is fixed, only exposes electrode zone, then It is attached on the horse of vacuum coating, promotes vacuum machine, vacuumize, background vacuum is more than 1 × 10-2Pa, by metal chromium target On power supply is logical, argon gas is filled with, starts sputter, the logical current settings of chromium target are 22A, and the thickness of gained layers of chrome is 0.3 micron.
Sputter nickel-copper alloy layer:The power supply of chromium target is closed, opens the power supply of monel target, what monel target led to Current settings are 22A, and the thickness of gained nickel-copper alloy layer is 1.0 microns.
Sputter silver layer:The power supply of monel target is closed, opens the power supply of argent target, the logical current settings of silver-colored target For 18A, the thickness of gained silver layer is 0.3 micron.
Solderability, heat resistance and peel strength performance are carried out to metallization FERRITE CORE obtained by the above embodiment of the present invention Test, test result are good.
Described above is the preferred embodiment of the embodiment of the present invention, it is noted that for the common skill of the art For art personnel, on the premise of principle of the embodiment of the present invention is not departed from, some improvements and modifications can also be made, these improvement The protection domain of the embodiment of the present invention is also considered as with retouching.

Claims (4)

1. one kind metallization FERRITE CORE, including FERRITE CORE, electrode zone is provided with the FERRITE CORE, it is special Sign is, includes successively formed with the coat of metal for being connected with other devices, the coat of metal on the electrode zone Stacking forms the layers of chrome, nickel-copper alloy layer and silver layer in the electrode area surfaces, and the layers of chrome, nickel-copper alloy layer and silver layer lead to Cross magnetron sputtering preparation, the thickness of the nickel-copper alloy layer is 0.7-2.0 microns, and in the nickel-copper alloy layer, the quality of nickel contains Amount is more than 70%, and the thickness of the layers of chrome is 0.2-1.0 microns, and the thickness of the silver layer is 0.2-1.0 microns.
2. metallization FERRITE CORE as claimed in claim 1, it is characterised in that the silver-colored purity of the silver layer is more than 3N.
3. a kind of preparation method for the FERRITE CORE that metallizes, it is characterised in that comprise the following steps:
(1) FERRITE CORE is taken, the FERRITE CORE is cleaned and dried, electrode district is provided with the FERRITE CORE Domain;
(2) coat of metal is prepared in the electrode area surfaces by the way of magnetron sputtering, obtains the FERRITE CORE that metallizes, The coat of metal includes stacking gradually the layers of chrome, nickel-copper alloy layer and silver layer to be formed in the electrode area surfaces;Using magnetic During control sputtering prepares the nickel-copper alloy layer:Using monel as target, the thickness of the nickel-copper alloy layer is 0.7- 2.0 microns, in the nickel-copper alloy layer, the mass content of nickel is more than 70%, and the process of the layers of chrome is prepared using magnetron sputtering In:Using crome metal as target, the thickness of the layers of chrome is 0.2-1.0 microns, and the process of the silver layer is prepared using magnetron sputtering In:Using argent as target, the thickness of the silver layer is 0.2-1.0 microns.
4. the preparation method of metallization FERRITE CORE as claimed in claim 3, it is characterised in that have the step of the cleaning Body includes:Alcohol-pickled 5-10 minutes are first used, then ultrasonic wave cleans 10-20 minutes at a temperature of 40-60 DEG C, then uses clear water 1-3 minutes are rinsed, then normal temperature ultrasonic wave cleaning 10-20 minutes, finally rinse 1-3 minutes with 50-80 DEG C of hot water.
CN201510946887.8A 2015-12-16 2015-12-16 One kind metallization FERRITE CORE and preparation method thereof Active CN105405601B (en)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016220082A1 (en) 2016-10-14 2018-04-19 Würth Elektronik eiSos Gmbh & Co. KG Method for metallizing ferrite ceramics and component with a ferrite ceramic
CN107708306A (en) * 2017-08-30 2018-02-16 奥士康精密电路(惠州)有限公司 A kind of circuit board pressing quality-improving technique
CN107974663A (en) * 2017-11-24 2018-05-01 苏州市康普来表面处理科技有限公司 New-energy automobile inverter heat sink PVD coating process
CN108675834A (en) * 2018-05-30 2018-10-19 苏州求是真空电子有限公司 A method of improving ceramic surface metallization adhesive force
CN113930733B (en) * 2021-09-14 2023-12-15 国瓷赛创电气(铜陵)有限公司 Magnetron sputtering method for ferrite processing
CN114260530A (en) * 2021-12-27 2022-04-01 烟台台芯电子科技有限公司 Welding process of large-area ceramic copper-clad plate based on IGBT module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1316522C (en) * 2004-01-14 2007-05-16 电子科技大学 N-layer magnetic core I-type thin-film transformer array and its preparing method
CN1333105C (en) * 2004-09-09 2007-08-22 蔡育平 Magnetron sputtering vacuum plating silver process for soft-magnetic ferrite core
JP5195669B2 (en) * 2009-06-29 2013-05-08 Tdk株式会社 Ferrite core and electronic components
CN101658929B (en) * 2009-09-06 2011-03-23 宁波广博纳米材料有限公司 Cupro-nickel alloy powder used for preparing terminal electrode of chip-type multilayer ceramic capacitor (MLCC)
CN101661757A (en) * 2009-09-15 2010-03-03 山西师范大学 Method for preparing magnetic recording exchange coupling complex film
KR101301443B1 (en) * 2011-11-03 2013-08-28 경희대학교 산학협력단 Graphene having properties of visible light photoluminescence and method for fabricating the same
CN102936131B (en) * 2012-11-07 2014-09-17 天通控股股份有限公司 Manganese zinc ferrite material for eddy current type approach switch, film-coated magnetic core and preparing method of manganese zinc ferrite material
CN202996518U (en) * 2013-01-10 2013-06-12 湖南创一电子科技有限公司 Novel manganese-zinc ferrite chip magnetic core
CN205428649U (en) * 2015-12-16 2016-08-03 深圳市康磁电子有限公司 Metallization ferrite core and paster inductance

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
《铁氧体陶瓷无害金属化技术的研究》;马元远;《中国优秀硕士学位论文全文数据库工程科技Ⅱ辑》;20080815;第43-52页 *

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