CN110369822A - A kind of efficient reliable small deep hole rotation wards off tin and goes golden method - Google Patents
A kind of efficient reliable small deep hole rotation wards off tin and goes golden method Download PDFInfo
- Publication number
- CN110369822A CN110369822A CN201910568502.7A CN201910568502A CN110369822A CN 110369822 A CN110369822 A CN 110369822A CN 201910568502 A CN201910568502 A CN 201910568502A CN 110369822 A CN110369822 A CN 110369822A
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- Prior art keywords
- tin
- contact pin
- wards
- goes
- deep hole
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
A kind of efficient reliable small deep hole rotation wards off tin and goes golden method, is related to Gold plated Layer removal technology field；Include the following steps: Step 1: winding adhesive tape in pin tip side wall；Step 2: the contact pin syringe needle after n winding adhesive tape is sequentially inserted into the opening for warding off tin tool pedestal；Step 3: being packed into solder stick in scolding tin hole, and in contact pin top cover upper cover plate；Step 4: substrate is rotated by 90 °, n contact pin is axially horizontal positioned；Step 5: circumferentially rotatable n contact pin, while contact pin is heated；Step 6: rotating horizontally substrate；N contact pin is heated simultaneously；Step 7: repeating step 3 to step 6；Step 8: adhesive tape of dismantling；Washes of absolute alcohol, ultrasonic cleaning, drying and processing are successively carried out to contact pin；The present invention improves small deep hole and wards off tin, goes the efficiency of gold, while realizing that small deep hole thoroughly goes golden effect.
Description
Technical field
The present invention relates to Gold plated Layer removal technology field, especially a kind of efficient reliable small deep hole rotation wards off tin and removes gold
Method.
Background technique
Gold due to its, not oxidizable, good welding performance good with chemical stability, it is wear-resisting, conduct electricity very well and contact electricity
Hinder it is small etc. it is a series of a little, be widely used in electronics industry.And fresh nickel layer surface can be effectively protected in Gold plated Layer, prevent
Only it is aoxidized, to improve solderability.The inner conductor of connector generallys use gold-plated processing.But one is just brought in welding
A difficulty need to be to welding position to prevent the crisp generation of gold --- and small deep hole ward off tin and removes gold, but non-welded part ---
The outer surface of inner conductor cannot have scolding tin.
The prior art, warding off tin processing method such as patent of invention 201410365156.X, patent name for one kind is mainly
Gold is removed for the tin of warding off of lead, wards off tin using tin pot, the inner hole that this method cannot be applicable in small deep hole wards off tin and goes golden situation；
CN106312233A, patent name are a kind of side for going gold to ward off the specific purpose tool of tin for QFN encapsulation component and gold being gone to ward off tin
Method carries out warding off tin and removes gold, be still not suitable for small deep hole by the melting soldering alloy wave crest gushed to the pin of surface mounting component
Part wards off tin and removes gold,
Other patent majorities retrieved remove gold for outer surfaces such as the gold-plated pin of component or surface mount devices
Process is all using contact resistance heating, and inner conductors are heated, and after hole Nei Jiaxi melts, uses suction tin band pair
Scolding tin is absorbed in hole, and the method efficiency is slow, and is easy to appear that ward off tin incomplete, is inhaled tin and is not thorough, need to ward off tin repeatedly, inhale
Tin；And there is no only ward off the method that tin removes gold to inner hole for small deep hole.
Summary of the invention
It is an object of the invention to overcome the above-mentioned deficiency of the prior art, a kind of efficient reliable small deep hole rotation is provided
It wards off tin and goes golden method, improve small deep hole and ward off tin, go the efficiency of gold, while realizing that small deep hole thoroughly goes golden effect.Not only fit
Gold is removed for small deep hole, the inner wall for being also applied for the hollow part of other single radial cuts or dual openings wards off tin or removes gold.
Above-mentioned purpose of the invention is achieved by following technical solution:
A kind of efficient reliable small deep hole rotation wards off tin and goes golden method, includes the following steps:
Step 1: contact pin is axially vertical, and syringe needle is placed downwards, and the axial top of contact pin is provided with scolding tin hole；Tip side
Wall is provided with gas vent；Adhesive tape is wound in pin tip side wall；
Step 2: substrate level is placed；N, which wards off tin tool pedestal and is placed adjacent, to form a line, and is fixedly mounted on substrate
Surface；And it wards off tin tool pedestal opening and places straight up；Contact pin syringe needle after n winding adhesive tape is sequentially inserted into and wards off tin tooling
In the opening of pedestal；N is the positive integer more than or equal to 3；
It is Step 3: be packed into solder stick in scolding tin hole at the top of contact pin, and in contact pin top cover upper cover plate, scolding tin hole is close
Envelope；
Step 4: substrate is rotated by 90 ° centered on substrate axis, realize that n contact pin is axially horizontal positioned；
Step 5: circumferentially rotatable outermost wards off tin tool pedestal, remaining n-1 are driven to ward off the rotation of tin tool pedestal；Together
When contact pin is heated；It realizes and melts the solder stick in scolding tin hole；Uniform infiltration is in scolding tin hole inner wall surface layer, scolding tin hole
The Gold plated Layer on inner wall surface layer is dissolved in scolding tin；It stops rotating and heats；
Step 6: removing cover board, centered on substrate axial direction one end, substrate is rotated horizontally；N contact pin is added simultaneously
Heat；Scolding tin in scolding tin hole is thrown out of, and the Gold plated Layer of melting is carried over scolding tin；
Step 7: repeating step 3 to step 6, until meeting remaining gold content requirement；
Step 8: it is cooling, contact pin is removed from tin tool pedestal is warded off, adhesive tape of dismantling；Dehydrated alcohol is successively carried out to contact pin
Cleaning, ultrasonic cleaning, drying and processing.
Tin is warded off in a kind of above-mentioned efficient reliable small deep hole rotation and goes golden method, and in the step one, adhesive tape is adopted
Use polyimide material；Winding circle number is 3-4 circle；It is realized after winding adhesive tape and the closing of contact pin tail end gas vent is blocked.
Tin, which is warded off, in a kind of above-mentioned efficient reliable small deep hole rotation goes golden method, in the step three, solder stick
Using 63Sn/37Pb material, length 2.5mm；Diameter is 0.5-0.8mm.
Tin, which is warded off, in a kind of above-mentioned efficient reliable small deep hole rotation goes to golden method, the outer wall of the contact pin and scolding tin hole
Inner wall be coated with Gold plated Layer.
Tin is warded off in a kind of above-mentioned efficient reliable small deep hole rotation and goes golden method, and in the step 5, n are warded off tin work
Dress pedestal drives n contact pin to rotate in a circumferential direction, and adjacent 2 to ward off tin tool pedestal contrary；It is whole that contact pin rotating cycle is greater than 3
Circle.
Ward off tin in a kind of above-mentioned efficient reliable small deep hole rotation and go golden method, in the step 5, to contact pin plus
When hot, contact pin rotary heating temperature is 280 DEG C；Heating time is 1-2s.
Tin, which is warded off, in a kind of above-mentioned efficient reliable small deep hole rotation goes golden method, in the step 6, substrate rotation
It encloses number and is greater than 5 whole circles.
Tin, which is warded off, in a kind of above-mentioned efficient reliable small deep hole rotation goes golden method, in the step 6, heating temperature
It is 280 DEG C；Heating time is 2-3s.
Tin is warded off in a kind of above-mentioned efficient reliable small deep hole rotation and goes golden method, in the step 7, when remaining gold
When content is less than 3wt.%, meet the requirements.
Ward off tin in a kind of above-mentioned efficient reliable small deep hole rotation and go golden method, cooling time 5s；Dehydrated alcohol
When cleaning, 30min is impregnated；The ultrasonic cleaning time is 10min；Drying temperature is 105 DEG C；Drying time is 30min.
The invention has the following advantages over the prior art:
(1) rotation that the present invention uses wards off tin, goes golden method, and when warding off tin, inner conductor is fixed on the center for warding off tin tooling,
As 360 ° of tooling rotate in a circumferential direction, realizes that the scolding tin of the heated shape that is in a liquid state flows in small deep hole, cover entire inner chamber body；
(2) for the present invention when going tin to remove gold, inner conductor does centrifugal rotation with tooling, and the scolding tin of the heated shape that is in a liquid state is from childhood
It is thrown away in deep hole；
(3) method that a kind of rotation of small deep hole of the present invention wards off tin, removes gold, using the present invention can be improved small deep hole ward off tin,
The efficiency of gold is gone, while realizing that small deep hole thoroughly goes golden effect.
Detailed description of the invention
Fig. 1 wards off tin for present invention rotation and removes golden flow chart；
Fig. 2 is that contact pin of the present invention twines adhesive tape schematic diagram；
Fig. 3 is contact pin of the present invention and wards off tin tool pedestal cooperation schematic diagram；
Fig. 4 is n of the present invention and wards off tin tool pedestal along axis rotation schematic diagram；
Fig. 5 is that substrate of the present invention rotates schematic diagram.
Specific embodiment
The present invention is described in further detail in the following with reference to the drawings and specific embodiments:
The present invention, which provides a kind of efficient reliable small deep hole rotation and wards off tin, goes golden method, improves small deep hole and wards off tin, goes
The efficiency of gold, while realizing that small deep hole thoroughly goes golden effect.The present invention, which wards off tin golden method is gone to be applicable not only to small deep hole, removes gold,
The inner wall that can be used for the hollow part of other single radial cuts or dual openings wards off tin or removes gold, is widely used.
Tin is warded off for rotation as shown in Figure 1 and removes golden flow chart, and as seen from the figure, a kind of efficiently reliably tin is warded off in small deep hole rotation
Golden method is gone, is included the following steps:
Step 1: being illustrated in figure 2 contact pin twines adhesive tape schematic diagram, as seen from the figure, contact pin 1 is axial vertical, and syringe needle is downward
It places, the axial top of contact pin 1 is provided with scolding tin hole 12；Top side wall is provided with gas vent 11；It is wound in 1 top side wall of contact pin
Adhesive tape 2；Adhesive tape uses polyimide material；Winding circle number is 3-4 circle；It realizes after winding adhesive tape to 1 tail end gas vent 11 of contact pin
Closing block.The outer wall of contact pin 1 and the inner wall in scolding tin hole 12 are coated with Gold plated Layer.
Step 2: being illustrated in figure 3 contact pin and warding off tin tool pedestal cooperation schematic diagram, as seen from the figure, 5 level of substrate is put
It sets；N, which wards off tin tool pedestal 3 and is placed adjacent, to form a line, and is fixedly mounted on 5 upper surface of substrate；And ward off the opening of tin tool pedestal 3
It places straight up；1 syringe needle of contact pin after n winding adhesive tape 2 is sequentially inserted into the opening for warding off tin tool pedestal 3；N be greater than
Positive integer equal to 3；
Step 3: being packed into solder stick in the scolding tin hole 12 at 1 top of contact pin, and in 1 top cover upper cover plate 4 of contact pin, will weld
Tin hole 12 seals；Solder stick uses 63Sn/37Pb material, length 2.5mm；Diameter is 0.5-0.8mm.
Step 4: substrate 5 is rotated by 90 ° centered on 5 axis of substrate, realize that n contact pin 1 is axial horizontal positioned.
Schematic diagram is rotated along axis Step 5: being illustrated in figure 4 n and warding off tin tool pedestal, it is as seen from the figure, circumferentially rotatable
Outermost wards off tin tool pedestal 3, drives remaining n-1 to ward off the rotation of tin tool pedestal 3；Contact pin 1 is heated simultaneously；Realizing will
Solder stick in scolding tin hole 12 melts；Uniform infiltration is in 12 inner wall surface layer of scolding tin hole, the Gold plated Layer on 12 inner wall surface layer of scolding tin hole
It is dissolved in scolding tin；It stops rotating and heats；Warding off tin tool pedestal 3 for n drives n contact pin 1 to rotate in a circumferential direction, and adjacent 2 are warded off
Tin tool pedestal 3 is contrary；1 rotating cycle of contact pin is greater than 3 whole circles.When heating to contact pin 1,1 rotary heating temperature of contact pin is
280℃；Heating time is 1-2s.
Step 6: being illustrated in figure 5 substrate rotation schematic diagram removes cover board 4 as seen from the figure, it is with the axial one end of substrate 5
Center rotates horizontally substrate 5；N contact pin 1 is heated simultaneously；Scolding tin in scolding tin hole 12 is thrown out of, the Gold plated Layer of melting
As scolding tin is carried over；5 rotating cycle of substrate is greater than 5 whole circles.Heating temperature is 280 DEG C；Heating time is 2-3s.
Step 7: repeating step 3 to step 6, until meeting remaining gold content requirement；When remaining gold content is less than
When 3wt.%, meet the requirements.Cooling time is 5s；When washes of absolute alcohol, 30min is impregnated；The ultrasonic cleaning time is
10min；Drying temperature is 105 DEG C；Drying time is 30min.
Step 8: it is cooling, contact pin 1 is removed from tin tool pedestal 3 is warded off, adhesive tape 2 of dismantling；Contact pin 1 is successively carried out anhydrous
Ethyl alcohol cleaning, ultrasonic cleaning, drying and processing.
The rotation that the present invention uses wards off tin, goes golden method, and when warding off tin, inner conductor is fixed on the center for warding off tin tooling, with
360 ° of tooling rotate in a circumferential direction, and the scolding tin of the heated shape that is in a liquid state flows in small deep hole, cover entire inner chamber body.Tin is being gone to remove gold
When, inner conductor does centrifugal rotation with tooling, and the scolding tin of the heated shape that is in a liquid state is thrown away from small deep hole, realizes that small deep hole is thorough
Go golden effect.
The content that description in the present invention is not described in detail belongs to the well-known technique of those skilled in the art.
Claims (10)
1. a kind of efficient reliable small deep hole rotation wards off tin and goes golden method, characterized by the following steps:
Step 1: contact pin (1) is axial vertical, and syringe needle is placed downwards, and the axial top of contact pin (1) is provided with scolding tin hole (12)；
Top side wall is provided with gas vent (11)；Adhesive tape (2) are wound in contact pin (1) top side wall；
Step 2: substrate (5) is horizontal positioned；N, which wards off tin tool pedestal (3) and is placed adjacent, to form a line, and is fixedly mounted on substrate
(5) upper surface；And it wards off tin tool pedestal (3) opening and places straight up；By n wind adhesive tape (2) after contact pin (1) syringe needle according to
It is secondary to be inserted into the opening for warding off tin tool pedestal (3)；N is the positive integer more than or equal to 3；
Step 3: be packed into solder stick in scolding tin hole (12) at the top of contact pin (1), and in contact pin (1) top cover upper cover plate (4),
Scolding tin hole (12) are sealed；
Step 4: substrate (5) is rotated by 90 ° centered on substrate (5) axis, realize that n contact pin (1) is axially horizontal positioned；
Step 5: circumferentially rotatable outermost wards off tin tool pedestal (3), remaining n-1 are driven to ward off tin tool pedestal (3) rotation；
Contact pin (1) is heated simultaneously；It realizes and melts the solder stick in scolding tin hole (12)；Uniform infiltration is in scolding tin hole (12)
The Gold plated Layer on wall surface layer, scolding tin hole (12) inner wall surface layer is dissolved in scolding tin；It stops rotating and heats；
Step 6: removing cover board (4), centered on the axial one end of substrate (5), rotate horizontally substrate (5)；Simultaneously to n contact pin
(1) it is heated；Scolding tin in scolding tin hole (12) is thrown out of, and the Gold plated Layer of melting is carried over scolding tin；
Step 7: repeating step 3 to step 6, until meeting remaining gold content requirement；
Step 8: it is cooling, contact pin (1) is removed from tin tool pedestal (3) is warded off, adhesive tape of dismantling (2)；Contact pin (1) is successively carried out
Washes of absolute alcohol, ultrasonic cleaning, drying and processing.
2. a kind of efficient reliable small deep hole rotation according to claim 1 wards off tin and goes golden method, it is characterised in that: institute
In the step of stating one, adhesive tape uses polyimide material；Winding circle number is 3-4 circle；It realizes after winding adhesive tape to contact pin (1) tail end
The closing of gas vent (11) blocks.
3. a kind of efficient reliable small deep hole rotation according to claim 1 wards off tin and goes golden method, it is characterised in that: institute
In the step of stating three, solder stick uses 63Sn/37Pb material, length 2.5mm；Diameter is 0.5-0.8mm.
4. a kind of efficient reliable small deep hole rotation according to claim 3 wards off tin and goes golden method, it is characterised in that: institute
The inner wall of the outer wall and scolding tin hole (12) of stating contact pin (1) is coated with Gold plated Layer.
5. a kind of efficient reliable small deep hole rotation according to claim 4 wards off tin and goes golden method, it is characterised in that: institute
It states in step 5, wards off tin tool pedestal (3) for n and n contact pin (1) is driven to rotate in a circumferential direction, and adjacent 2 are warded off tin tool pedestal (3)
It is contrary；Contact pin (1) rotating cycle is greater than 3 whole circles.
6. a kind of efficient reliable small deep hole rotation according to claim 5 wards off tin and goes golden method, it is characterised in that: institute
It states in step 5, when heating to contact pin (1), contact pin (1) rotary heating temperature is 280 DEG C；Heating time is 1-2s.
7. a kind of efficient reliable small deep hole rotation according to claim 6 wards off tin and goes golden method, it is characterised in that: institute
It states in step 6, substrate (5) rotating cycle is greater than 5 whole circles.
8. a kind of efficient reliable small deep hole rotation according to claim 7 wards off tin and goes golden method, it is characterised in that: institute
It states in step 6, heating temperature is 280 DEG C；Heating time is 2-3s.
9. a kind of efficient reliable small deep hole rotation according to claim 8 wards off tin and goes golden method, it is characterised in that: institute
It states in step 7, when remaining gold content is less than 3wt.%, meets the requirements.
10. a kind of efficient reliable small deep hole rotation according to claim 9 wards off tin and goes golden method, it is characterised in that:
Cooling time is 5s；When washes of absolute alcohol, 30min is impregnated；The ultrasonic cleaning time is 10min；Drying temperature is 105 DEG C；
Drying time is 30min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910568502.7A CN110369822B (en) | 2019-06-27 | 2019-06-27 | Efficient and reliable small deep hole rotary tin-coating and gold-removing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910568502.7A CN110369822B (en) | 2019-06-27 | 2019-06-27 | Efficient and reliable small deep hole rotary tin-coating and gold-removing method |
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| Publication Number | Publication Date |
|---|---|
| CN110369822A true CN110369822A (en) | 2019-10-25 |
| CN110369822B CN110369822B (en) | 2021-05-11 |
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| CN201910568502.7A Active CN110369822B (en) | 2019-06-27 | 2019-06-27 | Efficient and reliable small deep hole rotary tin-coating and gold-removing method |
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Cited By (2)
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| CN114243414A (en) * | 2021-12-10 | 2022-03-25 | 中国电子科技集团公司第三十八研究所 | Automatic gold-removing tin-coating process method of SMP connector and tool used by same |
| CN116683259A (en) * | 2023-06-13 | 2023-09-01 | 西安晶捷电子技术有限公司 | Design method of high-frequency cable assembly fixture |
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| CN110369822B (en) | 2021-05-11 |
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