CN100581322C - Method of welding varnished wire and plated circuit soft plate in electronic component - Google Patents
Method of welding varnished wire and plated circuit soft plate in electronic component Download PDFInfo
- Publication number
- CN100581322C CN100581322C CN200710060449A CN200710060449A CN100581322C CN 100581322 C CN100581322 C CN 100581322C CN 200710060449 A CN200710060449 A CN 200710060449A CN 200710060449 A CN200710060449 A CN 200710060449A CN 100581322 C CN100581322 C CN 100581322C
- Authority
- CN
- China
- Prior art keywords
- pad
- bonding pad
- welding
- printed circuit
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The invention relates to a welding method of an enamel wire inside an electronic component and a flexible printed circuit board, and is characterized by the following implementation steps: (1) a flexible printed circuit board bonding pad is set as a double bonding pad, i.e. an upper bonding pad and a lower bonding pad with a connecting channel of the upper bonding pad and the lower bonding pad formed in between; (2) transparent organic protectant is adopted and coated on the surface of the flexible printed circuit board bonding pad; (3) before welding the bonding pad, solder paste is only brushed evenly on the upper bonding pad and then the coated upper bonding pad is heated by hot blast in the temperature ranging between 350 DEG C and 400 DEG C to melt down the solder paste coated on the upper bonding pad; (4) equipment welding is completed with the welding tip of a spot welder pressing the enamel wire on the lower bonding pad; (5) the tin coated on the upper bonding pad is directly scraped by a hand iron and then is coated on the lower bonding pad through the bonding pad connecting channel to cover the enamel wire. The invention effectively prevents the generation of foreign material during welding the enamel wire with the flexible printed circuit board, thereby increasing the bonding force between the enamel wire and the bonding pad and reducing the generation of noise and defective products; moreover, with simple and convenient operation, the invention can be widely applied.
Description
Technical field
The present invention relates to a kind of welding method of electronic devices and components, the welding method of enamelled wire and printed circuit soft board in particularly a kind of electronic devices and components.
Background technology
At present, in the miniature electronic components and parts, enamelled wire (coil) and printed circuit soft board (Fpcb) welding adopt electronic spot welder usually, and printed circuit soft board pad adopts tin (Sn) coating usually.Electronic spot welder is under big current conditions, and moment produces high heat, some soldering tip contact enamelled wire (coil), the megohmite insulant instant melting exposes copper cash, copper cash again with the pad welding, this common process is called the equipment welding.But enamelled wire and the pad bonding strength finished after this welding are very low, often need secondary welding; Generally all be common welding, the tin silk melts on solder horn, puts tin by solder horn on pad, increases the intensity of enamelled wire and pad, and this process is called manual welding usually.
There are a lot of drawbacks in above-described welding procedure, in the equipment welding process, because moment generation high heat, the point soldering tip is again quick decline, printed circuit soft board tin (Sn) pad can be at instant melting, and produces and splash, and a large amount of tin sweat(ing)s are splashed to printed circuit soft board pad outside.Manually in the welding process, tin on the solder horn, because the uncertain of hand moved, can touch the outer place of printed circuit soft board pad, form the foreign matter tin sweat(ing), and when the tin sweat(ing) of high temperature touches the polymer on printed circuit soft board pad next door, can make polymer instant melting, heat release and produce and splash, produce transparent at once or the black foreign matter.All these foreign matters all need to remove in engineering, if do not clean up, will have a strong impact on the work of product, cause the performance of product integral body bad, increase fraction defective, improve production cost, and are not suitable for large-scale production.
Summary of the invention
The objective of the invention is to overcome above-mentioned weak point, the welding method of enamelled wire and printed circuit soft board in a kind of easy and simple to handle, obvious results electronic devices and components is provided.
The technical solution adopted in the present invention is for achieving the above object: the welding method of enamelled wire and printed circuit soft board in a kind of electronic devices and components is characterized in that implementation step is as follows:
(1) printed circuit soft board pad is set to two pads, promptly upper and lower pad two parts, and the upper and lower pad interface channel of middle formation;
(2) adopt transparent organic protective agent (OSPcoating) to be coated on printed circuit soft board bond pad surface;
(3) before the pad welding, brush tin cream on last pad, promptly tin cream only evenly applies at last pad, hot blast heating then, and temperature is 350-400 ℃, makes the fusing of pad tin cream;
(4) carry out the equipment welding then, point welding machine welding head is pressed in down enamelled wire on the pad;
(5) tin that directly will go up pad with flatiron scrapes off, and is coated in down on the pad by the pad interface channel, enamelled wire (coil) is encased get final product.
It is that phenyl three connects azoles BTA that described organic protective agent adopts the organic substance classification.
The invention has the beneficial effects as follows: owing to adopt two pad structures and transparent organic protective agent to be coated on printed circuit soft board pad mode, so avoid producing the phenomenon that tin sweat(ing), foreign matter splash.After the equipment welding, manually weld, but scrape off, be coated in down on the pad, enamelled wire (coil) is encased with the tin that flatiron directly will be gone up pad without the tin silk; Therefore, effectively prevent production of foreign matters in enamelled wire and the printed circuit soft board welding process, increase the adhesion of enamelled wire (coil) and pad, reduce the generation of noise and defective products.Its implementation method is simple, and is easy and simple to handle, has wide range of applications, and is fit to very much large-scale production.
Description of drawings
Fig. 1 is existing printed circuit soft board and pad syndeton schematic diagram;
Pad is single pad, and coating is tin.
Fig. 2 is the printed circuit soft board and structural representation after coil is connected.
Fig. 3 is Fig. 2 sectional view.
Fig. 4 is printed circuit soft board of the present invention and pad syndeton schematic diagram;
Pad is two pads, and protective layer is organic protective agent (OSP coating).
Fig. 5 is a printed circuit soft board of the present invention and structural representation after coil is connected.
Among the figure, 1 printed circuit soft board, 2 collets, 3 enamelled wires, 4 single pads, pad on 5,6 times pads.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, to according to embodiment provided by the invention, details are as follows:
With reference to Fig. 4, Fig. 5, the welding method of enamelled wire and printed circuit soft board in a kind of electronic devices and components, the welding method of the enamelled wire in the micromachine (coil) and printed circuit soft board for example is characterized in that implementation step is as follows:
(1) printed circuit soft board 1 is arranged on the collet 2, and printed circuit soft board 1 pad is set to two pads, promptly upper and lower pad 5,6 two parts, and upper and lower pad 5,6 interface channels of middle formation.
(2) adopt transparent organic protective agent (OSPcoating) to be coated on printed circuit soft board 1 bond pad surface.
(3) before the pad welding, brush tin cream on last pad 5, promptly tin cream only evenly applies at last pad 5, hot blast heating then, and temperature is 350-400 ℃, makes the fusing of pad tin cream.
(4) carry out the equipment welding then, point welding machine welding head is pressed in down enamelled wire 3 on the pad 6.
(5) tin that directly will go up pad 5 with flatiron scrapes off, and is coated in down on the pad 6 by the pad interface channel, enamelled wire 3 (coil) is encased get final product.
It is that phenyl three connects azoles BTA that described organic protective agent adopts the organic substance classification.
Schematic diagrames such as comparison diagram 1-existing printed circuit soft board illustrated in fig. 3 and pad syndeton; It is provided with single pad structure that coating is tin, easily produces tin sweat(ing), foreign matter splashes, direct stained printed circuit soft board, and the drawback of its existence is apparent, has a strong impact on the overall performance that electronic devices and components are used.
Through check analysis, implement this method after, the foreign matter occupation rate drops to 38% by 79%, has reduced 50%.
Above-mentioned detailed description of the welding method of enamelled wire in these electronic devices and components and printed circuit soft board being carried out with reference to embodiment; be illustrative rather than determinate; the present invention can be applicable in the welding procedure of other various electronic devices and components and printed circuit soft board equally; therefore in the variation and the modification that do not break away under the general plotting of the present invention, should belong within protection scope of the present invention.
Claims (2)
1, the welding method of enamelled wire and printed circuit soft board in a kind of electronic devices and components is characterized in that implementation step is as follows:
(1) printed circuit soft board pad is set to two pads, promptly upper and lower pad two parts, and the upper and lower pad interface channel of middle formation;
(2) adopt transparent organic protective agent to be coated on printed circuit soft board bond pad surface;
(3) before the pad welding, brush tin cream on last pad, promptly tin cream only evenly applies at last pad, hot blast heating then, and temperature is 350-400 ℃, makes the fusing of pad tin cream;
(4) carry out the equipment welding then, point welding machine welding head is pressed in down enamelled wire on the pad;
(5) tin that directly will go up pad with flatiron scrapes off, and is coated in down on the pad by the pad interface channel, enamelled wire is encased get final product.
2, the welding method of enamelled wire and printed circuit soft board in the electronic devices and components according to claim 1 is characterized in that it is that phenyl three connects azoles that described organic protective agent adopts the organic substance classification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710060449A CN100581322C (en) | 2007-12-28 | 2007-12-28 | Method of welding varnished wire and plated circuit soft plate in electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710060449A CN100581322C (en) | 2007-12-28 | 2007-12-28 | Method of welding varnished wire and plated circuit soft plate in electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101198220A CN101198220A (en) | 2008-06-11 |
| CN100581322C true CN100581322C (en) | 2010-01-13 |
Family
ID=39548290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710060449A Expired - Fee Related CN100581322C (en) | 2007-12-28 | 2007-12-28 | Method of welding varnished wire and plated circuit soft plate in electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100581322C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI452911B (en) * | 2011-03-04 | 2014-09-11 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108723538A (en) * | 2018-07-19 | 2018-11-02 | 广东盛路通信科技股份有限公司 | A kind of low-temperature welding method and equipment |
-
2007
- 2007-12-28 CN CN200710060449A patent/CN100581322C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI452911B (en) * | 2011-03-04 | 2014-09-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101198220A (en) | 2008-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104737630B (en) | The welding method of low temperature soldering paste | |
| CN110142475A (en) | It is a kind of to be fixedly welded method without tooling for high-power IGBT module | |
| CN205428913U (en) | Power semiconductor module | |
| CN100581322C (en) | Method of welding varnished wire and plated circuit soft plate in electronic component | |
| CN104241025B (en) | A kind of multiple layer nickel plating method of relay1 case | |
| CN108111138A (en) | Method for manufacturing power amplifier | |
| CN202415672U (en) | Circuit component | |
| CN106356424A (en) | Environment-friendly brazing method for Al back electrode and Cu electrode leads of Si wafer of solar cell | |
| CN104112707B (en) | A kind of solid ultrasonic bonding method based on nickel and copper micropin cone foreign structure | |
| CN107946201B (en) | Preparation method of lead bonding welding spot structure based on local electrodeposition | |
| CN107498126B (en) | Method for enameling tin on deep cavity or narrow cavity | |
| CN104805479A (en) | Surface treatment method for power semiconductor device lead frame | |
| CN115722752A (en) | Tin coating device and process method for surface-mounted bottom terminal component | |
| CN102049580B (en) | Welding method of lead frame | |
| CN102120828B (en) | Swelling solution for removing through-hole residues of epoxy resin circuit board | |
| CN111774682B (en) | Welding method for special-shaped porous printed board | |
| CN110322985A (en) | A kind of electrocondution slurry and its preparation method and application | |
| CN203227940U (en) | Solder wire using environment-friendly fluxes | |
| CN103369857A (en) | A method for processing a testing board before a conductive anodic filament experiment | |
| CN107708329B (en) | A kind of primary method to flow back while realizing BGA plant ball and assembling | |
| CN102886579A (en) | Lead-free high-frequency brazing method for deformed zinc alloy grafting structure | |
| CN106270865A (en) | A kind of lightweight copper component resistance brazing device and method | |
| CN201369426Y (en) | Connection terminal | |
| CN202571524U (en) | Soldering clamp | |
| CN113543481B (en) | 3D circuit board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100113 Termination date: 20141228 |
|
| EXPY | Termination of patent right or utility model |