CN203227940U - Solder wire using environment-friendly fluxes - Google Patents
Solder wire using environment-friendly fluxes Download PDFInfo
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- CN203227940U CN203227940U CN 201320188475 CN201320188475U CN203227940U CN 203227940 U CN203227940 U CN 203227940U CN 201320188475 CN201320188475 CN 201320188475 CN 201320188475 U CN201320188475 U CN 201320188475U CN 203227940 U CN203227940 U CN 203227940U
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- core wires
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Abstract
The utility model provides a solder wire using environment-friendly fluxes. The solder wire comprises a solder alloy layer and a plurality of core wires, the triangular core wires are positioned at the center of the solder alloy layer and connected at the same point, the solder alloy layer comprises at least one opening, and the depth of each opening is smaller than the distance between each core wire and the outer surface of the solder alloy layer. As at least one opening is formed in the solder alloy layer, internal pressure generated after the solder wire is heated can be automatically released, splashing of solder alloys is avoided, the problems of easiness in short-circuiting, continuous soldering and the like of soldered products are avoided, and operating efficiency and product quality are improved. Besides, the contact area of the core wires and the solder alloy layer is enlarged as a plurality of core wires are arranged, soldering is rapider, and soldering effects are better. In addition, the rosin type solder wire is fine in performance by the aid of the fluxes in a new formula, and the solder wire using the environment-friendly fluxes is lead-free and more environmentally friendly.
Description
Technical field
The utility model relates to welding technology field, relates in particular to a kind of solder stick that uses environment protection soldering fluid.
Background technology
Solder stick is a kind of of scolder, is mainly used in manual flatiron weldering and semiautomatic machine welding procedure.Solder alloy can be made up of different alloying components, has unleaded and the branch of lead is arranged; Directly have different specifications according to the line after the weldering processing, as 1.0mm, 0.5mm, 0.2mm, 0.15mm etc.Solder stick is through handling and processing by solder alloy.The manufacturing process of tradition solder stick is mainly: melting, casting, extruding, wire drawing, coiling, packaging and other steps.
Flourish along with electronics industry, the lifting of the lightweight of electronic product, miniaturization, microminiaturization, quality requirement to electronic product is stricter, the particularly appearance of environment-friendly products, requirement is replaced by lead-free solder gradually from the existing tin-lead solder that uses, present lead-free solder development speed is very fast, the particularly present domestic production of still not having of unleaded ultra-fine welding wire, rely on import, and imported product is because of complex manufacturing, and expensive, cycle is long, strengthened enterprise's production product cost, and be single core leadless solder wire, speed of welding is slower.
At present, domestic solder stick technology is relatively backward, in the welding of scolding tin is used, scaling powder mainly solves the welding activity problems, influence welding activity has two big factors: first activating agent is to the oxide of face of weld and the quick removing of spot, and it two is that surfactant is to the effectively reduction of the surface tension of scolder on base material.Because halogen-containing organic matter can efficiently be removed oxide, also can serve as the surface of good activating agent, the tradition formulations of solder flux is that main component is formed with halogen-containing organic amine salt, serious, the residual rosin of environmental pollution is dirty, corrosivity strong, it is big to splash, smog big, residual dirty be universal phenomenon.
And that the immediate cause that causes this phenomenon is exactly colophony type scaling powder (as the rosin core of solder stick, run-of-the-mill percentage is about 3%) prescription is improper, and above-mentioned phenomenon also can be brought the strong potential hazard of corrosivity, influences quality and the reliability of printed circuit board (PCB).
Summary of the invention
In view of the above problems, the utility model provides a kind of solder stick that uses environment protection soldering fluid, has solved existing solder stick inside and has had the internal stress effect, in use easily splashes and causes by weldering product short circuit, connects problem such as weldering.
In order to achieve the above object, the utility model provides a kind of solder stick that uses environment protection soldering fluid, it mainly comprises: solder alloy layer and a plurality of core wires that are positioned at described solder alloy layer, described a plurality of core wire is positioned at described solder alloy layer center, and a plurality of core wires join in same point, described solder alloy layer also includes at least one opening, and the degree of depth of this opening is less than the distance of this core wire from this solder alloy layer outer surface.
Preferable, the utility model provides a kind of solder stick that uses environment protection soldering fluid, and wherein, described a plurality of core wires are three triangle core wires.
Preferable, the utility model provides a kind of solder stick that uses environment protection soldering fluid, and wherein, described a plurality of core wires are five triangle core wires.
Preferable, the utility model provides a kind of solder stick that uses environment protection soldering fluid, and wherein, the angle number of degrees of described opening are in 10 ° to 45 ° the scope.
Preferable, the utility model provides a kind of solder stick that uses environment protection soldering fluid, and wherein, the diameter of described solder alloy layer is in the scope of 0.5mm to 1.0mm.
Preferable, the utility model provides a kind of solder stick that uses environment protection soldering fluid, and wherein, the distance of described core wire central point and phase contact is less than 1/4th of described solder alloy layer diameter.
Preferable, the utility model provides a kind of solder stick that uses environment protection soldering fluid, and wherein, described solder alloy layer comprises two described openings.
Preferable, the utility model provides a kind of solder stick that uses environment protection soldering fluid, wherein, described triangle core wire is the scaling powder layer, and this scaling powder is that Foral is heated to 170 ℃, adds novel active agent A, naturally cool to about 150 ℃, add novel surfactant B, add other auxiliary reagent then, stir and made in 30 minutes.
Compared to prior art, the utility model provides a kind of solder stick that uses environment protection soldering fluid, owing to be provided with at least one opening at the solder alloy layer, the interior pressure that produces after making solder stick be heated can discharge automatically, overcoming solder alloy splashes, thereby avoided by the easy short circuit of weldering product, connect phenomenons such as weldering, improve operating efficiency and product quality, owing to be provided with a plurality of core wires, made core wire and solder alloy layer contact area increase simultaneously, feasible welding is faster, and better effects if in addition, uses the scaling powder of new prescription to make the functional of colophony type solder stick, and the solder stick of described use environment protection soldering fluid is not leaded, more environmental protection.
Description of drawings
Fig. 1 is the schematic cross-section that the utility model embodiment one uses the solder stick of environment protection soldering fluid.
Fig. 2 is the schematic cross-section that the utility model embodiment two uses the solder stick of environment protection soldering fluid.
The specific embodiment
Embodiment one
Please refer to Fig. 1, Fig. 1 is the schematic cross-section that the utility model embodiment one uses the solder stick of environment protection soldering fluid.
In the present embodiment, provide a kind of solder stick 10 that uses environment protection soldering fluid, this solder stick 10 mainly comprises solder alloy layer 101 and three triangle core wires 103 that are poured in the solder alloy layer 101.Traditional core wire is generally a thin cylindrical solder alloy layer 101 that is positioned at, but in present embodiment, described three triangle core wires 103 are the identical equilateral triangle of shape size, these three triangle core wires 103 are uniformly distributed in the solder alloy layer 101, thereby the contact area of triangle core wire 103 and solder alloy layer 101 increases, thereby can be so that be in contact with one another more abundant between triangle core wire 103 and the solder alloy layer 101,101 fusing of solder alloy layer are better rapider in welding process, wherein, three triangle core wires 103 preferably are positioned at the center of solder alloy layer 101, join in same point, and centered by the phase contact, be uniformly distributed in the solder alloy layer 101, scaling powder is evenly distributed, and core wire does not have disconnected scaling powder phenomenon, thereby prevents the fracture of wire that stretches.Solder alloy layer 101 can become to be grouped into by lead-free solder, and three triangle core wires 103 are the scaling powder layer, and solder alloy and three triangle core wires 103 solder by weight percentage are 96-98%, and scaling powder is 2-3%, wherein, described scaling powder layer is that Foral is heated to 170 ℃, add novel active agent A, cool to naturally about 150 ℃, add novel surfactant B, add other auxiliary reagent then, stir and made in 30 minutes.Described scaling powder layer has the auxilliary heat conduction of raising solder stick in welding process, removes oxidation, reduces soldered material surface tension force, removes soldered material surface greasy dirt, increases the effect of bonding area.
In the present embodiment, solder alloy layer 101 also includes an opening 102, the setting of this opening 102 can be so that the interior pressure that solder stick produces after being heated can discharge automatically, overcoming solder alloy splashes, thereby avoided by phenomenons such as the easy short circuit of weldering product, company's welderings, improved operating efficiency and product quality, be the proof stress releasing effect, the angle number of degrees of opening 102 are preferably 10 °-45 °.And as can be seen from Figure 1, the degree of depth of opening 102 is preferably less than the distance of three triangle core wires 103 from solder alloy layer 101 outer surface.This is not destroyed at opening 102 places in order to guarantee three triangle core wires 103.
Need to prove that in the present embodiment, the diameter of solder alloy layer 101 is preferably 0.5mm-1.0mm.The distance of the central point of three triangle core wires 103 and phase contact can be for less than 1/4th of solder alloy layer 101 diameter.In addition, in other embodiments, solder alloy layer 101 can comprise two openings 102 or three openings 102, and opening 102 preferably evenly is arranged at the periphery of solder alloy layer 101.
Embodiment two
Please refer to Fig. 2, Fig. 2 is the schematic cross-section that the utility model embodiment two uses the solder stick of environment protection soldering fluid.The solder stick 10 of the use environment protection soldering fluid that present embodiment provides and the solder stick 10 of the use environment protection soldering fluid among the embodiment one are similar, comprise solder alloy layer 101 and a plurality of core wires 103 that are positioned at solder alloy layer 101, but this moment, core wire was set to five triangle core wires 103.In the present embodiment, solder alloy layer 101 also includes an opening 102, and the angle number of degrees of opening 102 are preferably 10 °-45 °.As can be seen from Figure 1, the degree of depth of opening 102 is less than the distance of core wire 103 from solder alloy layer 101 outer surface.Wherein, five triangle core wires 103 are positioned at solder alloy layer 101 center, join in same point, and are uniformly distributed in centered by the phase contact in the solder alloy layer 101, to prevent the fracture of wire that stretches.The diameter of solder alloy layer 101 is 0.5mm-1.0mm.Equally, the central point of five triangle core wires 103 and the distance of phase contact are less than 1/4th of solder alloy layer 101 diameter.Solder alloy layer 101 can become to be grouped into by lead-free solder, and three triangle core wires 103 are the scaling powder layer, and solder alloy and five triangle core wires 103 solder by weight percentage are 96-98%, and scaling powder is 2-3%, wherein, described scaling powder layer is that Foral is heated to 170 ℃, add novel active agent A, cool to naturally about 150 ℃, add novel surfactant B, add other auxiliary reagent then, stir and made in 30 minutes.
Employed scaling powder effectively replaces halogen in above-described embodiment, under the prerequisite that guarantees original activity, produce the halogen-free colophony type scaling powder of environmental protection, be used for solder stick, this scaling powder does not have the low smog that splashes substantially in welding process, its solder joint residual cleaning of welding back is transparent, extremely low to the corrosivity of printed circuit board (PCB), use the scaling powder of new prescription to make the functional of colophony type solder stick, and the solder stick of described use environment protection soldering fluid is not leaded, environmental protection more.
Various piece adopts the mode of going forward one by one to describe in this specification, and what each part stressed is and the difference of other parts that identical similar part is mutually referring to getting final product between the various piece.
Though the utility model with preferred embodiment openly as above; but it is not to limit the utility model; any those skilled in the art are not in breaking away from spirit and scope of the present utility model; can make possible change and modification, therefore protection domain of the present utility model should be as the criterion with the scope that the utility model claim is defined.
Claims (7)
1. solder stick that uses environment protection soldering fluid, it is characterized in that, solder alloy layer and a plurality of core wire, described a plurality of core wire is positioned at described solder alloy layer center, a plurality of core wires are triangular in shape and join in same point, described solder alloy layer also includes at least one opening, and the degree of depth of this opening is less than the distance of this core wire from this solder alloy layer outer surface.
2. the solder stick of use environment protection soldering fluid according to claim 1 is characterized in that, described a plurality of core wires are three triangle core wires.
3. the solder stick of use environment protection soldering fluid according to claim 1 is characterized in that, described a plurality of core wires are five triangle core wires.
4. the solder stick of use environment protection soldering fluid according to claim 1 is characterized in that, the angle number of degrees of described opening are in 10 ° to 45 ° the scope.
5. the solder stick of use environment protection soldering fluid according to claim 1 is characterized in that, the diameter of described solder alloy layer is in the scope of 0.5mm to 1.0mm.
6. the solder stick of use environment protection soldering fluid according to claim 1 is characterized in that, the distance of described core wire central point and phase contact is less than 1/4th of described solder alloy layer diameter.
7. the solder stick of use environment protection soldering fluid according to claim 1 is characterized in that, described solder alloy layer comprises two described openings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320188475 CN203227940U (en) | 2013-04-16 | 2013-04-16 | Solder wire using environment-friendly fluxes |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320188475 CN203227940U (en) | 2013-04-16 | 2013-04-16 | Solder wire using environment-friendly fluxes |
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| CN203227940U true CN203227940U (en) | 2013-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320188475 Expired - Fee Related CN203227940U (en) | 2013-04-16 | 2013-04-16 | Solder wire using environment-friendly fluxes |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157921A (en) * | 2013-04-16 | 2013-06-19 | 昆山市圣翰锡业有限公司 | Tin wire with environmental-protection scaling powder |
| CN105397231A (en) * | 2015-11-26 | 2016-03-16 | 吴水鱼 | Soldering tin preheating principle and application |
-
2013
- 2013-04-16 CN CN 201320188475 patent/CN203227940U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157921A (en) * | 2013-04-16 | 2013-06-19 | 昆山市圣翰锡业有限公司 | Tin wire with environmental-protection scaling powder |
| CN105397231A (en) * | 2015-11-26 | 2016-03-16 | 吴水鱼 | Soldering tin preheating principle and application |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131009 Termination date: 20190416 |
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| CF01 | Termination of patent right due to non-payment of annual fee |