CN101489358B - Element surface mounting method for flexible circuit board - Google Patents
Element surface mounting method for flexible circuit board Download PDFInfo
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- CN101489358B CN101489358B CN2008100004986A CN200810000498A CN101489358B CN 101489358 B CN101489358 B CN 101489358B CN 2008100004986 A CN2008100004986 A CN 2008100004986A CN 200810000498 A CN200810000498 A CN 200810000498A CN 101489358 B CN101489358 B CN 101489358B
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- flexible circuit
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- surface mounting
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Abstract
The present invention relates to a component surface actual installation method of flexible circuit board. The flexible circuit board is provided with a plurality of jointing pads and a plurality of peripheral ends which are formed with a low-temperature welding layer on the surface through electroplating. Furthermore the jointing pad of flexible circuit board is installed with at least one surface jointing component through a re-welding mode. Before re-welding, a heat-absorbing type compression jointing component is placed on the flexible circuit board. The compression jointing area of the heat-absorbing type compression jointing component comprises the peripheral ends, but does not comprise the surface jointing component or the jointed jointing pads of flexible circuit board. The heat-absorbing type compression jointing component can cause that the highest re-welding temperature of peripheral ends is lower than the highest re-welding temperature of jointing pad. Thus the low-temperature welding layer does not melt, and furthermore a consistent film thickness after re-welding can be maintained.
Description
Technical field
The present invention relates to a kind of on flexible circuit board the reflow technology of installation elements, particularly relate to a kind of element surface mounting method of flexible circuit board.
Background technology
Flexible circuit board (FPC, F1exible Printed Circuit) has the characteristic of flexible and has a plurality of external connection end, externally to be welded in hard circuit board (PCB, Printed Circuit Board) or other electronic product.Usually (Surface Mount Device, the real dress in surface SMD) is to improve value of the product and practicality for example can to carry out surface joint elements such as passive component on flexible circuit board.
The surperficial mounting method of flexible circuit board is will comply with the surface that a predetermined pattern is formed at this flexible circuit board as the welding substance of scolding tin earlier at present, gets then and puts the precalculated position of required surface joint elements at this flexible circuit board.Put into a reflow stove again and heat reflow, make this welding substance fusing,, reach electric connection so that this surface joint elements is welded on this flexible circuit board.Yet in a specific application scenario, the surface of described external connection end can be electroplated the soldered layer that is formed with just like electrotinning in advance, so that soldered.Because the fusing point of this welding substance and the fusing point of this soldered layer are quite approaching, so in the process of reflow, this soldered layer also can produce projection or distortion (can with reference to the little figure of figure 8A) because of melted by heat, existing flexible circuit board 10 is provided with a plurality of external connection end 11, surface electrical is coated with a soldered layer 12, this soldered layer 12 can produce projection or distortion and have uneven thickness after reflow, causes the assembling difficulty.Therefore, the composition surface out-of-flatness meeting of flexible circuit board causes the bad problem of quality that electrically connects during the welding of follow-up external connection end.
This shows that the element surface mounting method of above-mentioned existing flexible circuit board obviously still has inconvenience and defective, and demands urgently further being improved in method and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks the road that solves painstakingly, but do not see always that for a long time suitable design finished by development, and conventional method does not have appropriate method to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of element surface mounting method of new flexible circuit board, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that the element surface mounting method of above-mentioned existing flexible circuit board exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of element surface mounting method of new flexible circuit board, can improve the element surface mounting method of general existing flexible circuit board, make it have more practicality.Through constantly research, design, and after studying repeatedly and improving, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective of the element surface mounting method existence of existing flexible circuit board, and provide a kind of element surface mounting method of new flexible circuit board, technical problem to be solved be make its can be when reflow the heating temperature of differentiation soldered layer, with the unlikely fusing of control soldered layer, make it after reflow, still have more consistent thickness, be very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.For achieving the above object, element surface mounting method according to flexible circuit board of the present invention, it may further comprise the steps: a flexible circuit board is provided, has a plurality of first external connection end and a plurality of joint sheet, the surface of wherein said first external connection end is formed with a soldered layer; Form welding substance in described joint sheet; At least one surface joint elements is set on this welding substance; One heat absorption type pressing element is set in this flexible circuit board, this flexible circuit board is smooth in a support plate, and the pressing zone of this heat absorption type pressing element comprises described first external connection end, but gets rid of described joint sheet and this surface joint elements; And this flexible circuit board of reflow, so that this this surface joint elements of welding substance fusion bond is to described joint sheet, and make the highest reflow temperature of described first external connection end be lower than the highest reflow temperature of described joint sheet by this heat absorption type pressing element.
The element surface mounting method of aforesaid flexible circuit board, wherein said heat absorption type pressing element have a heat absorption body, so that a pressing heat-absorbent surface to be provided.
The element surface mounting method of aforesaid flexible circuit board, wherein said heat absorption body is a metal material.
The element surface mounting method of aforesaid flexible circuit board, wherein said heat absorption type pressing element has more a heat resistant layer, and it coats the remaining surface of this heat absorption body outside this pressing heat-absorbent surface.
The element surface mounting method of aforesaid flexible circuit board, wherein said heat resistant layer comprise glass fabric impregnation resin sheet.
The element surface mounting method of aforesaid flexible circuit board, wherein said heat absorption type pressing element is a press strip.
The element surface mounting method of aforesaid flexible circuit board, wherein said heat absorption type pressing element is a frame-like.
The element surface mounting method of aforesaid flexible circuit board, wherein said first external connection end is for drawing finger.
The element surface mounting method of aforesaid flexible circuit board, wherein said welding substance is identical or approaching with the fusing point of this soldered layer.
The highest reflow temperature difference that the element surface mounting method of aforesaid flexible circuit board, wherein said first external connection end are lower than described joint sheet is about 20 degree or more Celsius.
The element surface mounting method of aforesaid flexible circuit board, wherein said soldered layer is the electrotinning layer.
The element surface mounting method of aforesaid flexible circuit board, wherein said welding substance comprises tin lead or unleaded solder.
The element surface mounting method of aforesaid flexible circuit board, wherein said surface joint elements are chip-shaped passive component.
The element surface mounting method of aforesaid flexible circuit board, the generation type of wherein said welding substance comprises screen printing.
The element surface mounting method of aforesaid flexible circuit board, wherein said first external connection end is formed at a first surface of this flexible circuit board, and described joint sheet is formed at a second surface of this flexible circuit board.
The element surface mounting method of aforesaid flexible circuit board, this first surface of wherein said flexible circuit board is pressed and is touched in this support plate, and this support plate is provided with a plurality of grooves, and its position does not directly contact with this soldered layer to cause this support plate corresponding to described first external connection end.
The element surface mounting method of aforesaid flexible circuit board, wherein said flexible circuit board have a plurality of second external connection end in addition, it is characterized in that the surface of wherein said second external connection end is formed with a high-temperature metal layer.
The element surface mounting method of aforesaid flexible circuit board, wherein said high-temperature metal layer is the electrogilding layer.
The present invention compared with prior art has tangible advantage and beneficial effect.By technique scheme, the element surface mounting method of flexible circuit board of the present invention has following advantage and beneficial effect at least:
Utilize the attached area of pressure of this heat absorption type pressing element to comprise described first external connection end, make its surperficial unlikely fusing of soldered layer, and after reflow, still can keep more consistent thickness.
In sum, the element surface mounting method of flexible circuit board of the present invention, this flexible circuit board have the external connection end that a plurality of joint sheets and a plurality of electroplating surface are formed with the soldered layer.And at least one surface joint elements is set on the joint sheet of this flexible circuit board in the reflow mode.Before the reflow, place a heat absorption type pressing element on this flexible circuit board, the pressing zone of this heat absorption type pressing element comprises described external connection end, but gets rid of this surface joint elements and the engaged joint sheet of this flexible circuit board.Can make the highest reflow temperature of described external connection end be lower than the highest reflow temperature of described joint sheet by this heat absorption type pressing element during reflow.Whereby, the unlikely fusing of this soldered layer, and after reflow, still can maintain consistent thickness.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1: according to first specific embodiment of the present invention, a kind of first surface schematic diagram of flexible circuit board.
Fig. 2: according to first specific embodiment of the present invention, the second surface schematic diagram of this flexible circuit board.
Fig. 3 A to Fig. 3 E: according to first specific embodiment of the present invention, in the flexible circuit board schematic partial cross-sectional view of element surface mounting processing procedure of the present invention along A-A line hatching line among Fig. 2.
Fig. 4: according to first specific embodiment of the present invention, according in this element surface mounting method, contrasting the second surface schematic diagram that the flexible circuit board of heat absorption type pressing element has been set to Fig. 3 D.
Fig. 5: according to first specific embodiment of the present invention, the pressing heat-absorbent surface schematic diagram of employed heat absorption type pressing element in this element surface mounting method.
Fig. 6: according to first specific embodiment of the present invention, the end face schematic diagram of an employed support plate in this element surface mounting method.
Fig. 7: show the joint sheet of this flexible circuit board when reflow with outside the variations in temperature of connection pad and the chart of temperature measurement result.
Fig. 8:, relatively have schematic partial cross-sectional view now with flexible circuit board of the present invention flexible circuit board after reflow according to first specific embodiment of the present invention.(A represents to have now, and B represents the present invention)
Fig. 9:, the flexible circuit board schematic partial cross-sectional view of heat absorption type pressing element has been set in element surface mounting processing procedure of the present invention according to second specific embodiment of the present invention.
[main element symbol description]
10: flexible circuit board 11: external connection end 12: the soldered layer
110: flexible circuit board 111: first surface 112: second surface
External connection end 114 in 113: the first: joint sheet 115: the soldered layer
External connection end 117 in 116: the second: the high-temperature metal layer
120: welding substance
130: surface joint elements 131: electrode
140: heat absorption type pressing element 141: the heat absorption body
142: pressing heat-absorbent surface 143: heat resistant layer
150: 152: the second grooves of 151: the first grooves of support plate
211: perforate
Ach: joint sheet temperature curve
Ech: the first external connection end temperature curve
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, its embodiment of element surface mounting method, method, step, feature and the effect thereof of the flexible circuit board that foundation the present invention is proposed, describe in detail as after.
According to first specific embodiment of the present invention, disclose a kind of element surface mounting method of flexible circuit board.Fig. 1 and Fig. 2 are the first surface and the second surface schematic diagram of a flexible circuit board, and 3A to 3E figure is the schematic partial cross-sectional view of this flexible circuit board in the element surface mounting processing procedure.
At first, as Fig. 1, Fig. 2 and Fig. 3 A, provide a flexible circuit board 110, it has a first surface 111 and an opposing second surface 112, in Fig. 3 A, this first surface 111 of this flexible circuit board 110 down, and this second surface 112 of this flexible circuit board 110 is up.See also Figure 1 and Figure 2, this flexible circuit board 110 has a plurality of first external connection end 113 and a plurality of joint sheet 114, and its material can be copper or copper alloy, and the surface of wherein said first external connection end 113 is formed with a soldered layer 115 (as shown in Figure 3A).Described first external connection end 113 can be formed at the first surface 111 of this flexible circuit board 110, and described joint sheet 114 can be formed at the second surface 112 of this flexible circuit board 110.In the present embodiment, described first external connection end 113 can be draws finger, for to outer engagement.This soldered layer 115 can be electrotinning layer (Sn).More specifically, this flexible circuit board 110 can have a plurality of second external connection end 116 in addition, and the surface of wherein said second external connection end 116 is formed with a high-temperature metal layer 117.This high-temperature metal layer 117 can be electrogilding layer (Au).See also shown in Fig. 3 A, an end of described second external connection end 116 is not hidden by this first surface 111 and this second surface 112 and is hanging shape.
Then, see also shown in Fig. 3 B, form welding substance 120 in described joint sheet 114.This welding substance 120 can comprise tin lead or unleaded solder.Perhaps, in different embodiment, this welding substance 120 can be a scaling powder.And the generation type of this welding substance 120 can comprise screen printing.That is to say, this welding substance 120 is formed on the described joint sheet 114 of this flexible circuit board 110 according to a predetermined pattern printing.
After forming this welding substance 120, see also shown in Fig. 3 C, at least one surface joint elements 130 is set, and (Surface Mount Device is SMD) on this welding substance 120.Wherein, this surface joint elements 130 has a plurality of electrodes 131.This surface joint elements 130 is arranged on this welding substance 120.This surface joint elements 130 can be chip-shaped passive component or IC chip.In the present embodiment, this surface joint elements 130 is chip-shaped passive component, and its electrode 131 is positioned at the two ends of this surface joint elements 130, and is being stained with in this welding substance 120.
Afterwards, see also Fig. 3 D and shown in Figure 4, a heat absorption type pressing element 140 is set in the second surface 112 of this flexible circuit board 110, the first surface 111 of this flexible circuit board 110 is smooth in a support plate 150.As shown in Figure 4, the pressing zone of this heat absorption type pressing element 140 comprises described first external connection end 113, but gets rid of described joint sheet 114 and this surface joint elements 130.This heat absorption type pressing element 140 can have a heat absorption body 141, and so that a pressing heat-absorbent surface 142 to be provided, this pressing heat-absorbent surface 142 is smooth in this second surface 112 of this flexible circuit board 110.This heat absorption body 141 can be metal material, and for example stainless steel or cast iron are to absorb the heat of described first external connection end 113 in follow-up reflow process.See also shown in Fig. 3 D, this heat absorption type pressing element 140 more can have a heat resistant layer 143, and it coats the remaining surface of this heat absorption body 141 outside this pressing heat-absorbent surface 142.Preferably, this heat resistant layer 143 can comprise glass fabric impregnation resin sheet, and it is the basic material of printed circuit board (PCB), can be embedded into bonding jumper again to make this heat absorption type pressing element 140 by cutting clout, subtracts the element cost so can fall.See also Fig. 4 and shown in Figure 5, in the present embodiment, this heat absorption type pressing element 140 can be a press strip.
Please consult shown in Fig. 3 D again, this first surface 111 of this flexible circuit board 110 can be pressed and be touched in this support plate 150, and this support plate 150 is provided with a plurality of first grooves 151 and a plurality of second groove 152 (as shown in Figure 6), described first groove 151 positions are corresponding to described first external connection end 113, to cause this support plate 150 directly not contact with this soldered layer 115, wherein said second groove 152 positions are corresponding to described second external connection end 116, so that this support plate 150 does not directly contact with this high-temperature metal layer 117.Therefore, can in reflow process, avoid described first external connection end 113 or/and described second external connection end 116 to be welded in this support plate 150.
At last, see also shown in Fig. 3 E, with this support plate 150, this flexible circuit board 110 is positioned in the reflow stove with the composition of this this heat absorption type pressing element 140, in these flexible circuit board 110 processes of reflow (reflowing), heat this welding substance 120 on this flexible circuit board 110, so that the electrode 131 of this this surface joint elements 130 of welding substance 120 fusion bond is to described joint sheet 114 and form electrical lotus root and connect relation, and can make the highest reflow temperature of described first external connection end 113 be lower than the highest reflow temperature of described joint sheet 114 by this heat absorption type pressing element 140, to control this soldered layer 115 unlikely fusings, still have more consistent thickness after the reflow.In one embodiment, the described first external connection end 113 the highest reflow temperature difference that is lower than described joint sheet 114 is about 20 degree or more Celsius.Preferably, this welding substance 120 can be identical or approaching with the fusing point of this soldered layer 115, when carrying out reflow, can draw the reflow temperature of described first external connection end 113 by this heat absorption type pressing element 140, make this position have slow liter of local temperature and slow characteristic of falling.
In a test, this flexible circuit board 110 respectively is provided with temperature probe at described joint sheet 114 with described first external connection end 113, to write down the variations in temperature of described position in reflow process.As shown in Figure 7, the temperature curve of described joint sheet 114 is denoted as Ach; The temperature curve of described first external connection end 113 is denoted as Ech.The highest reflow temperature of this joint sheet temperature curve Ach is about 236.7 ℃; The highest reflow temperature of this first external connection end temperature curve Ech is about 210.4 ℃.Be lower than the highest reflow temperature of described joint sheet 114 more than 20 degree Celsius so can prove described first external connection end 113.Therefore, utilize this temperature difference, the welding substance 120 on described joint sheet 114 can be welded the electrode 131 of this surface joint elements 130; But the soldered layer 115 unlikely generation fusing on described first external connection end 113 surfaces are flowed.
See also shown in Fig. 8 A, existing flexible circuit board 10 is when reflow, because external connection end 11 is subjected to the synchronous influence of the reflow temperature of surface joint elements, temperature reaches the fusing point of soldered layer 12 or higher, make the soldered layer 12 that is coated on external connection end 11 produce projection or distortion, and make composition surface out-of-flatness even generation when being connected electrically connect the bad problem of quality with the external circuit board or other circuit boards.See also shown in Fig. 8 B, in the present invention, utilize the attached area of pressure of this heat absorption type pressing element 140 to comprise described first external connection end 113, make its surperficial soldered layer 115 unlikely fusings, and after reflow, still can keep more consistent thickness.
According to second specific embodiment of the present invention, the element surface mounting method of a kind of flexible circuit board that is disclosed and the described fabrication steps of first specific embodiment are roughly the same, and employed element in the method, can be roughly identically with first specific embodiment as flexible circuit board 110, welding substance and surface joint elements 130, repeat no more.See also shown in Figure 9ly, in the step that heat absorption type pressing element is set, a heat absorption type pressing element 140 is arranged on the flexible circuit board 110.In the present embodiment, this heat absorption type pressing element 140 can be frame-like.This heat absorption type pressing element 140 has a plurality of perforates 211, and described perforate 211 is in order to appear this surface joint elements 130 and described second external connection end 116.The pressing zone of this heat absorption type pressing element 140 comprises described first external connection end 113, but gets rid of the joint sheet (do not draw among the figure, but be positioned at the bottom of described surface joint elements 130) and this surface joint elements 130 of this flexible circuit board 110.Whereby, the temperature fusing distortion that this soldered layer of being positioned on described first external connection end 113 is not heated during the reason reflow.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (18)
1. the element surface mounting method of a flexible circuit board is characterized in that it may further comprise the steps:
One flexible circuit board is provided, has a plurality of first external connection end and a plurality of joint sheet, the surface of wherein said first external connection end is formed with a soldered layer;
Form welding substance in described joint sheet;
At least one surface joint elements is set on this welding substance;
One heat absorption type pressing element is set in this flexible circuit board, this flexible circuit board is smooth in a support plate, and the pressing zone of this heat absorption type pressing element comprises described first external connection end, but gets rid of described joint sheet and this surface joint elements; And
This flexible circuit board of reflow so that this this surface joint elements of welding substance fusion bond is to described joint sheet, and makes the highest reflow temperature of described first external connection end be lower than the highest reflow temperature of described joint sheet by this heat absorption type pressing element.
2. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said heat absorption type pressing element has a heat absorption body, so that a pressing heat-absorbent surface to be provided.
3. the element surface mounting method of flexible circuit board according to claim 2 is characterized in that wherein said heat absorption body is a metal material.
4. the element surface mounting method of flexible circuit board according to claim 2 is characterized in that wherein said heat absorption type pressing element has more a heat resistant layer, and it coats the remaining surface of this heat absorption body outside this pressing heat-absorbent surface.
5. the element surface mounting method of flexible circuit board according to claim 4 is characterized in that wherein said heat resistant layer comprises glass fabric impregnation resin sheet.
6. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said heat absorption type pressing element is a press strip.
7. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said heat absorption type pressing element is a frame-like.
8. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said first external connection end is for drawing finger.
9. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said welding substance is identical or approaching with the fusing point of this soldered layer.
10. the element surface mounting method of flexible circuit board according to claim 9 is characterized in that the highest reflow temperature difference that wherein said first external connection end is lower than described joint sheet is about 20 degree or more Celsius.
11. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said soldered layer is the electrotinning layer.
12. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said welding substance comprises tin lead or unleaded solder.
13. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said surface joint elements is chip-shaped passive component.
14. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that the generation type of wherein said welding substance comprises screen printing.
15. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said first external connection end is formed at a first surface of this flexible circuit board, described joint sheet is formed at a second surface of this flexible circuit board.
16. the element surface mounting method of flexible circuit board according to claim 15, this first surface pressure that it is characterized in that wherein said flexible circuit board is touched in this support plate, and this support plate is provided with a plurality of grooves, its position does not directly contact with this soldered layer to cause this support plate corresponding to described first external connection end.
17. the element surface mounting method of flexible circuit board according to claim 1 is characterized in that wherein said flexible circuit board has a plurality of second external connection end in addition, it is characterized in that the surface of wherein said second external connection end is formed with a high-temperature metal layer.
18. the element surface mounting method of flexible circuit board according to claim 17 is characterized in that wherein said high-temperature metal layer is the electrogilding layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100004986A CN101489358B (en) | 2008-01-14 | 2008-01-14 | Element surface mounting method for flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100004986A CN101489358B (en) | 2008-01-14 | 2008-01-14 | Element surface mounting method for flexible circuit board |
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| CN101489358A CN101489358A (en) | 2009-07-22 |
| CN101489358B true CN101489358B (en) | 2011-03-16 |
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| CN2008100004986A Expired - Fee Related CN101489358B (en) | 2008-01-14 | 2008-01-14 | Element surface mounting method for flexible circuit board |
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| TWI590735B (en) * | 2014-12-15 | 2017-07-01 | 財團法人工業技術研究院 | Signal transmission board and manufacturing method thereof |
| TWI576026B (en) | 2015-07-17 | 2017-03-21 | 財團法人工業技術研究院 | Circuit structure |
| CN105428261A (en) * | 2015-12-23 | 2016-03-23 | 南通富士通微电子股份有限公司 | SMT (surface mount technology) method for fixing substrate by using UV (ultra violet) film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2534775Y (en) * | 2002-04-03 | 2003-02-05 | 英业达股份有限公司 | Heat conduction radiating structure for electronic element of circuit board |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2534775Y (en) * | 2002-04-03 | 2003-02-05 | 英业达股份有限公司 | Heat conduction radiating structure for electronic element of circuit board |
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Granted publication date: 20110316 Termination date: 20180114 |