CN2534775Y

CN2534775Y - Heat conduction radiating structure for electronic element of circuit board

Info

Publication number: CN2534775Y
Application number: CN 02230267
Authority: CN
Inventors: 王锋谷; 郑懿伦
Original assignee: Inventec Corp
Current assignee: Inventec Corp
Priority date: 2002-04-03
Filing date: 2002-04-03
Publication date: 2003-02-05
Anticipated expiration: 2012-04-03

Abstract

The utility model discloses a heat-inducting and dispersing structure for an electrical component of a circuit plate, which comprises a metal heat-dispersing piece, a soft sheet heat-inducting glue level arranged between the metal heat-dispersing piece and the electrical component; the sheet heat-inducting glue level is a normal soft heat-inducting glue with a fixing appearance (such as a silica gel piece including a powder heat-inducting material); the metal heat-dispersing piece arranged on any side or both sides of the electrical component all can pass through the sheet heat-inducting glue to form a much better contact with the metal heat-dispersing piece; besides, by using of the sheet heat-dispersing glue, the utility model can transfer the heat to the metal heat-dispersing piece to provide a heat-inducting module for the share to a plurality of electrical components.

Description

A kind of heat conduction and heat radiation structure of circuit board electronic component

Technical field

The utility model relates to a kind of conductive structure, is meant a kind of heat conduction and heat radiation structure that is used to distribute the heat of electronic building brick such as chip (chip) or analog especially.

Background technology

Because electronic technology develops rapidly, use electronic equipment as integrated circuit electronic building bricks such as (IC), its caloric value will be more and more high and size can be more and more little, for this intensive heat effectively is dispersed into environment, normally utilize to have the larger area radiating subassembly and be attached on the surface of heating electronic building brick, increase overall area of dissipation to promote radiating effect.Known radiating subassembly includes radiating fin (heat sinks) and radiator fan (cooling fans).For the narrow and small notebook computer of volume, the heat radiation of electronic building brick requires to seem important especially, but above-mentioned radiating fin and radiator fan are owing to highly bigger, so difficult the use among notebook computer or other more small-sized electronic equipment.

The effect of radiating fin is in order to increase the area of dissipation of electronic building brick, it typically uses the good material of thermal conductivity and comes Production Example such as copper, aluminium or other analog, radiating fin is fixed on the surface of electronic building brick by other device, transmits heat by radiating fin and electronic component contact surface each other again.Because radiating fin is not easy to reach desirable contacting with the normal influence because of manufacturing technology in surface that electronic building brick contacts with each other, and can make the area and the heat transfer efficiency that conduct heat be affected like this.

United States Patent (USP) the 5th people such as Jay H.Feinberg, 060, in No. 114, disclosed the conductive structure of a kind of use class colloid heat carrier (gel-like pad), a kind of in order to assist by the electronic building brick discharge heat of package among metal shell, class colloid heat carrier wherein is enclosed in above-mentioned by the electronic building brick periphery of package in metal shell, and then packaged by a metallic shield shell (metalshield), reaches the purpose of heat radiation and electromagnetic shielding thus.

In addition at people's such as James D.MacDonald United States Patent (USP) the 6th, 195, in 276B1 number, a kind of method that solves electronic building brick such as chip (Chips) heat radiation and electromagnetic shielding (EMI) problem has simultaneously been proposed, wherein disclosed technology mainly is the shell (inwall has a coat of metal) that utilizes plastics the to make screen as chip, and fill up therein heat-conducting glue (Thermally Conductivegel) in order to the heat transferred of chip to shell, and then heat is distributed to the outside of electronic installation by a heat-conducting glue between between a shell outer side surface and an electronic device housing.The function of electromagnetic shielding is provided for the plastic casing of the coat of metal by inwall simultaneously.

Though all disclosed among two above-mentioned prior proprietary technologies and used the technology of a kind of heat-conducting glue as Heat Conduction Material, their main purpose has comprised the function that electromagnetic shielding is provided, this is then variant mutually at the structure of reaching aspect the heat sinking function.

Though above-mentioned technology has the function of electromagnetic shielding and heat radiation, but their structure obviously has suitable height (thickness), the electronic installation that the face inside space is narrow and small, the electronic installation that particularly has two circuit boards probably will be difficult to install and uses above-mentioned technology that the required heat sinking function of electronic building brick of two circuit boards is provided.

Summary of the invention

Main purpose of the present utility model provides a kind of heat conduction and heat radiation structure of circuit board electronic component, is particularly suitable for using having the electronic installation of narrow and small inner space.

Another purpose of the present utility model is to provide a kind of heat conduction and heat radiation structure of sharing for monolithic electronic component, allows be located at two electronic building bricks on the circuit board respectively and can both share this conductive structure.

The conductive structure that the utility model proposed, comprised a metal fin, and the soft sheet heat conduction glue-line between this metal fin and electronic building brick, particularly a kind of normality of sheet heat-conducting glue wherein promptly has the fixing soft heat-conducting glue of the external form silica gel sheet of powdery heat conducting material (as contain), the electronic building brick that is configured in metal fin one side can form excellent contact with metal fin by the sheet heat-conducting glue, and by the sheet heat-conducting glue with heat transferred to metal fin, and provide a kind of conductive structure of sharing for several electronic building bricks.

Conductive structure of the present utility model, metal fin also can be configured between two circuit boards, and the sheet heat-conducting glue is configured in the both side surface of metal fin, contact with the surface of electronic building brick respectively, the electronic building brick that therefore is located at various boards respectively can be shared same heat conducting module and dispel the heat.

Described metal fin can select for use preferable Heat Conduction Material to make, for example copper coin, copper alloy, aluminium flake, aluminium alloy and the making of other analog.

The beneficial effects of the utility model are, can be advantageously used in the narrow and small notebook computer of volume and electronic installation such as PDA in, reach better heat radiating effect.

Below in conjunction with embodiment and accompanying drawing, the utility model is further specified.

Description of drawings

Fig. 1 is the structure decomposition map of first kind of embodiment of the present utility model;

Fig. 2 is the structure profile diagram of first kind of embodiment;

Fig. 3 is the structure profile diagram of second kind of embodiment of the present utility model.

Embodiment

In Fig. 1 and Fig. 2, first kind of disclosed conductive structure of embodiment of the present utility model includes: a sheet of metal fin 10, and the one-sided heat-conducting glue 20 that is attached to metal fin 10, the another side of this heat-conducting glue 20 then forms excellent contact with the electronic building brick 30 that is installed in a circuit board 40 surfaces, in order to the heat transferred of electronic building brick 30 to metal fin 10.

In Fig. 3, show second kind of embodiment of the present utility model, it provides a kind of for the shared conductive structure of a plurality of electronic building bricks, according to disclosed example among the figure, this conductive structure is configured in two circuit board 40a, and between the 40b, the surface of a slice circuit board 40a in office or 40b is equipped with electronic building brick 30a, 30b, they all will be shared this conductive structure and dispel the heat.In order to reach this purpose, this heat conducting module includes: a sheet of metal fin 10, and the heat-conducting glue 20a that is attached to the both side surface of metal fin 10,20b, and these two heat-conducting glue 20a, the another side of 20b then again respectively with electronic building brick 30a, 30b contacts closely, in order to electronic building brick 30a, the heat transferred of 30b is to metal fin 10, and then provide two circuit board 40a, the electronic building brick 30a of 40b, all sharable heat conducting module of 30b.

Above-mentioned metal fin 10 can select for use preferable Heat Conduction Material to make, for example copper coin, copper alloy, aluminium flake, aluminium alloy and other analog.The fuel plate that metal fin 10 is preferably straight should increase its area under the electronic installation inner space allows, as much as possible so that enough area of dissipations to be provided.

Heat-conducting glue 20 is to adopt to make as silica gel material basically, infiltrate the particulate of tool thermal conductivity therein, can become a kind of softness and possess the heat-conducting glue 20 of the capacity of heat transmission, preferred embodiment has comprised this heat-conducting glue 20 has been made into the sheet heat-conducting glue 20 that has solid shape under normal conditions, owing to have fixing external form under the normality, so do not need the support or the packing of remaining component, just can be installed between metal fin 10 and the electronic building brick 30, preferable heat transfer medium is provided, relevant technology can be with reference to United States Patent (USP) 5,060, and 114 and 6,195, the technology contents of 267B1; Utilize its soft characteristic so can keep contacting closely, to improve the conducting effect of heat with the surface of electronic building brick 30 and metal fin 10.

Comprehensive above-mentioned explanation, the disclosed conductive structure of the utility model be specially adapted to the narrow and small electronic installation in space (as mobile computer, PDA), the heat sinking function that provides the electronic building brick on the multichip circuit plate to share.

Claims

1. the heat conduction and heat radiation structure of a circuit board electronic component is installed in a side that is arranged on the electronic component of circuit board surface, comprises a heat conducting module, it is characterized in that described heat conducting module includes:

One metal fin is a kind of straight chip component; And

One heat conduction glue-line is a kind of thermal conductive material layer that infiltrates tool thermal conductivity particulate, and described heat conduction glue-line is configured between this metal fin and the electronic building brick.

2. the heat conduction and heat radiation structure of a kind of circuit board electronic component as claimed in claim 1, wherein said metal fin are a kind of copper sheets.

3. the heat conduction and heat radiation structure of a kind of circuit board electronic component as claimed in claim 1, wherein said metal fin are a kind of alcu alloy films.

4. the heat conduction and heat radiation structure of a kind of circuit board electronic component as claimed in claim 1, wherein said metal fin are a kind of aluminium flakes.

5. the heat conduction and heat radiation structure of a kind of circuit board electronic component as claimed in claim 1, wherein said metal fin are a kind of aluminum alloy sheets.

6. the heat conduction and heat radiation structure of a kind of circuit board electronic component as claimed in claim 1, wherein said metal fin is installed between the electronic building brick of two circuit board surfaces.

7. the heat conduction and heat radiation structure of a kind of circuit board electronic component as claimed in claim 1, wherein said heat conduction glue-line are the sheet heat-conducting glues that has solid shape under a kind of normality.

8. the heat conduction and heat radiation structure of a kind of circuit board electronic component as claimed in claim 1, wherein said heat conduction glue-line are a kind of silica gel sheets.