CN100357809C - Back light module - Google Patents
Back light module Download PDFInfo
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- CN100357809C CN100357809C CNB031243096A CN03124309A CN100357809C CN 100357809 C CN100357809 C CN 100357809C CN B031243096 A CNB031243096 A CN B031243096A CN 03124309 A CN03124309 A CN 03124309A CN 100357809 C CN100357809 C CN 100357809C
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- transducer
- cover plate
- disposed
- backlight module
- module
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Abstract
The present invention relates to a back light module which is mainly composed of a module body, a converter, a converter cover plate and a heat dissipating device, wherein the converter is arranged at the bottom of the module body, the converter cover plate is arranged at the bottom of the module body, and the inner surface of the converter cover plate contacts and covers the converter; the heat dissipating device is arranged on the outer surface of the converter cover plate, and the heat dissipating device is provided with a plurality of heat dissipating fins. The heat dissipating device is arranged on the outer surface of the converter cover plate, high heat generated by the converter which directly contacts the converter cover plate can be smoothly guided out of the back light module, and thereby, the brightness of the back light module is enhanced.
Description
Technical field
The present invention is about a kind of backlight module, and the backlight module of particularly discharging about a kind of high heat that has heat abstractor and can effectively transducer (inverter) be produced.
Background technology
The progressive rapidly tremendous progress that is indebted to semiconductor subassembly or man-machine display device mostly of multimedia society.With regard to display, cathode ray tube (CRT) is monopolized monitor market in recent years because of having excellent display quality and its economy always.Yet, operate the environment of a plurality of terminating machine/display equipments on the table for the individual, or with the incision of the viewpoint of environmental protection, if predicted with the trend of saving the energy, cathode-ray tube (CRT) is because of still existing a lot of problems in space utilization and the energy resource consumption, and can't effectively provide solution for the demand of light, thin, short, little and low consumpting power.Therefore, the LCD (LCD) with high image quality, high spatial utilization ratio, low consumpting power, advantageous characteristic such as radiationless becomes the main flow in market gradually.
It should be noted that because liquid crystal molecule itself can't be luminous, so must provide liquid crystal panel required area source, make liquid crystal panel reach the effect of demonstration, and obtain enough brightness and contrast simultaneously by means of backlight module.Backlight module is divided into two kinds of side incident type and straight-down negatives usually, wherein, the backlight module of side incident type need pass through a light guide plate (light guideplate), line source is converted to the required area source of liquid crystal panel, the backlight module of straight-down negative then need not dispose light guide plate, just can directly provide liquid crystal panel required area source.
Fig. 1 is the decomposing schematic representation of backlight module in the prior art.Fig. 2 is the combination synoptic diagram of backlight module in the prior art.Please jointly with reference to Fig. 1 and Fig. 2, backlight module 100, this sentences bottom-lighting type back light module is example, it mainly is made of a module body 110, a transducer 120 and a transducer cover plate 130.Module body 110 mainly is made of an outer framework (bezel back) 112 and a plurality of cold-cathode fluorescence lamp (CCFL) 114, these cold-cathode fluorescence lamps 114 are disposed in the outer framework 112, and the material of outer framework 112 for example is the reflection material, in order to the light that cold-cathode fluorescence lamp 114 is launched, concentrate liquid crystal panel (figure does not show) projection of being disposed towards module body 110 tops.
As shown in Figures 1 and 2, transducer 120 is disposed at the bottom of module body 110, and transducer cover plate 130 is disposed at the bottom of module body 110, and transducer cover plate 130 has an inside surface 132 and an outside surface 134, wherein this inside surface 132 contacts with transducer 120, and transducer 120 is covered.Transducer 120 mainly is made of a circuit board 122 and at least one lamp source driven unit 124, and wherein lamp source driven unit 124 is disposed on the circuit board 122, and lamp source driven unit 124 contacts with the inside surface 132 of transducer cover plate 130.Lamp source driven unit 124 can produce high heat in order to drive cold-cathode fluorescence lamp 114 during its running, and therefore, lamp source driven unit 124 can be considered the main heat source in the backlight module 100.
As mentioned above, in the prior art after transducer 120 and transducer cover plate 130 are assembled to the bottom of module body 110 in regular turn, transducer cover plate 130 is about to transducer 120 and covers, the high heat that its transducer 120 is produced when running can be towards the conduction of the bottom of module body 110, cause the rising of module body 110 internal temperatures, when module body 110 temperature inside are higher than the luminance temperature of cold-cathode fluorescence lamp 114, promptly can influence the luminescence efficiency of cold-cathode fluorescence lamp 114, and then the brightness that directly has influence on backlight module 100 presents.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of backlight module, it can successfully be derived the high heat that transducer produced outside the backlight module, operate under the environment of high temperature to avoid cold-cathode fluorescence lamp, and then the raising brightness of backlight module represents.
Based on above-mentioned purpose, the present invention proposes a kind of backlight module, and it mainly is made of a module body, a transducer, a transducer cover plate and a heat abstractor.Wherein, converters is in the bottom of module body; The transducer cover plate is disposed at the bottom of module body, and the transducer cover plate has an inside surface and an outside surface, and the inside surface of transducer cover plate contacts with transducer, and transducer is covered and this transducer cover plate and this transducer are electrically insulated; Heat abstractor (heat sink) is disposed on the outside surface of transducer cover plate, and this heat abstractor has a plurality of heat radiator.
Based on above-mentioned purpose, the present invention also proposes a kind of backlight module, and it mainly is made of a module body, a transducer and a transducer cover plate.Wherein, converters is in the bottom of module body; The transducer cover plate is disposed at the bottom of module body, and the transducer cover plate has an inside surface and an outside surface, and the inside surface of transducer cover plate contacts with transducer, and transducer is covered, and the outside surface of transducer cover plate has a plurality of heat radiator.
In preferred embodiment of the present invention, above-mentioned module body mainly is made of an outer framework and at least one cold-cathode fluorescence lamp.Wherein, this outer framework has an inside surface and an outside surface, and converters is on this outside surface, and cold-cathode fluorescence lamp then is disposed in the outer framework.For example dispose a reflector plate (reflector) on the inside surface of outer framework,, concentrate the liquid crystal panel projection of being disposed towards the module body top in order to the light that cold-cathode fluorescence lamp is launched.In addition, the material of outer framework itself also can adopt the reflection material, with the assembly cost and the time of saving reflector plate.
In preferred embodiment of the present invention, present in order to promote brightness of backlight module, optionally dispose a diffusion sheet and a brightening piece, wherein diffusion sheet for example is to be disposed on the module body and corresponding to the top of cold-cathode fluorescence lamp, and brightening piece for example is to be disposed on the diffusion sheet.
In preferred embodiment of the present invention, above-mentioned transducer mainly is made of a circuit board and at least one lamp source driven unit, and wherein lamp source driven unit is disposed on the circuit board, and lamp source driven unit contacts with the inside surface of transducer cover plate.
In preferred embodiment of the present invention, for example dispose one first radiating gasket (thermal pad) between above-mentioned transducer and the transducer cover plate, and for example dispose one second radiating gasket between transducer cover plate and the heat abstractor.In addition, an also configurable heat-conducting glue between transducer cover plate and the heat abstractor.By first, second above-mentioned radiating gasket or heat-conducting glue to promote the radiating effect of heat abstractor.
The present invention is by increasing configuration one heat abstractor at integrally formed a plurality of heat radiator on the outside surface of transducer cover plate or on the outside surface of transducer cover plate, make the high heat energy that transducer produced that directly contacts successfully derive outside the backlight module, and then promote representing of backlight module brightness with the transducer cover plate.
Description of drawings
For above and other objects of the present invention, feature and advantage can be become apparent, hereinafter will be described in detail a preferred embodiment of the present invention in conjunction with the following drawings, wherein:
Fig. 1 is the decomposing schematic representation of backlight module in the prior art;
Fig. 2 is the combination synoptic diagram of backlight module in the prior art;
Figure 3 shows that the decomposing schematic representation of the preferred embodiment of backlight module of the present invention; And
Figure 4 shows that the combination synoptic diagram of the preferred embodiment of backlight module of the present invention.
Reference numeral:
134,234: outside surface
216: reflector plate
217: diffusion sheet
218: brightening piece
236: heat radiator
240: heat abstractor
242: heat radiator
250: the first radiating gaskets
260: the second radiating gaskets
Embodiment
Figure 3 shows that the decomposing schematic representation of the preferred embodiment of backlight module of the present invention.Figure 4 shows that the combination synoptic diagram of the preferred embodiment of backlight module of the present invention.Please jointly with reference to Fig. 3 and Fig. 4, this sentences bottom-lighting type back light module is example, and it mainly is made of a module body 210, a transducer 220, a transducer cover plate 230 and a heat abstractor 240.Wherein, mainly by an outer framework 212 and 214 formations of a plurality of cold-cathode fluorescence lamp (CCFL), these cold-cathode fluorescence lamps 214 are disposed in the outer framework 212 module body 210.For example dispose a reflector plate 216 on the inside surface of outer framework 212,, concentrate liquid crystal panel (figure does not show) projection of being disposed towards module body 210 tops in order to the light that cold-cathode fluorescence lamp 214 is launched.Certainly, outer framework 212 materials own also can adopt the reflection material, with the assembly cost and the time of saving reflector plate 216.
In addition, for the brightness of promoting backlight module 200 presents, optionally dispose a diffusion sheet 217 and a brightening piece 218, wherein diffusion sheet 217 for example is to be disposed on the module body 210 and corresponding to the top of cold-cathode fluorescence lamp 214, and brightening piece 218 for example is to be disposed on the diffusion sheet 218.
As shown in Figures 3 and 4, transducer 220 is disposed at the bottom of module body 210, and transducer cover plate 230 is disposed at the bottom of module body 210, and transducer cover plate 230 has an inside surface 232 and an outside surface 234, wherein this inside surface 232 contacts with transducer 230, and transducer 220 is covered.Transducer 220 mainly is made of a circuit board 222 and at least one lamp source driven unit 224, and wherein lamp source driven unit 224 is disposed on the circuit board 222, and lamp source driven unit 224 contacts with the inside surface 232 of transducer cover plate 230.
Please continue to consult Fig. 3 and Fig. 4, heat abstractor 240 is disposed on the outside surface 234 of transducer cover plate 230, and this heat abstractor 240 has a plurality of heat radiator 242.Configuration by above-mentioned heat abstractor 240, the high heat energy that the lamp source driven unit 224 of the feasible transducer 220 that directly contacts with transducer cover plate 230 is produced conducts on the heat abstractor 240 via transducer cover plate 230, and this high heat energy is successfully derived outside the backlight module 200.So, the cold-cathode fluorescence lamp 214 of module body 210 inside can be in normal luminance temperature, and then promotes representing of backlight module 200 brightness.
As shown in Figure 4, for example dispose one first radiating gasket 250 between transducer 220 and the transducer cover plate 230, and for example dispose one second radiating gasket 260 between transducer cover plate 230 and the heat abstractor 240, configuration by first radiating gasket 250 and second radiating gasket 260, the high heat that transducer 220 is produced can conduct on the heat abstractor 240 more swimmingly, to promote the radiating effect of heat abstractor 240.Certainly, also configurable one has thermal conduction characteristic and the heat-conducting glue that binds function (figure does not show) concurrently between transducer cover plate 230 and the heat abstractor 240, heat abstractor 240 directly is attached on the transducer cover plate 230, and then saves the cost of assembling.
In the foregoing description, be on the outside surface of transducer cover plate, to increase configuration one heat abstractor, make the high heat energy that transducer produced that directly contacts successfully derive outside the backlight module, and then promote representing of backlight module brightness with the transducer cover plate.Yet, those skilled in the art all can be known by inference easily, the present invention also not only is confined to increase on the outside surface of transducer cover plate configuration one heat abstractor, can be on transducer cover plate ground outside surface direct integrally formed a plurality of heat radiator, can reach the effect of heat radiation too.
In sum, backlight module of the present invention has following advantage at least:
1. the present invention is increasing configuration one heat abstractor or integrally formed a plurality of heat radiator on the outside surface of transducer cover plate on the outside surface of transducer cover plate, make the high heat energy that transducer produced that directly contacts successfully derive outside the backlight module, and then promote representing of backlight module brightness with the transducer cover plate.
2. the present invention is disposing a radiating gasket between transducer and the transducer cover plate and between transducer cover plate and the heat abstractor, and the high heat that transducer is produced can conduct on the heat abstractor more swimmingly, and then promotes the radiating effect of heat abstractor.
Though the present invention discloses as above with a preferred embodiment; right its is not in order to limit the present invention; those skilled in the art is under the situation that does not break away from the spirit and scope of the present invention; can carry out some change or improvement, thus protection scope of the present invention later on the limited range of attached claims be as the criterion.
Claims (10)
1. backlight module comprises:
One module body;
One transducer is disposed at the bottom of this module body;
One transducer cover plate, the bottom that is disposed at this module body to be covering this transducer, and this transducer cover plate and this transducer be electrically insulated, and wherein this transducer cover plate has an inside surface and an outside surface, and this inside surface contacts with this transducer; And
One heat abstractor is disposed on this outside surface, and this heat abstractor has a plurality of heat radiator.
2. backlight module as claimed in claim 1, wherein this module body comprises:
One outer framework has an inside surface and an outside surface, and wherein this converters is on this outside surface; And
At least one cold-cathode fluorescence lamp is disposed in this outer framework.
3. backlight module as claimed in claim 2, the material of wherein being somebody's turn to do outer framework are a reflection material.
4. backlight module as claimed in claim 2 also comprises a reflector plate, and wherein this reflector plate is disposed on this inside surface of this outer framework.
5. backlight module as claimed in claim 2 also comprises a diffusion sheet, and wherein this diffusion sheet is disposed on this module body, and corresponding to the top of this cold-cathode fluorescence lamp.
6. backlight module as claimed in claim 5 also comprises a brightening piece, and wherein this brightening piece is disposed on this diffusion sheet.
7. backlight module as claimed in claim 1, wherein this transducer comprises:
One circuit board; And
At least one lamp source driven unit is disposed on this circuit board, and this lamp source driven unit contacts with this transducer cover plate.
8. backlight module as claimed in claim 1 also comprises one first radiating gasket, and wherein this radiating gasket is disposed between this transducer and this transducer cover plate.
9. backlight module as claimed in claim 1 also comprises one second radiating gasket, and wherein this radiating gasket is disposed between this transducer cover plate and this heat abstractor.
10. backlight module as claimed in claim 1 also comprises a heat-conducting glue, and wherein this heat-conducting glue is disposed between this transducer cover plate and this heat abstractor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031243096A CN100357809C (en) | 2003-04-30 | 2003-04-30 | Back light module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031243096A CN100357809C (en) | 2003-04-30 | 2003-04-30 | Back light module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1542514A CN1542514A (en) | 2004-11-03 |
| CN100357809C true CN100357809C (en) | 2007-12-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031243096A Expired - Lifetime CN100357809C (en) | 2003-04-30 | 2003-04-30 | Back light module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100357809C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100373234C (en) * | 2004-11-29 | 2008-03-05 | 友达光电股份有限公司 | Backlight module |
| TWI460495B (en) * | 2011-11-07 | 2014-11-11 | Au Optronics Corp | Display module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
| US6407781B2 (en) * | 2000-03-24 | 2002-06-18 | Hitachi, Ltd. | LCD device having electronic formed within concave portion of a reflector |
| CN1372317A (en) * | 2002-03-11 | 2002-10-02 | 威盛电子股份有限公司 | Chip heat sink package structure and making method thereof |
| CN2534775Y (en) * | 2002-04-03 | 2003-02-05 | 英业达股份有限公司 | Heat conduction radiating structure for electronic element of circuit board |
-
2003
- 2003-04-30 CN CNB031243096A patent/CN100357809C/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
| US6407781B2 (en) * | 2000-03-24 | 2002-06-18 | Hitachi, Ltd. | LCD device having electronic formed within concave portion of a reflector |
| CN1372317A (en) * | 2002-03-11 | 2002-10-02 | 威盛电子股份有限公司 | Chip heat sink package structure and making method thereof |
| CN2534775Y (en) * | 2002-04-03 | 2003-02-05 | 英业达股份有限公司 | Heat conduction radiating structure for electronic element of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1542514A (en) | 2004-11-03 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20071226 |
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| CX01 | Expiry of patent term |