WO2018036202A1 - Method for non-contact heating and tin brazing of metal structural member and pcb - Google Patents

Method for non-contact heating and tin brazing of metal structural member and pcb Download PDF

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Publication number
WO2018036202A1
WO2018036202A1 PCT/CN2017/083221 CN2017083221W WO2018036202A1 WO 2018036202 A1 WO2018036202 A1 WO 2018036202A1 CN 2017083221 W CN2017083221 W CN 2017083221W WO 2018036202 A1 WO2018036202 A1 WO 2018036202A1
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Prior art keywords
pcb
metal structural
structural member
workpiece
heating
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PCT/CN2017/083221
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French (fr)
Chinese (zh)
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吕晓胜
郭林波
王文长
孙善球
刘海滨
朱龙翔
岳德周
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京信通信技术(广州)有限公司
京信通信系统(中国)有限公司
天津京信通信系统有限公司
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Publication of WO2018036202A1 publication Critical patent/WO2018036202A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/005Soldering by means of radiant energy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/085Cooling, heat sink or heat shielding means

Definitions

  • the invention relates to the field of processing technology, in particular to a welding related technology in the field of communication technology, in particular to a non-contact integral heating tin brazing method for a metal structural member and a PCB.
  • the base station antenna is a key component of the coverage of the mobile communication network.
  • the base station antenna is composed of a main feed end and a plurality of terminal components, and the metal structural member and the PCB component are the intermediate bridge between the main feed end and the terminal component, and the metal structural member.
  • the connection to the PCB is typically tin brazing.
  • the combination of PCB and metal structural parts is a grounding effect, and grounding is a very important indicator in the communications industry. Grounding technology is an important technology that must be taken when any electronic or electrical equipment or system works normally. It is not only a necessary means to protect equipment and personal safety, but also to suppress electromagnetic interference, ensure electromagnetic compatibility of equipment or systems, and improve equipment or system reliability. Important technical measures.
  • the conventional tin brazing process is a local heating welding method in which a soldering iron is heated to conduct heat to the soldered contact point and to assist the solder wire to fill the solder.
  • the welding method of the metal structural parts of the communication industry is basically welded by the electric soldering iron.
  • high temperature transfer or long-time contact welding is required. High-power soldering station must be used, and the long-term high temperature accelerates the oxidation of the soldering iron tip, and the service life of the soldering iron is greatly reduced.
  • the uneven heating of the soldering joint can not ensure the consistency of the soldering temperature, which leads to the decline of soldering quality reliability.
  • the manual welding method can not guarantee the consistency of the welding time and the amount of tin delivered, the quality consistency is poor, and the operation mode is inefficient.
  • the components composed of metal structural parts and PCBs are used in a base station antenna, and the number of solder joints of a single product is dense. Due to the limitations of manual welding, it is inevitable that there will be virtual welding and leakage welding. The phenomenon. To achieve its fully automated welding, it is basically impossible on the basis of the prior art.
  • the object of the present invention is to provide a non-contact heating tin brazing method for a metal structural member and a PCB which improve welding efficiency and ensure welding quality.
  • the present invention provides the following technical solutions:
  • a non-contact heating tin brazing method for a metal structural member and a PCB comprising an integral heating welding device having a transmission system and a heating system and a cooling system disposed in sequence along the workpiece driving direction, the method comprising the following steps: on the transmission system Placing the workpiece and transferring the workpiece to the heating system through a transmission system, the workpiece being a common body composed of a metal structural member, a PCB, a solder, and a turnover jig; the non-contact heat radiation is integrally heated to melt the solder on the workpiece The workpiece that is heated and welded is cooled to rapidly solidify the molten solder into the desired solder joint.
  • the tin brazing method further includes the step of presetting the workpiece, specifically comprising: placing and locating the metal structural member on the revolving fixture having the limiting and positioning functions; and spacing the PCB from the metal structural member Assembly; solder pre-positioning of the solder joint between the metal structural member and the PCB; after the solder preset is completed, the metal structural member and the PCB are secondarily assembled.
  • the PCB is smoothly fixed to the metal structural member by means of the support.
  • the plurality of PCBs are divided into the positive and negative surfaces and placed in the molding tool with a predetermined gap, thereby being integrally assembled with the metal structural member.
  • the solder is added to the solder joint between the metal structural member and the PCB by a stereo solder automatic adding device.
  • the heating region is partitioned such that the temperature of the region where the non-soldering portion of the PCB is located is lower than the temperature of the region where the solder joint portion is located.
  • the heating regions are layered such that the temperature of the layer on which the lower surface of the PCB is located is lower than the temperature of the layer on which the upper surface is located.
  • the tin brazing method further comprises a subsequent step, specifically comprising: removing the finished finished product from the revolving jig and returning the revolving jig through the transmission system.
  • the welding device is fixed, the solder is added, and the heating and welding are split, and different processes are set up, and the precise division of labor facilitates automation of each process and realizes the module. Management.
  • the solder joint is uniformly pre-soldered, and then the non-contact program controlled heating is performed as a whole, and the solder is integrally completed in the integral heating and soldering device.
  • Preheating, melting, welding, cooling, tin brazing is not affected by the number of solder joints and the size of the soldering device.
  • the solder flow is more uniform and the wetting is more sufficient, which ensures the welding quality of the metal structural parts and the PCB, and improves the welding efficiency. .
  • Figure 1 is a schematic view of an embodiment of the present invention for heat welding of a workpiece in an integral heating and welding apparatus
  • FIG. 2 is a schematic view of another embodiment of the present invention for heat welding of a workpiece in an integral heating and welding apparatus.
  • the non-contact integral heating tin brazing method (hereinafter referred to as "tin brazing method") of the metal structural member and the coaxial cable of the invention mainly comprises a preset workpiece (including solder addition), a non-contact heating workpiece, a cooling workpiece, Four steps of disassembling the workpiece are carried out by fixing the welding device, soldering, heating and welding, setting up different processes and finely controlling them, facilitating the automatic completion of the welding process and realizing modular management.
  • the solder is added in the stereo soldering automatic adding device, which can realize the synchronous multi-point addition of the solder at the solder joints of many required soldering, so that the solder has accurate quantification and the solder shape is moved to ensure the welding process.
  • the flow distance of the solder is consistent.
  • the non-contact heating is performed in an integral heating welding device having a transmission system for transmitting the workpiece and sequentially providing a heating system and a cooling system along the workpiece transmission direction, and the heating system is used for 360-degree full working of the workpiece
  • the heat radiation makes the product evenly heated in each orientation and position, so that the solder on the solder joint is fully absorbed and melted, and then the solder joint between the metal structural member and the coaxial cable is wetted and flowed. Cooling is then performed so that the liquid solder at the solder joint rapidly solidifies to form the desired solder joint.
  • the integral heating and welding device of the present invention transfers heat by means of heat radiation
  • the heating elements thereof include, but are not limited to, infrared heating, heating tube heating, laser heating, and the like, and the heating orientation is not limited to upper heating, lower heating, or Heating up and down, can be heated simultaneously in multiple directions.
  • the preset workpiece step specifically includes:
  • the metal structural member is taken out from the turnover box and placed on a revolving jig having a limit and positioning function, so that the metal structural member is placed in a predetermined position.
  • the support member adopts a multi-array integral structure fixing manner, can ensure the state of each PCB and the metal structural member after assembly, and provides effective and reliable fixation of a plurality of orientations to ensure the consistency of the welding effect.
  • the support member has high temperature resistance characteristics, prevents the support failure of the whole heating process due to the thermal expansion and contraction effect of the object itself, and the support member has the characteristics of fast pick and place.
  • the metal structure of the PCB is fixed together with the revolving jig and placed in a stereo solder automatic adding device for solder presetting.
  • the solder auto-addition device allows for simultaneous solder multi-point addition to the solder joints to be soldered, with precise solder addition and consistent solder shape to ensure consistent solder flow distance during soldering.
  • the metal structure of the solder preset and the semi-finished product of the PCB will be completed and then assembled twice.
  • the preset process of the workpiece is completed, wherein the workpiece is a community composed of a metal structural member, a PCB, a solder and a turnover jig.
  • the semi-finished semi-finished product together with the revolving jig is placed in an integral heating welding device, heated by the heating system on the principle of heat radiation, and cooled by a cooling system.
  • the heating system performs 360-degree heat transfer on the metal structural member and the PCB, so that each orientation and location of the product can be uniformly heated, so that the solder on the solder joint is fully absorbed and melted. And further, wetting and flowing between the metal structural member and the solder joint of the PCB; in addition, the solder passes through the through-hole flow path on the PCB, and the other side of the PCB flows through the via hole, and the through hole of the metal structural member and the PCB The element is diffused between the solder joint and the plating layer to form a corresponding tin-copper alloy layer.
  • the cooling system of the integral heating and welding device cools the workpiece that is heated and welded by, for example, air cooling, and completes the entire non-contact tin brazing.
  • This type of integral heat welding device is capable of setting welding parameters (temperature, time, etc.).
  • the temperature of the welding area is hierarchically and properly set.
  • the peripheral heating at the non-soldering portion of the PCB is 5-10 °C lower than the temperature of the solder joint area (the solder joint 3 and the solder joint 4 in Fig. 1) to avoid deformation of the PCB due to excessive heating;
  • the solder joint temperature of the layer on the upper surface of the PCB is about 5 °C higher than the solder joint of the layer on the lower surface of the PCB. With a small temperature difference, the solder has a flowability in a certain range from a low temperature to a high temperature.
  • the method further comprises removing the finished product of the welded metal structure from the turnover jig and returning the revolving jig through the pipeline to complete the whole single cycle process.
  • the tin brazing method of the first embodiment is similar to that of the first embodiment, and is different in the preset process of the workpiece. Specifically embodied in:
  • the PCB is first taken out of the turnover box, and the corresponding front and back sides are zoned.
  • the side of the PCB to be soldered is placed on a revolving fixture with a predetermined function.
  • all the PCB boards are correspondingly positioned by the die tooling.
  • the pre-positioning function of the stamping tool has high temperature resistance to prevent deformation of the positioned PCB due to the thermal expansion and contraction effect of the object itself.
  • the temperature of the welding area is hierarchically and rationally set.
  • the peripheral heating at the non-soldering portion of the PCB is 5-10 °C lower than the temperature of the solder joint area (the area of the solder joint 3 to 10 in Fig. 1) to avoid deformation of the PCB due to excessive heating; secondly, it is placed on the PCB.
  • the solder joint temperature of the surface is about 5 °C higher than the solder joint on the lower surface of the PCB. With a small temperature difference, the solder has a flowability in a certain range from a low temperature to a high temperature.

Abstract

Provided is a method for non-contact overall heating and tin brazing of a metal structural member and PCB, comprising the following steps: placing a workpiece on a drive system and transferring said workpiece to a heating system by means of the drive system, the workpiece being a joint body consisting of a metal structural member, PCB, weld, and a rotation fixture; heating the workpiece by non-contact thermal radiation of the entire body, causing the weld on the workpiece to melt; cooling the workpiece on which heating and welding has been completed, such that the molten weld rapidly solidifies into a desired weld point. The welded components are fixed, weld material is added, the weld is heated, and splitting is performed to establish two different processes, and a fine division of process steps is advantageous to the automation of each of the process steps, achieving modularized management.

Description

金属结构件与PCB非接触式加热锡钎焊方法Non-contact heating tin brazing method for metal structural parts and PCB 技术领域Technical field
本发明涉及加工技术领域,具体涉及通信技术领域的焊接相关技术,尤其涉及一种金属结构件与PCB非接触式整体加热锡钎焊方法。The invention relates to the field of processing technology, in particular to a welding related technology in the field of communication technology, in particular to a non-contact integral heating tin brazing method for a metal structural member and a PCB.
背景技术Background technique
基站天线是移动通信网络覆盖的关键部件,基站天线由主馈端与众多终端部件连接组成,而金属结构件及PCB构成的组件,正是主馈端与终端部件的中间桥梁,而金属结构件与PCB的连接一般为锡钎焊。PCB与金属结构件的结合,属于接地作用,而接地作用在通信行业是非常重要的指标。接地技术是任何电子、电气设备或系统正常工作时必须采取的重要技术,它不仅是保护设备和人身安全的必要手段,也是抑制电磁干扰、保障设备或系统电磁兼容性、提高设备或系统可靠性的重要技术措施。如果接地不良,整副基站天线就存在着不稳定性,处理不好甚至会危害到整个基站系统。为了保障良好的电气连接导通性能和结构连接稳定性,对于焊点的锡量一致性、焊点的融透性以及力学强度有着苛刻要求。The base station antenna is a key component of the coverage of the mobile communication network. The base station antenna is composed of a main feed end and a plurality of terminal components, and the metal structural member and the PCB component are the intermediate bridge between the main feed end and the terminal component, and the metal structural member. The connection to the PCB is typically tin brazing. The combination of PCB and metal structural parts is a grounding effect, and grounding is a very important indicator in the communications industry. Grounding technology is an important technology that must be taken when any electronic or electrical equipment or system works normally. It is not only a necessary means to protect equipment and personal safety, but also to suppress electromagnetic interference, ensure electromagnetic compatibility of equipment or systems, and improve equipment or system reliability. Important technical measures. If the grounding is poor, the entire base station antenna will be unstable, and the poor handling will even harm the entire base station system. In order to ensure good electrical connection conduction performance and structural connection stability, there are stringent requirements for the solder amount uniformity, solder joint penetration and mechanical strength.
众所周知,传统锡钎焊接工艺是一种局部加热的焊接方法,由烙铁发热,对被焊点进行接触传导热量,同时辅助焊锡丝进行焊料的填充。通信行业的金属结构件的焊接方式,基本上采用这种电烙铁焊接,然而,由于金属结构件的吸热效应,为了使其加热能够满足焊接需求,需要较高的温度传递或长时间接触焊接,就必须选用大功率的焊台,而由于长时间高温,加速烙铁头氧化,电烙铁使用寿命大幅降低,同时加剧了焊点受热不均匀无法保证焊接温度的一致性而造成焊接质量可靠性下降,另一方面,采用人工焊接方式,无法保证焊接时间及送锡量的一致性,质量一致性差,作业方式效率低下。As is known, the conventional tin brazing process is a local heating welding method in which a soldering iron is heated to conduct heat to the soldered contact point and to assist the solder wire to fill the solder. The welding method of the metal structural parts of the communication industry is basically welded by the electric soldering iron. However, due to the heat absorbing effect of the metal structural parts, in order to make the heating meet the welding demand, high temperature transfer or long-time contact welding is required. High-power soldering station must be used, and the long-term high temperature accelerates the oxidation of the soldering iron tip, and the service life of the soldering iron is greatly reduced. At the same time, the uneven heating of the soldering joint can not ensure the consistency of the soldering temperature, which leads to the decline of soldering quality reliability. On the other hand, the manual welding method can not guarantee the consistency of the welding time and the amount of tin delivered, the quality consistency is poor, and the operation mode is inefficient.
金属结构件与PCB构成的组件,在一副基站天线中,用量多,而且单个产品的焊点数量密集,人工焊接由于其局限性,难免会出现虚焊、漏焊 的现象。而要实现其全自动化的焊接,在现有技术的基础上,基本上是不可能的。The components composed of metal structural parts and PCBs are used in a base station antenna, and the number of solder joints of a single product is dense. Due to the limitations of manual welding, it is inevitable that there will be virtual welding and leakage welding. The phenomenon. To achieve its fully automated welding, it is basically impossible on the basis of the prior art.
业界也进行一些尝试,即采用三维机械手带动烙铁进行定位焊接,可以在一定程度上解决了送锡和焊接时间的量化管控,但从原理上还是无法解决金属结构件的带来的吸热影响,产生的焊点可靠性问题。The industry has also made some attempts to use a three-dimensional robot to drive the soldering iron for positioning welding, which can solve the quantitative control of the tin feeding and welding time to a certain extent, but in principle, it cannot solve the heat absorption effect brought by the metal structural parts. The resulting solder joint reliability problem.
发明内容Summary of the invention
本发明的目的旨在提供一种提高焊接效率、保证焊接质量的金属结构件与PCB非接触式加热锡钎焊方法。The object of the present invention is to provide a non-contact heating tin brazing method for a metal structural member and a PCB which improve welding efficiency and ensure welding quality.
为了实现上述目的,本发明提供以下技术方案:In order to achieve the above object, the present invention provides the following technical solutions:
一种金属结构件与PCB非接触式加热锡钎焊方法,包括具有传动系统及沿工件传动方向依次设置的加热系统和冷却系统的整体加热焊接装置,所述方法包括以下步骤:在传动系统上放置工件,并通过传动系统向加热系统传输所述工件,所述工件为金属结构件、PCB、焊料及周转夹具组成的共同体;对工件进行非接触式热辐射整体加热,使工件上的焊料熔融;对加热焊接完成的工件进行冷却,使熔融的焊料快速凝固成所需的焊点。A non-contact heating tin brazing method for a metal structural member and a PCB, comprising an integral heating welding device having a transmission system and a heating system and a cooling system disposed in sequence along the workpiece driving direction, the method comprising the following steps: on the transmission system Placing the workpiece and transferring the workpiece to the heating system through a transmission system, the workpiece being a common body composed of a metal structural member, a PCB, a solder, and a turnover jig; the non-contact heat radiation is integrally heated to melt the solder on the workpiece The workpiece that is heated and welded is cooled to rapidly solidify the molten solder into the desired solder joint.
进一步地,所述锡钎焊方法还包括预置工件的步骤,具体包括:在具有限位和定位功能的周转夹具上放置金属结构件并对其限位和定位;将PCB与金属结构件间隙装配;对金属结构件与PCB之间的焊点处进行焊料预置;在焊料预置完成后,对金属结构件、PCB进行二次组装。Further, the tin brazing method further includes the step of presetting the workpiece, specifically comprising: placing and locating the metal structural member on the revolving fixture having the limiting and positioning functions; and spacing the PCB from the metal structural member Assembly; solder pre-positioning of the solder joint between the metal structural member and the PCB; after the solder preset is completed, the metal structural member and the PCB are secondarily assembled.
优选地,将PCB与金属结构件间隙装配的步骤中,借助支撑件将PCB平稳地固定在金属结构件上。Preferably, in the step of assembling the PCB to the metal structural member, the PCB is smoothly fixed to the metal structural member by means of the support.
优选地,将PCB与金属结构件间隙装配的步骤中,将多个PCB区分正反面以预定间隙放入压模工装中,进而整体与所述金属结构件组装。Preferably, in the step of assembling the PCB into the gap between the metal structural members, the plurality of PCBs are divided into the positive and negative surfaces and placed in the molding tool with a predetermined gap, thereby being integrally assembled with the metal structural member.
优选地,通过立体型焊料自动添加设备向金属结构件和PCB之间焊点处添加所述焊料。Preferably, the solder is added to the solder joint between the metal structural member and the PCB by a stereo solder automatic adding device.
优选地,所述对工件进行非接触式热辐射整体加热步骤中,对加热区域进行分区设置,使得PCB非焊点部位所在区域的温度低于焊点部位所在区域的温度。 Preferably, in the step of performing non-contact thermal radiation heating on the workpiece, the heating region is partitioned such that the temperature of the region where the non-soldering portion of the PCB is located is lower than the temperature of the region where the solder joint portion is located.
进一步地,对加热区域进行分层设置,使得PCB下表面所在一层的温度比其上表面所在一层的温度低。Further, the heating regions are layered such that the temperature of the layer on which the lower surface of the PCB is located is lower than the temperature of the layer on which the upper surface is located.
优选地,所述锡钎焊方法还包括后续步骤,具体包括:从周转夹具上取下焊接完成的成品,并通过传动系统回传周转夹具。Preferably, the tin brazing method further comprises a subsequent step, specifically comprising: removing the finished finished product from the revolving jig and returning the revolving jig through the transmission system.
相比现有技术,本发明的方案具有以下优点:Compared with the prior art, the solution of the invention has the following advantages:
1、本发明的金属结构件与PCB非接触式整体加热焊接方法中,将焊接器件固定、焊料添加、加热焊接进行拆分,设立不同工序,通过精细的分工有利于各个工序实现自动化,实现模块化管理。1. In the non-contact integral heating welding method of the metal structural member and the PCB of the present invention, the welding device is fixed, the solder is added, and the heating and welding are split, and different processes are set up, and the precise division of labor facilitates automation of each process and realizes the module. Management.
2、本发明的锡钎焊方法中,将金属件结构件与PCB相对位置固定后,焊点进行统一预加焊料,然后整体进行非接触式程序控制加热,在整体加热焊接装置内整体完成焊料的预热、融化、焊接、冷却,锡钎焊接不受焊点数量以及焊接器件大小的影响,焊料的流动更均匀、浸润更充分,保证了金属结构件与PCB焊接质量,提高了焊接效率。2. In the tin brazing method of the present invention, after the relative position of the metal structural member and the PCB is fixed, the solder joint is uniformly pre-soldered, and then the non-contact program controlled heating is performed as a whole, and the solder is integrally completed in the integral heating and soldering device. Preheating, melting, welding, cooling, tin brazing is not affected by the number of solder joints and the size of the soldering device. The solder flow is more uniform and the wetting is more sufficient, which ensures the welding quality of the metal structural parts and the PCB, and improves the welding efficiency. .
本发明附加的方面和优点将在下面的描述中部分给出,这些将从下面的描述中变得明显,或通过本发明的实践了解到。The additional aspects and advantages of the invention will be set forth in part in the description which follows.
附图说明DRAWINGS
本发明上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from
图1为本发明的工件在整体加热焊接装置中加热焊接的一种实施方式的示意图;Figure 1 is a schematic view of an embodiment of the present invention for heat welding of a workpiece in an integral heating and welding apparatus;
图2为本发明的工件在整体加热焊接装置中加热焊接的另一种实施方式的示意图。2 is a schematic view of another embodiment of the present invention for heat welding of a workpiece in an integral heating and welding apparatus.
具体实施方式detailed description
下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似 功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本发明,而不能解释为对本发明的限制。The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the accompanying drawings, in which the same or Functional components. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.
本发明的金属结构件与同轴电缆非接触式整体加热锡钎焊方法(以下简称“锡钎焊方法”),主要包括预置工件(含焊料添加)、非接触式加热工件、冷却工件、拆卸工件四大步骤,通过将焊接器件的固定、焊料添加、加热焊接进行拆分,设立不同工序并对其进行精细化管控,便于自动化完成焊接过程,实现了模块化管理。The non-contact integral heating tin brazing method (hereinafter referred to as "tin brazing method") of the metal structural member and the coaxial cable of the invention mainly comprises a preset workpiece (including solder addition), a non-contact heating workpiece, a cooling workpiece, Four steps of disassembling the workpiece are carried out by fixing the welding device, soldering, heating and welding, setting up different processes and finely controlling them, facilitating the automatic completion of the welding process and realizing modular management.
其中,焊料添加在立体型焊料自动添加设备中进行,可实现多所需焊接的焊点处进行焊料的同步多点添加,使其焊料具有精确定量、焊料形状移至,以确保在焊接过程中焊锡的流动距离一致性。Among them, the solder is added in the stereo soldering automatic adding device, which can realize the synchronous multi-point addition of the solder at the solder joints of many required soldering, so that the solder has accurate quantification and the solder shape is moved to ensure the welding process. The flow distance of the solder is consistent.
非接触式加热在整体加热焊接装置中进行,该整体加热焊接装置具有用于传输工件的传动系统及沿工件传动方向依次设置加热系统和冷却系统,并且加热系统用于对工件进行360度全方位热辐射,使得产品的每个方位、部位都可以均匀受热,从而使焊点上的焊料充分吸热熔化,进而在金属结构件与同轴电缆之间的焊点之间进行润湿、流动,继而进行冷却使得焊点处的液体焊料快速凝固而形成所需焊点。The non-contact heating is performed in an integral heating welding device having a transmission system for transmitting the workpiece and sequentially providing a heating system and a cooling system along the workpiece transmission direction, and the heating system is used for 360-degree full working of the workpiece The heat radiation makes the product evenly heated in each orientation and position, so that the solder on the solder joint is fully absorbed and melted, and then the solder joint between the metal structural member and the coaxial cable is wetted and flowed. Cooling is then performed so that the liquid solder at the solder joint rapidly solidifies to form the desired solder joint.
本发明的整体加热焊接装置采用热辐射的传递方式传热,其发热元件包括但不限于红外加热、发热管加热、激光加热等多种加热方式,并且加热方位不限于上方加热、下方加热、或上下方加热,可多方位同时加热。The integral heating and welding device of the present invention transfers heat by means of heat radiation, and the heating elements thereof include, but are not limited to, infrared heating, heating tube heating, laser heating, and the like, and the heating orientation is not limited to upper heating, lower heating, or Heating up and down, can be heated simultaneously in multiple directions.
实施例一 Embodiment 1
所述预置工件步骤具体包括:The preset workpiece step specifically includes:
将金属结构件从周转盒中取出,放进具有限位和定位功能的周转夹具上,使金属结构件按预定位摆放。The metal structural member is taken out from the turnover box and placed on a revolving jig having a limit and positioning function, so that the metal structural member is placed in a predetermined position.
进行PCB与金属结构件之间插入式的间隙装配;确保装配到位后,PCB四周采用一种平台式的支撑件,将PCB平稳地固定在金属结构件上。该种支撑件,采取一种多阵列的整体结构固定方式,能保证每一个PCB与金属结构件装配后的状态,并提供多个方位的有效可靠的固定性,以保证焊接效果的一致性。该支撑件具备耐高温特性,防止因物体本身的热胀冷缩效应,在整体加热过程中的支撑性失效;同时该支撑件具备快速取放的特性。 Insert the gap assembly between the PCB and the metal structural member; ensure that the PCB is surrounded by a platform-type support member to securely fix the PCB to the metal structural member. The support member adopts a multi-array integral structure fixing manner, can ensure the state of each PCB and the metal structural member after assembly, and provides effective and reliable fixation of a plurality of orientations to ensure the consistency of the welding effect. The support member has high temperature resistance characteristics, prevents the support failure of the whole heating process due to the thermal expansion and contraction effect of the object itself, and the support member has the characteristics of fast pick and place.
将固定好PCB的金属结构件连同周转夹具,放到一种立体型焊料自动添加设备中进行焊料预置。该焊料自动添加设备,可对所需焊接的焊点处进行焊料的同步多点添加,使其焊料添加具备精确定量、焊料的形状一致,以确保在焊接过程中焊锡的流动距离一致性。The metal structure of the PCB is fixed together with the revolving jig and placed in a stereo solder automatic adding device for solder presetting. The solder auto-addition device allows for simultaneous solder multi-point addition to the solder joints to be soldered, with precise solder addition and consistent solder shape to ensure consistent solder flow distance during soldering.
将完成焊料预置的金属结构件与PCB半成品,再进行二次组装。The metal structure of the solder preset and the semi-finished product of the PCB will be completed and then assembled twice.
由此完成了工件的预置工序,其中,所述工件为由金属结构件、PCB、焊料及周转夹具组成的共同体。Thereby, the preset process of the workpiece is completed, wherein the workpiece is a community composed of a metal structural member, a PCB, a solder and a turnover jig.
将二次组装完成的半成品连同周转夹具放进一种整体加热焊接装置中,通过加热系统以热量辐射的原理对其加热,并通过冷却系统实施冷却。The semi-finished semi-finished product together with the revolving jig is placed in an integral heating welding device, heated by the heating system on the principle of heat radiation, and cooled by a cooling system.
如图1所示,所述加热系统对金属结构件及PCB,进行360度全方位的热量传递,使产品的每个方位、部位都能均匀受热、从而使焊点上的焊料充分吸热融化,进而在金属结构件与PCB的焊点之间进行润湿、流动;另外,焊料通过PCB上的过孔流道PCB的另一面,通过过孔流动,在金属结构件与PCB的通孔之间、焊点与镀层之间,进行元素扩散,生成相应的锡铜合金层。As shown in FIG. 1 , the heating system performs 360-degree heat transfer on the metal structural member and the PCB, so that each orientation and location of the product can be uniformly heated, so that the solder on the solder joint is fully absorbed and melted. And further, wetting and flowing between the metal structural member and the solder joint of the PCB; in addition, the solder passes through the through-hole flow path on the PCB, and the other side of the PCB flows through the via hole, and the through hole of the metal structural member and the PCB The element is diffused between the solder joint and the plating layer to form a corresponding tin-copper alloy layer.
所述整体加热焊接装置的冷却系统通过比如风冷的方式对加热焊接完成的工件进行冷却,完成整个非接触式的锡钎焊接。The cooling system of the integral heating and welding device cools the workpiece that is heated and welded by, for example, air cooling, and completes the entire non-contact tin brazing.
该种整体加热焊接装置能够对焊接参数(温度、时间等)进行设定。为保证PCB的耐温性,对焊接区域温度进行分层分区合理设置。首先,使处于PCB非焊点部位的周边受热比焊点区域(图1的焊点3、焊点4所在区域)的温度低5-10℃,避免PCB受热过度而变形;其次,使处在PCB上表面所在一层的焊点温度比PCB下表面所在一层的焊点高5℃左右。利用小范围的温差,使焊锡具有从温低向温高的一定范围内的流向性。This type of integral heat welding device is capable of setting welding parameters (temperature, time, etc.). In order to ensure the temperature resistance of the PCB, the temperature of the welding area is hierarchically and properly set. First, the peripheral heating at the non-soldering portion of the PCB is 5-10 °C lower than the temperature of the solder joint area (the solder joint 3 and the solder joint 4 in Fig. 1) to avoid deformation of the PCB due to excessive heating; secondly, it is placed at The solder joint temperature of the layer on the upper surface of the PCB is about 5 °C higher than the solder joint of the layer on the lower surface of the PCB. With a small temperature difference, the solder has a flowability in a certain range from a low temperature to a high temperature.
此外,还包括从周转夹具上取下已焊接好PCB的金属结构件的成品,并通过流水线回传该周转夹具的步骤,完成整一个单循环流程。In addition, the method further comprises removing the finished product of the welded metal structure from the turnover jig and returning the revolving jig through the pipeline to complete the whole single cycle process.
实施例二Embodiment 2
如图2所示,本实施一的锡钎焊方法与实施例一的相类似,其不同之处在于工件的预置工序。具体体现在:As shown in FIG. 2, the tin brazing method of the first embodiment is similar to that of the first embodiment, and is different in the preset process of the workpiece. Specifically embodied in:
在本实施例中,首先将PCB从周转盒中取出,并区相应的正反面。然 后将PCB需要焊接的一面,摆放进具有预定位功能的周转夹具上。同时通过压模工装对所有的PCB板进行相应的整体定位。通过压模工装这一整体预定位的结构工装,能保证多个PCB有效可靠的固定性,同时保证PCB之间的相互位置不超过±0.1mm,以保证焊接效果的一致性。该预定位功能的压模工装具备耐高温特性,防止因物体本身的热胀冷缩效应,造成定位好的PCB变形。In this embodiment, the PCB is first taken out of the turnover box, and the corresponding front and back sides are zoned. Of course After that, the side of the PCB to be soldered is placed on a revolving fixture with a predetermined function. At the same time, all the PCB boards are correspondingly positioned by the die tooling. Through the structural pre-positioning of the stamping tooling, the effective and reliable fixing of multiple PCBs can be ensured, and the mutual position between the PCBs is not more than ±0.1 mm to ensure the consistency of the welding effect. The pre-positioning function of the stamping tool has high temperature resistance to prevent deformation of the positioned PCB due to the thermal expansion and contraction effect of the object itself.
相应地,在焊料预置工序完成之后,二次组装之前,还包括脱模处理工序。Accordingly, after the completion of the solder presetting process, before the secondary assembly, a demolding process is also included.
同理地,为保证PCB的耐温性,对焊接区域温度进行分层分区合理设置。首先,使处于PCB非焊点部位的周边受热比焊点区域(图1的焊点3~10所在区域)的温度低5-10℃,避免PCB受热过度而变形;其次,使处在PCB上表面的焊点温度比PCB下表面的焊点高5℃左右。利用小范围的温差,使焊锡具有从温低向温高的一定范围内的流向性。Similarly, in order to ensure the temperature resistance of the PCB, the temperature of the welding area is hierarchically and rationally set. First, the peripheral heating at the non-soldering portion of the PCB is 5-10 °C lower than the temperature of the solder joint area (the area of the solder joint 3 to 10 in Fig. 1) to avoid deformation of the PCB due to excessive heating; secondly, it is placed on the PCB. The solder joint temperature of the surface is about 5 °C higher than the solder joint on the lower surface of the PCB. With a small temperature difference, the solder has a flowability in a certain range from a low temperature to a high temperature.
以上所述仅是本发明的部分实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。 The above is only a part of the embodiments of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. It should be considered as the scope of protection of the present invention.

Claims (8)

  1. 一种金属结构件与PCB非接触式加热锡钎焊方法,其特征在于,包括具有传动系统及沿工件传动方向依次设置的加热系统和冷却系统的整体加热焊接装置,所述方法包括以下步骤:A non-contact heating tin brazing method for a metal structural member and a PCB, characterized in that it comprises an integral heating welding device having a transmission system and a heating system and a cooling system arranged in sequence along the workpiece transmission direction, the method comprising the steps of:
    在传动系统上放置工件,并通过传动系统向加热系统传输所述工件,所述工件为金属结构件、PCB、焊料及周转夹具组成的共同体;Positioning the workpiece on the transmission system and transmitting the workpiece to the heating system through a transmission system, the workpiece being a community of metal structural members, PCB, solder, and a turnover fixture;
    对工件进行非接触式热辐射整体加热,使工件上的焊料熔融;Non-contact thermal radiation heating of the workpiece to melt the solder on the workpiece;
    对加热焊接完成的工件进行冷却,使熔融的焊料快速凝固成所需的焊点。The workpiece that is heated and welded is cooled to rapidly solidify the molten solder into the desired solder joint.
  2. 根据权利要求1所述的金属结构件与PCB非接触式加热锡钎焊方法,其特征在于,还包括预置工件的步骤,具体包括:The method of non-contact heating tin brazing of a metal structural member and a PCB according to claim 1, further comprising the step of presetting a workpiece, specifically comprising:
    在具有限位和定位功能的周转夹具上放置金属结构件并对其限位和定位;Place metal structural members on the revolving fixture with limit and positioning functions and position and position them;
    将PCB与金属结构件间隙装配;Assembling the PCB from the metal structural member;
    对金属结构件与PCB之间的焊点处进行焊料预置;Solder presetting the solder joint between the metal structural member and the PCB;
    在焊料预置完成后,对金属结构件、PCB进行二次组装。After the solder preset is completed, the metal structural member and the PCB are secondarily assembled.
  3. 根据权利要求2所述的金属结构件与PCB非接触式加热锡钎焊方法,其特征在于,将PCB与金属结构件间隙装配的步骤中,借助支撑件将PCB平稳地固定在金属结构件上。The method of non-contact heating tin brazing of a metal structural member and a PCB according to claim 2, wherein in the step of assembling the PCB and the metal structural member, the PCB is smoothly fixed on the metal structural member by means of the support member. .
  4. 根据权利要求2所述的金属结构件与PCB非接触式加热锡钎焊方法,其特征在于,将PCB与金属结构件间隙装配的步骤中,将多个PCB区分正反面以预定间隙放入压模工装中,进而整体与所述金属结构件组装。The method of non-contact heating tin brazing of a metal structural member and a PCB according to claim 2, wherein in the step of assembling the PCB and the metal structural member, the plurality of PCBs are divided into front and back surfaces and placed in a predetermined gap. In the mold assembly, the whole is assembled with the metal structural member.
  5. 根据权利要求2所述的金属结构件与PCB非接触式加热锡钎焊方法,其特征在于,通过立体型焊料自动添加设备向金属结构件和PCB之间焊点处添加所述焊料。The method of non-contact heating tin brazing of a metal structural member and a PCB according to claim 2, wherein the solder is added to a solder joint between the metal structural member and the PCB by a stereoscopic solder automatic adding device.
  6. 根据权利要求1所述的金属结构件与PCB非接触式加热锡钎焊方法,其特征在于,所述对工件进行非接触式热辐射整体加热步骤中,对加热区域进行分区设置,使得PCB非焊点部位所在区域与焊点部位所在区域 存在温度差。The non-contact heating tin brazing method for a metal structural member and a PCB according to claim 1, wherein in the step of performing non-contact thermal radiation heating on the workpiece, the heating region is partitioned so that the PCB is not The area where the solder joint is located and the area where the solder joint is located There is a temperature difference.
  7. 根据权利要求6所述的金属结构件与PCB非接触式加热锡钎焊方法,其特征在于,所述对工件进行非接触式热辐射整体加热步骤中,对加热区域进行分层设置,使得PCB下表面所在一层与其上表面所在一层存在温度差。The method of non-contact heating tin brazing of a metal structural member and a PCB according to claim 6, wherein in the step of performing non-contact thermal radiation heating on the workpiece, the heating region is layered to make the PCB There is a temperature difference between the layer on the lower surface and the layer on the upper surface.
  8. 根据权利要求1所述的金属结构件与PCB非接触式加热锡钎焊方法,其特征在于,还包括后续步骤,具体包括:从周转夹具上取下焊接完成的成品,并通过传动系统回传周转夹具。 The non-contact heating tin brazing method for a metal structural member and a PCB according to claim 1, further comprising a subsequent step, comprising: removing the finished finished product from the revolving jig and returning it through the transmission system Turnover fixture.
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