WO2018036202A1 - Procédé de chauffage sans contact et brasage à l'étain d'un élément structurel métallique et carte de circuit imprimé - Google Patents

Procédé de chauffage sans contact et brasage à l'étain d'un élément structurel métallique et carte de circuit imprimé Download PDF

Info

Publication number
WO2018036202A1
WO2018036202A1 PCT/CN2017/083221 CN2017083221W WO2018036202A1 WO 2018036202 A1 WO2018036202 A1 WO 2018036202A1 CN 2017083221 W CN2017083221 W CN 2017083221W WO 2018036202 A1 WO2018036202 A1 WO 2018036202A1
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
metal structural
structural member
workpiece
heating
Prior art date
Application number
PCT/CN2017/083221
Other languages
English (en)
Chinese (zh)
Inventor
吕晓胜
郭林波
王文长
孙善球
刘海滨
朱龙翔
岳德周
Original Assignee
京信通信技术(广州)有限公司
京信通信系统（中国）有限公司
天津京信通信系统有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京信通信技术(广州)有限公司, 京信通信系统（中国）有限公司, 天津京信通信系统有限公司 filed Critical 京信通信技术(广州)有限公司
Publication of WO2018036202A1 publication Critical patent/WO2018036202A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means

Definitions

  • the invention relates to the field of processing technology, in particular to a welding related technology in the field of communication technology, in particular to a non-contact integral heating tin brazing method for a metal structural member and a PCB.
  • the base station antenna is a key component of the coverage of the mobile communication network.
  • the base station antenna is composed of a main feed end and a plurality of terminal components, and the metal structural member and the PCB component are the intermediate bridge between the main feed end and the terminal component, and the metal structural member.
  • the connection to the PCB is typically tin brazing.
  • the combination of PCB and metal structural parts is a grounding effect, and grounding is a very important indicator in the communications industry. Grounding technology is an important technology that must be taken when any electronic or electrical equipment or system works normally. It is not only a necessary means to protect equipment and personal safety, but also to suppress electromagnetic interference, ensure electromagnetic compatibility of equipment or systems, and improve equipment or system reliability. Important technical measures.
  • the conventional tin brazing process is a local heating welding method in which a soldering iron is heated to conduct heat to the soldered contact point and to assist the solder wire to fill the solder.
  • the welding method of the metal structural parts of the communication industry is basically welded by the electric soldering iron.
  • high temperature transfer or long-time contact welding is required. High-power soldering station must be used, and the long-term high temperature accelerates the oxidation of the soldering iron tip, and the service life of the soldering iron is greatly reduced.
  • the uneven heating of the soldering joint can not ensure the consistency of the soldering temperature, which leads to the decline of soldering quality reliability.
  • the manual welding method can not guarantee the consistency of the welding time and the amount of tin delivered, the quality consistency is poor, and the operation mode is inefficient.
  • the components composed of metal structural parts and PCBs are used in a base station antenna, and the number of solder joints of a single product is dense. Due to the limitations of manual welding, it is inevitable that there will be virtual welding and leakage welding. The phenomenon. To achieve its fully automated welding, it is basically impossible on the basis of the prior art.
  • the object of the present invention is to provide a non-contact heating tin brazing method for a metal structural member and a PCB which improve welding efficiency and ensure welding quality.
  • the present invention provides the following technical solutions:
  • a non-contact heating tin brazing method for a metal structural member and a PCB comprising an integral heating welding device having a transmission system and a heating system and a cooling system disposed in sequence along the workpiece driving direction, the method comprising the following steps: on the transmission system Placing the workpiece and transferring the workpiece to the heating system through a transmission system, the workpiece being a common body composed of a metal structural member, a PCB, a solder, and a turnover jig; the non-contact heat radiation is integrally heated to melt the solder on the workpiece The workpiece that is heated and welded is cooled to rapidly solidify the molten solder into the desired solder joint.
  • the tin brazing method further includes the step of presetting the workpiece, specifically comprising: placing and locating the metal structural member on the revolving fixture having the limiting and positioning functions; and spacing the PCB from the metal structural member Assembly; solder pre-positioning of the solder joint between the metal structural member and the PCB; after the solder preset is completed, the metal structural member and the PCB are secondarily assembled.
  • the PCB is smoothly fixed to the metal structural member by means of the support.
  • the plurality of PCBs are divided into the positive and negative surfaces and placed in the molding tool with a predetermined gap, thereby being integrally assembled with the metal structural member.
  • the solder is added to the solder joint between the metal structural member and the PCB by a stereo solder automatic adding device.
  • the heating region is partitioned such that the temperature of the region where the non-soldering portion of the PCB is located is lower than the temperature of the region where the solder joint portion is located.
  • the heating regions are layered such that the temperature of the layer on which the lower surface of the PCB is located is lower than the temperature of the layer on which the upper surface is located.
  • the tin brazing method further comprises a subsequent step, specifically comprising: removing the finished finished product from the revolving jig and returning the revolving jig through the transmission system.
  • the welding device is fixed, the solder is added, and the heating and welding are split, and different processes are set up, and the precise division of labor facilitates automation of each process and realizes the module. Management.
  • the solder joint is uniformly pre-soldered, and then the non-contact program controlled heating is performed as a whole, and the solder is integrally completed in the integral heating and soldering device.
  • Preheating, melting, welding, cooling, tin brazing is not affected by the number of solder joints and the size of the soldering device.
  • the solder flow is more uniform and the wetting is more sufficient, which ensures the welding quality of the metal structural parts and the PCB, and improves the welding efficiency. .
  • Figure 1 is a schematic view of an embodiment of the present invention for heat welding of a workpiece in an integral heating and welding apparatus
  • FIG. 2 is a schematic view of another embodiment of the present invention for heat welding of a workpiece in an integral heating and welding apparatus.
  • the non-contact integral heating tin brazing method (hereinafter referred to as "tin brazing method") of the metal structural member and the coaxial cable of the invention mainly comprises a preset workpiece (including solder addition), a non-contact heating workpiece, a cooling workpiece, Four steps of disassembling the workpiece are carried out by fixing the welding device, soldering, heating and welding, setting up different processes and finely controlling them, facilitating the automatic completion of the welding process and realizing modular management.
  • the solder is added in the stereo soldering automatic adding device, which can realize the synchronous multi-point addition of the solder at the solder joints of many required soldering, so that the solder has accurate quantification and the solder shape is moved to ensure the welding process.
  • the flow distance of the solder is consistent.
  • the non-contact heating is performed in an integral heating welding device having a transmission system for transmitting the workpiece and sequentially providing a heating system and a cooling system along the workpiece transmission direction, and the heating system is used for 360-degree full working of the workpiece
  • the heat radiation makes the product evenly heated in each orientation and position, so that the solder on the solder joint is fully absorbed and melted, and then the solder joint between the metal structural member and the coaxial cable is wetted and flowed. Cooling is then performed so that the liquid solder at the solder joint rapidly solidifies to form the desired solder joint.
  • the integral heating and welding device of the present invention transfers heat by means of heat radiation
  • the heating elements thereof include, but are not limited to, infrared heating, heating tube heating, laser heating, and the like, and the heating orientation is not limited to upper heating, lower heating, or Heating up and down, can be heated simultaneously in multiple directions.
  • the preset workpiece step specifically includes:
  • the metal structural member is taken out from the turnover box and placed on a revolving jig having a limit and positioning function, so that the metal structural member is placed in a predetermined position.
  • the support member adopts a multi-array integral structure fixing manner, can ensure the state of each PCB and the metal structural member after assembly, and provides effective and reliable fixation of a plurality of orientations to ensure the consistency of the welding effect.
  • the support member has high temperature resistance characteristics, prevents the support failure of the whole heating process due to the thermal expansion and contraction effect of the object itself, and the support member has the characteristics of fast pick and place.
  • the metal structure of the PCB is fixed together with the revolving jig and placed in a stereo solder automatic adding device for solder presetting.
  • the solder auto-addition device allows for simultaneous solder multi-point addition to the solder joints to be soldered, with precise solder addition and consistent solder shape to ensure consistent solder flow distance during soldering.
  • the metal structure of the solder preset and the semi-finished product of the PCB will be completed and then assembled twice.
  • the preset process of the workpiece is completed, wherein the workpiece is a community composed of a metal structural member, a PCB, a solder and a turnover jig.
  • the semi-finished semi-finished product together with the revolving jig is placed in an integral heating welding device, heated by the heating system on the principle of heat radiation, and cooled by a cooling system.
  • the heating system performs 360-degree heat transfer on the metal structural member and the PCB, so that each orientation and location of the product can be uniformly heated, so that the solder on the solder joint is fully absorbed and melted. And further, wetting and flowing between the metal structural member and the solder joint of the PCB; in addition, the solder passes through the through-hole flow path on the PCB, and the other side of the PCB flows through the via hole, and the through hole of the metal structural member and the PCB The element is diffused between the solder joint and the plating layer to form a corresponding tin-copper alloy layer.
  • the cooling system of the integral heating and welding device cools the workpiece that is heated and welded by, for example, air cooling, and completes the entire non-contact tin brazing.
  • This type of integral heat welding device is capable of setting welding parameters (temperature, time, etc.).
  • the temperature of the welding area is hierarchically and properly set.
  • the peripheral heating at the non-soldering portion of the PCB is 5-10 °C lower than the temperature of the solder joint area (the solder joint 3 and the solder joint 4 in Fig. 1) to avoid deformation of the PCB due to excessive heating;
  • the solder joint temperature of the layer on the upper surface of the PCB is about 5 °C higher than the solder joint of the layer on the lower surface of the PCB. With a small temperature difference, the solder has a flowability in a certain range from a low temperature to a high temperature.
  • the method further comprises removing the finished product of the welded metal structure from the turnover jig and returning the revolving jig through the pipeline to complete the whole single cycle process.
  • the tin brazing method of the first embodiment is similar to that of the first embodiment, and is different in the preset process of the workpiece. Specifically embodied in:
  • the PCB is first taken out of the turnover box, and the corresponding front and back sides are zoned.
  • the side of the PCB to be soldered is placed on a revolving fixture with a predetermined function.
  • all the PCB boards are correspondingly positioned by the die tooling.
  • the pre-positioning function of the stamping tool has high temperature resistance to prevent deformation of the positioned PCB due to the thermal expansion and contraction effect of the object itself.
  • the temperature of the welding area is hierarchically and rationally set.
  • the peripheral heating at the non-soldering portion of the PCB is 5-10 °C lower than the temperature of the solder joint area (the area of the solder joint 3 to 10 in Fig. 1) to avoid deformation of the PCB due to excessive heating; secondly, it is placed on the PCB.
  • the solder joint temperature of the surface is about 5 °C higher than the solder joint on the lower surface of the PCB. With a small temperature difference, the solder has a flowability in a certain range from a low temperature to a high temperature.

Abstract

La présente invention concerne un procédé de chauffage et de brasage à l'étain complet sans contact d'un élément structurel métallique et une carte de circuit imprimé, comprenant les étapes suivantes : la mise en place d'une pièce à travailler sur un système de commande et le transfert de ladite pièce à travailler vers un système de chauffage à l'aide du système de commande, la pièce à travailler étant un corps d'articulation constitué d'un élément structurel métallique, d'une carte de circuit imprimé, d'une soudure, et d'un raccord rotatif ; le chauffage de la pièce à travailler par exposition à de la chaleur sans contact du corps entier, la fusion de la soudure sur la pièce à travailler ; le refroidissement de la pièce à travailler sur laquelle le chauffage et la soudure ont été effectués, afin que la soudure fondue se solidifie rapidement en un point de soudure souhaité. Les éléments soudés sont fixés, le matériau soudé est ajouté, la soudure est chauffée, et la division est effectuée de manière à établir deux différents procédés, et une fine répartition des étapes du procédé est avantageuse pour l'automatisation de chacune des étapes du procédé, permettant d'atteindre une gestion modulaire.
PCT/CN2017/083221 2016-08-22 2017-05-05 Procédé de chauffage sans contact et brasage à l'étain d'un élément structurel métallique et carte de circuit imprimé WO2018036202A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610705280.5A CN106238848B (zh) 2016-08-22 2016-08-22 金属结构件与pcb非接触式加热锡钎焊方法
CN201610705280.5 2016-08-22

Publications (1)

Publication Number Publication Date
WO2018036202A1 true WO2018036202A1 (fr) 2018-03-01

Family

ID=57596225

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/083221 WO2018036202A1 (fr) 2016-08-22 2017-05-05 Procédé de chauffage sans contact et brasage à l'étain d'un élément structurel métallique et carte de circuit imprimé

Country Status (2)

Country Link
CN (1) CN106238848B (fr)
WO (1) WO2018036202A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106238848B (zh) * 2016-08-22 2019-12-27 京信通信技术(广州)有限公司 金属结构件与pcb非接触式加热锡钎焊方法
CN106238846B (zh) * 2016-08-22 2019-12-27 京信通信技术(广州)有限公司 金属结构件与同轴电缆非接触式加热锡钎焊方法
CN111935918A (zh) * 2019-05-13 2020-11-13 台湾爱司帝科技股份有限公司 应用于固接led的高周波加热装置
CN112893810A (zh) * 2021-02-04 2021-06-04 极能电气(苏州)有限公司 一种导电网接触片的连接设备
CN112958756A (zh) * 2021-02-04 2021-06-15 极能电气(苏州)有限公司 一种导电网接触片的连接方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01159586A (ja) * 1987-12-17 1989-06-22 Matsushita Electric Ind Co Ltd 加熱装置
US5405074A (en) * 1992-07-29 1995-04-11 Soltec B.V. Reflow soldering apparatus
JP2008166450A (ja) * 2006-12-27 2008-07-17 Matsushita Electric Ind Co Ltd リフローはんだ付け装置、リフローはんだ付け方法
CN103648700A (zh) * 2011-09-15 2014-03-19 富士通通讯网络株式会社 回流焊接装置及方法
CN106238846A (zh) * 2016-08-22 2016-12-21 京信通信技术(广州)有限公司 金属结构件与同轴电缆非接触式加热锡钎焊方法
CN106238848A (zh) * 2016-08-22 2016-12-21 京信通信技术(广州)有限公司 金属结构件与pcb非接触式加热锡钎焊方法
CN106270864A (zh) * 2016-08-22 2017-01-04 京信通信技术(广州)有限公司 金属结构件与五金件非接触式加热锡钎焊方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009160652A (ja) * 2008-01-08 2009-07-23 Fec:Kk 高周波誘導加熱装置及び高周波誘導コイルと磁性体による加熱方法
TW201230910A (en) * 2011-01-11 2012-07-16 Hon Hai Prec Ind Co Ltd The method of manufacturing the LED lightbar and the equipment thereof
CN103286408B (zh) * 2012-02-24 2017-03-01 联想企业解决方案（新加坡）私人有限公司 一种热源系统
CN203448816U (zh) * 2013-08-31 2014-02-26 东莞市科隆威自动化设备有限公司 结构改进的回流焊机

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01159586A (ja) * 1987-12-17 1989-06-22 Matsushita Electric Ind Co Ltd 加熱装置
US5405074A (en) * 1992-07-29 1995-04-11 Soltec B.V. Reflow soldering apparatus
JP2008166450A (ja) * 2006-12-27 2008-07-17 Matsushita Electric Ind Co Ltd リフローはんだ付け装置、リフローはんだ付け方法
CN103648700A (zh) * 2011-09-15 2014-03-19 富士通通讯网络株式会社 回流焊接装置及方法
CN106238846A (zh) * 2016-08-22 2016-12-21 京信通信技术(广州)有限公司 金属结构件与同轴电缆非接触式加热锡钎焊方法
CN106238848A (zh) * 2016-08-22 2016-12-21 京信通信技术(广州)有限公司 金属结构件与pcb非接触式加热锡钎焊方法
CN106270864A (zh) * 2016-08-22 2017-01-04 京信通信技术(广州)有限公司 金属结构件与五金件非接触式加热锡钎焊方法

Also Published As

Publication number Publication date
CN106238848A (zh) 2016-12-21
CN106238848B (zh) 2019-12-27

Similar Documents

Publication Publication Date Title
WO2018036202A1 (fr) Procédé de chauffage sans contact et brasage à l'étain d'un élément structurel métallique et carte de circuit imprimé
WO2018036213A1 (fr) Système automatique et procédé de mise en œuvre pour souder une pièce métallique et un câble coaxial
CN102474988B (zh) 电子元件单元和加强粘合剂
CN105904051B (zh) 一种锡环预上料电磁感应焊锡装置和方法
CN109365942A (zh) 自动焊锡设备及其控制方法
US9087778B2 (en) Joining method and semiconductor device manufacturing method
CN106238846B (zh) 金属结构件与同轴电缆非接触式加热锡钎焊方法
CN106270864B (zh) 金属结构件与五金件非接触式加热锡钎焊方法
CN102706205A (zh) 热交换器及接合热交换器的管的方法
JP6832675B2 (ja) 予備半田成形システムおよび方法
CN105945481B (zh) 一种半导体的自动生产方法
KR102328685B1 (ko) 전기 자동차용 배터리 스택의 쿨링 플레이트 제조 방법 및 이에 의해 제조된 쿨링 플레이트
CN104319010A (zh) 一种复合铜排导电层的焊接方法及复合铜排
CN112820652B (zh) 一种用于qfn封装器件l形焊接端子除金搪锡的方法
CN110497055B (zh) 纯镍与铜镀镍材质贴合锡膏焊接工艺
CN111482670B (zh) 电子元件焊接方法
CN220825553U (zh) 一种锡焊工装
CN106180944B (zh) 基站天线的锡钎焊接方法
CN220902112U (zh) 一种专用的自动化焊接设备
CN109702301A (zh) 平板精密自动氩弧焊焊接设备及其加工方法
CN204167089U (zh) 一种电感焊接定位治具
CN203057706U (zh) 金属基板刷锡装置
CN220306546U (zh) 动力电池高压电连接结构及具有其的动力电池
CN110125501B (zh) 点焊机的焊接方法
CN216902985U (zh) 辅助设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17842627

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17842627

Country of ref document: EP

Kind code of ref document: A1