JP6832675B2 - 予備半田成形システムおよび方法 - Google Patents
予備半田成形システムおよび方法 Download PDFInfo
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- JP6832675B2 JP6832675B2 JP2016206751A JP2016206751A JP6832675B2 JP 6832675 B2 JP6832675 B2 JP 6832675B2 JP 2016206751 A JP2016206751 A JP 2016206751A JP 2016206751 A JP2016206751 A JP 2016206751A JP 6832675 B2 JP6832675 B2 JP 6832675B2
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- 238000005476 soldering Methods 0.000 title claims description 49
- 238000000034 method Methods 0.000 title claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 100
- 239000000758 substrate Substances 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0435—Metal coated solder, e.g. for passivation of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
前記回路基板を確実に保持するための基板保持ユニットと、
前記予備半田を成形するように前記回路基板の前記パッド上の前記予備半田に対して熱プレス作業を行うための熱プレスユニットと、
前記基板保持ユニットに対して前記熱プレスユニットを移動させるための動作ユニットとを備え、
前記熱プレスユニットは、前記回路基板の前記パッド上の前記予備半田を成形するための熱プレッサを備える。
前記基板保持ユニットによって前記回路基板を確実に保持するステップと、
前記回路基板の前記パッド上の前記予備半田に対して前記熱プレスユニットの前記熱プレッサを整列させるように、前記動作ユニットによって前記基板保持ユニットに対して前記熱プレスユニットを移動させるステップと、
前記予備半田を成形するように前記熱プレスユニットによって前記回路基板の前記パッド上の前記予備半田に対して前記熱プレス作業を行うステップを備える。
前記熱プレッサが前記回路基板上の前記予備半田に対して前記熱プレス作業を行うときは、溶融した予備半田が隣接するパッドに向かって流れることを防止するように前記支持部が前記回路基板に接触しながら、前記予備半田が前記熱プレス部によってプレスされるステップをさらに備える。
Claims (11)
- 回路基板のパッド上の予備半田を成形するための予備半田成形システムであって、
前記回路基板を確実に保持するための基板保持ユニットと、
前記予備半田を成形するように前記回路基板の前記パッド上の前記予備半田に対して熱プレス作業を行うための熱プレスユニットと、
前記基板保持ユニットに対して前記熱プレスユニットを移動させるための動作ユニットとを備え、
前記熱プレスユニットは、前記回路基板の前記パッド上の前記予備半田を成形するための熱プレッサを備え、
前記熱プレッサは、2つの支持部と、前記2つの支持部の間に配置された熱プレス部とを備え、
前記熱プレッサが前記回路基板の前記パッド上の前記予備半田に対して前記熱プレス作業を行うときは、溶融した予備半田が隣接するパッドに向かって流れることを防止するように前記支持部が前記回路基板に接触しながら、前記予備半田は、前記熱プレス部によってプレスされる予備半田成形システム。
- 前記熱プレス部は、U字形又はV字形の断面を有する請求項1に記載の予備半田成形システム。
- 前記熱プレス部は、前記予備半田に付着しない材料から作られる請求項1又は2に記載の予備半田成形システム。
- 前記予備半田に付着しない前記材料は、モリブデン合金又はチタン合金をからなる請求項3に記載の予備半田成形システム。
- 前記熱プレスユニットは1つ以上の熱プレッサを備える請求項1に記載の予備半田成形システム。
- 前記基板保持ユニットは前記動作ユニットに対して移動可能である請求項1に記載の予備半田成形システム。
- 前記熱プレスユニットに設けられ、前記熱プレス作業が前記熱プレスユニットによって行われる温度を制御するように構成された温度制御ユニットをさらに備える請求項1に記載の予備半田成形システム。
- 請求項1に記載の予備半田成形システムによって前記予備半田を成形する方法であって、前記方法は、次のステップ、即ち、
前記基板保持ユニットによって前記回路基板を確実に保持するステップと、
前記回路基板の前記パッド上の前記予備半田に対して前記熱プレスユニットの前記熱プレッサを整列させるように、前記動作ユニットによって前記基板保持ユニットに対して前記熱プレスユニットを移動させるステップと、
前記予備半田を成形するように前記熱プレスユニットによって前記回路基板の前記パッド上の前記予備半田に対して前記熱プレス作業を行うステップを備え、
前記熱プレッサは、2つの支持部と、前記2つの支持部の間に配置された熱プレス部とを備え、本方法は、次のステップ、即ち、
前記熱プレッサが前記回路基板上の前記予備半田に対して前記熱プレス作業を行うときは、溶融した予備半田が隣接するパッドに向かって流れることを防止するように前記支持部が前記回路基板に接触しながら、前記予備半田は、前記熱プレス部によってプレスされるステップをさらに備える、方法。
- 次のステップ、即ち、
前記動作ユニットに対して前記基板保持ユニットを移動させるステップをさらに備える請求項8に記載の方法。
- 前記熱プレスユニットは1つ以上の熱プレッサを備え、前記方法は、次のステップ、即ち、
前記1つ以上の熱プレッサによって一斉に前記熱プレス作業を行うステップをさらに備える請求項8に記載の方法。
- 前記システムは、前記熱プレスユニットに設けられる温度制御ユニットをさらに備え、前記方法は、次のステップ、即ち、
前記温度制御ユニットによって、閉ループフィードバック制御を用いて、前記熱プレス作業が前記熱プレスユニットによって行われる前記温度を調整するステップをさらに備える請求項8に記載の方法。
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CN201510713062.1A CN106612592B (zh) | 2015-10-27 | 2015-10-27 | 预镀锡成型系统及其方法 |
CN201510713062.1 | 2015-10-27 |
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JP2017103452A JP2017103452A (ja) | 2017-06-08 |
JP6832675B2 true JP6832675B2 (ja) | 2021-02-24 |
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US (1) | US10512172B2 (ja) |
EP (1) | EP3163984B1 (ja) |
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CN (1) | CN106612592B (ja) |
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KR102440366B1 (ko) | 2018-01-04 | 2022-09-05 | 삼성전자주식회사 | 메모리 카드 및 이를 포함하는 전자 장치 |
US11354617B1 (en) | 2018-03-12 | 2022-06-07 | Amazon Technologies, Inc. | Managing shipments based on data from a sensor-based automatic replenishment device |
CN108966499B (zh) * | 2018-08-06 | 2019-12-03 | 信丰明新电子科技有限公司 | 一种电路板固定装置 |
CN114204310B (zh) * | 2021-12-22 | 2022-12-20 | 深圳市信而昌电子有限公司 | 一种便于自动焊接的预加锡的hdmi连接器 |
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JPS5696594A (en) * | 1979-12-29 | 1981-08-04 | Matsushita Electric Works Ltd | Relay control panel for remote multiplex control system |
JPS6330156A (ja) * | 1986-07-22 | 1988-02-08 | Mitsubishi Electric Corp | 薄板鋳塊およびその製造方法 |
DE3824865A1 (de) * | 1988-07-21 | 1990-01-25 | Productech Gmbh | Herstellen von loetflaechen |
CN1104950A (zh) * | 1993-10-04 | 1995-07-12 | 成都市焊料厂 | 一种低锡高效焊料 |
JPH0823160A (ja) * | 1994-05-06 | 1996-01-23 | Seiko Epson Corp | プリント配線板と電子部品の接続方法 |
JP2000294914A (ja) * | 1999-04-06 | 2000-10-20 | Seiko Epson Corp | 半導体装置及びその製造方法 |
CA2354546A1 (en) * | 2001-07-16 | 2003-01-16 | Paul Foley | Solder shaping process using a light source |
JP4251458B2 (ja) * | 2005-12-21 | 2009-04-08 | Tdk株式会社 | チップ部品の実装方法及び回路基板 |
CN101125396A (zh) * | 2006-08-17 | 2008-02-20 | 黄柏山 | 锡膏及其应用于热压焊接的方法 |
CN201359998Y (zh) * | 2008-12-17 | 2009-12-09 | 佛山市蓝箭电子有限公司 | 焊料压模成型装置 |
CN201720573U (zh) * | 2010-07-27 | 2011-01-26 | 北京索爱普天移动通信有限公司 | 一种新型的粘锡托盘 |
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- 2016-10-27 EP EP16195933.3A patent/EP3163984B1/en active Active
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CN106612592A (zh) | 2017-05-03 |
US20170118845A1 (en) | 2017-04-27 |
JP2017103452A (ja) | 2017-06-08 |
US10512172B2 (en) | 2019-12-17 |
CN106612592B (zh) | 2019-02-22 |
EP3163984B1 (en) | 2018-08-08 |
EP3163984A1 (en) | 2017-05-03 |
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