JP2012157903A - 電気部品からの金の除去 - Google Patents
電気部品からの金の除去 Download PDFInfo
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- JP2012157903A JP2012157903A JP2011257636A JP2011257636A JP2012157903A JP 2012157903 A JP2012157903 A JP 2012157903A JP 2011257636 A JP2011257636 A JP 2011257636A JP 2011257636 A JP2011257636 A JP 2011257636A JP 2012157903 A JP2012157903 A JP 2012157903A
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- Prior art keywords
- solder
- gold
- electrical component
- cooling
- metal screen
- Prior art date
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 239000010931 gold Substances 0.000 title claims abstract description 88
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 claims abstract description 97
- 229910000679 solder Inorganic materials 0.000 claims abstract description 94
- 238000001816 cooling Methods 0.000 claims abstract description 70
- 238000010438 heat treatment Methods 0.000 claims abstract description 70
- 239000000203 mixture Substances 0.000 claims abstract description 46
- 238000007747 plating Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 30
- 230000007246 mechanism Effects 0.000 claims description 18
- 230000004907 flux Effects 0.000 claims description 13
- 230000035939 shock Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 2
- 230000008569 process Effects 0.000 description 50
- 238000010586 diagram Methods 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49718—Repairing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49718—Repairing
- Y10T29/49721—Repairing with disassembling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49718—Repairing
- Y10T29/49721—Repairing with disassembling
- Y10T29/49723—Repairing with disassembling including reconditioning of part
- Y10T29/49725—Repairing with disassembling including reconditioning of part by shaping
- Y10T29/49726—Removing material
- Y10T29/49728—Removing material and by a metallurgical operation, e.g., welding, diffusion bonding, casting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】ある実施形態においては、ある方法により、電気部品上の金メッキが除去される。この方法は、第1増分制御加熱工程により電気部品上に金とはんだの混合物を形成し、第1冷却工程により電気部品を増分的に冷却し、第2増分制御加熱工程により電気部品から金属製スクリーンへと金とはんだの混合物の一部又は全部を吸い上げ、第2冷却工程により増分的に電気部品を冷却する。
【選択図】図1
Description
幾つかの実施形態においては、本工程は、更に、金属製スクリーン上に配置された電気部品上へフラックスを塗布/堆積する(232)工程を含む。この例示的工程において説明された加熱及び冷却工程は、ここに開示の任意の例及び/又は技術を利用可能である。幾つかの実施形態においては、この例示的工程において説明された加熱工程の高い温度は、はんだの溶融温度(融点)である。
「備える」、「含む」、及び/又は「複数」は、非限定的であり、列挙された構成を含み、また、列挙されていない追加の構成を含み得る。「及び/又は」は、非限定的であり、1以上の列挙された構成及び列挙された構成の組み合わせを含む。
200 :フローチャート
300 :フローチャート
400 :パッド
410 :非金属基板
510 :非金属基板
520 :電気部品
530 :はんだプリフォーム
530a :はんだプリフォーム
540b :混合物
540e :混合物
550c :金属製スクリーン
560d :フラックス
610 :電気部品
612 :パッド
614 :混合物
630b :非金属基板
640c :移動機構
650c :オーブン
660e :金属製スクリーン
670f :移動機構
680g :オーブン
Claims (12)
- 電気部品上の金メッキの除去方法であって、
(a)第1増分制御加熱工程により前記電気部品上に金とはんだの混合物を形成し、
(b)第1冷却工程により前記電気部品を増分的に冷却し、
(c)第2増分制御加熱工程により前記電気部品から金属製スクリーンへと前記金とはんだの混合物の一部又は全部を吸い上げ、
(d)第2冷却工程により前記電気部品を増分的に冷却する、方法。 - 請求項1に記載の方法であって、
前記(c)工程は、前記金属製スクリーンへの前記金とはんだの混合物の移動を促進するべく、前記金属製スクリーン上に前記電気部品を位置づける工程を更に含む、方法。 - 請求項1又は2に記載の方法であって、
前記(a)工程は、はんだペースト及びはんだプリフォームの少なくとも一方を非金属基板に一時的に付着し、所定量のはんだパッドを形成する工程と、
前記所定量のはんだパッド上に前記電気部品を位置づける工程と、
を更に含む、方法。 - 請求項3に記載の方法であって、
前記非金属基板は、複合材料を含む、方法。 - 請求項1乃至4のいずれか一項に記載の方法であって、
前記(c)工程は、前記金属製スクリーン上に配置された前記電気部品にフラックスを塗布する工程を更に含む、方法。 - 請求項1乃至5のいずれか一項に記載の方法であって、
前記金属製スクリーンは、フラックスコーティングを含み、これにより、前記金属製スクリーンへと前記金とはんだの混合物の移動が促進される、方法。 - 請求項1乃至6のいずれか一項に記載の方法であって、
前記第1増分制御加熱工程は、実質的に摂氏0.1度/秒〜摂氏3.0度/秒間の加熱速度にて実行され、
前記第1冷却工程は、実質的に摂氏0.1度/秒〜摂氏3.0度/秒間の冷却速度にて実行される、方法。 - 請求項1乃至7のいずれか一項に記載の方法であって、
前記第2増分制御加熱工程は、実質的に摂氏0.1度/秒〜摂氏3.0度/秒間の加熱速度にて実行され、
前記第2冷却工程は、実質的に摂氏0.1度/秒〜摂氏3.0度/秒間の冷却速度にて実行される、方法。 - 請求項1乃至8のいずれか一項に記載の方法であって、
前記第1増分制御加熱工程は、実質的に前記第2増分制御加熱工程に等しく、
前記第1冷却工程は、実質的に前記第2冷却工程に等しい、方法。 - 請求項1乃至9のいずれか一項に記載の方法であって、
前記(c)工程後に前記電気部品のはんだ接合部に残存している前記金とはんだの混合物中の金は、実質的に体積比3%未満である、方法。 - 電気部品の熱衝撃管理の方法であって、
(a)非金属基板に付着した個別はんだパッド群上に向けて電気部品ホルダーから複数の電気部品を自動的にアンロードし、
(b)前記非金属基板を第1移動機構上に位置付け、
(c)前記第1移動機構により前記非金属基板を移動して第1オーブンを通過させ、第1温度プロファイルに基づいて前記複数の電気部品を加熱及び冷却し、ここで、前記はんだパッド群夫々の加熱により、前記複数の電気部品夫々上には、金とはんだの混合物が形成され、
(d)前記非金属基板から金属製スクリーン上に前記複数の電気部品を配置し、
(e)前記金属製スクリーンを第2移動機構上にロードし、
(f)前記第2移動機構により前記金属製スクリーンを移動して第2オーブンを通過させ、第2温度プロファイルに基づいて前記複数の電気部品を加熱及び冷却し、ここで、前記複数の電気部品の夫々の加熱により、前記金とはんだの混合物の一部又は全部が前記金属製スクリーンへと吸い上がる、方法。 - 請求項11に記載の方法であって、
(g)前記電気部品ホルダー上へ前記複数の電気部品を自動的にロードする工程を更に含む、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/016316 | 2011-01-28 | ||
US13/016,316 US8413320B2 (en) | 2011-01-28 | 2011-01-28 | Method of gold removal from electronic components |
Publications (2)
Publication Number | Publication Date |
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JP2012157903A true JP2012157903A (ja) | 2012-08-23 |
JP5926935B2 JP5926935B2 (ja) | 2016-05-25 |
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Application Number | Title | Priority Date | Filing Date |
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JP2011257636A Active JP5926935B2 (ja) | 2011-01-28 | 2011-11-25 | 電気部品からの金の除去 |
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US (2) | US8413320B2 (ja) |
EP (1) | EP2481511B1 (ja) |
JP (1) | JP5926935B2 (ja) |
KR (1) | KR101829924B1 (ja) |
SG (1) | SG182898A1 (ja) |
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US9232630B1 (en) | 2012-05-18 | 2016-01-05 | Flextronics Ap, Llc | Method of making an inlay PCB with embedded coin |
US9521754B1 (en) | 2013-08-19 | 2016-12-13 | Multek Technologies Limited | Embedded components in a substrate |
US9180539B1 (en) * | 2014-03-18 | 2015-11-10 | Flextronics Ap, Llc | Method of and system for dressing RF shield pads |
WO2016022755A2 (en) | 2014-08-06 | 2016-02-11 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
DE102015106177A1 (de) | 2015-04-22 | 2016-10-27 | Calbe Chemie GmbH | Recyclingverfahren für metallisierte kunststoffbasierte Datenspeicherträger |
US10096550B2 (en) * | 2017-02-21 | 2018-10-09 | Raytheon Company | Nitride structure having gold-free contact and methods for forming such structures |
CN112888188A (zh) * | 2019-11-29 | 2021-06-01 | 深圳市普能达电子有限公司 | 一种pcba的贴片加工工艺 |
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JPH04287957A (ja) * | 1991-01-08 | 1992-10-13 | Nec Corp | Lsiパッケージのリード金メッキ層除去治具及び除去方法 |
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JP2004351480A (ja) * | 2003-05-29 | 2004-12-16 | Mitsubishi Electric Corp | ろう付け方法及びろう付け装置 |
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- 2011-11-18 KR KR1020110120644A patent/KR101829924B1/ko active IP Right Grant
- 2011-11-22 SG SG2011086519A patent/SG182898A1/en unknown
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EP2481511B1 (en) | 2013-09-18 |
KR20120087780A (ko) | 2012-08-07 |
KR101829924B1 (ko) | 2018-02-19 |
SG182898A1 (en) | 2012-08-30 |
US20130186942A1 (en) | 2013-07-25 |
EP2481511A1 (en) | 2012-08-01 |
US8413320B2 (en) | 2013-04-09 |
JP5926935B2 (ja) | 2016-05-25 |
US20120192406A1 (en) | 2012-08-02 |
US8943662B2 (en) | 2015-02-03 |
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