JPH01159586A - Heater - Google Patents

Abstract

PURPOSE: To accurately achieve temperature adjustment of an article to be heated and prevent any inferior product from being produced by measuring temperature of the article by bringing a contact type thermometer sensor unit provided at a proper position into contact with the article on a conveyor. CONSTITUTION: Electronic parts 16 are mounted on the same substrate 13 as that used upon actual production and are fixed so as not to be displaced even when it is heated to soldering temperature, and a thermocouple 14 is attached at a position to be measured. In such a manner, a temperature state checking substrate is put from an arrow 18 of a heating reflow apparatus to measure substrate temperature. When the substrate 13 stops at a predetermined position, temperature of the substrate 13 is measured with a contact type thermometer 15, and a correction coefficient is calculated by comparison with a measured result of the thermocouple 14. Since temperature is controlled while measuring temperature of an article to be measured during production in such a manner, accurate temperature adjustment of the article is achieved, and hence any failure which might be caused owing to temperature is substantially prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for heating a printed circuit board (hereinafter abbreviated as a board), etc., and in particular, after electronic components are mounted on the board.
The present invention relates to a heating device for reflow soldering and a heating device for manufacturing hybrid ICs.

Conventional technology Conventionally, after applying solder material to a board and mounting electronic components, heating reflow equipment and heating equipment for hybrid IC manufacturing use methods such as heating with hot air, heating with infrared rays, or heating using latent heat of vapor. There is.

However, when actually producing substrates using any of the above methods and devices, a temperature sensor, such as a thermocouple, etc. is attached to the substrate in advance, and the substrate is heated by passing it through a heating device. At the same time as measuring and determining the temperature inside the device, heating conditions and other conditions were determined by checking the melting state of the solder, the drying state of the paste, and the hardening state of the resin.

Hereinafter, a heating reflow apparatus among the above-mentioned conventional heating apparatuses will be described with reference to the drawings.

FIG. 4 is a schematic diagram showing the basic configuration of a conventional heating reflux apparatus using an infrared heating method. In Figure 4, 1
2 is a preheating panel heater, and 2 is a reflow heater. 3 is a fan for cooling the heated object. 4 is a conveyor for transporting objects to be heated. 6 is a substrate for temperature measurement, and 6 is a thermocouple for temperature measurement.

The operation of the heating reflow apparatus configured as described above will be described below.

First, when producing a mounting board, etc., the heating reflow equipment is turned on to be able to heat the board. Then, after leaving it for a certain period of time, in order to check whether the predetermined temperature condition is reached, a thermocouple 6 is attached to the temperature measurement board 5, and the other end 7 of the thermocouple 6 is connected to a recording pen recorder, etc. (not shown) and insert the temperature measurement substrate 6 into the device from the entrance arrow 8. The temperature of the substrate 6 is controlled by the preheating panel heater 1, the reflow heater 2, and the cooling fan 3, and after confirming that it has reached the predetermined temperature, the actual production begins. .

Problems to be Solved by the Invention However, with the method described above, even if the temperature state at the time of the start of production is known, production is being carried out without knowing what the temperature of the substrate will actually be during production. Become. As a result, even if the heating heater is heated under the same conditions, the actual temperature of the produced substrates may change due to changes in the surrounding environment or the number of substrates in the device due to changes in production takt. In many cases, soldering was the cause of defects.

In view of the above-mentioned problems, the present invention provides a heating device that does not cause defects in soldering by controlling the temperature of the substrate while measuring the actual temperature of the substrate during production.

Means for Solving the Problems In order to solve the above-mentioned problems, the heating device of the present invention is equipped with a heating device that is heated by bringing the sensor part of a contact type radiation thermometer provided at a predetermined position into contact with the object to be heated. It is equipped with a configuration that measures the temperature of the object to be heated.

Function The present invention uses the above-described configuration to control the temperature of the substrate, etc., which is the object to be heated during production, while measuring the temperature of the object to be heated. This means that most of the defects that occur can be prevented.

EXAMPLE Hereinafter, an embodiment of the present invention will be described using a solder reflow apparatus as an example with reference to the drawings.

FIG. 1 is a schematic diagram showing the basic structure of a heating reflow apparatus in an embodiment of the present invention. In FIG. 1, 9 is a panel heater for preheating, and 10 is a heater for heat flow. Reference numeral 11 is a fan for cooling a substrate or the like that is a heated object. Reference numeral 12 denotes a conveyor for transporting substrates and the like that are objects to be heated. 13 is a board for checking the temperature state, and 14 is a thermocouple for measuring the board temperature. Furthermore, 16 is a contact type radiation thermometer.

The operation of the heating reflow apparatus configured as described above will be described below with reference to FIGS. 1 and 2.

Figure 2 is a schematic diagram of a board for checking the temperature status of the heating reflow equipment, and is the same board 13 as the board used during actual production.
Attach the electronic component 16 to the board, fix it with adhesive or high-temperature solder so that it will not come off even when heated to the soldering temperature, attach the thermocouple 14 to the point to be measured, and in some cases use heat-resistant adhesive tape 17. Fix the thermocouple 14 with.

The substrate for checking the temperature state is inserted into the heating reflow apparatus shown in FIG. 1 from the arrow 18, and the temperature of the substrate is measured. When the substrate 13 stops at a predetermined position, the contact type radiation thermometer 1
6, the temperature of the substrate 13 is measured, and a correction coefficient is calculated by comparing it with the measurement result of the thermocouple 14 to ensure the measurement accuracy of the contact type radiation thermometer.

In this state, when the actual board is heated and the production board stops, the temperature of the board is measured each time, and at the same time feedback is sent to the heating heater and the speed and stop time of the conveyor are adjusted. Provide functionality to do this. , υ According to this embodiment, as shown above, the object to be heated, such as a substrate, is intermittently fed, and at the same time, the sensor part of the contact type radiation thermometer is brought into contact with the object to be heated while the object is stopped. By using a heating reflow device that retains the function of measuring the temperature of the heated object, it is possible to heat the substrate while measuring the actual temperature of the substrate.As a result, it is possible to control the temperature with high precision, which can lead to defects. It is now possible to perform solder reflow without the occurrence of

In the present invention, a thermocouple is used as an example of a method for correcting a contact type radiation thermometer, but a resistance temperature measuring device or other similar device may be used as long as it can measure the actual temperature of the object to be heated. Furthermore, the contact type radiation thermometer may be installed in the preheating zone as shown in FIG.

Effects of the Invention As described above, the present invention has a system in which the temperature of the object to be heated is measured by bringing the sensor part of the contact type radiation thermometer provided at a predetermined position into contact with the object to be heated. Since the temperature is controlled while measuring the temperature of the heated object during production, the temperature of the heated object can be adjusted accurately, and most defects caused by temperature can be prevented.

Furthermore, this method is effective not only for heating methods using infrared rays but also for heating methods using hot air and heating methods using latent heat of steam. It is also effective in curing equipment for coating resins.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a schematic front view showing the substrate structure of a heating reflow apparatus according to a first embodiment of the present invention, and Fig. 2 is a perspective view of a substrate for checking the temperature state of the heating reflow apparatus. 3 is a schematic front view of a heating reflow apparatus in a second embodiment, and FIG. 4 is a schematic front view showing the basic configuration of a heating reflow apparatus using a conventional infrared heating method. 9... Hanel heater for preheating, 10...
・Reflow heater, 12... Conveyor for conveying the substrate to be heated, 13... Temperature measurement board, 14... Thermocouple, 15... ...Contact type radiation thermometer. Figure 2 evil 0

Claims (7)

[Claims] (1) A heater for heating an object to be heated, and a conveyor for conveying the object to be heated, and a sensor section of a contact thermometer provided at a predetermined position are brought into contact with the object to be heated. A heating device characterized in that it measures the temperature of an object to be heated. (2) The heating device according to claim 1, wherein the heating device is configured to carry out intermittent feeding by repeatedly conveying the object to be heated a predetermined distance and then stopping for a predetermined period of time. (3) The heating device according to claim 2, wherein the sensor portion is configured to contact the object to be heated while the object to be heated is stopped. (4) The scope of the claim characterized in that the heater is controlled so that the temperature of the heated object reaches a preset temperature while measuring the temperature of the heated object with a contact radiation thermometer. The heating device according to item 2. (5) While measuring the temperature of the heated object with a contact thermometer, the conveyor stop time or conveyor movement speed is controlled so that the temperature of the heated object reaches a preset temperature. A heating device according to claim 2, characterized in that: (6) Make the sensor part of the contact thermometer swingable, keep the sensor part and the heated object apart when the object to be heated is moving, and move the sensor part when the object to be heated is stationary. 3. The heating device according to claim 2, wherein the temperature is measured by bringing the heating device into contact with the object to be heated. (7) The heating device according to claim 2, which uses a thermocouple as the contact thermometer.