JP2001165990A - Method and apparatus for controlling temperature of electronic device - Google Patents
Method and apparatus for controlling temperature of electronic deviceInfo
- Publication number
- JP2001165990A JP2001165990A JP34711899A JP34711899A JP2001165990A JP 2001165990 A JP2001165990 A JP 2001165990A JP 34711899 A JP34711899 A JP 34711899A JP 34711899 A JP34711899 A JP 34711899A JP 2001165990 A JP2001165990 A JP 2001165990A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- socket
- dummy pin
- electronic device
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Control Of Temperature (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体デバイス、
水晶デバイスあるいは受光・発光デバイスとして機能す
る、温度に対して特性が敏感な電子デバイスの特性検査
等に必要とされる、電子デバイスの温度を所定の温度に
保持するための技術に関する。TECHNICAL FIELD The present invention relates to a semiconductor device,
The present invention relates to a technique for maintaining the temperature of an electronic device at a predetermined temperature, which is required for a characteristic test or the like of an electronic device that functions as a quartz crystal device or a light receiving / light emitting device and whose characteristics are sensitive to temperature.
【０００２】[0002]
【従来の技術】図７に、特開平６−２３２２９８号に開
示されたＩＣの温度を制御する装置を示す。ここでは、
ＩＣソケット１に温度センサ１Ａとこのセンサ１Ａの周
囲に配置されＩＣソケット１を冷却加熱する冷却加熱体
２Ｂとが組み込まれ、さらに、冷却加熱体２Ｂを冷却加
熱等する冷却加熱伝導部材２Ｃ、２Ｄ及び冷却加熱回路
２Ａと、温度センサ１Ａで検出された温度情報と設定温
度とを比較して冷却加熱回路２Ａを制御する制御装置３
とが接続されている。この装置では、ＩＣソケット１に
挿入されたＩＣのモールド部分の温度が、ＩＣの温度と
して温度センサ１Ａにより測定され、この温度に基づい
てＩＣの温度制御が行われる。2. Description of the Related Art FIG. 7 shows an apparatus for controlling the temperature of an IC disclosed in JP-A-6-232298. here,
A temperature sensor 1A and a cooling / heating body 2B disposed around the sensor 1A for cooling and heating the IC socket 1 are incorporated in the IC socket 1, and further, cooling / heating conducting members 2C and 2D for cooling / heating the cooling / heating body 2B. And a control device 3 for controlling the cooling and heating circuit 2A by comparing the temperature information detected by the temperature sensor 1A and the set temperature with the cooling and heating circuit 2A.
And are connected. In this device, the temperature of the molded part of the IC inserted into the IC socket 1 is measured by the temperature sensor 1A as the temperature of the IC, and the temperature of the IC is controlled based on this temperature.
【０００３】また、特開平５−１２１５９８号には、ベ
ースと蓋を備え、加熱冷却用のエアーが送る通風パイプ
が貫通したＩＣソケットの内側に、ＩＣの上部を通風パ
イプの開口に対向させ、ＩＣのピンをベースから出すよ
うにしてＩＣを固定し、通風パイプ内に配置した温度セ
ンサの温度情報に従い、通風パイプに加熱又は冷却用エ
アーを送ってＩＣの温度制御を行なう技術が開示されて
いる。[0003] Japanese Patent Application Laid-Open No. 5-121598 discloses a device having a base and a lid, in which an upper part of an IC is opposed to an opening of a ventilation pipe inside an IC socket through which a ventilation pipe for sending air for heating and cooling passes. A technique is disclosed in which an IC is fixed such that pins of the IC are pulled out of a base, and heating or cooling air is sent to the ventilation pipe in accordance with temperature information of a temperature sensor arranged in the ventilation pipe to control the temperature of the IC. I have.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、特開平
６−２３２２９８号の場合、測定されるＩＣの温度は、
実際にはＩＣのモールド部分である。ＩＣのモールド部
分は、熱伝導率が低く実際に温度をコントロールしたい
チップ部分とは温度差があり、また、応答が鈍いために
加熱や冷却をしても設定温度に達するまで時間がかかる
ことがある。一方、特開平５−１２１５９８号の場合、
通風パイプ内の空気温度が一定でもＩＣの温度が一定に
保たれているとは限らない。特に、ＩＣソケットのピン
からの放熱を考慮すれば、ＩＣの温度は通風パイプ内の
空気温度よりかなり低くなりがちである。また、ＩＣの
温度として周囲の空気温度をフィードバックしているた
め、設定温度への追従が遅れやすい。本発明は、これら
の課題を解決するためになされたもので、下記のような
構成を採用する。However, in the case of JP-A-6-232298, the measured temperature of the IC is
Actually, it is the molded part of the IC. The mold part of the IC has a low thermal conductivity and has a temperature difference from the chip part where you want to control the temperature, and it takes a long time to reach the set temperature even if heating or cooling due to the slow response. is there. On the other hand, in the case of JP-A-5-121598,
Even if the air temperature in the ventilation pipe is constant, the temperature of the IC is not always kept constant. In particular, considering the heat radiation from the pins of the IC socket, the temperature of the IC tends to be considerably lower than the temperature of the air in the ventilation pipe. Further, since the temperature of the surrounding air is fed back as the temperature of the IC, the tracking of the set temperature tends to be delayed. The present invention has been made to solve these problems, and employs the following configuration.
【０００５】[0005]
【課題を解決するための手段】本発明の方法は、電子デ
バイスが挿入されるソケットのピン近傍に位置するダミ
ーピンと、前記ソケット及び前記ダミーピンを加熱及び
／又は冷却する温度調整機構と、予め定めた設定温度情
報と前記ダミーピンの温度情報とを比較演算する比較演
算部とを備えて、前記比較演算部により演算されたデー
タに基づき前記温度調整機構を制御して電子デバイスの
温度を調整する。また、前記ダミーピンの温度が前記設
定温度となるように前記温度調整機構を制御する。SUMMARY OF THE INVENTION The method of the present invention comprises a dummy pin located near a pin of a socket into which an electronic device is inserted, a temperature adjusting mechanism for heating and / or cooling the socket and the dummy pin, and A comparison operation unit configured to compare the set temperature information with the temperature information of the dummy pin, and controls the temperature adjustment mechanism based on the data calculated by the comparison operation unit to adjust the temperature of the electronic device. Further, the control section controls the temperature adjusting mechanism so that the temperature of the dummy pin becomes the set temperature.
【０００６】ＩＣ等の電子デバイスの温度制御に際し
て、実際に必要なのはデバイス内部のチップ等の温度で
あり、その温度は、その構造上デバイスが挿入されたソ
ケットのピンの温度とほぼ等しいと言うことが出来る。
これは、ソケットのピンとＩＣリード及びＩＣチップが
電気的に導通があるのと同時に、熱的にも高い熱伝導率
で接続されているためである。また、熱の移動、すなわ
ち、デバイスの温度変化はソケットのピンを通して起こ
ることが多い。従って、ソケットのピンの温度を制御す
ることでデバイスの温度を制御することが可能である
が、それが不可能な場合に上記構成を採用することで、
ソケットのピンの温度を測定するのと同様の効果を得る
ことが出来る。また、ソケットのピンとは別に測定用の
ダミーピンを設けることで、例えばこのピンを着脱可能
に構成すれば、デバイスの種類やソケットの形状が変わ
った場合にも、各ソケット等に対応した形状及び熱的条
件のダミーピンを設けることにより、汎用的な電子デバ
イスの温度制御装置を得ることも可能になる。In controlling the temperature of an electronic device such as an IC, what is actually required is the temperature of a chip or the like inside the device, and the temperature is substantially equal to the temperature of a pin of a socket into which the device is inserted due to its structure. Can be done.
This is because the pins of the socket and the IC leads and the IC chip are electrically connected to each other and have a high thermal conductivity at the same time. Also, heat transfer, that is, a change in the temperature of the device, often occurs through the pins of the socket. Therefore, it is possible to control the temperature of the device by controlling the temperature of the pins of the socket, but when that is not possible, by employing the above configuration,
The same effect as measuring the temperature of the socket pins can be obtained. Also, by providing a dummy pin for measurement separately from the pin of the socket, for example, if this pin is configured to be detachable, even if the type of device or the shape of the socket changes, the shape and heat corresponding to each socket etc. can be changed. By providing the dummy pins under the proper conditions, it is also possible to obtain a general-purpose electronic device temperature controller.
【０００７】また、前記ダミーピンには温度センサが組
み込まれ、該ダミーピンの温度はこの温度センサにより
検出される。これによれば、ダミーピンの温度測定を簡
易に行える。さらに、前記ダミーピンとして前記ソケッ
トのピンのうち電子デバイスとの電気的接続に供されな
いピンを割り当てる。この場合、ソケットと別にダミー
ピンを設けることが不要なため構成が簡単となる。しか
も、ここで測定した温度は電子デバイスのピンの温度そ
のものとなるため、極めて高精度な電子デバイスの温度
制御が可能となる。Further, a temperature sensor is incorporated in the dummy pin, and the temperature of the dummy pin is detected by the temperature sensor. According to this, the temperature of the dummy pin can be easily measured. Furthermore, pins that are not used for electrical connection with an electronic device among pins of the socket are assigned as the dummy pins. In this case, since it is not necessary to provide a dummy pin separately from the socket, the configuration is simplified. Moreover, since the temperature measured here is the temperature of the pins of the electronic device itself, it is possible to control the temperature of the electronic device with extremely high precision.
【０００８】本発明の装置は、電子デバイスが挿入され
るソケットのピン近傍に設けられたダミーピンと、前記
ソケット及び前記ダミーピンを加熱及び／又は冷却する
温度調整機構と、予め定めた設定温度情報と前記ダミー
ピンの温度情報とに基づき比較演算する比較演算部と、
前記比較演算部で演算されたデータに基づき前記ダミー
ピンの温度が前記設定温度となるように前記温度調整機
構を制御する温度調整機構制御部と、を備えた。これに
よれば、ＩＣソケットのピンを温度制御に直接用いるこ
とが困難な場合等であっても、ダミーピンの温度を基準
に電子デバイスを温度制御することで、電子デバイスの
特性検査等の際における高精度な温度制御や温度保持が
可能となる。また、前記ダミーピンには該ダミーピンの
温度を検出するための温度センサが組み込まれてなる。
これによれば、ダミーピンの温度測定を簡易に行える。An apparatus according to the present invention comprises: a dummy pin provided near a pin of a socket into which an electronic device is inserted; a temperature adjusting mechanism for heating and / or cooling the socket and the dummy pin; A comparison operation unit that performs a comparison operation based on the temperature information of the dummy pin,
A temperature adjustment mechanism control unit that controls the temperature adjustment mechanism so that the temperature of the dummy pin becomes the set temperature based on the data calculated by the comparison calculation unit. According to this, even when it is difficult to directly use the pins of the IC socket for temperature control, by controlling the temperature of the electronic device on the basis of the temperature of the dummy pin, it is possible to perform a characteristic test or the like of the electronic device. High-precision temperature control and temperature holding become possible. Further, a temperature sensor for detecting the temperature of the dummy pin is incorporated in the dummy pin.
According to this, the temperature of the dummy pin can be easily measured.
【０００９】また、前記ダミーピンは前記ソケットのピ
ンと熱特性がほぼ同じ材質のものからなる。また、前記
ダミーピンをダミーピンホルダに挿入して固定するとと
もに、該ダミーピンホルダは前記ソケットと熱特性がほ
ぼ同じ材質のものからなる。また、前記ダミーピンは前
記ソケットのケースに一体に組み込まれてなる。さら
に、前記ダミーピンはその放熱及び受熱の状態が前記ソ
ケットのピンの放熱及び受熱の状態と近似する状態に設
置される。これらの構成によれば、ダミーピンの熱的な
環境や条件がソケットのピンのそれと近くなるので、ダ
ミーピンの温度をソケットのピンの温度と等しいと見な
すことができる。従って、ＩＣソケットのピンを温度制
御に直接用いることが困難な場合等であっても、ダミー
ピンの温度を基準に電子デバイスを温度制御すること
で、電子デバイスの特性検査等の際における高精度な温
度制御や温度保持が可能となる。The dummy pins are made of a material having substantially the same thermal characteristics as the pins of the socket. The dummy pin is inserted into and fixed to the dummy pin holder, and the dummy pin holder is made of a material having substantially the same thermal characteristics as the socket. Further, the dummy pin is integrated with the case of the socket. Further, the dummy pins are placed in such a state that the state of heat radiation and heat reception is similar to the state of heat radiation and heat reception of the pins of the socket. According to these configurations, since the thermal environment and conditions of the dummy pins are close to those of the pins of the socket, the temperature of the dummy pins can be regarded as being equal to the temperature of the pins of the socket. Therefore, even when it is difficult to directly use the pins of the IC socket for temperature control, by controlling the temperature of the electronic device on the basis of the temperature of the dummy pin, it is possible to perform high-precision inspection of the characteristics of the electronic device. Temperature control and temperature maintenance can be performed.
【００１０】[0010]
【発明の実施の形態】以下、図面に基づいて本発明の実
施の形態を説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１１】実施の形態１．図１は本発明の実施の形態
１を示すＩＣソケット周辺の正面断面図であり、図２は
図１に対応する平面図、図３は図２に対応する側面断面
図である。図示するように、ＩＣを挿入して固定するＩ
Ｃソケット１０が２個並んでベース板９上にネジなどに
より固定用穴１０ｃを介して取り付けられ、これらのＩ
Ｃソケット１０の間には、温度検出用の温度センサ１３
ａを組み込んだダミーピン１１がダミーピンホルダ１２
に保持されて配置される。そして、温度センサ１３ａか
らはこのセンサ１３ａで測定されたダミーピン１１の温
度情報を、後述する比較演算部に送るための温度送出線
１３が出ている。Embodiment 1 FIG. 1 is a front sectional view around an IC socket according to a first embodiment of the present invention, FIG. 2 is a plan view corresponding to FIG. 1, and FIG. 3 is a side sectional view corresponding to FIG. As shown, the IC is inserted and fixed.
Two C sockets 10 are mounted side by side on a base plate 9 via fixing holes 10c by screws or the like.
A temperature sensor 13 for detecting temperature is provided between the C sockets 10.
a into the dummy pin holder 12
Is held and arranged. From the temperature sensor 13a, a temperature transmission line 13 for transmitting the temperature information of the dummy pin 11 measured by the sensor 13a to a comparison operation unit described later is provided.
【００１２】ここで、ＩＣソケット１０のケース１０ａ
とダミーピンホルダ１２、また、ＩＣソケット１０のピ
ン１０ｂとダミーピン１１とは、温度に対する特性を同
じくするため、それぞれほぼ同じ熱特性を有するもの
で、特に好ましくは同じ材質のもので製作するのがよ
い。さらに、ＩＣソケット１０のピン１０ｂ及びダミー
ピン１１のベース板９から突出する上下部分の長さも、
温度に対する環境を同じくするために、等しくするのが
好ましい。なお、ＩＣソケット１０の個数やダミーピン
１１の位置は、この例に限定されることなく、必要に応
じて適宜定めてよいが、ダミーピン１１はＩＣソケット
１０のピン１０ｂにできるだけ近づけて位置させること
が好ましい。Here, the case 10a of the IC socket 10
The dummy pin holder 12 and the pins 10b and the dummy pins 11 of the IC socket 10 have substantially the same thermal characteristics in order to have the same characteristics with respect to temperature, and are preferably made of the same material. Good. Further, the lengths of the upper and lower portions of the IC socket 10 protruding from the base plate 9 of the pins 10b and the dummy pins 11 are also:
It is preferable to make them equal so that the environment for temperature is the same. The number of IC sockets 10 and the positions of the dummy pins 11 are not limited to this example, and may be determined as needed. However, the dummy pins 11 may be positioned as close as possible to the pins 10b of the IC socket 10. preferable.
【００１３】図２、図３に示すように、ＩＣソケット１
０が並んだ両側のＩＣソケット１０近傍には、ＩＣソケ
ット１０及びダミーピン１１の上部を加熱又は冷却する
加熱冷却機構１６が配される。加熱はヒータ又はブロー
ヒータなどにより行われ、一方、冷却は冷媒噴霧などに
より行われる。このため、加熱冷却機構１６は、加熱空
気や冷媒を通すダクト１６ａと、それらを噴射するため
の複数のノズル１６ｂと、ノズル１６ｂを支持するマニ
ホールド１６ｃとを備える。As shown in FIGS. 2 and 3, the IC socket 1
A heating / cooling mechanism 16 for heating or cooling the upper portions of the IC socket 10 and the dummy pins 11 is arranged near the IC sockets 10 on both sides where the 0s are arranged. Heating is performed by a heater or a blow heater or the like, while cooling is performed by refrigerant spray or the like. To this end, the heating / cooling mechanism 16 includes a duct 16a through which heated air or a refrigerant passes, a plurality of nozzles 16b for injecting the same, and a manifold 16c that supports the nozzle 16b.
【００１４】図４はこれまで説明した実施の形態１の全
体構成を示したブロック図であり、図５は実施の形態１
の動作を説明するフローチャートである。これらの図を
参照しながら、実施の形態１の動作を説明する。ダミー
ピン１１の温度は温度センサ１３ａで検出され、その温
度情報は温度送出線１３を介して比較演算部１４に送ら
れる（図５、Ｓー１）。比較演算部１４には、一方でＩ
Ｃの特性検査に要求される設定温度（情報）が入力され
る（図５、Ｓー２）。そして、これらの情報に基づいて
ダミーピン１１と設定温度との温度差が比較演算部１４
で算出され（図５、Ｓー３）、さらに、その温度差に基
づいて、加熱冷却機構制御部１５により、ＩＣソケット
１０の温度が設定温度と同じ温度になるように、加熱冷
却機構１６が駆動制御される（図５、Ｓー４）。これに
よって、ＩＣソケット１０及びダミーピン１１の近傍に
加熱空気や冷媒が噴射されて（図５、Ｓー５）、ＩＣソ
ケット１０（ＩＣが挿入されている場合にはそのＩＣも
含む）の温度が設定値と同じ温度に調整保持される。FIG. 4 is a block diagram showing the overall configuration of the first embodiment described above, and FIG. 5 is a block diagram showing the first embodiment.
5 is a flowchart for explaining the operation of FIG. The operation of the first embodiment will be described with reference to these drawings. The temperature of the dummy pin 11 is detected by the temperature sensor 13a, and the temperature information is sent to the comparison operation unit 14 via the temperature sending line 13 (FIG. 5, S-1). On the other hand, I
The set temperature (information) required for the characteristic inspection of C is input (FIG. 5, S-2). Then, based on the information, the temperature difference between the dummy pin 11 and the set temperature is calculated by the comparison operation unit 14.
(FIG. 5, S-3), and based on the temperature difference, the heating / cooling mechanism controller 15 controls the heating / cooling mechanism 16 so that the temperature of the IC socket 10 becomes the same as the set temperature. The drive is controlled (FIG. 5, S-4). As a result, heated air or refrigerant is injected near the IC socket 10 and the dummy pin 11 (FIG. 5, S-5), and the temperature of the IC socket 10 (including the IC when the IC is inserted) is reduced. Adjusted and maintained at the same temperature as the set value.
【００１５】上記の動作をＩＣデバイス検査の場合に則
して説明すれば次のようになる。すなわち、ベース板９
の下に位置するテスターヘッド（図示せず）の温度が設
定値より上昇又は下降すると、ＩＣソケット１０のピン
１０ｂを介してＩＣデバイスの温度も同様に上昇又は下
降するが、この温度はＩＣソケット１０のピン１０ｂと
同じ温度条件下にあるダミーピン１１の温度に反映され
る。このダミーピン１１の温度は比較演算部１４で設定
値（温度）と比較されてその差が取られ、その差に基づ
いて、加熱冷却機構制御部１５が加熱冷却機構１６に加
熱又は冷却動作を実行させる。ダミーピン１１の温度は
常にフィードバックされているので、ダミーピン１１の
温度が設定値と一致したところで、加熱冷却機構制御部
１５は加熱冷却機構１６を停止させる。The above operation will be described below with reference to the case of IC device inspection. That is, the base plate 9
When the temperature of the tester head (not shown) located below the IC device rises or falls below a set value, the temperature of the IC device also rises or falls via the pin 10b of the IC socket 10, but this temperature rises or falls. This is reflected in the temperature of the dummy pin 11 under the same temperature condition as the ten pins 10b. The temperature of the dummy pin 11 is compared with a set value (temperature) by a comparison operation unit 14 and the difference is taken. Based on the difference, the heating / cooling mechanism control unit 15 executes a heating or cooling operation on the heating / cooling mechanism 16. Let it. Since the temperature of the dummy pin 11 is always fed back, the heating / cooling mechanism control unit 15 stops the heating / cooling mechanism 16 when the temperature of the dummy pin 11 matches the set value.
【００１６】この実施の形態１によれば、ソケットのピ
ンに温度センサを取り付けることができない場合に、ソ
ケットのピンに温度センサを取り付けたのと同等の精度
で、ＩＣの温度制御が可能となる。According to the first embodiment, when the temperature sensor cannot be attached to the socket pin, the temperature of the IC can be controlled with the same accuracy as attaching the temperature sensor to the socket pin. .
【００１７】実施の形態２．図６は本発明の実施の形態
２を示す装置の構成図である。これは、ダミーピン１１
をＩＣソケット１０のケース１０ａに組み込んでそれら
を一体に構成したもので、ここでは、ＩＣソケット１０
を固定する四隅の固定用穴１０ｃの一つにダミーピンホ
ルダ１２を形成し、そこにダミーピン１１を挿入した例
を示している。そして、ダミーピンの配置場所以外の構
成は、実施の形態１の場合と全て同じである。実施の形
態２によれば、ダミーピン１１はＩＣソケット１０のケ
ース１０ａによってそのピン１０ｂと実質的に同じ状態
で保持されることになり、ダミーピン１１の温度環境が
ＩＣソケット１０のピン１０ｂの温度環境と同じにな
る。従って、この温度に基づいてＩＣデバイスの温度を
制御することで、より高精度な温度制御が可能となる。
なお、ダミーピン１１は、この例に限定されることな
く、ＩＣソケット１０のケース１０ａ周囲の適宜の位置
に配置してよい。また、ダミーピン１１として、ＩＣソ
ケット１０のピン１０ｂの中で、電気的接続のために供
されていないピンを代用することも可能である。Embodiment 2 FIG. FIG. 6 is a configuration diagram of an apparatus according to the second embodiment of the present invention. This is the dummy pin 11
Are integrated into the case 10a of the IC socket 10 to integrally form them.
An example is shown in which a dummy pin holder 12 is formed in one of the four fixing holes 10c at the four corners where the dummy pin 11 is inserted. The configurations other than the locations of the dummy pins are all the same as those in the first embodiment. According to the second embodiment, the dummy pin 11 is held by the case 10a of the IC socket 10 in substantially the same state as the pin 10b, and the temperature environment of the dummy pin 11 is the temperature environment of the pin 10b of the IC socket 10. Will be the same as Therefore, by controlling the temperature of the IC device based on this temperature, more accurate temperature control becomes possible.
The dummy pins 11 are not limited to this example, and may be arranged at appropriate positions around the case 10a of the IC socket 10. Further, as the dummy pins 11, pins not provided for electrical connection among the pins 10b of the IC socket 10 can be substituted.
【００１８】上記各実施の形態は、主として、半導体デ
バイスの特性検査を行う際、テスト装置側にその半導体
デバイスをセットするＩＣハンドラーでの利用を考慮し
たもので、ＩＣケース１０が取り付けられたベース板９
はＩＣの種類に応じて交換使用されるものであり、その
場合、比較演算部１４、加熱冷却機構制御部１５、及び
加熱冷却機構１６はＩＣハンドラー本体に組み込まれ
る。しかしながら本発明は、ＩＣハンドラーでの使用に
限定されることなく、温度特性が敏感で高い温度精度が
求められる状況で一般に利用することが出来、従って、
半導体デバイスの特性検査に限らず、同様の条件が求め
られる電子回路素子、例えば、水晶デバイスあるいは受
光・発光デバイスの特性検査等にも応用できる。また、
上記実施の形態では、温度調整手段として加熱と冷却の
両方を行える加熱冷却機構を取り上げて説明したが、必
要に応じて加熱または冷却の一方のみが実施できる温度
調整手段も使用される。Each of the above embodiments mainly considers the use of an IC handler for setting the semiconductor device on the test apparatus side when performing a characteristic inspection of the semiconductor device. Board 9
Are replaced according to the type of IC. In this case, the comparison operation unit 14, the heating / cooling mechanism control unit 15, and the heating / cooling mechanism 16 are incorporated in the IC handler body. However, the invention is not limited to use in IC handlers, but can be generally used in situations where temperature characteristics are sensitive and high temperature accuracy is required,
The present invention can be applied not only to the characteristic inspection of the semiconductor device but also to the characteristic inspection of an electronic circuit element requiring similar conditions, for example, a crystal device or a light receiving / emitting device. Also,
In the above embodiment, the heating and cooling mechanism capable of performing both heating and cooling has been described as the temperature adjusting means, but a temperature adjusting means capable of performing only one of heating and cooling may be used as necessary.
【００１９】[0019]
【発明の効果】以上説明したように、本発明の温度制御
方法によれば、電子デバイスが挿入されるソケットのピ
ン近傍に位置するダミーピンと、ソケット及びダミーピ
ンを加熱及び／又は冷却する温度調整機構と、予め定め
た設定温度情報とダミーピンの温度情報とを比較演算す
る比較演算部とを備えて、比較演算部により演算された
データに基づき前記温度調整機構を制御して電子デバイ
スの温度を調整するようにしたので、ソケットのピンを
温度制御に利用できない場合でも、デバイスそのものの
温度を測定しながら温度制御するのとほぼ同精度の温度
制御が可能となり、従って、デバイスの特性検査等に必
要な温度精度及び温度保持性能の向上が図れる。As described above, according to the temperature control method of the present invention, a dummy pin located near a pin of a socket into which an electronic device is inserted, and a temperature adjusting mechanism for heating and / or cooling the socket and the dummy pin. And a comparison operation unit that compares the predetermined set temperature information and the temperature information of the dummy pin, and controls the temperature adjustment mechanism based on the data calculated by the comparison operation unit to adjust the temperature of the electronic device. Therefore, even when the socket pins cannot be used for temperature control, it is possible to control the temperature with almost the same accuracy as controlling the temperature while measuring the temperature of the device itself. The temperature accuracy and the temperature holding performance can be improved.
【００２０】また、本発明の温度制御装置によれば、電
子デバイスが挿入されるソケットのピン近傍に設けられ
たダミーピンと、ソケット及びダミーピンを加熱及び／
又は冷却する温度調整機構と、予め定めた設定温度情報
とダミーピンの温度情報とに基づき比較演算する比較演
算部と、比較演算部で演算されたデータに基づきダミー
ピンの温度が設定温度となるように温度調整機構を制御
する温度調整機構制御部とを備えたので、ソケットのピ
ンを温度制御に利用できない場合でも、デバイスそのも
のの温度を測定しながら温度制御するのと同等の精度の
温度制御が可能となる。しかも、デバイスの温度変化前
にデバイスの温度に影響を与えるダミーピンの温度を利
用してフィードバック制御しているので、温度変化に対
する追従制御も迅速に行える効果がある。Further, according to the temperature control device of the present invention, the dummy pin provided near the pin of the socket into which the electronic device is inserted, and the socket and the dummy pin are heated and / or heated.
Alternatively, a temperature adjusting mechanism for cooling, a comparison operation unit for performing a comparison operation based on predetermined set temperature information and the temperature information of the dummy pin, and a temperature of the dummy pin is set to the set temperature based on data calculated by the comparison operation unit. Equipped with a temperature adjustment mechanism control unit that controls the temperature adjustment mechanism, so even when the socket pins cannot be used for temperature control, temperature control with the same accuracy as measuring the temperature of the device itself is possible. Becomes In addition, since the feedback control is performed using the temperature of the dummy pin which affects the temperature of the device before the temperature change of the device, there is an effect that the follow-up control to the temperature change can be quickly performed.
【図１】本発明の実施の形態１を示すＩＣソケット周辺
の正面断面図である。FIG. 1 is a front sectional view around an IC socket according to a first embodiment of the present invention.
【図２】図１のＩＣソケット周辺の平面図である。FIG. 2 is a plan view around the IC socket of FIG. 1;
【図３】図１のＩＣソケット周辺の側面断面図である。FIG. 3 is a side cross-sectional view around the IC socket of FIG. 1;
【図４】実施の形態１の全体構成を示すブロック図であ
る。FIG. 4 is a block diagram showing an overall configuration of the first embodiment.
【図５】実施の形態１の動作を説明するフローチャート
である。FIG. 5 is a flowchart illustrating the operation of the first embodiment.
【図６】本発明の実施の形態２を示す装置の構成図であ
る。FIG. 6 is a configuration diagram of an apparatus according to a second embodiment of the present invention.
【図７】ＩＣの温度を制御する従来の装置の概念図であ
る。FIG. 7 is a conceptual diagram of a conventional device for controlling the temperature of an IC.
１０・・ＩＣソケット、１０ａ・・ＩＣソケットのケー
ス、１０ｂ・・ＩＣソケットのピン、１０ｃ・・ＩＣソ
ケットの固定用穴、１１・・ダミーピン、１２・・ダミ
ーピンホルダ、１３・・温度送出線、１３ａ・・温度セ
ンサ、１４・・比較演算部、１５・・加熱冷却機構制御
部、１６・・加熱冷却機構。10. IC socket, 10a IC socket case, 10b IC socket pin, 10c IC socket fixing hole, 11 dummy pin, 12 dummy pin holder, 13 temperature sending wire , 13a temperature sensor, 14 comparison operation unit, 15 heating / cooling mechanism control unit, 16 heating / cooling mechanism.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2G003 AA06 AA07 AB16 AC03 AD01 AD04 AG01 AG11 4M106 AA02 AA07 CA27 CA31 CA56 CA60 CA64 DH02 DH44 DH45 DH46 DJ18 5H323 AA38 AA40 BB01 BB04 CA09 CB02 CB23 CB25 CB32 CB33 CB44 DA04 EE01 FF02 HH02 KK05 ──────────────────────────────────────────────────続 き Continuing on the front page F term (reference) 2G003 AA06 AA07 AB16 AC03 AD01 AD04 AG01 AG11 4M106 AA02 AA07 CA27 CA31 CA56 CA60 CA64 DH02 DH44 DH45 DH46 DJ18 5H323 AA38 AA40 BB01 BB04 CA09 CB02 CB23 CB25 CB04 CB25 CB04 CB25 CB25 KK05
Claims (10)
ン近傍に位置するダミーピンと、 前記ソケット及び前記ダミーピンを加熱及び／又は冷却
する温度調整機構と、予め定めた設定温度情報と前記ダ
ミーピンの温度情報とを比較演算する比較演算部とを備
えて、 前記比較演算部により演算されたデータに基づき前記温
度調整機構を制御して電子デバイスの温度を調整する、
ことを特徴とする電子デバイスの温度制御方法。1. A dummy pin located near a pin of a socket into which an electronic device is inserted, a temperature adjusting mechanism for heating and / or cooling the socket and the dummy pin, predetermined set temperature information and temperature information of the dummy pin. And a comparison operation unit that performs a comparison operation on the electronic device, and controls the temperature adjustment mechanism based on the data calculated by the comparison operation unit to adjust the temperature of the electronic device.
A temperature control method for an electronic device, comprising:
なるように前記温度調整機構を制御する、ことを特徴と
する請求項１に記載の電子デバイスの温度制御方法。2. The electronic device temperature control method according to claim 1, wherein the temperature adjustment mechanism is controlled so that the temperature of the dummy pin becomes the set temperature.
まれ、該ダミーピンの温度はこの温度センサにより検出
される、ことを特徴とする請求項１又は２に記載の電子
デバイスの温度制御方法。3. The temperature control method for an electronic device according to claim 1, wherein a temperature sensor is incorporated in the dummy pin, and a temperature of the dummy pin is detected by the temperature sensor.
ンのうち電子デバイスとの電気的接続に供されないピン
を割り当てる、ことを特徴とする請求項１乃至３のいず
れかに記載の電子デバイスの温度制御方法。4. The method of controlling a temperature of an electronic device according to claim 1, wherein a pin not provided for electrical connection with an electronic device among pins of said socket is assigned as said dummy pin. .
ン近傍に設けられたダミーピンと、 前記ソケット及び前記ダミーピンを加熱及び／又は冷却
する温度調整機構と、 予め定めた設定温度情報と前記ダミーピンの温度情報と
に基づき比較演算する比較演算部と、 前記比較演算部で演算されたデータに基づき前記ダミー
ピンの温度が前記設定温度となるように前記温度調整機
構を制御する温度調整機構制御部と、を備えたことを特
徴とする電子デバイスの温度制御装置。5. A dummy pin provided near a pin of a socket into which an electronic device is inserted, a temperature adjustment mechanism for heating and / or cooling the socket and the dummy pin, predetermined set temperature information and a temperature of the dummy pin. A comparison operation unit that performs a comparison operation based on the information, and a temperature adjustment mechanism control unit that controls the temperature adjustment mechanism so that the temperature of the dummy pin becomes the set temperature based on the data calculated by the comparison operation unit. A temperature control device for an electronic device, comprising:
を検出するための温度センサが組み込まれてなる、こと
を特徴とする請求項５に記載の電子デバイスの温度制御
装置。6. The temperature control device for an electronic device according to claim 5, wherein a temperature sensor for detecting a temperature of the dummy pin is incorporated in the dummy pin.
熱特性がほぼ同じ材質のものからなる、ことを特徴とす
る請求項５又は６に記載の電子デバイスの温度制御装
置。7. The temperature control device for an electronic device according to claim 5, wherein the dummy pins are made of a material having substantially the same thermal characteristics as the pins of the socket.
入して固定するとともに、該ダミーピンホルダは前記ソ
ケットと熱特性がほぼ同じ材質のものからなる、ことを
特徴とする請求項５乃至７のいずれかに記載の電子デバ
イスの温度制御装置。8. The dummy pin holder is inserted and fixed in a dummy pin holder, and the dummy pin holder is made of a material having substantially the same thermal characteristics as the socket. A temperature control device for an electronic device according to any one of the above.
に一体に組み込まれてなる、ことを特徴とする請求項５
乃至８のいずれかに記載の電子デバイスの温度制御装
置。9. The socket according to claim 5, wherein the dummy pin is integrated with a case of the socket.
9. The temperature control device for an electronic device according to any one of claims 1 to 8.
状態が前記ソケットのピンの放熱及び受熱の状態と近似
する状態に設置される、ことを特徴とする請求項５乃至
９のいずれかに記載の電子デバイスの温度制御装置。10. The dummy pin according to claim 5, wherein the state of heat radiation and heat reception of the dummy pin is set to be similar to the state of heat radiation and heat reception of the pin of the socket. Temperature control device for electronic devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34711899A JP3700505B2 (en) | 1999-12-07 | 1999-12-07 | IC handler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34711899A JP3700505B2 (en) | 1999-12-07 | 1999-12-07 | IC handler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001165990A true JP2001165990A (en) | 2001-06-22 |
| JP3700505B2 JP3700505B2 (en) | 2005-09-28 |
Family
ID=18388040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34711899A Expired - Fee Related JP3700505B2 (en) | 1999-12-07 | 1999-12-07 | IC handler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3700505B2 (en) |
Cited By (7)
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| KR100491131B1 (en) * | 2002-09-17 | 2005-05-27 | (주)세미뱅크 | Apparatus for Testing Semiconductor Device |
| JP2007503127A (en) * | 2003-08-21 | 2007-02-15 | ユニシス コーポレイシヨン | A temperature control system that sprays liquid refrigerant droplets on an IC module and directs radiation. |
| WO2007023557A1 (en) * | 2005-08-25 | 2007-03-01 | Advantest Corporation | Electronic component test apparatus and temperature control method in electronic component test apparatus |
| CN105843278A (en) * | 2016-04-29 | 2016-08-10 | 广东美的制冷设备有限公司 | Method and system controlling environment temperature according to virtual scene and temperature data terminal |
| WO2016129208A1 (en) * | 2015-02-13 | 2016-08-18 | セイコーエプソン株式会社 | Electronic component transfer device and electronic component inspection device |
| TWI657252B (en) * | 2015-02-13 | 2019-04-21 | 日商精工愛普生股份有限公司 | Electronic component conveying device and electronic component inspection device |
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1999
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100491131B1 (en) * | 2002-09-17 | 2005-05-27 | (주)세미뱅크 | Apparatus for Testing Semiconductor Device |
| JP2007503127A (en) * | 2003-08-21 | 2007-02-15 | ユニシス コーポレイシヨン | A temperature control system that sprays liquid refrigerant droplets on an IC module and directs radiation. |
| WO2007023557A1 (en) * | 2005-08-25 | 2007-03-01 | Advantest Corporation | Electronic component test apparatus and temperature control method in electronic component test apparatus |
| US7768286B2 (en) | 2005-08-25 | 2010-08-03 | Advantest Corporation | Electronic device testing apparatus and temperature control method in an electronic device testing apparatus |
| WO2016129208A1 (en) * | 2015-02-13 | 2016-08-18 | セイコーエプソン株式会社 | Electronic component transfer device and electronic component inspection device |
| CN107889524A (en) * | 2015-02-13 | 2018-04-06 | 精工爱普生株式会社 | Electronic component conveyer and electronic component check device |
| TWI657252B (en) * | 2015-02-13 | 2019-04-21 | 日商精工愛普生股份有限公司 | Electronic component conveying device and electronic component inspection device |
| CN105843278A (en) * | 2016-04-29 | 2016-08-10 | 广东美的制冷设备有限公司 | Method and system controlling environment temperature according to virtual scene and temperature data terminal |
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| JP2019074484A (en) * | 2017-10-19 | 2019-05-16 | セイコーエプソン株式会社 | Electronic component conveying device and electronic component inspection device |
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