JPH01124727A - Heating device - Google Patents
Heating deviceInfo
- Publication number
- JPH01124727A JPH01124727A JP62283508A JP28350887A JPH01124727A JP H01124727 A JPH01124727 A JP H01124727A JP 62283508 A JP62283508 A JP 62283508A JP 28350887 A JP28350887 A JP 28350887A JP H01124727 A JPH01124727 A JP H01124727A
- Authority
- JP
- Japan
- Prior art keywords
- radiation thermometer
- temperature
- infrared radiation
- heated
- infrared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims description 48
- 230000005855 radiation Effects 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 27
- 238000005259 measurement Methods 0.000 abstract description 10
- 238000012790 confirmation Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000009529 body temperature measurement Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Landscapes
- Radiation Pyrometers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント回路基板（以後基板と略す）等を加
熱する装置に係シ、特に基板に電子部品を装着した後、
リフローはんだ付けするだめの加熱装置やハイブリッド
ＩＣ製造用の加熱装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for heating printed circuit boards (hereinafter referred to as "boards"), etc., and in particular, after electronic components are mounted on the boards.
The present invention relates to a heating device for reflow soldering and a heating device for manufacturing hybrid ICs.
従来の技術
従来、基板にはんだ材料を塗布し電子部品を装着した後
、加熱リフローする装置やハイブリッドＩＣ製造用の加
熱装置には、熱風による加熱、赤外線による加熱、ある
いは蒸気潜熱を利用した加熱等がある。Conventional technology Conventionally, after applying solder material to a board and mounting electronic components, heating reflow equipment and heating equipment for hybrid IC manufacturing use methods such as heating with hot air, heating with infrared rays, or heating using latent heat of vapor. There is.
しかしながら、上記のいずれの方法や装置に於いても実
際に基板等を生産する場合には、あらかじめ生産しよう
とする基板に温度センサー、例えば熱電対等をはりつけ
た状態で加熱装置の中を通して基板の加熱装置内温度を
測定すると同時に、はんだの溶は具合いやペーストの乾
燥具合い或は樹脂の硬化具合いを見て、加熱条件等を決
定していた。However, when actually producing substrates using any of the above methods and devices, a temperature sensor, such as a thermocouple, etc., is attached to the substrate in advance, and the substrate is heated by passing it through a heating device. At the same time as measuring the temperature inside the device, heating conditions, etc., were determined by checking the melting state of the solder, the drying state of the paste, or the hardening state of the resin.
以下図面を参照しながら、上述した従来の加熱装置のう
ち加熱リフロー装置について、図面を参照しながら説明
する。Hereinafter, a heating reflow apparatus among the above-mentioned conventional heating apparatuses will be described with reference to the drawings.
第４図は従来の赤外線加熱方式による加熱リフロー装置
の基本構成を示す概略図である。第４図においてＳｌは
予熱用パネルヒーターで、２はリフロー用ヒーターであ
る。３は被加熱物の冷却用ファンである。４は被加熱物
の搬送用コンベアである。５は温度測定用基板であり、
６は熱電対である。FIG. 4 is a schematic diagram showing the basic configuration of a conventional heating reflow apparatus using an infrared heating method. In FIG. 4, SI is a preheating panel heater, and 2 is a reflow heater. 3 is a fan for cooling the heated object. 4 is a conveyor for transporting objects to be heated. 5 is a temperature measurement board;
6 is a thermocouple.
以上のように構成された加熱リフロー装置について、以
下その動作を説明する。まず実装基板等を生産するにあ
たり、加熱リフロー装置の電源を入れ基板を加熱できる
状態にする。そしである−定時間放置後、所定の温度条
件になっているかどうか確認するために、温度測定用基
板６に熱電対６を適宜張シ付け、熱電対８の他端７を記
録用のペンレコーダー等（図示せず）へつなぎ、入口の
矢印８の所から温度測定用基板６を装置内に入れる。そ
して該基板の温度が予熱用パネルヒーター１とりフロー
用ヒーター２及び冷却用ファン３で温度コントロールさ
れ、所定の温度に成っていることを確認後、実際の生産
基板を流し始める。The operation of the heating reflow apparatus configured as described above will be described below. First, when producing a mounting board or the like, the heating reflow equipment is turned on and the board is ready to be heated. After leaving it for a certain period of time, in order to check whether the predetermined temperature condition has been reached, a thermocouple 6 is appropriately attached to the temperature measurement board 6, and the other end 7 of the thermocouple 8 is connected with a recording pen. It is connected to a recorder or the like (not shown), and the temperature measurement substrate 6 is inserted into the device from the entrance arrow 8. The temperature of the substrate is controlled by a preheating panel heater 1, a flow heater 2, and a cooling fan 3, and after confirming that the predetermined temperature has been reached, the actual production substrate begins to flow.
発明が解決しようとする問題点
しかしながら上記のような方法では、生産開始時点の温
度状１は分かっていても、実際に生産中の基板温度がど
ういう状態にあるのか分からないまま生産していること
になる。その結果、加熱ヒーターは同じ条件で加熱して
いても、周シの環境や、生産タクトの変化によシ装置内
の基板枚数の変化等により、実際の生産基板の温度は変
化していることが多く、はんだ付は不良の原因になって
いた。Problems to be Solved by the Invention However, with the method described above, even if the temperature state 1 at the time of starting production is known, production is carried out without knowing what state the substrate temperature is actually in during production. become. As a result, even if the heating heater is heated under the same conditions, the actual temperature of the produced substrates changes due to changes in the surrounding environment, production tact, changes in the number of substrates in the equipment, etc. In many cases, soldering was the cause of defects.
本発明は上記問題点に鑑み、生産中の実際の基板温度を
測定しながら、基板の温度コントロールをすることによ
り、はんだ付は不良の発生しない加熱装置を提供するも
のである。In view of the above-mentioned problems, the present invention provides a heating device that does not cause defects in soldering by controlling the temperature of the substrate while measuring the actual temperature of the substrate during production.
問題点を解決するだめの手段
上記問題点を解決するために、本発明の加熱装置は、赤
外線放射温度計と接触式の温度計を併用する事で、加熱
ヒーターによる赤外線の分布と被加熱物の赤外線放射率
を補正し、実際に生産する被加熱物である基板等の温度
を赤外線放射温度計で測定するという構成を備えだもの
である。Means for Solving the Problems In order to solve the above problems, the heating device of the present invention uses an infrared radiation thermometer and a contact thermometer in combination, so that the distribution of infrared rays by the heating heater and the object to be heated can be controlled. The infrared radiation thermometer is used to correct the infrared emissivity of the infrared radiation thermometer and measure the temperature of the substrate, etc., which is the heated object actually produced.
作 用
本発明は上記した構成によって、生産中の被加熱物であ
る基板等の温度を測定しながら、温度コントロールする
ので、被加熱物の温度調整を正確にすることができ、温
度が原因で発生する不良のほとんどを防ぐことができる
こととなる。Function The present invention uses the above-described configuration to control the temperature of the substrate, etc., which is the object to be heated during production, while measuring the temperature of the object to be heated. This means that most of the defects that occur can be prevented.
実施例
以下本発明の一実施例としてはんだリフロー装置を例に
図面を参照しながら説明する。EXAMPLE Hereinafter, an embodiment of the present invention will be described using a solder reflow apparatus as an example with reference to the drawings.
第１図は本発明の実施例における加熱リフロー装置の基
本構造を示した概略図である。第１図において、９は予
熱用パネルヒーターで、１０はリフロー用ヒーターであ
る。１１は被加熱物である基板等の冷却用ファンである
。１２は被加熱物である基板等の搬送用コンベアである
。１３は温度状態確認用基板であり、１４は熱電対であ
る。さらに１５は赤外線放射温度計である。FIG. 1 is a schematic diagram showing the basic structure of a heating reflow apparatus in an embodiment of the present invention. In FIG. 1, 9 is a preheating panel heater, and 10 is a reflow heater. Reference numeral 11 is a fan for cooling a substrate or the like that is a heated object. Reference numeral 12 denotes a conveyor for transporting substrates and the like that are objects to be heated. 13 is a board for checking the temperature state, and 14 is a thermocouple. Furthermore, 15 is an infrared radiation thermometer.
以上のように構成された加熱リフロー装置について、以
下第１図及び第２図を用いてその動作を説明する。The operation of the heating reflow apparatus configured as described above will be described below with reference to FIGS. 1 and 2.
第２図は加熱リフロー装置の温度状態確認用基板の概略
図であυ、実際の生産時に使用する基板と同じ基板１３
に電子部品１６を装着し、はんだ付は温度に加熱されて
もずれないよう接着剤または高温はんだで固定し、測定
したい点に熱電対１４を取り付け、場合によっては耐熱
性のある粘着テープ１７で熱電対１４を固定する。Figure 2 is a schematic diagram of a board for checking the temperature status of the heating reflow equipment.
Attach the electronic component 16 to the board, fix it with adhesive or high-temperature solder so that it will not come off even when heated, and attach the thermocouple 14 to the point to be measured, and in some cases use heat-resistant adhesive tape 17. Fix the thermocouple 14.
このような温度状態確認用基板を第１図に示す加熱リフ
ロー装置の矢印１８から入れ基板温度を測定する。該基
板１３が赤外線放射温度計１６の測定範囲に入ってきた
とき、熱電対１４の測定結果から赤外線放射温度計の補
正係数をだし、ヒーターからの赤外線の影響や、被加熱
物である基板１３自身の放射率の補正を行なうことによ
シ、赤外線放射温度計の測定精度を確保しておくように
する。The substrate for checking the temperature state is inserted into the heating reflow apparatus shown in FIG. 1 from the arrow 18, and the temperature of the substrate is measured. When the substrate 13 enters the measurement range of the infrared radiation thermometer 16, a correction coefficient of the infrared radiation thermometer is calculated from the measurement result of the thermocouple 14, and the correction coefficient of the infrared radiation thermometer is calculated from the measurement result of the thermocouple 14, and the influence of infrared rays from the heater and the substrate 13, which is the object to be heated, are calculated. By correcting its own emissivity, the measurement accuracy of the infrared radiation thermometer is ensured.
このようにした状態で、実際の基板を加熱し、生産基板
が赤外線放射温度計の測定範囲に入った時に、そのつど
該基板の温度を測定すると同時に、加熱ヒーターにフィ
ードバックしたり、搬送用コンベアのスピードを調整し
たシする機能を持たせる。In this state, the actual board is heated, and each time the production board enters the measurement range of the infrared radiation thermometer, the temperature of the board is measured and fed back to the heating heater or conveyed to the conveyor. Provides a function to adjust the speed of
以上のように本実施例によれば、被加熱物例えば基板等
の温度を赤外線放射温度計と接触式温度計の２種類で同
時に測定し、前記接触式温度計の結果と前記赤外線放射
温度計の結果から加熱用ヒーターによる赤外線の影響や
、前記被加熱物の放射率を算出し、前記赤外線放射温度
計の係数補正をする機能を保持した加熱リフロー装置に
することで、実際の基板温度を測定しながら加熱するこ
とができるので、その結果精度の良い温度コントロール
ができ、ひいては不良の発生しないはんだリフローが可
能となった。As described above, according to this embodiment, the temperature of an object to be heated, such as a substrate, is measured simultaneously with two types of infrared radiation thermometer and a contact thermometer, and the results of the contact thermometer and the infrared radiation thermometer are combined. By using a heating reflow apparatus that has the function of calculating the effect of infrared rays from the heating heater and the emissivity of the heated object from the results of , and correcting the coefficient of the infrared radiation thermometer, it is possible to calculate the actual substrate temperature. Since heating can be performed while measuring, it has become possible to control the temperature with high precision, which in turn has made it possible to perform solder reflow without causing defects.
しかしながら、赤外線放射温度計のセンサー部分は耐熱
性がないため、温度センサーの先端にガラスファイバー
を取シ付け、該ガラスファイバーを加熱装置内に入れる
ことや、センサー部分に空気や水を循環させることによ
り耐熱性をもたせることで、加熱炉内にある前記被加熱
物の温度を非接触で測定できるようになった。However, since the sensor part of an infrared thermometer is not heat resistant, it is difficult to attach a glass fiber to the tip of the temperature sensor and insert the glass fiber into a heating device, or to circulate air or water through the sensor part. By imparting heat resistance, it has become possible to measure the temperature of the object to be heated in the heating furnace without contact.
また搬送系を間欠法りにすることによシ、赤外線放射温
度計による測定位置と熱電対などによる接触式温度測定
位置を一致させることができるので、より高精度の温度
測定とコントロールが可能となった。In addition, by using an intermittent conveyance system, it is possible to match the measurement position of an infrared radiation thermometer with the contact temperature measurement position of a thermocouple, etc., making it possible to measure and control temperature with higher precision. became.
なお、本発明では赤外線放射温度計の補正方法として熱
電対を例にしたが、実際の能加熱物の温度を測定できる
ものであれば、抵抗温度測定機等地の物でも良い。さら
に赤外線放射温度計の取り Ａ付は位置を第３図に示す
よう予熱ゾーンに設けてもよい。In the present invention, a thermocouple is used as an example of a method for correcting an infrared radiation thermometer, but any other device such as a resistance temperature measuring device may be used as long as it can measure the temperature of an actual heated object. Furthermore, an infrared radiation thermometer with a handle A may be installed in the preheating zone as shown in FIG.
発明の効果
以上のように本発明は、被加熱物の温度を赤外線放射温
度計と接触式温度計の２種類で同時に測定し、前記接触
式温度計の結果と前記赤外線放射温度計の結果から前記
被加熱物の放射率と加熱ヒーターからでている赤外線の
影響を出し、前記赤外線放射温度計の係数補正をする機
能を設けることにより、生産中の被加熱物の温度を測定
しながら、温度コントロールするので、被加熱物の温度
調整を正確にする事ができ、温度が原因で発生する不良
のほとんどを防ぐ事ができることとなる。Effects of the Invention As described above, the present invention measures the temperature of a heated object simultaneously with two types of infrared radiation thermometer and a contact thermometer, and calculates the temperature of the object to be heated from the results of the contact thermometer and the infrared radiation thermometer. By providing a function to correct the coefficient of the infrared radiation thermometer by taking into account the emissivity of the object to be heated and the effect of infrared rays emitted from the heating heater, it is possible to adjust the temperature while measuring the temperature of the object to be heated during production. Since it is controlled, it is possible to accurately adjust the temperature of the heated object, and most of the defects caused by temperature can be prevented.
さらにこの方式は、赤外線による加熱方式以外にも熱風
による加熱方式や蒸気潜熱を利用した加熱方式において
も有効であると同時に、加熱リフロー装置のみならずハ
イブリッドＩＣｇ造用の乾燥炉や焼成炉、あるいはコー
ティング用樹脂の硬化装置においても有効である。Furthermore, this method is effective not only for heating methods using infrared rays but also for heating methods using hot air and heating methods using latent heat of steam. It is also effective in curing equipment for coating resins.
第１図は本発明の第１の実施例における加熱リフロー装
置の基本構造を示しだ概略正面図、第２図は加熱リフロ
ー装置の温度状態確認用基板の概略斜視図、第３図は第
２の実施例における加熱リフロー装置の概略正面図、第
４図は従来の赤外線加熱方式による加熱リフロー装置の
基本構成を示した概略正面図である。
９・・・・・・予熱用ハネルヒーター、１０・・・・・
・リフロー用ヒーター、１２・・・・・・被加熱物であ
る基板の搬送用コンベア、１３・・・・・・温度測定用
基板、１４・・・・・・熱電対、１６・・・・・・赤外
線放射温度計。FIG. 1 is a schematic front view showing the basic structure of a heating reflow apparatus according to a first embodiment of the present invention, FIG. 2 is a schematic perspective view of a temperature status confirmation board of the heating reflow apparatus, and FIG. FIG. 4 is a schematic front view showing the basic configuration of a heating reflow apparatus using a conventional infrared heating method. 9... Hanel heater for preheating, 10...
・Reflow heater, 12... Conveyor for transporting substrates as objects to be heated, 13... Temperature measurement board, 14... Thermocouple, 16... ...Infrared radiation thermometer.
Claims (6)
ためのヒーターと、前記被加熱物を搬送するコンベアと
を具備した加熱装置において、前記被加熱物の温度を赤
外線放射温度計と接触式温度計の２種類で同時に測定し
、前記接触式温度計の結果と前記赤外線放射温度計の結
果から、前記赤外線放射温度計の係数を補正可能に構成
したことを特徴とする加熱装置。(1) In a heating device equipped with a heater for heating an object to be heated to a predetermined temperature and a conveyor for conveying the object to be heated, the temperature of the object to be heated can be measured using an infrared radiation thermometer and a contact type. A heating device characterized in that the coefficient of the infrared radiation thermometer can be corrected based on the result of the contact type thermometer and the result of the infrared radiation thermometer, by measuring with two types of thermometers at the same time.
度測定しながら、該被加熱物の温度があらかじめ設定し
た温度になるようヒーターをコントロールすることを特
徴とする特許請求の範囲第１項記載の加熱装置。(2) The heater is controlled so that the temperature of the heated object reaches a preset temperature while measuring the temperature of the heated object with an infrared radiation thermometer. The heating device according to item 1.
度測定しながら、該被加熱物の温度があらかじめ設定し
た温度になるようコンベアの停止時間あるいはコンベア
の移動スピードをコントロールすることを特徴とする特
許請求の範囲第１項記載の加熱装置。(3) While measuring the temperature of the heated object with an infrared radiation thermometer, the conveyor stop time or conveyor moving speed is controlled so that the temperature of the heated object reaches a preset temperature. A heating device according to claim 1, characterized in that:
を使用し、ガラスファイバーを通して被加熱物からの赤
外線強度を検出するようにしたことにより、加熱炉の中
にあるセンサー部に耐熱性をもたせた赤外線放射温度計
を具備したことを特徴とする特許請求の範囲第１項記載
の加熱装置。(4) By using a glass fiber at the tip of the infrared radiation thermometer and detecting the intensity of infrared rays from the heated object through the glass fiber, the sensor part inside the heating furnace is made heat resistant. 2. The heating device according to claim 1, further comprising an infrared radiation thermometer.
たは水を循環させたことにより、耐熱性をもたせた赤外
線放射温度計を具備したことを特徴とする特許請求の範
囲第１項記載の加熱装置。(5) Claim 1, characterized in that the infrared radiation thermometer is equipped with an infrared radiation thermometer that is made heat resistant by circulating cooling air or water through the tip of the infrared radiation thermometer. heating device.
れを繰り返すことで、間欠送りをするようにしたことを
特徴とする特許請求の範囲第１項記載の加熱装置。(6) The heating device according to claim 1, wherein the object to be heated is conveyed a certain distance, then stopped for a certain period of time, and this is repeated to perform intermittent feeding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62283508A JPH01124727A (en) | 1987-11-10 | 1987-11-10 | Heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62283508A JPH01124727A (en) | 1987-11-10 | 1987-11-10 | Heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01124727A true JPH01124727A (en) | 1989-05-17 |
Family
ID=17666448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62283508A Pending JPH01124727A (en) | 1987-11-10 | 1987-11-10 | Heating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01124727A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104070258A (en) * | 2013-03-29 | 2014-10-01 | 千住金属工业株式会社 | Substrate heating device and soldering device |
| US9307912B2 (en) | 2012-08-08 | 2016-04-12 | Welch Allyn, Inc. | Temperature measurement system |
| JP7116236B1 (en) * | 2021-09-30 | 2022-08-09 | 株式会社オリジン | Soldering device and method for manufacturing soldered products |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58193428A (en) * | 1982-05-07 | 1983-11-11 | Kubota Ltd | Apparatus for measuring temperature of product in annealing furnace |
| JPS595494U (en) * | 1982-07-05 | 1984-01-13 | 株式会社クボタ | fishing boat |
| JPS6186071A (en) * | 1984-10-03 | 1986-05-01 | Tamura Seisakusho Co Ltd | Method for controlling preheating temperature in soldering |
| JPS62110127A (en) * | 1985-11-07 | 1987-05-21 | Koyo Rindobaagu Kk | Method for measuring temperature of article to be heat-treated in optical heat-treatment apparatus |
| JPS62183961A (en) * | 1986-02-10 | 1987-08-12 | Matsushita Electric Ind Co Ltd | Reflow soldering device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58193428A (en) * | 1982-05-07 | 1983-11-11 | Kubota Ltd | Apparatus for measuring temperature of product in annealing furnace |
| JPS595494U (en) * | 1982-07-05 | 1984-01-13 | 株式会社クボタ | fishing boat |
| JPS6186071A (en) * | 1984-10-03 | 1986-05-01 | Tamura Seisakusho Co Ltd | Method for controlling preheating temperature in soldering |
| JPS62110127A (en) * | 1985-11-07 | 1987-05-21 | Koyo Rindobaagu Kk | Method for measuring temperature of article to be heat-treated in optical heat-treatment apparatus |
| JPS62183961A (en) * | 1986-02-10 | 1987-08-12 | Matsushita Electric Ind Co Ltd | Reflow soldering device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9307912B2 (en) | 2012-08-08 | 2016-04-12 | Welch Allyn, Inc. | Temperature measurement system |
| US9474450B2 (en) | 2012-08-08 | 2016-10-25 | Welch Allyn, Inc. | Temperature measurement system |
| US9901258B2 (en) | 2012-08-08 | 2018-02-27 | Welch Allyn, Inc. | Temperature measurement system |
| CN104070258A (en) * | 2013-03-29 | 2014-10-01 | 千住金属工业株式会社 | Substrate heating device and soldering device |
| JP2014197632A (en) * | 2013-03-29 | 2014-10-16 | 株式会社デンソー | Substrate heating apparatus and soldering apparatus |
| JP7116236B1 (en) * | 2021-09-30 | 2022-08-09 | 株式会社オリジン | Soldering device and method for manufacturing soldered products |
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