CN106270864A - Hardware and handware non-contact thermal Sn-coupled SSBR method - Google Patents
Hardware and handware non-contact thermal Sn-coupled SSBR method Download PDFInfo
- Publication number
- CN106270864A CN106270864A CN201610703512.3A CN201610703512A CN106270864A CN 106270864 A CN106270864 A CN 106270864A CN 201610703512 A CN201610703512 A CN 201610703512A CN 106270864 A CN106270864 A CN 106270864A
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- Prior art keywords
- hardware
- handware
- workpiece
- solder
- heating
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of hardware and handware non-contact thermal Sn-coupled SSBR method, comprising the following steps: preset workpiece transmitting to heating system to by workpiece in drive system, described workpiece includes hardware and the pre-assembled structures of handware, solder at the solder joint that is preset between hardware and handware and in order to position the turnover clamp of pre-assembled structures；Workpiece is carried out contactless heat radiation heating so that the solder at solder joint is the most melted；To adding the workpiece enforcement cooling that thermal weld completes so that solder joint is by rapid solidification.By the welding assembling of device, solder are added and add thermal weld and split, difference operations can be carried out fine-grained management, be conducive to improving welding efficiency；Add thermal weld by contactless entirety, make solder joint the most endothermic melting, the solder joint between hardware and handware is carried out moistening, flowing and Elements Diffusion, be conducive to improving welding quality.
Description
Technical field
The present invention relates to processing technique field, be specifically related to the welding related process of the critical component of the communications field, especially
Relate to a kind of hardware and handware non-contact thermal Sn-coupled SSBR method.
Background technology
Antenna for base station is the critical component that mobile communications network covers, and the main flow parts wherein having a big class are to use metal
Structural member forms with handware joint welding.The welding quality of this main flow device, decides the product index of such antenna for base station, in order to
Ensure good electrical connection conduction property and structure connective stability, for stannum amount concordance, the melting property of solder joint of solder joint
And mechanical strength has rigors, therefore, welding condition quantify management and control, be realize homogeneity of product great before
Carry.
It is known that tradition Sn-coupled SSBR connects the welding method that technique is the heating of a kind of local, use flatiron heating, to being welded
Point carries out contact conduction heat, and auxiliary solder stick carries out the filling of solder simultaneously.The welding side of the hardware of the communications industry
Formula, is the most also to use the welding of this electric cautery.Due to the endothermic effect of hardware, disclosure satisfy that to make it heat
Welding demand, needs higher temperature transfer or Long contact time welding, is necessary for selecting powerful welding stage, due to for a long time
High temperature, accelerates Trimeresurus mucrosquamatus (Cantor). oxidation, is greatly reduced service life, exacerbates solder joint simultaneously and is heated and uneven cannot ensure welding temperature
Concordance and cause reliable welding quality to decline, on the other hand, use human weld's mode, it is impossible to ensure weld interval and
The concordance of tin feeding amount, quality conformance is poor, and welding efficiency is low.
Additionally, the parts that the hardware in antenna for base station forms with handware, it is many that its scrambling causes solder joint
Orientation, i.e. various dimensions solder joint exists the most simultaneously, uses manual flatiron welding, need to repeatedly put and position, will realize it complete
The welding of automatization, the most impossible.
Industry also has some to innovate, it is simply that use three-dimensional machinery hand-motion flatiron to carry out positioning welding, can be in certain journey
Solve isoplanar solder joint on degree, solve the quantization management and control sending stannum and weld interval simultaneously, but still cannot solve from principle
The certainly heat absorption the brought impact of hardware, the welding spot reliability problem of generation.
Summary of the invention
The purpose of the present invention aims to provide and a kind of improves welding efficiency, ensures the hardware of welding quality and handware
Non-contact thermal Sn-coupled SSBR method.
To achieve these goals, the present invention provides techniques below scheme:
A kind of hardware and handware non-contact thermal Sn-coupled SSBR method, including having drive system, along workpiece
The heating system of transmission direction setting and the overall heating welding device of cooling system, said method comprising the steps of: Xiang Chuan
Preset workpiece being transmitted to heating system by workpiece in dynamic system, described workpiece includes the pre-assembled of hardware and handware
Solder at structure, the solder joint being preset between hardware and handware and pressing from both sides in order to position the turnover of pre-assembled structures
Tool；Workpiece is carried out contactless heat radiation heating so that the solder at solder joint is the most melted；To adding the workpiece that thermal weld completes
Implement cooling so that solder joint is by rapid solidification.
Further, also include the pre-assembled operation of workpiece, specifically include following steps: prepare hardware and by it
Pre-determined bit is on turnover clamp；Hardware assembles handware, and realizes the pretension of the two；To hardware and five
Preset solder at solder joint between gold part.
Preferably, automatically add equipment by solid type solder at solder joint between hardware and handware, add institute
State solder.
Preferably, workpiece is carried out in contactless heat radiation heating steps, during to the heating-up temperature of heating system, heating
Between be set, make heating system according to preset heating parameters to workpiece heat.
Further, heating region is implemented temperature Sub-region and hierarchical to control so that temperature at hardware body and solder joint
Degree difference is in 5-10 DEG C.
The method also includes subsequent step, specifically includes: take off the finished product welded from turnover clamp, and by passing
Dynamic system passback turnover clamp.
Compared to existing technology, the solution of the present invention has the advantage that
1, the Sn-coupled SSBR of the present invention connects in method, and owing to being fixed by welding device, solder adds, adds thermal weld and tear open
Point, set up different operation and carry out fine-grained management, it is simple to automatization carries out welding process, it is achieved modularization management, improves
Welding efficiency, it is ensured that welding quality.
2, the Sn-coupled SSBR of the present invention connects method and uses contactless overall heating welding scheme, it is ensured that the weldering of hardware
The jointing temp uniformity and temperature uniformity；By temperature programmed control, needed for meeting the characteristic of Sn-coupled SSBR material, it is ensured that the mobility of solder and weldering
Point forms intensity.
3, the Sn-coupled SSBR of the present invention connects method and uses contactless overall heating welding scheme, uses state modulator effect,
Making obtain management and control the most accurately its weld interval, welding quality is guaranteed.
Aspect and advantage that the present invention adds will part be given in the following description, and these will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Accompanying drawing explanation
The present invention above-mentioned and/or that add aspect and advantage will become from the following description of the accompanying drawings of embodiments
Substantially with easy to understand, wherein:
Fig. 1 is the workpiece of present invention schematic diagram of overall heating in overall heating welding device.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, is only used for explaining the present invention, and is not construed as limiting the claims.
The hardware of the present invention and handware non-contact thermal Sn-coupled SSBR method (hereinafter referred to as " Sn-coupled SSBR side
Method "), mainly include preset workpiece (adding containing solder), non-contact thermal workpiece, cooling workpiece, the dismounting big step of workpiece four,
Split by fixing, the solder of welding device being added, adding thermal weld, set up different operation and to its pipe that becomes more meticulous
Control, it is simple to automatically complete welding process, it is achieved that modularization management.
Wherein, solder is added in solid type solder interpolation equipment automatically and carries out, and can realize at the solder joint of many required welding
The synchronization multiple spot carrying out solder adds so that it is solder has accurate quantification, solder shape moves to, to guarantee to weld in welding process
The flow distance concordance of stannum.
As it is shown in figure 1, non-contact thermal is carried out in overall heating welding device 1, this entirety heating welding device 1 has
There is the drive system for transmitting workpiece and set gradually heating system and cooling system along workpiece transmission direction, and heating system
System for carrying out 360 degree of comprehensive heat radiations to workpiece so that each orientation of product, position can thermally equivalent, thus
Make the solder on solder joint the most endothermic melting, and then carry out moistening, stream between the solder joint 3,4 of hardware 2 and handware
Dynamic, then carry out the liquid solder rapid solidification that cools down at so that solder joint and form required solder joint.
Described Sn-coupled SSBR method specifically includes following steps:
In drive system preset workpiece and by workpiece to heating system transmit；
Described workpiece includes hardware 2 and the pre-assembled structures of handware, is preset at hardware and handware
Between solder joint at solder and in order to position the turnover clamp of pre-assembled structures.Described turnover clamp has spacing and location merit
Can, high temperature resistant and spacing and location while can be used for multiple half product.
Workpiece is carried out contactless heat radiation heating so that the solder at solder joint is the most melted.In the present invention, by upper
State entirety to add hot welding equipment workpiece carries out comprehensive heat radiation heating so that solder joint is the most endothermic melting, in metal structure
The diffusion of moistening, flowing and element is carried out between part and the solder joint of handware.
To adding the workpiece enforcement cooling that thermal weld completes so that solder joint, by rapid solidification, completes whole contactless stannum
Soldering connects.
Further, also include the pre-assembled operation of workpiece, specifically include following steps:
Prepare hardware and by its pre-determined bit on turnover clamp；
Hardware assembles handware, and realizes the pretension of the two；Wherein, hardware has indent knot
Structure, described handware embeds in the concave inward structure of hardware, and realizes the two by a kind of resistant to elevated temperatures pre-clamping tool
Pretension, and make the hardware stand-off height with handware less than 0.1mm.Additionally, pre-clamping tool is owing to having high temperature resistance super
Property, it is possible to prevent to lose efficacy because expanding with heat and contract with cold effect at object itself.
Preset solder at solder joint between hardware and handware.Preferably, in the present invention, by solid type solder
Automatically add equipment at solder joint between hardware and handware, add described solder.
Preferably, workpiece is carried out in contactless heat radiation heating steps, during to the heating-up temperature of heating system, heating
Between be set, make heating system according to preset heating parameters to workpiece heat.
Preferably, heating region is implemented temperature Sub-region and hierarchical to control so that temperature at hardware body and solder joint
Difference is in 5-10 DEG C, it is ensured that the electrodeposited coating of handware and welding temperature demand.
Further, it is additionally included in the subsequent step after having welded, specifically includes: take off from turnover clamp and welded
The finished product become, and return turnover clamp by drive system, complete a complete single cycle flow process.
The above is only the some embodiments of the present invention, it is noted that for the ordinary skill people of the art
For Yuan, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (6)
1. a hardware and handware non-contact thermal Sn-coupled SSBR method, it is characterised in that include that there is power train
System, the heating system arranged along workpiece transmission direction and the overall heating welding device of cooling system, described method includes following
Step:
In drive system preset workpiece and by workpiece to heating system transmit, described workpiece includes hardware and handware
Pre-assembled structures, solder at the solder joint that is preset between hardware and handware and in order to position pre-assembled structures
Turnover clamp；
Workpiece is carried out the heating of contactless heat radiation entirety so that the solder at solder joint is the most melted；
To adding the workpiece enforcement cooling that thermal weld completes so that solder joint is by rapid solidification.
Hardware the most according to claim 1 and handware non-contact thermal Sn-coupled SSBR method, it is characterised in that
Also include the pre-assembled operation of workpiece, specifically include following steps:
Prepare hardware and by its pre-determined bit on turnover clamp；
Hardware assembles handware, and realizes the pretension of the two；
Preset solder at solder joint between hardware and handware.
Hardware the most according to claim 2 and handware non-contact thermal Sn-coupled SSBR method, it is characterised in that
Automatically add equipment by solid type solder at solder joint between hardware and handware, add described solder.
Hardware the most according to claim 1 and handware non-contact thermal Sn-coupled SSBR method, it is characterised in that
Workpiece is carried out in contactless heat radiation heating steps, heating-up temperature, the heat time heating time of heating system is set, makes to add
Hot systems according to preset heating parameters to workpiece heat.
Hardware the most according to claim 4 and handware non-contact thermal Sn-coupled SSBR method, it is characterised in that
Heating region is implemented temperature Sub-region and hierarchical control so that hardware body and solder joint exist temperature difference.
Hardware the most according to claim 1 and handware non-contact thermal Sn-coupled SSBR method, it is characterised in that
Also include subsequent step, specifically include: from turnover clamp, take off the finished product welded, and by drive system passback turnover
Fixture.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610703512.3A CN106270864B (en) | 2016-08-22 | 2016-08-22 | Non-contact heating tin brazing method for metal structural part and hardware part |
| PCT/CN2017/082151 WO2018036187A1 (en) | 2016-08-22 | 2017-04-27 | Non-contact heating tin brazing method for welding metal structure and hardware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610703512.3A CN106270864B (en) | 2016-08-22 | 2016-08-22 | Non-contact heating tin brazing method for metal structural part and hardware part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106270864A true CN106270864A (en) | 2017-01-04 |
| CN106270864B CN106270864B (en) | 2019-12-27 |
Family
ID=57662246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610703512.3A Active CN106270864B (en) | 2016-08-22 | 2016-08-22 | Non-contact heating tin brazing method for metal structural part and hardware part |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106270864B (en) |
| WO (1) | WO2018036187A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018036227A1 (en) * | 2016-08-22 | 2018-03-01 | 京信通信技术(广州)有限公司 | Method for non-contact heating and tin brazing of metal structural member and coaxial cable |
| WO2018036187A1 (en) * | 2016-08-22 | 2018-03-01 | 京信通信技术(广州)有限公司 | Non-contact heating tin brazing method for welding metal structure and hardware |
| WO2018036202A1 (en) * | 2016-08-22 | 2018-03-01 | 京信通信技术(广州)有限公司 | Method for non-contact heating and tin brazing of metal structural member and pcb |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018036187A1 (en) * | 2016-08-22 | 2018-03-01 | 京信通信技术(广州)有限公司 | Non-contact heating tin brazing method for welding metal structure and hardware |
| WO2018036202A1 (en) * | 2016-08-22 | 2018-03-01 | 京信通信技术(广州)有限公司 | Method for non-contact heating and tin brazing of metal structural member and pcb |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106270864B (en) | 2019-12-27 |
| WO2018036187A1 (en) | 2018-03-01 |
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Effective date of registration: 20200121 Address after: 510730 Guangdong city of Guangzhou province Guangzhou economic and Technological Development Zone Jinbi Road No. 6 Patentee after: Jingxin Communication Technology (Guangzhou) Co., Ltd. Address before: 510663 No. 6, layered Road, Guangzhou economic and Technological Development Zone, Guangdong Co-patentee before: Jingxin Communication System (China) Co., Ltd. Patentee before: Jingxin Communication Technology (Guangzhou) Co., Ltd. Co-patentee before: TIANJIN COMBA TELECOM SYSTEMS CO., LTD. |