CN110497055B - Pure nickel and copper nickel plating material joint solder paste welding process - Google Patents
Pure nickel and copper nickel plating material joint solder paste welding process Download PDFInfo
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- CN110497055B CN110497055B CN201910826439.2A CN201910826439A CN110497055B CN 110497055 B CN110497055 B CN 110497055B CN 201910826439 A CN201910826439 A CN 201910826439A CN 110497055 B CN110497055 B CN 110497055B
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- nickel
- copper
- nickel sheet
- sheet
- copper nickel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a pure nickel and copper nickel plating material joint solder paste welding process, which comprises the following steps: manufacturing a special printing screen plate which is attached by pure nickel and copper nickel plating materials; carrying out bidirectional printing on a nickel sheet or a copper nickel sheet by using a nickel sheet printing jig; bonding and aligning the two nickel sheets and the copper nickel sheet to ensure that the error of the two bonded nickel sheets and the copper nickel sheet is smaller than a set tolerance standard; loading and fixing the adhered nickel sheet and the copper nickel sheet by using a permanent magnet furnace-passing carrier; adjusting the welding temperature, and performing reflow welding by using a mesh belt furnace or a track furnace; and (4) cooling the nickel sheet printing jig by using a high-speed cooling fan, and checking the quality of the nickel sheet product after the nickel sheet printing jig is attached and welded. The invention can improve the current resistance of the nickel plate, ensure the welding quality, has wider product application range, greatly reduces the manufacturing cost especially for the design of the lithium battery pack, reduces the equipment investment, and has high speed, less investment and higher quality reliability for developing new varieties.
Description
Technical Field
The invention relates to the technical field of welding, in particular to a pure nickel and copper nickel plating material joint solder paste welding process.
Background
In the prior art, a laser spot welding process is generally used for manufacturing the nickel sheets, although the precision of the product is high, the equipment investment cost is high, the production process is complex, and the production efficiency of the product is low.
Accordingly, there is a need in the art for improvements.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is as follows: provides a solder paste welding process for the attachment of pure nickel and copper nickel plating materials, which aims to solve the problems in the prior art.
According to one aspect of the embodiment of the invention, the solder paste welding process for the pure nickel and copper nickel plating material lamination comprises the following steps:
manufacturing a special printing screen plate which is made of pure nickel and copper nickel plating materials and is adhered to the pure nickel and copper nickel plating materials, wherein the special printing screen plate is a dot-matrix perforated and distributed printing screen plate;
performing bidirectional printing on a nickel sheet or a copper nickel sheet by using a nickel sheet printing jig, wherein the tolerance requirement of the nickel sheet printing jig is less than 0.1 mm;
bonding and aligning the two nickel sheets and the copper nickel sheet to ensure that the error of the two bonded nickel sheets and the copper nickel sheet is smaller than a set tolerance standard;
loading and fixing the adhered nickel sheet and the copper nickel sheet by using a permanent magnet furnace-passing carrier;
adjusting the welding temperature, and performing reflow welding by using a mesh belt furnace or a track furnace, wherein the welding temperature is not higher than 300 ℃;
and (4) cooling the nickel sheet printing jig by using a high-speed cooling fan, and checking the quality of the nickel sheet product after the nickel sheet printing jig is attached and welded.
In another embodiment of the above welding process for bonding solder paste to a pure nickel and copper nickel-plated material, the dot matrix type hole opening mode of the screen plate for printing is as follows: the diameter of the open pores is 0.3-1.0 mm, the distance between the open pores is 0.5-2.0 mm, and the thickness of the screen plate is 0.15-0.2 mm.
In another embodiment of the welding process of the pure nickel and copper nickel plating material bonded with the solder paste, the permanent magnet of the permanent magnet furnace-passing carrier is a circular permanent magnet with a diameter of 8 mm, and the periphery of the permanent magnet is covered by a 0.1 mm anti-corrosion iron sheet.
In another embodiment of the solder paste bonding process for bonding the pure nickel and copper nickel plating materials, the error between the two bonded nickel sheets and the copper nickel plating sheet is less than the set tolerance standard by 0.1 mm.
In another embodiment of the welding process of the pure nickel and copper nickel plating material bonding solder paste according to the invention, paper is arranged on the lower side of the permanent magnet furnace carrier and used for receiving pollutants generated during welding and preventing pollution to the jig.
Compared with the prior art, the invention has the following advantages:
the pure nickel and copper nickel plating material laminating solder paste welding process is manufactured in a mode of laminating nickel sheet product materials and a mode of carrying out reflow welding through carrier clamping, can improve the current resistance of the nickel sheet, ensures the welding quality, has a wider product application range, greatly reduces the manufacturing cost especially for the design of a lithium battery pack, reduces the equipment investment, and has high speed, less investment and higher quality reliability in developing new varieties.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description will be given below of the drawings used in the description of the embodiments or the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a flow chart of an embodiment of a pure nickel and copper nickel plating material bonding solder paste welding process of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The solder paste bonding process for pure nickel and copper nickel plating material provided by the invention is described in more detail below with reference to the accompanying drawings and examples.
Fig. 1 is a flowchart of an embodiment of a solder paste bonding process for a nickel-plated pure nickel material and a nickel-plated copper material according to the present invention, and as shown in fig. 1, the solder paste bonding process for a nickel-plated pure nickel material and a nickel-plated copper material according to the embodiment includes:
10, manufacturing a special printing screen plate which is made of pure nickel and copper nickel plating materials and is adhered to the pure nickel and copper nickel plating materials, wherein the special printing screen plate is a dot-matrix perforated distribution printing screen plate; the dot matrix type hole opening mode of the special screen for printing is as follows: the diameter of the open pores is 0.3-1.0 mm, the distance between the open pores is 0.5-2.0 mm, and the thickness of the screen plate is 0.15-0.2 mm;
20, performing bidirectional printing on a nickel sheet or a copper nickel sheet by using a nickel sheet printing jig, wherein the tolerance requirement of the nickel sheet printing jig is less than 0.1 mm;
30, bonding and aligning the two nickel sheets and the copper nickel sheet to ensure that the error of the two bonded nickel sheets and the copper nickel sheet is smaller than a set tolerance standard; the error between the two attached nickel sheets and the copper nickel sheet is less than the set tolerance standard and is 0.1 mm;
40, loading and fixing the adhered nickel sheet and the copper nickel sheet by using a permanent magnet furnace-passing carrier; the permanent magnet of the permanent magnet furnace-passing carrier is a circular permanent magnet with the diameter of 8 mm, and the periphery of the permanent magnet is covered by a 0.1 mm anti-corrosion iron sheet; paper is arranged on the lower side of the permanent magnet furnace carrier and used for receiving pollutants generated during welding and preventing pollution to the smelting tool; under the condition of no limitation, the more permanent magnets, the better, the permanent magnet furnace carrier is fully paved, and the attached nickel sheet product is placed on the permanent magnet furnace carrier, so that the nickel sheet product is prevented from falling off after being adsorbed, the attachment state is kept, and welding is facilitated to be completed;
50, adjusting the welding temperature, and performing reflow welding by using a mesh belt furnace or a track furnace, wherein the welding temperature is not higher than 300 ℃; the temperature setting is to fully consider the thickness, the size, the heat absorption and the heat dissipation states of the nickel sheet product and set parameters by combining the welding of the solder paste;
and 60, cooling the nickel sheet printing jig by using a high-speed cooling fan, and checking the quality of the nickel sheet product after the nickel sheet printing jig is attached and welded. After welding, the nickel sheet printing jig and the nickel sheet product are taken out, and high-temperature protective gloves must be worn. The nickel sheet printing jig is cooled through the high-speed cooling fan, and can be reused after the cooling waiting time is 5-8 minutes.
The welded nickel sheet product is visually checked by an operator whether the part adhered and welded has a poor warping welding phenomenon or not and whether the surface is flat or not, the position where tin beads are generated is cleaned, and the product is delivered for inspection after the position is confirmed to be correct.
The above detailed description of the solder paste welding process for bonding pure nickel and copper nickel plating materials provided by the invention, and the specific examples applied herein illustrate the principle and implementation of the invention, and the description of the above examples is only used to help understanding the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (5)
1. A pure nickel and copper nickel plating material joint solder paste welding process is characterized by comprising the following steps:
manufacturing a special printing screen plate which is made of pure nickel and copper nickel plating materials and is adhered to the pure nickel and copper nickel plating materials, wherein the special printing screen plate is a dot-matrix perforated and distributed printing screen plate;
performing bidirectional printing on a nickel sheet or a copper nickel sheet by using a nickel sheet printing jig, wherein the tolerance requirement of the nickel sheet printing jig is less than 0.1 mm;
bonding and aligning the two nickel sheets and the copper nickel sheet to ensure that the error of the two bonded nickel sheets and the copper nickel sheet is smaller than a set tolerance standard;
loading and fixing the adhered nickel sheet and the copper nickel sheet by using a permanent magnet furnace-passing carrier;
adjusting the welding temperature, and performing reflow welding by using a mesh belt furnace or a track furnace, wherein the welding temperature is not higher than 300 ℃;
and (4) cooling the nickel sheet printing jig by using a high-speed cooling fan, and checking the quality of the nickel sheet product after the nickel sheet printing jig is attached and welded.
2. The solder paste welding process for attaching pure nickel and copper nickel plating materials to the pure nickel and copper nickel plating material of claim 1, wherein the dot matrix type hole opening mode of the special printing screen is as follows: the diameter of the open pores is 0.3-1.0 mm, the distance between the open pores is 0.5-2.0 mm, and the thickness of the screen plate is 0.15-0.2 mm.
3. The process of claim 1, wherein the permanent magnet of the permanent magnet furnace-passing carrier is a circular permanent magnet with a diameter of 8 mm, and the periphery of the permanent magnet is covered with a 0.1 mm corrosion-resistant sheet iron.
4. The solder paste welding process for attaching the pure nickel and copper nickel plating materials according to claim 1, wherein the error between the two attached nickel sheets and the copper nickel sheet is less than a set tolerance standard and is 0.1 mm.
5. The process of claim 1, wherein paper is disposed on the underside of the permanent magnet furnace carrier for receiving contaminants generated during welding to prevent contamination of the tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910826439.2A CN110497055B (en) | 2019-09-03 | 2019-09-03 | Pure nickel and copper nickel plating material joint solder paste welding process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910826439.2A CN110497055B (en) | 2019-09-03 | 2019-09-03 | Pure nickel and copper nickel plating material joint solder paste welding process |
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| CN110497055A CN110497055A (en) | 2019-11-26 |
| CN110497055B true CN110497055B (en) | 2021-08-13 |
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| CN113225934B (en) * | 2021-05-07 | 2024-06-04 | 北京比特大陆科技有限公司 | Force calculating plate and manufacturing method thereof |
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| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
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| CN108289390A (en) * | 2018-03-21 | 2018-07-17 | 上海飞骧电子科技有限公司 | Solve support plate design, packaging method and support plate that small-sized Resistor-Capacitor Unit is set up a monument |
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2019
- 2019-09-03 CN CN201910826439.2A patent/CN110497055B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN102065646A (en) * | 2011-01-18 | 2011-05-18 | 武汉正维电子技术有限公司 | Surface mount technology of ratio frequency power amplification mainboard |
| CN103201834A (en) * | 2011-11-04 | 2013-07-10 | 松下电器产业株式会社 | Semiconductor device and manufacturing method thereof |
| CN106304688A (en) * | 2016-08-24 | 2017-01-04 | 广州梁氏通讯电器有限公司 | The Welding Structure of PCB and FPCB and welding method thereof |
| CN108289390A (en) * | 2018-03-21 | 2018-07-17 | 上海飞骧电子科技有限公司 | Solve support plate design, packaging method and support plate that small-sized Resistor-Capacitor Unit is set up a monument |
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