CN110933859A - Method for correcting BGA design through BGA adapting circuit board - Google Patents
Method for correcting BGA design through BGA adapting circuit board Download PDFInfo
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- CN110933859A CN110933859A CN201911169296.9A CN201911169296A CN110933859A CN 110933859 A CN110933859 A CN 110933859A CN 201911169296 A CN201911169296 A CN 201911169296A CN 110933859 A CN110933859 A CN 110933859A
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- bga
- circuit board
- welding
- adapting
- corrected
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Abstract
The invention discloses a method for correcting BGA design through a BGA transfer circuit board, which comprises the following steps: step 1), confirming the part of the BGA connecting circuit on the product printed circuit board which needs to be designed and corrected; step 2), removing the BGA device to be corrected from the BGA repairing table; step 3), manufacturing a BGA adapting circuit board according to the BGA connecting circuit design needing to be corrected on the product printed circuit board; step 4), welding the BGA device detached in the step 2) on the BGA repair platform on the BGA adapting circuit board manufactured in the step 3); and 5) welding the BGA adapting circuit board welded with the BGA device obtained in the step 4) on a product printed circuit board on the BGA repairing table. The invention manufactures the BGA adapting circuit board according to the BGA connecting circuit design on the product printed circuit board which needs to be corrected, thereby realizing the correction of the design defect of the BGA connecting circuit on the product printed circuit board, obviously saving the material cost, greatly shortening the research and development period and effectively reducing the research and development cost.
Description
Technical Field
The invention relates to the field of printed circuit board assembly, in particular to a method for correcting BGA design through a BGA adapter circuit board.
Background
Along with the requirements of multifunction and miniaturization of electronic products, the assembly density of the printed circuit board is higher and higher, the accuracy is higher and higher, and the BGA is widely applied to the current design and production due to the characteristics of high reliability, small volume, comprehensive functions, good electric heating performance and small volume. However, in the process of product development or debugging, because of more pins and complex functions of the BGA, it is inevitable to find out the defects of the BGA connection circuit on the product printed circuit board. The main defects of BGA packaging are that pins of the BGA packaging are arranged at the bottom of a body and are not exposed, detection and repair of welding spots are very difficult, once defects are found in circuit design of the BGA, for example, partial pins on the middle part of the BGA need to be mutually connected and are not actually connected, or partial welding spots need to be externally connected with other devices but do not have enough welding pads and the like, the original designed functions of a printed circuit board cannot be realized, the characteristics of the BGA packaging are also the defects in the repair process, the traditional method for repairing and welding other devices cannot be used for BGA repair, and when the defects in BGA design of connecting circuits on a printed circuit board of a BGA product are found at present, the printed circuit board is basically redesigned and processed to carry out BGA design and production, or the printed circuit board is required to be redesigned and produced at the same time, and then.
For example, the invention application with the application number of 201410448579.8 discloses a BGA rework packaging method, which is to remove a BGA chip to be reworked on a printed circuit board, clean a bonding pad on the printed circuit board, coat solder paste and soldering flux on the printed circuit board, attach a new BGA chip, align each solder ball on the new BGA chip with the bonding pad on the printed circuit board, and perform hot air reflow soldering processing on the attached printed circuit board and the new BGA chip by using a set rework reflow soldering curve. This operation mode can only correct the problem of BGA soldering defects, but cannot correct the problem of BGA connecting circuit design defects.
In the prior art, there are also a few methods for correcting the defects of the BGA connection circuit design, for example, the invention application with application number 200510099731.7 discloses a method for connecting other devices by repairing the pins of BGA package devices. The method comprises the steps of detaching the BGA device from the printed circuit board, connecting other devices needing to be connected with the BGA through leads, and then welding the BGA to the printed circuit board, so that the printed circuit board can simply and quickly realize the originally defined functions. However, in the above BGA connection circuit design modification method, the lead is soldered to the BGA, but the pads on the BGA are small, the number of the pads is large, the pitch is small, the operation technology for soldering the lead to the BGA is high, and the success rate is low; and only a few pins which are connected in a straight line can be used for correcting the defect of no connection, and the reliability of the corrected product is extremely low.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a method for correcting BGA design through a BGA adapter circuit board, the method designs and manufactures a BGA adapter circuit board according to a BGA which is used for correcting the design according to the requirement, and manufactures a correction circuit on the BGA adapter circuit board, the BGA adapter circuit board not only can correct the design of a BGA connecting circuit, but also can lead out an external bonding pad according to the requirement, thereby reducing the operation difficulty of connecting a lead on the bonding pad, improving the reliability of correcting the design, obviously shortening the research and development period and obviously reducing the research and development cost.
The technical scheme adopted by the invention for solving the technical problem is as follows: a method for correcting a BGA design through a BGA interposer board, said method comprising the steps of:
step 1), confirming the part of the BGA connecting circuit on the product printed circuit board which needs to be designed and corrected;
step 2), removing the BGA device to be corrected from the BGA repairing table;
step 3), manufacturing a BGA adapting circuit board according to the BGA design to be corrected on the product printed circuit board;
step 4), welding the BGA device detached in the step 2) on the BGA repair platform on the BGA adapting circuit board manufactured in the step 3);
and 5) welding the BGA adapting circuit board welded with the BGA device obtained in the step 4) on a product printed circuit board on a BGA repairing table.
Further, the step 2) specifically includes the following steps:
presetting a heating desoldering temperature curve of the BGA repair platform, wherein the peak temperature is 225 ℃ for lead welding or 245 ℃ for lead-free welding, or setting according to BGA welding materials;
placing the printed circuit board of the product welded with the BGA device to be corrected on a BGA repairing table;
and starting the BGA repair platform for heating, and when all welding spots on the BGA device are melted after finishing the real-time monitoring of the BGA repair platform, using the suction nozzle to remove the BGA device from the printed circuit board product.
Further, the step 3) specifically includes the following steps:
the width of the BGA adapting circuit board is 3-5 mm wider than that of the BGA device to be corrected, or the BGA adapting circuit board is designed and manufactured according to actual needs;
the BGA adapting circuit board is 1.0-2.0 mm in thickness or designed and manufactured according to actual requirements;
the BGA adapting circuit board is provided with welding pads with the same number and size as those of the BGA devices on the upper and lower parts;
on the BGA repair platform, implanting a solder ball consistent with the BGA device on one surface of the BGA transfer circuit board, which is welded with the product printed circuit board;
the BGA adapter circuit board only comprises printed circuits needing to be corrected except for the bonding pads and the soldering tin balls on the upper surface and the lower surface.
Further, the step 4) specifically includes the following steps:
confirming that a welding pad which is welded on the BGA adapting circuit board and corresponds to the BGA device is clean, and removing redundant materials before welding;
coating soldering paste containing soldering flux on a corresponding bonding pad on the BGA adapting circuit board for mounting and soldering the BGA device by using a proper steel sheet;
placing the BGA device on the processed BGA adapting circuit board on the BGA repairing table;
and heating and welding the BGA adapting circuit board provided with the BGA device on the BGA repairing table.
Further, the step 5) specifically includes the following steps:
confirming that a welding disc of the printed circuit board of the product, which is welded and corresponds to the BGA adapting circuit board, is clean, and removing redundant materials before welding;
coating soldering paste containing soldering flux on a corresponding bonding pad on a product printed circuit board of the BGA transfer circuit board by using a proper steel sheet;
placing the BGA adapting circuit board provided with the BGA device on the processed product printed circuit board on the BGA repairing table;
and heating and welding the printed circuit board of the product with the BGA adapting circuit board on the BGA repairing table.
Furthermore, in the step 3), besides the bonding pad with the same size as that of the BGA device, an external bonding pad can be led out according to actual requirements from one surface of the BGA adapting circuit board welded with the BGA device.
The invention has the beneficial effects that: compared with the prior art, the BGA adapting circuit board is designed and manufactured according to the BGA design needing to be corrected, and the repair of the defects of the BGA design is realized. Compared with a method for welding a lead on a BGA bonding pad, the method has the advantages that the difficulty of a welding technology is reduced, an external device can be connected, and the correction that the internal circuit of the BGA needs to be interconnected can be realized. The BGA adapting circuit board is designed and manufactured, on one hand, the existing BGA device and the printed circuit board which is possibly required to be reprocessed are fully utilized, the resource waste is avoided, and the material cost is obviously saved; on the other hand, the time for redesigning the BGA device and possibly needing to reprocess the printed circuit board is shortened, the research and development period is effectively shortened, and the research and development cost is reduced.
Drawings
FIG. 1 is a schematic diagram of the components of the present invention for correcting a BGA design via a BGA interposer board.
FIG. 2 is a schematic cross-sectional view of the components of the present invention for correcting a BGA design using a BGA interposer board.
1-BGA device; 2-BGA adapting circuit board; 3-product printed circuit board; 4-BGA adapting circuit board soldering tin ball; 5-BGA device solder ball.
Detailed Description
The invention is further illustrated by the following specific examples. These examples are intended to illustrate the invention and are not intended to limit the scope of the invention.
With reference to fig. 1-2 of the specification, a method for correcting a BGA design through a BGA interposer board mainly includes the following steps:
step 1), confirming the part of the BGA connecting circuit on the product printed circuit board 3 which needs to be designed and corrected;
step 2), removing the BGA device 1 needing to be corrected from the BGA repairing table;
step 3), manufacturing a BGA adapting circuit board 2 according to the BGA design to be corrected on the product printed circuit board 3;
step 4), welding the BGA device 1 detached in the step 2) on the BGA transfer circuit board 2 manufactured in the step 3) on a BGA repair platform;
and 5) welding the BGA adapting circuit board 2 welded with the BGA device 1 obtained in the step 4) to a product printed circuit board 3 on a BGA repairing table.
Wherein, the step 2) specifically comprises the following steps:
presetting a heating desoldering temperature curve of the BGA repair platform, wherein the peak temperature is 225 ℃ for lead welding or 245 ℃ for lead-free welding, or setting according to BGA welding materials;
placing the product printed circuit board 3 welded with the BGA device 1 to be corrected on a BGA repair table;
the BGA repairing table is started to heat, and according to the condition of the BGA repairing table monitored in real time, when all welding spots on the BGA device 1 are melted, the BGA device 1 is detached from the product printed circuit board 3 by using a suction nozzle.
Wherein, the step 3) specifically comprises the following steps:
the width of the BGA adapting circuit board 2 is 3-5 mm wider than that of the BGA device 1 to be corrected, or the BGA adapting circuit board is designed and manufactured according to actual needs;
the BGA adapting circuit board 2 is 1.0 mm-2.0 mm in thickness or is designed and manufactured according to actual requirements;
the BGA adapting circuit board 2 is provided with welding pads with the same number and size as those of the BGA device 1 on the upper and lower sides;
implanting a solder ball consistent with the BGA device 1 on one surface of the BGA adapting circuit board 2 welded with the product printed circuit board 3 on the BGA repairing table;
the BGA adapting circuit board 2 is only manufactured with printed circuits which need to be corrected except for a bonding pad and a soldering tin ball (including a BGA adapting circuit board soldering tin ball 4 and a BGA device soldering tin ball 5) on the upper surface and the lower surface.
Besides the bonding pad with the same size as the BGA device 1, an external bonding pad can be led out according to actual requirements on one surface of the BGA adapting circuit board 2 welded with the BGA device 1.
Wherein, the step 4) specifically comprises the following steps:
confirming that a welding pad corresponding to the BGA device 1 is clean when the BGA adapting circuit board 2 is welded, and removing redundant materials before welding;
coating soldering paste containing soldering flux on corresponding bonding pads on the BGA adapting circuit board 2 of the BGA device 1 by using a proper steel sheet;
placing the BGA device 1 on the processed BGA adapting circuit board 2 on the BGA repairing table;
and heating and welding the BGA adapting circuit board 2 provided with the BGA device 1 on the BGA repairing table.
Wherein, the step 5) specifically comprises the following steps:
confirming that a welding pad which is welded on the product printed circuit board 3 and corresponds to the BGA adapting circuit board 2 is clean, and removing redundant materials before welding;
coating soldering paste containing soldering flux on corresponding bonding pads on a product printed circuit board 3 of the BGA transfer circuit board 2 by using a proper steel sheet;
placing the BGA adapting circuit board 2 on which the BGA device 1 is welded on the processed product printed circuit board 3 on the BGA repairing table;
and heating and welding the product printed circuit board 3 provided with the BGA adapting circuit board 2 on the BGA repairing table.
Compared with the prior art, the BGA adapting circuit board 2 is designed and manufactured according to the BGA design needing to be corrected, and the repair of the BGA design defects is realized. Compared with a method for welding a lead on a BGA bonding pad, the method has the advantages that the difficulty of a welding technology is reduced, an external device can be connected, and the correction that the internal circuit of the BGA needs to be interconnected can be realized. The BGA adapting circuit board 2 is designed and manufactured, on one hand, the existing BGA device 1 and a printed circuit board which possibly needs to be reprocessed are fully utilized, the resource waste is avoided, and the material cost is obviously saved; on the other hand, the time for redesigning the BGA device 1 and possibly needing to reprocess the printed circuit board is shortened, the research and development period is effectively shortened, and the research and development cost is reduced.
The above embodiments are only for illustrating the invention and are not to be construed as limiting the invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention, therefore, all equivalent technical solutions also belong to the scope of the invention, and the scope of the invention is defined by the claims.
Claims (6)
1. A method for correcting BGA design through a BGA transfer circuit board is characterized in that: the method mainly comprises the following steps:
step 1), confirming the part of the BGA connecting circuit on the product printed circuit board which needs to be designed and corrected;
step 2), removing the BGA device to be corrected from the BGA repairing table;
step 3), manufacturing a BGA adapting circuit board according to the BGA design to be corrected on the product printed circuit board;
step 4), welding the BGA device detached in the step 2) on the BGA repair platform on the BGA adapting circuit board manufactured in the step 3);
and 5) welding the BGA adapting circuit board welded with the BGA device obtained in the step 4) on a product printed circuit board on a BGA repairing table.
2. The method of claim 1, wherein the BGA design is corrected through a BGA transfer circuit board, comprising: the step 2) specifically comprises the following steps:
presetting a heating desoldering temperature curve of the BGA repair platform, wherein the peak temperature is 225 ℃ for lead welding or 245 ℃ for lead-free welding, or setting according to BGA welding materials;
placing the printed circuit board of the product welded with the BGA device to be corrected on a BGA repairing table;
and starting the BGA repair platform for heating, and when all welding spots on the BGA device are melted after finishing the real-time monitoring of the BGA repair platform, using the suction nozzle to remove the BGA device from the printed circuit board product.
3. The method of claim 1, wherein the BGA design is corrected through a BGA transfer circuit board, comprising: the step 3) specifically comprises the following steps:
the width of the BGA adapting circuit board is 3-5 mm wider than that of the BGA device to be corrected, or the BGA adapting circuit board is designed and manufactured according to actual needs;
the BGA adapting circuit board is 1.0-2.0 mm in thickness or designed and manufactured according to actual requirements;
the BGA adapting circuit board is provided with welding pads with the same number and size as those of the BGA devices on the upper and lower parts;
on the BGA repair platform, implanting a solder ball consistent with the BGA device on one surface of the BGA transfer circuit board, which is welded with the product printed circuit board;
the BGA adapter circuit board only comprises printed circuits needing to be corrected except for the bonding pads and the soldering tin balls on the upper surface and the lower surface.
4. The method of claim 1, wherein the BGA design is corrected through a BGA transfer circuit board, comprising: the step 4) specifically comprises the following steps:
confirming that a welding pad which is welded on the BGA adapting circuit board and corresponds to the BGA device is clean, and removing redundant materials before welding;
coating soldering paste containing soldering flux on a corresponding bonding pad on the BGA adapting circuit board for mounting and soldering the BGA device by using a proper steel sheet;
placing the BGA device on the processed BGA adapting circuit board on the BGA repairing table;
and heating and welding the BGA adapting circuit board provided with the BGA device on the BGA repairing table.
5. The method of claim 1, wherein the BGA design is corrected through a BGA transfer circuit board, comprising: the step 5) specifically comprises the following steps:
confirming that a welding disc of the printed circuit board of the product, which is welded and corresponds to the BGA adapting circuit board, is clean, and removing redundant materials before welding;
coating soldering paste containing soldering flux on a corresponding bonding pad on a product printed circuit board of the BGA transfer circuit board by using a proper steel sheet;
placing the BGA adapting circuit board provided with the BGA device on the processed product printed circuit board on the BGA repairing table;
and heating and welding the printed circuit board of the product with the BGA adapting circuit board on the BGA repairing table.
6. The method of claim 3, wherein the method further comprises: in the step 3), besides the bonding pad with the same size as that of the BGA device, an external bonding pad can be led out according to actual requirements on one surface of the BGA transit circuit board welded with the BGA device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911169296.9A CN110933859A (en) | 2019-11-26 | 2019-11-26 | Method for correcting BGA design through BGA adapting circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911169296.9A CN110933859A (en) | 2019-11-26 | 2019-11-26 | Method for correcting BGA design through BGA adapting circuit board |
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| CN110933859A true CN110933859A (en) | 2020-03-27 |
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| CN201911169296.9A Pending CN110933859A (en) | 2019-11-26 | 2019-11-26 | Method for correcting BGA design through BGA adapting circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114793391A (en) * | 2022-06-27 | 2022-07-26 | 北京万龙精益科技有限公司 | PCB packaging error solution method |
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| US5107329A (en) * | 1988-02-26 | 1992-04-21 | Hitachi, Ltd. | Pin-grid array semiconductor device |
| CN203445108U (en) * | 2013-07-10 | 2014-02-19 | 詹泽明 | Chip packaging and switching board and circuit board with chip packaging and switching board |
| US9484277B2 (en) * | 2004-09-22 | 2016-11-01 | Intel Corporation | Materials, structures and methods for microelectronic packaging |
| CN205984963U (en) * | 2016-08-19 | 2017-02-22 | 深圳电器公司 | Chip keysets and circuit board |
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2019
- 2019-11-26 CN CN201911169296.9A patent/CN110933859A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5107329A (en) * | 1988-02-26 | 1992-04-21 | Hitachi, Ltd. | Pin-grid array semiconductor device |
| US9484277B2 (en) * | 2004-09-22 | 2016-11-01 | Intel Corporation | Materials, structures and methods for microelectronic packaging |
| CN203445108U (en) * | 2013-07-10 | 2014-02-19 | 詹泽明 | Chip packaging and switching board and circuit board with chip packaging and switching board |
| CN205984963U (en) * | 2016-08-19 | 2017-02-22 | 深圳电器公司 | Chip keysets and circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114793391A (en) * | 2022-06-27 | 2022-07-26 | 北京万龙精益科技有限公司 | PCB packaging error solution method |
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Application publication date: 20200327 |
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