CN111148427A - Repair process of stacking/I-shaped preset solder terminal connector - Google Patents
Repair process of stacking/I-shaped preset solder terminal connector Download PDFInfo
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- CN111148427A CN111148427A CN201911420217.7A CN201911420217A CN111148427A CN 111148427 A CN111148427 A CN 111148427A CN 201911420217 A CN201911420217 A CN 201911420217A CN 111148427 A CN111148427 A CN 111148427A
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- pcba
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- soldering lug
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Abstract
The invention discloses a repair process of a buttress/I-shaped preset solder terminal connector, which relates to the technical field of semiconductor processing, wherein a disassembled device is firstly inspected, and when the performance of the disassembled device is excellent, the disassembled buttress/I-shaped connector lacking preset solder is directly selected as a welding device to be welded on a PCBA (printed circuit board assembly) again, so that the utilization rate of the device is improved, and the repair cost is reduced; in the process of repairing and welding, an innovative method is provided for determining the size of the solder ball, short-circuit tin connection can be avoided while the soldering tin amount is ensured, meanwhile, the solder paste is coated on the solder ball before welding, the repair success rate and the welding reliability of the device are improved, and the high-reliability rework of the buttress/I-shaped preset solder terminal connector can be realized.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a repair process of a buttress/I-shaped preset solder terminal connector.
Background
The stacked/I-shaped pre-solder terminal connector is mainly used as a high density connector for high speed board-to-board interconnection (board-to-board) applications with a product data rate of 56Gbps, which uses a pre-solder terminal (solder charge) of a gate array package similar to BGA for connection. At present, the following rework schemes are commonly adopted in the industry for ball grid array packaging devices: the repair of using hot-blast infrared heating tears open the welding bench and dismantles the problem device from the printing board, use to inhale remaining soldering tin on tin rope completely clears away device pad and the printing board pad, then plant the solder ball that the size is suitable on device pad one side, and print the solder paste with the help of the pad that the silk screen net board corresponds the bit number on the printing board, the BGA device after will planting the ball is put the one-to-one on the pad of having printed the solder paste, do not squint, it is accomplished to repair tear open the welding bench heat welding through at last.
However, the buttress/I-shaped solder preset terminal connector has a special soldering end structure design, once a device needs to be reworked for any reason after soldering, the connector losing the preset solder is difficult to ensure the product reliability, and the conventional BGA rework scheme can only be used for directly reusing a new device for soldering after the device is detached, so that the soldering and rework costs are increased.
Disclosure of Invention
The invention provides a repair process of a buttress/I-shaped preset solder terminal connector aiming at the problems and the technical requirements, and the technical scheme of the invention is as follows:
a rework process of a stacked/I-shaped pre-solder terminal connector, the rework process comprising:
heating a device disassembly area of the component to be repaired, disassembling and separating to obtain a disassembled device and a PCBA plate, and cleaning a soldering lug of the disassembled device and a soldering pad of a corresponding number of the PCBA plate;
detecting whether the coplanarity of each soldering lug of the disassembled device is qualified or not, and directly selecting the disassembled device as a welding device if the coplanarity of each soldering lug is qualified; if the coplanarity of each soldering lug is unqualified, the disassembled device is abandoned, and a new device is selected as a welding device;
determining the pad spacing between pads of corresponding number positions of the PCBA; determining a welding distance between the tail end of a soldering lug of the welding device and the front end of an opening on the soldering lug, wherein the tail end of the soldering lug is one end of the soldering lug close to a device main body of the welding device, and the front end of the opening on the soldering lug is one end of the opening far away from the tail end of the soldering lug in the aperture;
determining the radius of a solder ball according to the welding distance and the distance between the pads, uniformly coating flux paste on the pads of the corresponding positions of the PCBA board, implanting the solder ball with the radius of the solder ball, and heating the ball implanting position of the PCBA board until the solder ball is melted;
the welding parts of the soldering lugs of the soldering device are uniformly coated with the flux paste, then the flux paste is aligned and placed on the PCBA after ball planting, heating welding is carried out to realize fixation and repair, the positioning columns of the soldering device are aligned with the positioning holes of the PCBA, and the soldering lugs of the soldering device correspond to the soldering pads of the PCBA corresponding to the number positions one by one.
The further technical scheme is that the radius of the solder ball meets the conditions that D-2r is larger than D and r is smaller than L and smaller than 2r, wherein D represents the distance between the pads, r represents the radius of the solder ball, L represents the welding distance, and D is a preset threshold value.
The method comprises the following steps of heating the device disassembly area of the component to be repaired according to a preset heating curve, wherein the heating process sequentially comprises a heating-up stage, a heat-preservation stage and a welding stage, the preset heating curve starts to heat up from room temperature to 135 ℃ in the heating-up stage, the heating-up time is 50-80s, the heat-preservation stage reaches 135-plus-material temperature of 175 ℃ and the heat-preservation time is 60-90s, and the heating-up is continued to 175-plus-material temperature of 225 ℃ in the welding stage and the welding time is 60-90 s.
Its further technical scheme does, align after the welding part department of the soldering lug of welding element evenly coats the soldering paste and places on the PCBA plate after the ball planting and carry out the heating welding and realize fixed completion and reprocess, include:
uniformly coating flux paste on the welding part of a soldering lug of a welding device, aligning and placing the flux paste on the PCBA after ball planting, and inspecting the positions of the welding device and the PCBA;
after the position is inspected to be qualified, heating welding is carried out to realize fixation, and welding spots between a welding device and the PCBA are inspected;
and after the welding spot is qualified, the electric connection performance is tested by electrifying, whether the data transmission rate is qualified or not is tested, and the repair is finished after the data transmission rate is qualified.
The further technical scheme is that the method for inspecting the welding spots between the welding device and the PCBA plate comprises the following steps:
carrying out appearance inspection on the two rows of welding spots on the outermost side by using a high-power optical magnifier;
after the appearance inspection is qualified, utilizing an X-ray detector to perform X-ray inspection on a welding spot between the welding device and the PCBA;
and when the X-ray inspection is qualified, determining that the welding spot is qualified.
The further technical scheme is that before the device disassembly area of the component to be repaired is heated, the repairing process further comprises the following steps: and fixing four corners of the component to be repaired, and when the length of the component to be repaired exceeds 200mm and/or the width of the component to be repaired exceeds 150mm, additionally, adding an ejector pin in the middle of the component to be repaired for fixing.
The further technical scheme is that whether the coplanarity of each soldering lug of the disassembled device is qualified or not is detected, and the method comprises the following steps:
horizontally placing the disassembled device on a detection platform, and measuring the distance between each soldering lug and the detection platform by using a feeler gauge;
and if the distance between each soldering lug and the detection platform is within a preset threshold value, determining that the coplanarity of each soldering lug of the disassembled device is qualified, otherwise determining that the coplanarity of each soldering lug of the disassembled device is unqualified.
Its further technical scheme does, the soldering lug of clearance quilt device torn open and PCBA plate correspond the pad of number position, include:
cleaning residual soldering tin on the soldering lug of the disassembled device by using an electric soldering iron, and cleaning the soldering lug by using board washing water; and cleaning the residual soldering tin on the soldering pad of the corresponding number position of the PCBA plate by using an electric soldering iron and a tin absorbing rope, and cleaning the soldering pad by using board washing water.
The further technical scheme is that the temperature of the electric soldering iron is controlled to be 300-320 ℃ when the residual soldering tin on the disassembled device and the PCBA is cleaned.
The beneficial technical effects of the invention are as follows:
the application discloses a repair process of a buttress/I-shaped preset solder terminal connector, which is used for firstly inspecting a disassembled device, and when the performance of the disassembled device is excellent, the disassembled buttress/I-shaped connector lacking preset solder is directly selected as a welding device to be welded on a PCBA plate again, so that the utilization rate of the device is improved, and the repair cost is reduced; in the process of repairing and welding, an innovative method is provided for determining the size of the solder ball, so that the solder volume can be ensured, short circuit and tin connection can be avoided, and meanwhile, the flux paste is coated, thereby being beneficial to improving the repair success rate and the welding reliability of the device.
In addition, reasonable temperature control is realized in the detaching process, the risk that the device or the printed board is deformed can be reduced, and the repair success rate and the welding reliability are further improved.
Drawings
Fig. 1 is a flow chart of a rework process of a buttress/I-shaped pre-solder terminal connector as disclosed herein.
Detailed Description
The following further describes the embodiments of the present invention with reference to the drawings.
Referring to the flow chart shown in fig. 1, a rework process of a stacked/I-shaped preset solder terminal connector includes:
1. the component to be repaired is fixed on the repairing and welding table, four corners of the component to be repaired are fixed, and when the length of the component to be repaired exceeds 200mm and/or the width of the component to be repaired exceeds 150mm, an ejector pin is additionally arranged in the middle of the component to be repaired for fixing. This step can prevent waiting to reprocess the subassembly and take place deformation because of the thermal stress at the platform heating process of reprocessing.
2. Heating the device disassembly area of the component to be repaired, wherein in the application, the heating is not performed according to a constant temperature, but the device disassembly area of the component to be repaired is heated according to a preset heating curve, the whole heating process sequentially comprises a heating-up stage, a heat-preservation stage and a welding stage, the preset heating curve starts to heat up from room temperature to 135 ℃ in the heating-up stage, the heating-up time is 50-80s, the heat-preservation stage reaches 135-plus-material temperature to 175 ℃ and the heat-preservation time is 60-90s, and the heating-up is continued to 175-plus-material temperature in the welding stage and the welding time is 60-90 s.
After the welding spots of the disassembled device are completely melted, the disassembled device is picked up by using a suction nozzle or tweezers of the repair platform, the component to be repaired is disassembled and separated to obtain the disassembled device and the PCBA, and then the disassembled device and the PCBA are cooled to room temperature.
3. The soldering lug of device is torn open in the clearance, and is concrete, uses the electric iron will be torn open the residual soldering tin clean up on the soldering lug of device, has cleared up behind the soldering tin, uses dustless cloth to dip in and gets a small amount of wash board water with the pad sanitization. And, the pad that clearance PCBA plate corresponds the number position, and is concrete, uses electric iron and inhale the tin rope with PCBA plate correspond the number position on the pad remain soldering tin clean up, use dustless cloth to dip in and get a small amount of wash board water with the pad sanitization. When residual soldering tin on the disassembled device and the PCBA is cleaned, the temperature of the electric soldering iron is controlled to be 300-320 DEG C
4. Detecting whether the coplanarity of each soldering lug of the disassembled device is qualified, specifically, horizontally placing the disassembled device on a detection platform, measuring the distance between each soldering lug and the detection platform by using a feeler gauge, if the distance between each soldering lug and the detection platform is within a preset threshold value, determining that the coplanarity of each soldering lug of the disassembled device is qualified, and otherwise, determining that the coplanarity of each soldering lug of the disassembled device is unqualified, wherein the preset threshold value is an empirical value and is usually 0.1 mm.
Since it is verified through a lot of experiments that when the coplanarity of the pads is greater than 0.1mm, the device has a connection function defect even if the soldering is successful, when the coplanarity of the respective pads is not good, the detached device is directly discarded, and a new buttress/I-shaped connector is selected as the soldered device. And if the coplanarity of each soldering lug is qualified, directly selecting the disassembled device as a soldering device.
5. And checking the gerber data of the corresponding number position in the PCBA plate so as to determine the pad spacing d between the pads of the corresponding number position of the PCBA plate.
6. And determining the welding distance L between the tail end of a soldering lug of the welding device and the front end of the opening on the soldering lug, wherein the tail end of the soldering lug is the end of the soldering lug close to the device body of the welding device, and the front end of the opening on the soldering lug is the end of the opening far away from the tail end of the soldering lug in the aperture. The soldered device determined in step 4 may be an original detached device or an optional new device.
7. And determining the radius r of the solder ball according to the welding distance L and the pad spacing D, wherein the radius r of the solder ball meets the conditions that D-2r is larger than D and r is smaller than L and smaller than 2r, D is a preset threshold value set according to an empirical value and is usually 0.15 mm. The solder ball meeting the size can not only ensure the minimum solder filling height (soldering tin amount) of the soldering lug of the device, but also avoid short circuit and continuous tin of adjacent pads on the printed board.
8. Evenly coating the soldering paste on the pad of the corresponding number position of the PCBA board of sanitization, according to pad distribution shape and size selection matching plastics bushing one-to-one corresponding pad and fixed, will have the solder ball of solder ball radius and implant on the pad through the plastics bushing, after all implanting the solder ball on each pad of visual inspection, remove the plastics bushing. Fixing the PCBA plate with the planted balls on a repair and unsoldering table, heating the ball-planting position until the solder balls melt and evenly cover the solder pads, stopping heating, and taking down the repair table after the PCBA plate is naturally cooled.
9. The soldering flux paste is uniformly coated on the welding part of the soldering lug of the welding device, and the coating of the soldering flux paste is beneficial to the soldering tin to climb onto the soldering lug of the device when the soldering tin is molten, so that the qualified minimum solder filling height is formed. Because a lot of experiments prove that the minimum filling height of the soldering lug without the soldering flux is difficult to meet the requirement after soldering. On the other hand, the soldering lug of the soldering device is in full contact with the solder to form a firm IMC layer, and the soldering reliability is improved.
Wear to prevent static wrist area, use finger or tweezers to press from both sides and get welding device and align and place on the PCBA plate after planting the ball, welding device's reference column aligns the locating hole of PCBA plate, and each soldering lug one-to-one of welding device corresponds each pad of number position to PCBA plate.
10. And (3) inspecting the positions of the welding device and the PCBA, specifically, smoothly taking the PCBA with the welding device placed therein and placing the PCBA into an X-ray detector, inspecting whether the welding piece of the welding device and the welding pad of the PCBA have deviation or not by means of the X-ray detector, inspecting according to the 3-level acceptance standard of '8.3.8.2 buttress shape/I shape preset welding flux terminal' of IPC-A-610G, executing the next step after the position is inspected to be qualified, and otherwise, adjusting the placing position of the welding device and inspecting again until the position is qualified.
11. And after the position is inspected to be qualified, the PCBA plate on which the welding device is placed is stably transferred to a repair and unsolder table from the X-ray detector to be heated and welded to realize fixation, and after welding is finished, the PCBA plate is naturally cooled to room temperature and the repair table is taken down.
12. And inspecting the welding spots between the welding device and the PCBA, firstly performing appearance inspection, performing appearance inspection on two rows of welding spots at the outermost side by using a high-power optical magnifier, inspecting whether the welding spots meet the 3-level acceptance standard of '8.3.8.2 pattern-buttress/I-shaped connection preset welding flux terminal' of IPC-A-610G, performing X-ray inspection after the appearance inspection is qualified, and otherwise, confirming that the repair is unsuccessful. When the X-ray inspection is carried out, the welded assembly is taken and placed into an X-ray detector, the X-ray detector is utilized to carry out the X-ray inspection on the welding spot between the welding device and the PCBA plate, and whether the welding spot meets the 3-level acceptance standard of '8.3.12 model-surface mounting surface array' of IPC-A-610G plate or not is checked. And when the X-ray inspection is qualified, determining that the welding spot is qualified, entering the next step, and otherwise, determining that the repair is unsuccessful.
13. And after the welding spot is qualified, the electric connection performance is tested by electrifying, whether the data transmission rate is qualified or not is tested, and the repair is finished after the data transmission rate is qualified.
What has been described above is only a preferred embodiment of the present application, and the present invention is not limited to the above embodiment. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the spirit and concept of the present invention are to be considered as included within the scope of the present invention.
Claims (9)
1. A rework process of a buttress/I-shaped pre-solder terminal connector, the rework process comprising:
heating a device disassembly area of a component to be repaired, disassembling and separating to obtain a disassembled device and a PCBA (printed Circuit Board Assembly), and cleaning a soldering lug of the disassembled device and a soldering pad of a corresponding number of the PCBA;
detecting whether the coplanarity of each soldering lug of the disassembled device is qualified or not, and if the coplanarity of each soldering lug is qualified, directly selecting the disassembled device as a welding device; if the coplanarity of each soldering lug is unqualified, the disassembled device is abandoned, and a new device is selected as a welding device;
determining the pad spacing between pads of corresponding number positions of the PCBA; determining a welding distance between the tail end of a soldering lug of the welding device and the front end of a hole on the soldering lug, wherein the tail end of the soldering lug is one end of the soldering lug close to a device body of the welding device, and the front end of the hole on the soldering lug is one end of the hole far away from the tail end of the soldering lug;
determining the radius of a solder ball according to the welding distance and the pad interval, uniformly coating flux paste on a pad at a corresponding position of the PCBA, implanting the solder ball with the radius of the solder ball, and heating the ball implanting position of the PCBA until the solder ball is melted;
the welding parts of the soldering pieces of the soldering device are uniformly coated with the flux paste and then are aligned and placed on the PCBA after ball planting, the PCBA is heated and welded to achieve fixation and repair, the positioning columns of the soldering device are aligned with the positioning holes of the PCBA, and the soldering pieces of the soldering device correspond to the soldering pads of the corresponding number positions of the PCBA one by one.
2. The rework process of claim 1, wherein the solder ball radius satisfies D-2r > D and r < L < 2r, where D represents the inter-pad distance, r represents the solder ball radius, L represents the solder ball radius, and D is a preset threshold.
3. The repair process as claimed in claim 1, wherein the heating of the device detachment zone of the component to be repaired comprises heating the device detachment zone of the component to be repaired according to a preset heating curve, the heating process comprises a temperature rise stage, a heat preservation stage and a welding stage in sequence, the preset heating curve starts to rise from room temperature to 135 ℃ in the temperature rise stage and the temperature rise time is 50-80s, reaches 175 ℃ along with the heat preservation stage and the heat preservation time is 60-90s, and continues to rise to 175 ℃ along with the heat preservation stage and the welding time is 60-90 s.
4. The repair process of claim 1, wherein the repair process comprises the steps of uniformly coating the soldering paste on the soldering position of the soldering lug of the soldering device, then aligning the soldering paste on the PCBA after ball mounting, and performing heating soldering to realize fixation, and completing repair, wherein the steps comprise:
uniformly coating flux paste on the welding part of a soldering lug of the soldering device, aligning and placing the flux paste on the PCBA after ball planting, and inspecting the positions of the soldering device and the PCBA;
after the position is inspected to be qualified, heating and welding are carried out to realize fixation, and welding spots between the welding device and the PCBA are inspected;
and after the welding spot is qualified, the electric connection performance is tested by electrifying, whether the data transmission rate is qualified or not is tested, and the repair is finished after the data transmission rate is qualified.
5. The rework process of claim 4, wherein the inspecting a weld between the solder device and the PCBA board comprises:
carrying out appearance inspection on the two rows of welding spots on the outermost side by using a high-power optical magnifier;
after the appearance inspection is qualified, utilizing an X-ray detector to perform X-ray inspection on a welding spot between the welding device and the PCBA;
and when the X-ray inspection is qualified, determining that the welding spot is qualified.
6. The rework process of any of claims 1-5, wherein prior to heating the device detachment zone of the component to be reworked, the rework process further comprises: and fixing four corners of the component to be repaired, and when the length of the component to be repaired exceeds 200mm and/or the width of the component to be repaired exceeds 150mm, additionally, adding an ejector pin in the middle of the component to be repaired for fixing.
7. The rework process of any of claims 1-5, wherein the detecting whether the coplanarity of the individual bonding pads of the singulated devices is acceptable comprises:
horizontally placing the disassembled device on a detection platform, and measuring the distance between each soldering lug and the detection platform by using a feeler gauge;
if the distance between each soldering lug and the detection platform is within a preset threshold value, determining that the coplanarity of each soldering lug of the disassembled device is qualified, otherwise determining that the coplanarity of each soldering lug of the disassembled device is unqualified.
8. A repair process as claimed in any one of claims 1 to 5, wherein the cleaning of the solder pads of the disassembled device and the pads of the PCBA board at the corresponding number comprises:
cleaning residual soldering tin on the soldering lug of the disassembled device by using an electric soldering iron, and cleaning the soldering lug by using board washing water; and using an electric iron and a tin suction rope to clean residual soldering tin on the pad of the corresponding number position of the PCBA plate, and using board washing water to clean the pad.
9. The rework process of claim 8, wherein the soldering iron is controlled at a temperature of 300 ℃ and 320 ℃ during the cleaning of the removed component and the residual solder on the PCBA.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911420217.7A CN111148427B (en) | 2019-12-31 | 2019-12-31 | Repair process of stacking/I-shaped preset solder terminal connector |
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| CN201911420217.7A CN111148427B (en) | 2019-12-31 | 2019-12-31 | Repair process of stacking/I-shaped preset solder terminal connector |
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| CN111148427A true CN111148427A (en) | 2020-05-12 |
| CN111148427B CN111148427B (en) | 2021-01-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113811102A (en) * | 2021-11-19 | 2021-12-17 | 北京万龙精益科技有限公司 | FPGA pad flying process on PCBA |
| CN112510459B (en) * | 2020-10-19 | 2022-04-19 | 中国船舶重工集团公司第七0九研究所 | Disassembling method of high-density connector |
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| CN113811102B (en) * | 2021-11-19 | 2022-02-22 | 北京万龙精益科技有限公司 | FPGA pad flying process on PCBA |
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| CN111148427B (en) | 2021-01-12 |
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