CN208971870U - The equipment and its template scaling powder being added on the pad of component load-bearing part - Google Patents
The equipment and its template scaling powder being added on the pad of component load-bearing part Download PDFInfo
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- CN208971870U CN208971870U CN201821415255.4U CN201821415255U CN208971870U CN 208971870 U CN208971870 U CN 208971870U CN 201821415255 U CN201821415255 U CN 201821415255U CN 208971870 U CN208971870 U CN 208971870U
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- hole
- template
- scaling powder
- pad
- bearing part
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Abstract
Provide a kind of template (100) of equipment for being added to scaling powder (102) on the pad (111) of component load-bearing part (110), wherein, template (100) includes base body, the base body includes the pattern of through-hole (101), the pattern indicate indicator load-bearing part (110) of the through-hole, the pad (111) that should add scaling powder (102) on it pattern.Base body has a thickness, and each through-hole (101) has a diameter, and limits aspect ratio by the ratio between the diameter of through-hole (101) and the thickness of base body.Aspect ratio is between 2 to 2.5.Additionally provide a kind of equipment for being added to scaling powder (102) on the pad (111) of component load-bearing part (110).
Description
Technical field
The utility model relates to a kind of template of equipment for being added to scaling powder on the pad of component load-bearing part, with
And a kind of equipment for scaling powder to be added on the pad of component load-bearing part.
Background technique
When manufacture is used for the component load-bearing part of electronic component, it is necessary to which soldered ball is highly precisely placed on to component load-bearing part
Each pad on.Therefore, scaling powder is printed on each pad first.It then, will in runic (bold) printing process
Soldered ball is placed on the top for the scaling powder being arranged on pad.Check and procedure of repairing after, using reflux (reflow,
Reflow Soldering) step is to complete microballoon attachment technique.
Purpose is to be controlled very precisely scaling powder thickness and scaling powder offset on pad, all to prevent failure
Such as, such as the scaling powder bridge between two adjacent pads.Scaling powder thickness, scaling powder offset and scaling powder bridge influence the function of microballoon
Can, and therefore influence the allomeric function of component load-bearing part.
Component load-bearing part can be combined with plate.Therefore, including the plate such as printed circuit board of multiple component load-bearing parts
(PCB) or substrate mechanically supports and electrically connects active electronic component and passive electrical components.Electronic component is mounted on portion
On part load-bearing part and it is interconnected so as to form operating circuit or electronic building brick.
Since the electric component of more and more complexity must be connect with component load-bearing part, so between two adjacent pads
Distance and the distance between two adjacent soldered balls become smaller and smaller respectively.It may therefore be necessary to provide being carried in component
The attachment of more accurate scaling powder and arrangement on each pad of part.
Utility model content
It is according to the present utility model in a first aspect, proposing a kind of for scaling powder to be added to the pad of component load-bearing part
On equipment template.Template includes base body, which includes the pattern of through-hole, and the pattern indicate indicator of through-hole is held
Holder, the pattern of the pad of scaling powder should be added thereon.Base body has a thickness, and each through-hole has always
Diameter.Aspect ratio is limited by the ratio between the diameter of through-hole and the thickness of base body, wherein aspect ratio is between 2 to 2.5
In range.
Plate includes multiple component load-bearing parts.The plate may include at least one electric insulation layer structure and at least one is led
The stacked body of electric layer structure.For example, component load-bearing part can be the laminated body of the electric insulation layer structure and conductive coating structure, it is special
It is not to be formed by applying mechanical pressure and/or thermal energy.The stacked body can provide plate-shaped member load-bearing part, the plate
Component load-bearing part can provide big mounting surface and still unusual thin compact for other component.Term " layer structure " can
Particularly to indicate the pantostrat in common plane, patterned layer or multiple discontinuous islands.In the context of the utility model,
Term " layer structure " can be single-layer or multi-layer component.
Component load-bearing part is configured as one of the group being made of printed circuit board and substrate (especially IC substrate).In this Shen
In context please, term " printed circuit board " (PCB) can be indicated particularly by by several conductive coating structures and several electricity
The component load-bearing part to be formed is laminated in insulation layer structure, and (its (i.e. plane) for can be plate, three-dimension curved surface (such as work as use
3D printing manufacture when) or its can have any other shape), above-mentioned forming process for example by apply pressure initiation, such as
Fruit is accompanied by the supply of thermal energy if needing.As the preferred material for PCB technology, conductive coating structure is made of copper, and electric
Insulation layer structure may include resin and/or glass fibre, so-called prepreg or FR4 material.By being formed across laminated body
Through-hole, such as by laser drill or machine drilling, and by filling these through-holes with conductive material (especially copper), by
This forms the via hole connected as through-hole, be connected to each conductive coating structure in the desired manner each other.In addition to can
With except one or more components for being embedded in printed circuit board, printed circuit board is commonly configured in plate printed circuit
One or more components are accommodated on one surface of plate or two opposed surfaces.The component can be connected by welding to accordingly
Main surface.The dielectric portion of PCB can be made of the resin with reinforcing fiber (such as glass fibre).
The base body of template is made of rigid material such as composite material.The pattern of through-hole is carried corresponding to component
The corresponding position (such as pad) that on part, scaling powder and soldered ball should adhere to respectively.Pad defines contact area, is connect using this
Touching section components load-bearing part should be connect with other component load-bearing part or electronic component.For example, pad forms component load-bearing part
The connections of other conductive structures connected with via hole.
Since the diameter of soldered ball becomes smaller and smaller, such as from 75 μm to 63 μm, and the distance (protuberance spacing) of soldered ball
Become smaller and smaller, such as from 130 μm to 100 μm, so before adhering to soldered ball, the amount of the scaling powder on pad and position
Setting must be more accurate.
It was found that the diameter of through-hole and the thickness of template have an impact to the amount of scaling powder and the thickness of scaling powder in template.Due to
Scaling powder is very viscous, therefore is difficult for scaling powder to be transferred to the surface of plate and pad respectively glibly from template.This
Outside, it is important to provide the excellent homogeneity of the shape and amount of scaling powder on pad.Scaling powder may include material composition, such as
Silver, copper, nickel and combinations thereof.
Since the protuberance spacing and size of soldered ball become smaller and smaller, so in the exact position not to scaling powder on pad
The diameter of the through-hole of template must be reduced in the case where having a negative impact with precisely predetermined amount.It was found that the aspect ratio butt welding of through-hole
The quality and quantity of scaling powder have an impact on disk.It is limited by the diameter of through-hole in template relative to the thickness of the base body of template
Determine aspect ratio:
Aspect ratio=through-hole diameter/base body thickness
For example, the diameter of through-hole is smaller in base body, print fluxing is more difficult on pad.However, due to weldering
Ball spacing between ball reduces, so the diameter of the through-hole in the base body of template must also reduce.Increase template opening
Diameter (through-hole diameter) may cause to be contacted with the undesirable of adjacent pad, and is occurred between adjacent pad undesirable
Scaling powder bridge.Further, since the adhesion characteristics of scaling powder, the uniform scaling powder thickness of the thickness effect of base body.
Therefore, in the present invention, discovery is in order to be accurately arranged at small weldering for scaling powder in a very uniform manner
On disk, by providing the aspect ratio between 2 to 2.5, it can be arranged in the sufficiently thick base body of template
The through-hole of minor diameter.
According to another exemplary embodiment, the thickness of base body is between 35 μm to 50 μm.
According to another exemplary embodiment, base body with a thickness of 40 μm.
According to another exemplary embodiment, model of the diameter of at least one through-hole in through-hole between 15 μm to 25 μm
In enclosing.
According to another exemplary embodiment, the diameter of at least one through-hole in through-hole is 18 μm.
According to another exemplary embodiment, aspect ratio is between 2.2 to 2.3.
According to another exemplary embodiment, wherein aspect ratio is 2.22.
Specifically, in order to which the diameter of through-hole is reduced to such as 40 μm, the base portion between 18 μm to 20 μm is had been applied in
The thickness of ontology.Specifically, 2.22 aspect ratio (diameter=40 μm of through-hole are provided；The thickness of the base body of template=18 μ
M), the scaling powder thickness more evenly that may be implemented on pad adheres to appropriate.In addition, not generating apparent scaling powder bridge.
According to illustrative embodiments, at least one through-hole in through-hole includes polygon, especially rectangle (e.g., four side
Shape) section.Alternatively, at least one through-hole in through-hole includes circle (such as round or ellipse) section.
According to illustrative embodiments, setting on a kind of pad for scaling powder to be added to component load-bearing part is proposed
It is standby.The equipment includes above-mentioned template, and wherein template can be placed above component load-bearing part, so that through-hole and component load-bearing part
Pad matched.The equipment further include: scraper, the through-hole which is configured to that scaling powder is made to scrape template；And scraper component, it should
Scaling powder for being pressed into through-hole and pad by scraper component respectively.
In addition, equipment further includes vaccum bench, and it is true that component load-bearing part can be placed at this according to another exemplary embodiment
In empty station, wherein vaccum bench is configured to by the way that component load-bearing part is pumped to vaccum bench come selectively by component load-bearing part
It is fixed to vaccum bench.
The above-mentioned aspect and another aspect of the utility model are bright according to the embodiment for the embodiment that will be described below
Aobvious, and the embodiment of reference implementation mode explains.It is more fully described below in conjunction with the embodiment of embodiment
The utility model, but the utility model is not limited to this.
Detailed description of the invention
Fig. 1 to Fig. 4 shows the system according to illustrative embodiments that scaling powder is added to pad by using template
Make step.
Fig. 5 shows arrangement of the soldered ball according to illustrative embodiments on the pad of component load-bearing part.
Fig. 6 shows the expectation arrangement of ball and scaling powder according to illustrative embodiments on pad.
Fig. 7 to Fig. 9 shows the bad embodiment of the arrangement of the scaling powder on pad.
Specific embodiment
Diagram in attached drawing is schematical.It should be noted that in various figures, similar or identical elements or features are mentioned
It is provided with identical appended drawing reference or is provided with appended drawing references only different from corresponding appended drawing reference in the first number.In order to keep away
Exempt from unnecessary repetition, the elements or features illustrated about previously described embodiment the part later of specification not
It illustrates again.
In addition, spatially relative term, " preceding " and " rear ", "up" and "down", " left side " and " right side " etc. are for describing as schemed
Shown in relationship of the element relative to another element.Therefore, spatially relative term can be applied to when in use in attached drawing
The different orientation of the orientation of description.Obviously, all these spatially relative terms be intended merely to facilitate description and with reference to institute in figure
The orientation shown, is not necessarily limiting, because the equipment of embodiment according to the present utility model can adopt when in use
With the orientation different from orientation those of as shown in the figure.
Fig. 1 to Fig. 4 shows the equipment on the pad 111 for scaling powder 102 to be added to component load-bearing part 110.It should
Equipment includes template 100, and wherein template 100 can be placed at 110 top of component load-bearing part, so that through-hole 101 and component carry
The pad 111 of part 110 matches.Template 100 includes base body, which includes the pattern of through-hole 101, the figure of the through-hole
Case indicate indicator load-bearing part 110, the pattern of the pad 111 of scaling powder 102 should be added thereon.Base body has thickness t, and
And each through-hole 101 has diameter d.Aspect ratio is limited by the ratio between the diameter d of through-hole 101 and the thickness t of base body.
Aspect ratio is between 2.0 to 2.5.Specifically, the diameter d of through-hole is such as 40 μm, and the base portion of template 100
The thickness t of ontology is 18 μm.
The equipment further include: scraper 121, the through-hole 101 which is configured to that scaling powder 102 is made to scrape template；With scrape
Panel element 122, scaling powder 102 for being pressed into through-hole 101 and pad 111 by the scraper component respectively.
Equipment further includes vaccum bench 123, and component load-bearing part 110 can be placed on the vaccum bench.Vaccum bench is configured as
Component load-bearing part 110 is selectively fixed to vaccum bench 123 by the way that component load-bearing part 110 is pumped to vaccum bench 123.
It will be seen from figure 1 that component load-bearing part 110 is placed on vaccum bench 123, and vaccum bench 123 is relative to template
100 arrangements.Specifically, the through-hole 101 of template 100 is matched with the pad 111 of component load-bearing part 110.In addition, scaling powder 102
It is arranged in template 100.
Figure it is seen that scraper 121 scrapes scaling powder 102 on the surface of template 100, so that the covering of scaling powder 102 is logical
Hole 101.
From figure 3, it can be seen that scraper component 122 moves above through-hole 101 and scaling powder 102 is pressed into through-hole 101
It neutralizes on pad 111.
From fig. 4, it can be seen that vaccum bench 123 and component load-bearing part 110 are moved together far from template 100.In next step
In, soldered ball 500 (referring to Fig. 6) can be placed on scaling powder 102.Furthermore, it is possible to stop the pumping function of vaccum bench 123, make
Component load-bearing part 110 can be removed from vaccum bench 123 by obtaining.
Fig. 5 shows arrangement of the soldered ball 500 according to illustrative embodiments on the pad 111 of component load-bearing part 110.
The distance between soldered ball 500 can be limited by protuberance spacing 501.It is, for example, less than 130 μm that protuberance spacing, which can be, specifically 100 μ
m.It is, for example, less than 75 μm, especially 63 μm that the diameter (ball size 502) of soldered ball 500, which can be,.
Fig. 6 shows the expectation arrangement of ball 500 and scaling powder 102 on the pad 111 of component load-bearing part 110.It can from Fig. 6
To find out, scaling powder 102 covers part of the pad 111 without extending to adjacent pad 111.Soldered ball 500 is arranged in pad 111
Top center, and surrounding scaling powder 102 formed be used for soldered ball 500 comfortable portions.
Fig. 7 to Fig. 9 shows the bad embodiment of the arrangement of the scaling powder on pad 111.From figure 7 it can be seen that scaling powder
102 relative to 111 misalignment of pad.Therefore, soldered ball 500 also is disposed on 111 side of pad.From figure 8, it is seen that scaling powder
102 amount is insufficient, prevent scaling powder 102 is from forming the comfortable portions for soldered ball 500.From fig. 9, it can be seen that scaling powder
102 amount is too many, so that scaling powder 102 covers 2 adjacent pads 111.Therefore, the soldered ball 500 of each attachment is by scaling powder
102 bridge joints.
It should be noted that term " includes " is not excluded for other elements or step, and "a" or "an" be not excluded for it is multiple.Separately
Outside, it can be combined in conjunction with the element that different embodiments describe.
It shall yet further be noted that the appended drawing reference in claim is not necessarily to be construed as limitation the scope of the claims.
The implementation of the utility model is not limited to preferred embodiment as shown in the figure and above-mentioned.On the contrary, even if substantially
In the case where different embodiments, also can be used shown in scheme and principle according to the present utility model a variety of modifications.
Appended drawing reference:
100 templates
101 through-holes
102 scaling powders
110 component load-bearing parts
111 pads
121 scrapers
122 scraper components
123 vaccum bench
500 soldered balls
501 protuberance spacing
502 ball sizes.
Claims (11)
1. the template of equipment of the one kind for being added to scaling powder (102) on the pad (111) of component load-bearing part (110)
(100), which is characterized in that the template (100) includes:
Base body, the base body include the pattern of through-hole (101), and the pattern of the through-hole indicates the component load-bearing part
(110), the pattern of pad (111) that the scaling powder (102) should be added on it；
Wherein, the base body is with a thickness and each through-hole (101) has a diameter,
Wherein, aspect ratio is limited by the ratio between the diameter of the through-hole (101) and the thickness of the base body,
Wherein, the aspect ratio is between 2 to 2.5.
2. template (100) according to claim 1, which is characterized in that the thickness of the base body is at 35 μm to 50 μm
Between.
3. template (100) according to claim 1, which is characterized in that the base body with a thickness of 40 μm.
4. template (100) according to claim 1, which is characterized in that at least one through-hole in the through-hole (101)
Diameter is between 15 μm to 25 μm.
5. template (100) according to claim 1, which is characterized in that at least one through-hole in the through-hole (101)
Diameter is 18 μm.
6. template (100) according to claim 1, which is characterized in that range of the aspect ratio between 2.2 to 2.3
It is interior.
7. template (100) according to claim 1, which is characterized in that the aspect ratio is 2.22.
8. template (100) according to claim 1, which is characterized in that at least one through-hole packet in the through-hole (101)
Include polygonal cross-section.
9. template (100) according to claim 1, which is characterized in that at least one through-hole packet in the through-hole (101)
Include rectangular section.
10. one kind is for being added to the equipment on the pad (111) of component load-bearing part (110) for scaling powder (102), feature exists
In the equipment includes:
Template (100) according to claim 1,
Wherein, the template (100) can be placed above the component load-bearing part (110), so that through-hole (101) and the portion
The pad (111) of part load-bearing part (110) matches,
Scraper (121), the through-hole (101) that the scraper is configured to that scaling powder (102) is made to scrape the template (100),
Scraper component (122), the scraper component is for the scaling powder (102) to be pressed into respectively in the through-hole (101)
On the pad (111).
11. equipment according to claim 10, which is characterized in that the equipment further include:
Vaccum bench (123), the component load-bearing part (110) can be placed on the vaccum bench, wherein the vaccum bench
(123) it is configured to by the way that the component load-bearing part (110) is pumped to the vaccum bench (123) come selectively by the portion
Part load-bearing part (110) is fixed to the vaccum bench (123).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821415255.4U CN208971870U (en) | 2018-08-30 | 2018-08-30 | The equipment and its template scaling powder being added on the pad of component load-bearing part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821415255.4U CN208971870U (en) | 2018-08-30 | 2018-08-30 | The equipment and its template scaling powder being added on the pad of component load-bearing part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208971870U true CN208971870U (en) | 2019-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821415255.4U Active CN208971870U (en) | 2018-08-30 | 2018-08-30 | The equipment and its template scaling powder being added on the pad of component load-bearing part |
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|---|---|
| CN (1) | CN208971870U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148427A (en) * | 2019-12-31 | 2020-05-12 | 无锡市同步电子制造有限公司 | Repair process of stacking/I-shaped preset solder terminal connector |
-
2018
- 2018-08-30 CN CN201821415255.4U patent/CN208971870U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148427A (en) * | 2019-12-31 | 2020-05-12 | 无锡市同步电子制造有限公司 | Repair process of stacking/I-shaped preset solder terminal connector |
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