JPH02312296A - Manufacture of high density mounting module - Google Patents

Manufacture of high density mounting module

Info

Publication number
JPH02312296A
JPH02312296A JP1134180A JP13418089A JPH02312296A JP H02312296 A JPH02312296 A JP H02312296A JP 1134180 A JP1134180 A JP 1134180A JP 13418089 A JP13418089 A JP 13418089A JP H02312296 A JPH02312296 A JP H02312296A
Authority
JP
Japan
Prior art keywords
board
circuit pattern
hole
buried component
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1134180A
Other versions
JPH0563112B2 (en
Inventor
Masaki Kinoshita
Original Assignee
Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Radio Co Ltd filed Critical Japan Radio Co Ltd
Priority to JP1134180A priority Critical patent/JPH0563112B2/ja
Publication of JPH02312296A publication Critical patent/JPH02312296A/en
Publication of JPH0563112B2 publication Critical patent/JPH0563112B2/ja
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Abstract

PURPOSE:To obtain a thermal shock-resistant module in which no short circuit occurs between circuits and many components can be housed by a method wherein the components are inserted in a board provided with a component embedding hole as being kept at the same plane with a circuit pattern, solder bumps are formed, and the different boards are pasted together. CONSTITUTION:A buried component 5 is inserted in an embedding hole 2 provided to a first board 1, which is joined to a position aligning film 4, then joining liquid resin is injected into the hole 2 and solidified, and the buried component 5 is fixed in the hole 2 of the first board 1 with the filled resin 6. Moreover, the position aligning film 4 is separated from the joining face of the board 1, and a mount land 7 of the buried component 5 is positioned at the same plane with the face of a circuit pattern 3. Solder bumps 8 and 9 are formed on a part where a second board 10 and the circuit pattern 3 are jointed together and the buried component fitting land 7, and the circuit pattern 3 and a circuit pattern 11 of the second board 10 are pasted together through the intermediary of the solder bump 8. By this setup, no short circuit occurs between circuits and a module of this design is high in resistance to thermal shock and capable of housing many components.
JP1134180A 1989-05-26 1989-05-26 Expired - Fee Related JPH0563112B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1134180A JPH0563112B2 (en) 1989-05-26 1989-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1134180A JPH0563112B2 (en) 1989-05-26 1989-05-26

Publications (2)

Publication Number Publication Date
JPH02312296A true JPH02312296A (en) 1990-12-27
JPH0563112B2 JPH0563112B2 (en) 1993-09-09

Family

ID=15122313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1134180A Expired - Fee Related JPH0563112B2 (en) 1989-05-26 1989-05-26

Country Status (1)

Country Link
JP (1) JPH0563112B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118368A (en) * 2000-07-31 2002-04-19 Ngk Spark Plug Co Ltd Wiring substrate and manufacturing method thereof
JP2002237683A (en) * 2001-02-08 2002-08-23 Ngk Spark Plug Co Ltd Method for manufacturing circuit board
US6581279B1 (en) * 1998-08-25 2003-06-24 Commissariat A L'energie Atomique Method of collectively packaging electronic components
JP2006351778A (en) * 2005-06-15 2006-12-28 Ngk Spark Plug Co Ltd Manufacturing method of wiring board
JP2007258541A (en) * 2006-03-24 2007-10-04 Ngk Spark Plug Co Ltd Method of manufacturing wiring board
US7435910B2 (en) 2000-02-25 2008-10-14 Ibiden Co., Ltd. Multilayer printed circuit board
KR100986829B1 (en) * 2007-11-07 2010-10-12 삼성전기주식회사 manufacturing method of PCB
US7852634B2 (en) 2000-09-25 2010-12-14 Ibiden Co., Ltd. Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
JP2014072279A (en) * 2012-09-28 2014-04-21 Dainippon Printing Co Ltd Manufacturing method of wiring board with components incorporated therein

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6581279B1 (en) * 1998-08-25 2003-06-24 Commissariat A L'energie Atomique Method of collectively packaging electronic components
US7888606B2 (en) 2000-02-25 2011-02-15 Ibiden Co., Ltd. Multilayer printed circuit board
US7842887B2 (en) 2000-02-25 2010-11-30 Ibiden Co., Ltd. Multilayer printed circuit board
US8438727B2 (en) 2000-02-25 2013-05-14 Ibiden Co., Ltd. Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US8186045B2 (en) 2000-02-25 2012-05-29 Ibiden Co., Ltd. Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US7435910B2 (en) 2000-02-25 2008-10-14 Ibiden Co., Ltd. Multilayer printed circuit board
US8079142B2 (en) 2000-02-25 2011-12-20 Ibiden Co., Ltd. Printed circuit board manufacturing method
JP2002118368A (en) * 2000-07-31 2002-04-19 Ngk Spark Plug Co Ltd Wiring substrate and manufacturing method thereof
JP4695289B2 (en) * 2000-07-31 2011-06-08 日本特殊陶業株式会社 Wiring board manufacturing method
US7855342B2 (en) 2000-09-25 2010-12-21 Ibiden Co., Ltd. Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
US7852634B2 (en) 2000-09-25 2010-12-14 Ibiden Co., Ltd. Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
US8959756B2 (en) 2000-09-25 2015-02-24 Ibiden Co., Ltd. Method of manufacturing a printed circuit board having an embedded electronic component
US7999387B2 (en) 2000-09-25 2011-08-16 Ibiden Co., Ltd. Semiconductor element connected to printed circuit board
US7908745B2 (en) 2000-09-25 2011-03-22 Ibiden Co., Ltd. Method of manufacturing multi-layer printed circuit board
US7893360B2 (en) 2000-09-25 2011-02-22 Ibiden Co., Ltd. Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
US9245838B2 (en) 2000-09-25 2016-01-26 Ibiden Co., Ltd. Semiconductor element
JP2002237683A (en) * 2001-02-08 2002-08-23 Ngk Spark Plug Co Ltd Method for manufacturing circuit board
JP2006351778A (en) * 2005-06-15 2006-12-28 Ngk Spark Plug Co Ltd Manufacturing method of wiring board
JP4714510B2 (en) * 2005-06-15 2011-06-29 日本特殊陶業株式会社 Wiring board manufacturing method
JP2007258541A (en) * 2006-03-24 2007-10-04 Ngk Spark Plug Co Ltd Method of manufacturing wiring board
JP4648230B2 (en) * 2006-03-24 2011-03-09 日本特殊陶業株式会社 Wiring board manufacturing method
KR100986829B1 (en) * 2007-11-07 2010-10-12 삼성전기주식회사 manufacturing method of PCB
JP2014072279A (en) * 2012-09-28 2014-04-21 Dainippon Printing Co Ltd Manufacturing method of wiring board with components incorporated therein

Also Published As

Publication number Publication date
JPH0563112B2 (en) 1993-09-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees