CN109714894A - A method of improving pad intensity - Google Patents
A method of improving pad intensity Download PDFInfo
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- CN109714894A CN109714894A CN201910107860.8A CN201910107860A CN109714894A CN 109714894 A CN109714894 A CN 109714894A CN 201910107860 A CN201910107860 A CN 201910107860A CN 109714894 A CN109714894 A CN 109714894A
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- pad
- matrix
- bonding pad
- strength
- solder mask
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 229910000679 solder Inorganic materials 0.000 claims abstract description 76
- 238000004458 analytical method Methods 0.000 claims abstract description 5
- 239000011159 matrix material Substances 0.000 claims description 40
- 238000003466 welding Methods 0.000 claims description 19
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 11
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 11
- 238000005476 soldering Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention discloses a kind of method for improving pad intensity, first passes through analysis in advance and obtains the direction of external force suffered by pad；Include: the direction of expansion for determining pad according to the direction of external force, expand pad along direction of expansion, and reduces the corresponding direction of solder mask windowing；Make solder mask covering pad in the edge of direction of expansion.Beneficial effect is: the size of pad and solder mask windowing is adjusted by the direction of external force suffered by analysis pad, expand pad in face of external force direction, simultaneously, reduce solder mask windowing along external force direction, make side of the solder mask covering pad by external force direction, further improve the intensity of pad, and this method will not reduce the electric equipment compartment of pad on pcb board away from, weld strength will not be influenced, and ensure that the reasonable arrangement space of pcb board.
Description
Technical Field
The invention relates to the technical field of printed circuit board design, in particular to a method for improving the strength of a bonding pad.
Background
With the development of electronic product technology, electronic products are developing towards miniaturization and refinement, components used by a Printed Circuit Board (PCB), the size of a pad of the PCB and the electrical spacing of the pad are gradually reduced, and the strength of the pad is gradually reduced. The welding disc is easy to fall off in the assembling and maintaining process of the PCB, the whole PCB is scrapped once the welding disc falls off, and the scrapping of the PCB brings great loss to production enterprises and users due to the fact that the PCB is high in cost.
In the prior art, there are two design methods for a pad for soldering a device on a PCB, namely: NSMD (Non Solder Mask Defined) pads shown in fig. 1 and SMD (Solder Mask Defined) pads shown in fig. 3. After the device is welded on the PCB where the pad is positioned, the temperature cycle life of the welding point of the NSMD pad is longer than that of the welding point of the SMD pad, and because the NSMD structure is used, the side surface of the pad is also welded, so that the welding strength is increased; however, the NSMD pads have lower adhesion strength to the PCB than the SMD pads, and are more likely to crack or fall off from the PCB when subjected to external force impact.
As shown in fig. 1 and 2, the PCB 1 includes NSMD pads, and the size of the pad 11 is enlarged, although the method can effectively improve the strength of the pad 11, under the condition that the size of the PCB 1 is not changed, the electrical spacing is reduced, which easily causes a bridging phenomenon in a soldering process, further affects the electrical performance and the insulation performance of the PCB 1, and also reduces the layout and wiring space of the PCB 1.
As shown in fig. 3 and 4, the PCB board 1 includes SMD pads, and the solder resist layer covers the periphery of the pads 11, which can effectively improve the strength of the pads 11. However, if the size of the holding pad 11 is the same as the size of the pad 11 in fig. 1, since the solder resist window 10 is smaller than the pad size, the soldering area of the solder is inevitably reduced, which easily causes poor soldering or a reduction in soldering strength due to an insufficient amount of solder; if the size of the pad 11 is enlarged to secure the area and amount of solder required for soldering, the electrical gap and creepage distance between adjacent pads in the device pad group are reduced.
Therefore, there is a need for a pad improvement method that can improve the strength of the pad without affecting the performance and soldering strength of the PCB.
Disclosure of Invention
In view of the above problems in the prior art, a method for improving the strength of a bonding pad is provided.
The specific technical scheme is as follows:
the invention comprises a method for improving the strength of a bonding pad, which obtains the direction of an external force applied to the bonding pad in advance through analysis; the method specifically comprises the following steps:
and determining the expansion direction of the pad according to the direction of the external force, expanding the pad along the expansion direction, and reducing the direction corresponding to the windowing of the solder mask layer.
Preferably, the enlarged portion of the pad is partially or completely covered by a solder resist layer.
Preferably, when the pad forms a pad group, the expansion direction of the pad is the outline of the pad group.
Preferably, when there are a plurality of the pads in one direction of the pad group, the direction of adjacency between the pads is not enlarged.
Preferably, when the pad group forms a matrix, only sides of the pads located at four corners of the matrix toward an outside of the matrix are enlarged.
Preferably, when the pads form a matrix, a gap is formed between the edge of the matrix, which is not located at the four corners of the matrix, and the solder resist windowing part, and the edge of the pads facing the outside of the matrix.
The invention comprises a method for improving the strength of a bonding pad, which specifically comprises the following steps:
and enlarging the size of the welding pad on the printed board along the outline of the printed board, and reducing the direction corresponding to the windowing of the solder mask layer.
Preferably, the enlarged portion of the pad is partially or completely covered by a solder resist layer.
Preferably, when the pad forms a pad group, the expansion direction of the pad is the outline of the pad group.
Preferably, when there are a plurality of the pads in one direction of the pad group, the direction of adjacency between the pads is not enlarged.
Preferably, when the pad group forms a matrix, only sides of the pads located at four corners of the matrix toward an outside of the matrix are enlarged.
Preferably, when the pads form a matrix, a gap is formed between the edge of the matrix, which is not located at the four corners of the matrix, and the solder resist windowing part, and the edge of the pads facing the outside of the matrix.
The invention includes a printed circuit board comprising a plurality of padsets, at least one of said padsets being formed by the method of claims 1 to 6; or at least one said padset is formed by the method of claims 7 to 12.
The technical scheme of the invention has the beneficial effects that: the size of the pad and the solder mask layer is adjusted by analyzing the direction of the external force applied to the pad, so that the pad is expanded in the plane of the PCB against the direction of the external force, meanwhile, the solder mask layer is reduced along the direction of the external force, the solder mask layer partially or completely covers the expanded part of the pad, the strength of the pad is further improved, the method cannot reduce the electrical distance between the pads on the PCB, the welding strength of the pad is not influenced, and the reasonable layout space of the PCB is ensured.
Drawings
Embodiments of the present invention will be described more fully with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.
FIG. 1 is a plan view of a prior art NSMD pad;
FIG. 2 is a cross-sectional view of a prior art NSMD pad;
fig. 3 is a plan view of an SMD pad in the prior art;
FIG. 4 is a cross-sectional view of an SMD pad of the prior art;
FIG. 5 is a plan view structural view of a PCB board prepared in advance in the embodiment of the present invention;
FIG. 6 is a plan view of a PCB board including a bonding pad set according to an embodiment of the present invention;
FIG. 7 is a cross-sectional view of a PCB board containing a set of pads in an embodiment of the present invention;
fig. 8 is a plan view of a PCB board including a plurality of pad groups prepared in advance in an embodiment of the present invention;
FIG. 9 is a plan view of a PCB board including a plurality of pad sets according to an embodiment of the present invention;
fig. 10 is a plan view of a PCB board including a plurality of pad groups according to another embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
The invention includes a method for improving the strength of a bonding pad, as shown in fig. 6, specifically including:
the direction of the external force applied to the bonding pad 11 is obtained in advance through analysis;
and determining the expansion direction of the pad 11 according to the direction of the external force, expanding the pad 11 along the expansion direction, reducing the direction corresponding to the windowing of the solder mask layer, and enabling the solder mask layer to cover the edge of the pad 11 in the expansion direction.
Specifically, as shown in fig. 5, a plurality of solder mask windows 10 are opened on the PCB board 1, a pad 11 is disposed in each solder mask window 10, a solder mask is coated on a region outside the solder mask window 10, and gaps are formed between four sides of the pad 11 and the solder mask window 10. As shown in fig. 6, the arrow points to the direction of the external force applied to the PCB 1, and the directions of the external force applied to the PCB 1 mainly include a first direction D1, a second direction D2, a third direction D3, and a fourth direction D4.
By analyzing the direction of the external force applied to the pad 11, it can be known that the outer edge of the pad 11 is most easily impacted by the external force. Therefore, the size of the pad 11 is enlarged, the direction of enlargement of the pad 11 is perpendicular to the direction of external force, the solder resist fenestration 10 is reduced in the direction opposite to the direction of enlargement of the pad 11, and the solder resist covers only the side of the pad 11 that receives external force (the hatched portion in fig. 6 is the portion where the solder resist covers the pad 11), thereby further improving the strength of the pad 11.
Through the technical scheme, the contact area between the bonding pad and the PCB board 1 can be increased by enlarging the size of the bonding pad 11, the strength of the bonding pad 11 is further improved, and meanwhile, the position of the inner edge of the bonding pad 11 is still kept unchanged; the size of the solder mask windowing 10 is reduced, so that the solder mask covers the edge of the pad 11 which is impacted by external force, the strength of the pad 11 is further improved, the position of the inner edge of the solder mask windowing 10 is also kept unchanged (as shown in figure 7), and the electrical distance of the PCB 1 is further ensured; because the solder mask only partially covers the edge of the pad 11, when the device pin is welded, the contact between the device pin and the pad 11 is not affected, and therefore, the technical scheme of the embodiment does not affect the welding strength of the device pin.
In the above technical solution, the pad expansion may be performed according to the above technical solution on the basis of the original pad design size in the design stage, and similarly, the solder mask windowing reduction may be performed according to the above technical solution on the basis of the original solder mask windowing design size in the design stage, that is, the pad expansion and the solder mask windowing reduction are completed in the design stage.
Certainly, the technical scheme of the application does not exclude the expansion of the size of the welding pad and the reduction of the windowing of the solder mask layer at other process stages except the design stage.
In a preferred embodiment, the enlarged portion of the pad 11 is partially or fully covered by a solder mask.
Specifically, as shown in fig. 6, since the first side 11A of the pad 11 receives an external force in the first direction D1, the first side 11A is expanded in a direction perpendicular to the D1 direction and should be expanded toward the outer edge of the PCB board 1, i.e., the first side 11A is expanded in the fourth direction D4; similarly, the third side 11C of the pad 11 is subjected to the external force of the third direction D3, and the third side 11C should also be expanded along the fourth direction D4; since the second side 11B of the pad 11 receives the external force in the second direction D2, the second sides 11B of the pad 11 are expanded along the first direction D1 and the third direction D3, respectively, and the expansion sizes of the second sides 11B in both directions are the same. Through the technical scheme, the solder mask layer 10 covers three sides of the pad 11 which are easily subjected to external force impact, the inner edge part of the pad 11, namely the fourth side 11D of the pad 11, is not covered by the solder mask layer 10, and a gap is reserved between the fourth side 11D and the solder mask layer windowing 10.
Further, according to the above-mentioned technical solution, the pad 11 is enlarged, as shown in fig. 5, a PCB 1 before improvement is prepared in advance, and assuming that a dimension of the pad 11 before enlargement corresponding to one side of the enlargement direction is X and a dimension of the solder resist windowing 10 before reduction corresponding to one side of the enlargement direction is a, the first side 11A of the pad 11 and the third side 11C of the pad 11 are enlarged in the fourth direction D4 by (a-X)/2, and accordingly, the dimensions of the two sides of the solder resist windowing 10 parallel to the first side 11A are reduced by (a-X)/2; the second side 11B of the pad 11 is enlarged in the first direction D1 and the third direction D3 by (a-X)/2, that is, the second side 11B is enlarged by (a-X) in total, and accordingly the two sides of the solder mask window 10 parallel to the second side 11B are reduced in size by (a-X), so as to further ensure that the electrical pitch of the PCB board 1 is not changed.
In a preferred embodiment, when one edge of the pad 11 is expanded in only one direction, the expanded size of the pad 11 is obtained according to the following formula:
L1＝X+(a-X)/2
wherein,
l1 is the enlarged size of one side of the pad 11 corresponding to the enlargement direction;
x is the size of the bonding pad 11 before one side corresponding to the expansion direction is expanded;
a is the size of the solder mask windowing 10 before one side corresponding to the expansion direction is reduced;
the reduced size of the solder mask window 10 is obtained according to the following formula:
L2＝a-(a-X)/2
wherein,
l2 is the size of the solder mask window 10 after being reduced corresponding to one side of the expansion direction;
x is the size of the bonding pad 11 before one side corresponding to the expansion direction is expanded;
a is a dimension of the solder resist layer opening window 10 before being reduced corresponding to one side in the expansion direction.
Specifically, as shown in fig. 6, the first side 11A of the pad 11 receives an external force in the first direction D1, and the first side 11A is expanded by (a-X)/2 along the fourth direction D4, and accordingly, the solder resist windowing 10 and the two sides of the first side 11A are respectively reduced by (a-X)/2 in the second direction D2, so that the solder resist 10 covers the first side 11A of the pad 11.
In a preferred embodiment, when one edge of the pad 11 is enlarged in both directions, the enlarged dimension of the pad 11 is obtained according to the following formula:
L1＝X+(a-X)
wherein,
l1 is the enlarged size of one side of the pad 11 corresponding to the enlargement direction;
x is the size of the bonding pad 11 before one side corresponding to the expansion direction is expanded;
a is the size of the solder mask windowing 10 before one side corresponding to the expansion direction is reduced;
the reduced size of the solder mask window 10 is obtained according to the following formula:
L2＝a-(a-X)
wherein,
l2 is the size of the solder mask window 10 after being reduced corresponding to one side of the expansion direction;
x is the size of the bonding pad 11 before one side corresponding to the expansion direction is expanded;
a is a dimension of the solder resist layer opening window 10 before being reduced corresponding to one side in the expansion direction.
Specifically, as shown in fig. 6, since the second side 11B of the pad 11 is subjected to the external force in the second direction D2, the second side 11B should be expanded by (a-X)/2 in the first direction D1 and the third direction D3, respectively, so that the second side 11B is expanded by (a-X) and accordingly, the two sides of the solder resist window 10 parallel to the second side 11B are reduced by (a-X), respectively, and the solder resist 10 is further made to cover the second side 11B just. And the position of the fourth edge 11D of the pad 11 is not changed, the position of one edge of the solder mask windowing 10 corresponding to the fourth edge 11D is also not changed, and a gap is reserved between the fourth edge 11D of the pad 11 and the solder mask windowing 10, so that the electrical distance of the PCB is further ensured.
In a preferred embodiment, when the pads 11 form a pad group, the expanding direction of the pads 11 is the outline of the pad group;
when there are a plurality of pads 11 in one direction of the pad group, the direction of adjacency between the pads 11 is not enlarged.
Specifically, as shown in fig. 6, the pad group includes at least two pads 11, and the adjacent direction of the pads 11 is the inner side of the PCB and is not easily impacted by external force, so the adjacent direction between the pads 11 is not expanded, and the expansion direction of the pads 11 is related to the profile of the pad group.
In a preferred embodiment, fig. 8 shows a PCB 1 comprising a plurality of pad groups, wherein when the pad groups form a matrix, only the sides of the pads 11 located at the four corners of the matrix facing the outside of the matrix are enlarged;
a gap is reserved between the welding pad 11 and the solder mask windowing 10;
when the pads 11 form a matrix, there is a gap between the edge of the pads 11 that is at the edge of the matrix and not at the four corners of the matrix, which edge faces the outside of the matrix, and the solder resist fenestration 10.
Specifically, as shown in fig. 9, when the PCB 1 includes a plurality of pad groups, since the pads 11 at the four corners of the matrix are generally used for soldering device pins, the strength of the pads 11 at the four corners directly determines the service life of the PCB 1, and the pads 11 at the four corners of the matrix are improved by using a partial pressure soldering method in the present embodiment.
Furthermore, the direction of the arrow points to the direction of the external force applied to the PCB board 1, the shaded portion is the portion of the solder mask covering the pad 11, the expanded size of one side of the pad 11 corresponding to the expanded direction is equal to the reduced size of one side of the solder mask windowing 10 corresponding to the expanded direction, so that the expanded side of the pad 11 is covered by the solder mask. The position of the inner edge of the bonding pad 11 is unchanged, and a gap is reserved between the edge of the inner edge of the bonding pad 11 and the solder mask windowing 10, so that the reasonable electrical distance of the PCB is further ensured, the strength of the bonding pad 11 is effectively improved, the contact space between the device pin and the bonding pad 11 is also ensured, and the welding strength of the device pin is not influenced.
In another preferred embodiment, as shown in fig. 10 (the hatched portion is the portion of the solder resist layer covering the pads 11), when the PCB board 1 includes a plurality of pad groups, when the pad groups form a matrix, the pads 11 located on four sides of the matrix are enlarged, the edge facing the outside of the matrix is enlarged, and the solder resist layer windows 10 corresponding to the pads 11 are reduced, so that the enlarged portions of the pads 11 are partially or completely covered by the solder resist layer.
The technical scheme of the invention has the beneficial effects that: the size of the pad and the solder mask layer is adjusted by analyzing the direction of the external force applied to the pad, so that the pad is expanded in the plane of the PCB against the direction of the external force, meanwhile, the solder mask layer is reduced along the direction of the external force, the solder mask layer partially or completely covers the expanded part of the pad, the strength of the pad is further improved, the method cannot reduce the electrical distance between the pads on the PCB, the welding strength of the pad is not influenced, and the reasonable layout space of the PCB is ensured.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (13)
1. A method for improving the strength of a bonding pad is characterized by comprising the following steps:
obtaining the direction of the external force applied to the bonding pad in advance through analysis;
and determining the expansion direction of the pad according to the direction of the external force, expanding the pad along the expansion direction, and reducing the direction corresponding to the windowing of the solder mask layer.
2. The method for improving the strength of the bonding pad according to claim 1, wherein the enlarged portion of the bonding pad is partially or completely covered by a solder resist layer.
3. The method for improving the strength of the bonding pad according to claim 1, wherein when the bonding pad is formed into a bonding pad group, the expansion direction of the bonding pad is the outline of the bonding pad group.
4. The method for improving strength of a bonding pad according to claim 3, wherein when there are a plurality of bonding pads in one direction of the bonding pad group, the direction of adjacency between the bonding pads is not enlarged.
5. The method for improving strength of bonding pads according to claim 1, wherein when the bonding pad group forms a matrix, only edges of the bonding pads located at four corners of the matrix toward the outside of the matrix are enlarged.
6. The method for improving the strength of the welding pad according to claim 1, wherein when the welding pad forms a matrix, the edge of the welding pad which is positioned at the edge of the matrix and is not positioned at the four corners of the matrix and is towards the outer side of the matrix has a gap with the windowing of the solder mask layer.
7. A method for improving the strength of a bonding pad is characterized by comprising the following steps:
and enlarging the size of the welding pad on the printed board along the outline of the printed board, and reducing the direction corresponding to the windowing of the solder mask layer.
8. The method for improving the strength of the bonding pad according to claim 7, wherein the enlarged portion of the bonding pad is partially or completely covered by a solder resist layer.
9. The method for improving the strength of the bonding pad according to claim 7, wherein when the bonding pad is formed into a bonding pad group, the expansion direction of the bonding pad is the outline of the bonding pad group.
10. The method for improving strength of bonding pads according to claim 9, wherein when there are a plurality of bonding pads in one direction of the bonding pad group, the direction of adjacency between the bonding pads is not enlarged.
11. The method for improving strength of bonding pads according to claim 7, wherein when the bonding pad group forms a matrix, only edges of the bonding pads located at four corners of the matrix toward the outside of the matrix are enlarged.
12. The method for improving the strength of the welding pad according to claim 7, wherein when the welding pad forms a matrix, the edge of the welding pad which is positioned at the edge of the matrix and is not positioned at the four corners of the matrix and is towards the outer side of the matrix has a gap with the windowing of the solder mask layer.
13. A printed circuit board comprising a plurality of padsets, at least one of said padsets being formed by the method of claims 1 to 6; or at least one said padset is formed by the method of claims 7 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910107860.8A CN109714894B (en) | 2019-02-02 | 2019-02-02 | Method for improving strength of bonding pad |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910107860.8A CN109714894B (en) | 2019-02-02 | 2019-02-02 | Method for improving strength of bonding pad |
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| Publication Number | Publication Date |
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| CN109714894A true CN109714894A (en) | 2019-05-03 |
| CN109714894B CN109714894B (en) | 2023-09-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910107860.8A Active CN109714894B (en) | 2019-02-02 | 2019-02-02 | Method for improving strength of bonding pad |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148427A (en) * | 2019-12-31 | 2020-05-12 | 无锡市同步电子制造有限公司 | Repair process of stacking/I-shaped preset solder terminal connector |
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|---|---|---|---|---|
| JP2003031937A (en) * | 2001-07-18 | 2003-01-31 | Sony Corp | Soldering land structure for surface mounting type component |
| CN101499451A (en) * | 2008-01-30 | 2009-08-05 | 三星电子株式会社 | Printed circuit board, semiconductor package, card apparatus, and system |
| CN205946344U (en) * | 2016-08-23 | 2017-02-08 | 合肥鑫晟光电科技有限公司 | Test point structure and PCB board |
-
2019
- 2019-02-02 CN CN201910107860.8A patent/CN109714894B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031937A (en) * | 2001-07-18 | 2003-01-31 | Sony Corp | Soldering land structure for surface mounting type component |
| CN101499451A (en) * | 2008-01-30 | 2009-08-05 | 三星电子株式会社 | Printed circuit board, semiconductor package, card apparatus, and system |
| CN205946344U (en) * | 2016-08-23 | 2017-02-08 | 合肥鑫晟光电科技有限公司 | Test point structure and PCB board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148427A (en) * | 2019-12-31 | 2020-05-12 | 无锡市同步电子制造有限公司 | Repair process of stacking/I-shaped preset solder terminal connector |
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| CN109714894B (en) | 2023-09-08 |
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