CN204657686U - Vapour phase welder - Google Patents
Vapour phase welder Download PDFInfo
- Publication number
- CN204657686U CN204657686U CN201520373987.1U CN201520373987U CN204657686U CN 204657686 U CN204657686 U CN 204657686U CN 201520373987 U CN201520373987 U CN 201520373987U CN 204657686 U CN204657686 U CN 204657686U
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- CN
- China
- Prior art keywords
- vapour phase
- flue
- storage tank
- liquid storage
- welder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a kind of vapour phase welder, comprise cabinet, control system, vapour phase liquid storage tank, flue, pallet and upper cover door, described vapour phase liquid storage tank is arranged at the bottom of described cabinet, the bottom of described vapour phase liquid storage tank is provided with heater, described flue is fixedly arranged in described cabinet just to the top of the output of described vapour phase liquid storage tank, and the input of described flue seals with the output of described vapour phase liquid storage tank and connects, the upper end of described flue is provided with conveyer belt, described pallet to be placed on described conveyer belt and to communicate with the inner chamber of described flue, described upper cover door swivelling cover is located at the top of described cabinet, described heater and described conveyer belt and described control system are electrically connected.The hot good evenness in vapour phase district that this vapour phase welder is formed in flue, and the vapour phase welder of the problem that same pcb board causes because device differences in absorbed heat is excessive can be solved.
Description
Technical field
The utility model relates to electroplating equipment wielding machine field, particularly relates to a kind of vapour phase welder.
Background technology
Paster welding in current PCBA board is main based on Reflow Soldering, first on pcb board, print tin cream by printing machine, then the attachment of surface mount elements is carried out by chip mounter, carry out heating and cooling according to the temperature curve that tin cream requires by Reflow Soldering again, tin cream is melted, thus paster part is firmly connected with pcb board.Such drawback be PCB plate on the difference of components and parts, such as pcb board has smallclothes and large part, may having absorbed heat too much at this temperature of such smallclothes, large part may absorb heat and melt tin not enough.When especially pcb board having some heat absorbing members to need to weld, such as aluminium radiator etc., if the heat needing the hot blast of Reflow Soldering to provide meets the reflux temperature of tin cream below aluminum component, those little components and parts are just overheated.Such as: the tin cream of client is the fusing point of 260 degree, if plate is all gadget, the temperature that when temperature of backflow is set as 280 degree, pcb board can obtain 260 degree melts tin.If when plate being all aluminum component, the temperature of backflow is set as that 330 degree just can melt tin.If two kinds when occurring simultaneously, in order to the tin cream temperature melting aluminum component needs to reach 330 degree, but this temperature is just too high for gadget, may damage device.Meanwhile, the mode of hot air reflux welding adopts hot blast to take away the heat of heater, and stove thermal deviation best is in the industry about positive and negative two degree.
Utility model content
The purpose of this utility model is to provide a kind of hot good evenness, and can solve the vapour phase welder of the problem that same pcb board causes because device differences in absorbed heat is excessive.
To achieve these goals, the technical solution of the utility model is: provide a kind of vapour phase welder, comprise cabinet, control system, vapour phase liquid storage tank, flue, pallet and upper cover door, described vapour phase liquid storage tank is arranged at the bottom of described cabinet, the bottom of described vapour phase liquid storage tank is provided with heater, described flue is fixedly arranged in described cabinet just to the top of the output of described vapour phase liquid storage tank, and the input of described flue seals with the output of described vapour phase liquid storage tank and connects, the upper end of described flue is provided with conveyer belt, described pallet to be placed on described conveyer belt and to communicate with the inner chamber of described flue, described upper cover door swivelling cover is located at the top of described cabinet, described heater and described conveyer belt and described control system are electrically connected.
The side of described cabinet is provided with the touch-screen be electrically connected with described control system.
Flue heat shield is also covered with outside described flue.
Described vapour phase welder also comprises cooling system, and described cooling system is for cooling the soldering fluid of vapour phase.
Compared with prior art, the hot good evenness in vapour phase district that the utility model vapour phase welder is formed in flue, and the vapour phase welder of the problem that same pcb board causes because device differences in absorbed heat is excessive can be solved.
By following description also by reference to the accompanying drawings, the utility model will become more clear, and these accompanying drawings are for explaining embodiment of the present utility model.
Accompanying drawing explanation
Fig. 1 is the structure chart of the utility model vapour phase welder first angle.
Fig. 2 is the structure chart of the utility model vapour phase welder second angle.
Fig. 3 is the structure chart of the utility model vapour phase welder the 3rd angle.
Detailed description of the invention
Referring to figs. 1 to Fig. 3, the utility model vapour phase welder 100 comprises cabinet 10, control system (not shown), vapour phase liquid storage tank 30, flue 40, pallet 50 and upper cover door 60.
Described vapour phase liquid storage tank 30 is arranged at the bottom of described cabinet 10, and the bottom of described vapour phase liquid storage tank 30 is provided with heater (not shown).Described flue 40 is fixedly arranged in just to the top of the output of described vapour phase liquid storage tank 30 in described cabinet 10, and the input of described flue 40 seals with the output of described vapour phase liquid storage tank 30 and connects.Flue heat shield 41 is also covered with outside described flue 40.The upper end of described flue 40 is provided with conveyer belt 42, and described pallet 50 to be placed on described conveyer belt 42 and to communicate with the inner chamber of described flue 40.Described upper cover door 60 swivelling cover is located at the top of described cabinet 10, and described heater and described conveyer belt 42 are electrically connected with described control system.The side of described cabinet 10 is provided with the touch-screen 11 be electrically connected with described control system.
Preferably, described vapour phase welder 100 also comprises cooling system 70, and described cooling system 70 is for cooling the soldering fluid of vapour phase.
When the utility model vapour phase welder 100 uses, heater is heated to phase transition temperature to the soldering fluid in vapour phase liquid storage tank 30, soldering fluid is vaporized and in flue 40, forms the saturated vapour phase district of high temperature, vapour phase district is entered with pallet 50 by after the printing welding plate assembly solidification that soldering paste is located temporarily, condensation and the disengaged vapor heat-transmission on its all exposed surface rapidly of vapour phase liquid, after soldering paste obtains heat, steep temperature rise is to melting, heat continues to be transformed into printed board assembly and vapour phase liquid reaches balance, and wetting mother metal spreads mutually.After printed board assembly leaves vapour phase district with pallet 50, soldering paste and condensation-crystallization, realize permalink.
The utility model vapour phase welder adopts the mode of heating vapor liquid, and vapour phase heating liquid to boiling point, form vapour phase district in the flue above vapour phase liquid, due to the physical characteristic of liquid itself, the fluid temperature of vaporization is a steady state value.Needing the pcb board of reflow soldering to put into vapour phase district with pallet, being heated of any one point now on pcb board is completely the same, far away higher than positive and negative two degree of deviations of hot air reflux best in the industry weldering.Meanwhile, vapour phase liquid provides the heat far above hot blast, and large device (such as aluminium radiating piece) can obtain the heat needing backflow rapidly, and little device also can not be overheated and damage the temperature constant of gas (because).Solve the problem that same pcb board causes because device differences in absorbed heat is excessive.
More than in conjunction with most preferred embodiment, the utility model is described, but the utility model is not limited to the embodiment of above announcement, and amendment that the various essence according to the present embodiment carries out, equivalent combinations should be contained.
Claims (4)
1. a vapour phase welder, it is characterized in that: comprise cabinet, control system, vapour phase liquid storage tank, flue, pallet and upper cover door, described vapour phase liquid storage tank is arranged at the bottom of described cabinet, the bottom of described vapour phase liquid storage tank is provided with heater, described flue is fixedly arranged in described cabinet just to the top of the output of described vapour phase liquid storage tank, and the input of described flue seals with the output of described vapour phase liquid storage tank and connects, the upper end of described flue is provided with conveyer belt, described pallet to be placed on described conveyer belt and to communicate with the inner chamber of described flue, described upper cover door swivelling cover is located at the top of described cabinet, described heater and described conveyer belt and described control system are electrically connected.
2. vapour phase welder as claimed in claim 1, is characterized in that: the side of described cabinet is provided with the touch-screen be electrically connected with described control system.
3. vapour phase welder as claimed in claim 1, is characterized in that: be also covered with flue heat shield outside described flue.
4. vapour phase welder as claimed in claim 1, it is characterized in that: also comprise cooling system, described cooling system is for cooling the soldering fluid of vapour phase.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520373987.1U CN204657686U (en) | 2015-06-03 | 2015-06-03 | Vapour phase welder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520373987.1U CN204657686U (en) | 2015-06-03 | 2015-06-03 | Vapour phase welder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204657686U true CN204657686U (en) | 2015-09-23 |
Family
ID=54128120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520373987.1U Expired - Fee Related CN204657686U (en) | 2015-06-03 | 2015-06-03 | Vapour phase welder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204657686U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115023065A (en) * | 2022-05-31 | 2022-09-06 | 深圳市创芯智汇电子科技有限公司 | Safe and reliable PCBA board packaging device and packaging method |
-
2015
- 2015-06-03 CN CN201520373987.1U patent/CN204657686U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115023065A (en) * | 2022-05-31 | 2022-09-06 | 深圳市创芯智汇电子科技有限公司 | Safe and reliable PCBA board packaging device and packaging method |
| CN115023065B (en) * | 2022-05-31 | 2024-05-03 | 深圳市宏曦睿科技有限公司 | Safe and reliable PCBA (printed circuit board assembly) packaging equipment and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150923 Termination date: 20160603 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |