CN109332839B - Reflow furnace for soldering integrated circuit board - Google Patents
Reflow furnace for soldering integrated circuit board Download PDFInfo
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- CN109332839B CN109332839B CN201811323135.6A CN201811323135A CN109332839B CN 109332839 B CN109332839 B CN 109332839B CN 201811323135 A CN201811323135 A CN 201811323135A CN 109332839 B CN109332839 B CN 109332839B
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- conveying
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- 238000005476 soldering Methods 0.000 title claims abstract description 133
- 238000011084 recovery Methods 0.000 claims abstract description 142
- 238000009413 insulation Methods 0.000 claims abstract description 78
- 230000004907 flux Effects 0.000 claims abstract description 68
- 238000000576 coating method Methods 0.000 claims abstract description 52
- 239000011248 coating agent Substances 0.000 claims abstract description 50
- 238000004064 recycling Methods 0.000 claims description 16
- 239000007788 liquid Substances 0.000 description 29
- 239000000843 powder Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 230000000694 effects Effects 0.000 description 14
- 238000004891 communication Methods 0.000 description 12
- 230000009471 action Effects 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 229910052753 mercury Inorganic materials 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- -1 polytetrafluoroethylene Polymers 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
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- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 238000005485 electric heating Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of reflow soldering furnaces, and discloses a reflow soldering furnace for soldering an integrated circuit board, which comprises a reflow soldering furnace, wherein a recovery conveying device for recovering and conveying soldering flux is installed in the reflow soldering furnace, the recovery conveying device comprises a heat insulation cavity I which is fixedly installed at the bottom in a hearth of the reflow soldering furnace, openings at two ends of the heat insulation cavity I are located outside the reflow soldering furnace, a recovery pipe I with constant temperature in the range of (85-95) DEG C is installed in the heat insulation cavity I, the recovery hole I is uniformly distributed in the axial middle of the top side wall, an anti-sticking coating I is coated on the outer side wall of the heat insulation cavity I, the horizontal plane height of the axial middle of the recovery part I of the recovery pipe I is higher than that of the axial end part of the recovery pipe I, and the shape structure of the recovery part I of the recovery pipe. The invention solves the technical problem that the soldering flux in the hearth of the reflow soldering furnace is difficult to recover and convey to the outside of the hearth of the reflow soldering furnace.
Description
Technical Field
The invention relates to the technical field of reflow furnaces, in particular to a reflow furnace for soldering an integrated circuit board.
Background
A reflow oven is an apparatus for soldering an integrated circuit board carrying electronic devices by providing a heating environment to melt solder paste so that surface mounted devices and the integrated circuit board are reliably bonded together by solder paste alloy. The soldering paste used for soldering is prepared by making grease-shaped soldering flux and powdered solder into paste, coating the paste on the soldering position of each component of the integrated circuit board by printing, accurately mounting electronic components on the paste, and heating and melting by using a reflow furnace to achieve reliable soldering of the components.
The flux in the solder paste is usually a mixture with rosin as a main component, and is an auxiliary material for ensuring the smooth soldering process. The soldering flux has the main functions of clearing away oxide on the surfaces of the solder and a soldered parent metal, enabling the metal surface to reach necessary cleanliness, preventing reoxidation of the surface during soldering, reducing the surface tension of the solder and improving the soldering performance. When the solder paste is heated and melted, the soldering flux is gasified to become steam. When the vaporized flux contacts a low temperature region below 110 c in the reflow oven, liquefaction occurs. If the temperature of the low temperature region in the reflow furnace is as low as 76 ℃ or lower, the flux changes from a liquid state to a solid state, which is the temperature state characteristic of the flux.
Besides the heating module, the reflow furnace is provided with a cooling module to ensure the metallurgical property and reduce the board discharging temperature of the integrated circuit board which is finished with soldering. In air reflow soldering ovens, flux vapors are vented directly out of the oven before cooling, leaving generally no flux condensate in the cooling module. However, in the nitrogen-protected reflow soldering furnace, in order to reduce the consumption of nitrogen, the internal mixed gas is recycled, and the soldering flux vapor cannot be directly discharged out of the furnace body, so that the soldering flux vapor is completely in full contact with the cooling module in the process of circulating flow along with the nitrogen, the temperature of the soldering flux vapor is lower than 110 ℃, a condensation phenomenon occurs, the soldering flux condensate liquid can be attached to the reflow plate of the cooling module, when the liquid soldering flux is accumulated to a certain degree, liquid drops can be formed, and finally the liquid soldering flux drops, and the liquid soldering flux drops on the integrated circuit board with a high probability, so that the quality of the integrated circuit board is unqualified or even the integrated circuit board is scrapped. In particular, when the temperature is as low as 76 ℃, the flux may solidify on the reflow board of the cooling module, and the solidified flux may wrap on the surface of the reflow board of the cooling module, with the result that the reflow board of the cooling module may not properly perform its own cooling operation.
The invention provides a reflow soldering furnace for soldering an integrated circuit board, aiming at solving the technical problem that the soldering flux in the hearth of the reflow soldering furnace is difficult to recover and convey to the outside of the hearth of the reflow soldering furnace, in order to effectively recover the soldering flux in the hearth of the reflow soldering furnace and convey the recovered soldering flux to the outside of the hearth of the reflow soldering furnace.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a reflow soldering furnace for soldering an integrated circuit board, which solves the technical problem that soldering flux in a hearth of the reflow soldering furnace is difficult to recover and convey to the outside of the hearth of the reflow soldering furnace.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a reflow soldering furnace for integrated circuit board brazes, including the reflow soldering furnace, install the recovery conveyor who is used for retrieving and carries the scaling powder in the reflow soldering furnace, this recovery conveyor includes that fixed mounting is in reflow soldering furnace bottom and both ends opening are located the outside thermal-insulated chamber I of reflow soldering furnace, install constancy of temperature in (85-95) degree C within range and the lateral wall on the thermal-insulated chamber I that axial middle part equipartition has recovery hole I on the top lateral wall and scribble the recovery tube I that has anti-adhesion coating I, the horizontal plane height at the axial middle part place of recovery portion I of recovery tube I is higher than the horizontal plane height at its axial tip place, the shape structure of recovery portion I of recovery tube I and the cavity shape structure in thermal-insulated chamber I mutually support.
Preferably, the recovery pipe I is arranged in an arc shape.
Preferably, the recovery pipe I is arranged in a triangular shape.
Preferably, a heat insulation cavity II which is positioned at the top in the hearth of the reflow soldering furnace and is provided with two closed end parts is arranged right above the heat insulation cavity I, a recovery pipe II which has constant temperature within the range of (85-95) DEG C and is coated with an anti-sticking coating II on the outer side wall is arranged in the heat insulation cavity II with the recovery holes II uniformly distributed in the axial middle part on the bottom side wall, the horizontal plane height of the axial middle part of the recovery part II of the recovery pipe II is higher than the horizontal plane height of the axial end parts, and the shape structure of the recovery part II of the recovery pipe II is matched with the cavity shape structure of the heat insulation cavity II;
the left end of the axial middle part of the heat insulation cavity I and the left end part of the heat insulation cavity II are communicated with each other through a conveying pipe Ia and a conveying pipe Ib which are arranged in an arched shape and coated with an anti-sticking coating III on a convex side wall in the cavity, and the distance between the axial middle part of the conveying pipe Ia and the axial middle part of the conveying pipe Ib is larger than the distance between the axial end part of the conveying pipe Ia and the axial end part of the conveying pipe Ib;
the right end in I axial middle part in thermal-insulated chamber and the right-hand member portion in thermal-insulated chamber II realize intercommunication each other through being bow-shaped shape setting and the conveyer pipe IIa and the conveyer pipe IIb that have the coating of antiseized coating IV on the protruding lateral wall in the cavity, and the distance between the axial middle part of conveyer pipe IIa and the axial middle part of conveyer pipe IIb is greater than the distance between the axial tip of conveyer pipe IIa and the axial tip of conveyer pipe IIb.
Preferably, the recovery pipe II is arranged in an arc shape.
Preferably, the recovery pipe II is arranged in a triangular shape.
Preferably, a conveying plate is mounted on the bottom wall of the axial end part in the heat insulation cavity II, and edges of two sides of the arc-shaped convex surface at the top end of the conveying plate are respectively and smoothly connected with the convex side wall of the axial top part in one conveying pipe.
Preferably, the arc convex surface at the top end of the conveying plate is coated with an anti-sticking coating III with a radial section in an isosceles obtuse triangle shape.
(III) advantageous effects
Compared with the prior art, the invention provides a reflow oven for soldering an integrated circuit board, which has the following beneficial effects:
1, the reflow soldering furnace has the advantages that the recovery conveying device for recovering and conveying soldering flux is installed in the reflow soldering furnace, the recovery part I of the recovery pipe I with the constant temperature in the range of (85-95) DEG C can enable the soldering flux steam to be condensed into condensed liquid on the outer pipe wall of the recovery pipe I without solidification, the shape structure of the middle part of the recovery part I, which is higher than the end part, of the recovery part I of the recovery pipe I is matched with the zero initial viscosity effect of the anti-sticking coating I coated on the outer side wall of the recovery part I, so that the soldering flux condensate can be conveyed to the opening part of the end part in the heat insulation cavity I along the outer side wall of the recovery part I and is discharged out of the hearth of the reflow soldering furnace, the technical effects of effectively recovering the soldering flux steam in the hearth of the reflow soldering furnace and conveying the recovered soldering flux condensate out of the hearth of the reflow soldering furnace are achieved, and the technical problem that the soldering flux.
2. According to the reflow soldering furnace, the shape of the recovery pipe is arranged to be arched or triangular, the condensate attached to the outer pipe wall of the recovery pipe with the arched or triangular structure can be conveyed smoothly and more efficiently along the outer pipe wall of the recovery pipe under the action of gravity, and the technical effect of improving the conveying efficiency of the soldering flux condensate is achieved.
3. The reflow soldering furnace has the advantages that the temperature of the recovery pipe II is constant within the range of (85-95) DEG C, the recovery part II of the recovery pipe II with the constant temperature within the range of (85-95) DEG C can enable soldering flux steam to be condensed into condensed liquid on the outer pipe wall of the recovery pipe II without solidification, the shape structure of the middle part higher than the end part of the recovery part II of the recovery pipe II is matched with the zero initial viscosity action of the anti-sticking coating II coated on the outer side wall of the recovery part II to enable soldering flux condensate to be conveyed to the end part in the heat insulation cavity II along the outer side wall of the recovery part II, the soldering flux condensate is conveyed to the end part in the heat insulation cavity I through the arc-shaped arrangement of the conveying pipe and the zero initial viscosity action of the anti-sticking coating IV coated on the convex side wall of the conveying pipe, and then the soldering flux is discharged to the outside of the furnace chamber of the reflow soldering furnace through the end opening of the heat insulation cavity I, and further recovery of the soldering flux in The technical effect outside the hearth can obviously improve the recovery and conveying efficiency of the soldering flux.
4. This reflow oven, through install the delivery board on the diapire of the axial tip in thermal-insulated chamber II, the both sides edge of delivery board top arc convex surface is mutual smooth connection setting with the convex side wall of axial top in a delivery pipe respectively, the delivery board can show and reduce the time that the scaling powder condensate is detained on the diapire of the axial tip in thermal-insulated chamber II, make the scaling powder condensate that arrives on the axial tip diapire in thermal-insulated chamber II can not make the dwell promptly be carried in the delivery pipe, the technological effect of the transport efficiency of further improvement scaling powder has been realized.
5. This reflow soldering stove, through coating on the arc convex surface on delivery board top radially the cross-section be the anti-adhesion coating III that isosceles obtuse triangle-shaped shape set up, anti-adhesion coating III's isosceles obtuse triangle-shaped shape structure sets up and mutually supports rather than the zero initial viscous interaction of self, can show to reduce the dwell time of scaling powder condensate on the delivery board, has realized the technological effect that further improves the conveying efficiency of scaling powder.
Drawings
FIG. 1 is a top view of a reflow oven for soldering an integrated circuit board in accordance with the present invention;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is a cross-sectional view taken along line B1-B1 of FIG. 1;
FIG. 4 is a cross-sectional view taken along line B2-B2 of FIG. 1;
FIG. 5 is a schematic structural view of the recovery conveying device of the present invention;
fig. 6 is a circuit diagram of a heater i and a heater ii according to the present invention.
The following are marked in the figure: 1-reflow oven, 101-fixing sleeve I, 102-fixing sleeve II;
2-heat insulation cavity I, 201-fixing shaft I, 202-fixing shaft II, 203-recovery hole I, 204-recovery pipe I, 205-cover body Ia, 206-cover body Ib, 207-heater I, 208-anti-sticking coating I;
3-heat insulation cavity II, 301-recovery hole II, 302-recovery tube II, 303-cover IIa, 304-cover IIb, 305-temperature control tube, 306-mercury, 307-temperature control zone, 308-lead I, 309-lead II, 310-heater II, 311-anti-sticking coating II, 312-conveying plate I, 313-anti-sticking coating IIIa, 314-conveying plate II, 315-anti-sticking coating IIIb;
4-conveying pipe Ia, 401-anti-sticking coating IVa, 5-conveying pipe Ib, 501-anti-sticking coating IVb, 6-conveying pipe IIa, 7-conveying pipe IIb, 8-power supply I, 9-temperature controller, 10-electromagnet, 11-armature, 12-reset spring, 13-contact switch, 14-power switch and 15-power supply II.
Detailed Description
A reflow soldering furnace for soldering an integrated circuit board is disclosed, referring to figure 1, and comprises a reflow soldering furnace 1, as shown in figure 2, a fixing sleeve I101 and a fixing sleeve II 102 which are symmetrically arranged with each other and have a cavity inside and an opening at the top end are uniformly distributed on the axial middle part of the bottom wall of a hearth of the reflow soldering furnace 1, the bottom end face of the fixing sleeve I101 and the bottom end face of the fixing sleeve II 102 are fixedly connected with the axial middle part of the bottom wall of the hearth of the reflow soldering furnace 1 respectively, a fixing shaft I201 and a fixing shaft II 202 of a recovery conveying device for recovering and conveying soldering flux are respectively arranged in the cavities of the fixing sleeve I101 and the fixing sleeve II 102, and the outer side wall of the fixing shaft I201 and the outer side wall of the fixing shaft II 202 are respectively connected with the inner side wall;
as shown in fig. 5, the recycling and conveying device comprises a heat insulation cavity i 2, wherein the radial section of the heat insulation cavity i 2 is arranged in a concentric circular ring shape, the axial section of the heat insulation cavity i 2 is arranged in a fan-ring shape, and the left end and the right end of the heat insulation cavity i 2 are provided with openings, and two sides of the axial center of the outer bottom wall of the cavity of the heat insulation cavity i 2 positioned at the bottom of the reflow oven 1 are respectively fixedly connected with the top end surface of a fixed shaft i 201; the left end opening and the right end opening of the heat insulation cavity I2 respectively penetrate through the left end and the right end of the reflow oven 1 and extend to the outside of the reflow oven 1;
the center of a circle of four arcs on an axial section of a heat insulation cavity I2 is arranged under the heat insulation cavity I2, a recovery hole Ia 203 with a circular radial section is uniformly formed in the axial middle of the top side wall of the heat insulation cavity I2, a recovery pipe I204 composed of a left communication part I, a recovery part I and a right communication part I which are integrally formed and sequentially connected with one another is arranged under the recovery hole Ia 203, openings are formed in two ends of the recovery pipe I204, a cavity is formed in the recovery pipe I, the left end opening and the right end opening of the recovery part I are respectively communicated with the right end opening of the left communication part I and the left end opening of the right communication part I, and a cover body I a205 and a cover body I b206 are respectively arranged on the top end opening of the left communication part I and the top end opening of the right communication part I;
the radial cross sections of the recycling parts I positioned in the axial middle part and the radial middle part of the cavity of the heat insulation cavity I2 are arranged in a concentric ring shape, the axial cross section is arranged in a fan-ring shape, and the circle centers of four circular arcs on the axial cross section of the recycling part I are all arranged right below the recycling part I; the top end opening of the left communicating part I and the top end opening of the right communicating part I respectively penetrate through the top side wall of the axial left end part and the top side wall of the axial right end part of the heat insulation cavity I2, respectively extend to the outside of the heat insulation cavity I2, and are respectively detachably connected with the cover body Ia 205 and the cover body Ib 206;
a liquid water body with the constant temperature within the range of (85-95) DEG C is stored in the cavity of the recovery pipe I204, a heater I207 matched with the cavity shapes of the recovery part I and the right communicating part I is inserted in the liquid water body, as shown in figure 3, the heater I207 comprises a metal pipe, an electric heating wire with two ends respectively connected with a power line is installed in the metal pipe, the electric heating wire and the inner wall of the metal pipe are packaged through an insulating material, the electric heating wire is not contacted with the inner wall of the metal pipe, and the power line access end of the heater I207 is arranged right above the cover body I b 206;
an anti-sticking coating I208 made of polytetrafluoroethylene and modified substances thereof is coated on the outer side wall of the recovery part I of the recovery pipe I204;
the recovery part I of the recovery pipe I204 with the constant temperature of (85-95) DEG C can condense soldering flux steam into condensed liquid on the outer pipe wall of the recovery pipe I204 without solidification, the shape and the structure of the middle part of the recovery pipe I204 higher than the end part are matched with the zero initial viscosity action of the anti-sticking coating I208 coated on the outer side wall of the recovery pipe I204, so that the soldering flux condensate can be conveyed to the end part opening in the heat insulation cavity I2 along the outer side wall of the recovery pipe I204 and discharged out of the hearth of the reflow soldering furnace 1, and the technical effects of effectively recovering the soldering flux steam in the hearth of the reflow soldering furnace 1 and conveying the recovered soldering flux condensate out of the hearth of the reflow soldering furnace 1 are achieved;
a heat insulation cavity II 3 which is arranged in a concentric ring shape in a radial section, in a fan ring shape in an axial section, in a closed manner at the left end and the right end and is positioned at the top of the cavity of the reflow oven 1 is arranged right above the heat insulation cavity I2, and the centers of four arcs on the axial section of the heat insulation cavity II 3 are all arranged right below the heat insulation cavity II 3;
a recovery hole II 301 with a circular radial cross section is uniformly distributed in the axial middle part on the bottom side wall of the heat insulation cavity II 3, a recovery pipe II 302 consisting of a left communication part II, a recovery part II and a right communication part II which are integrally formed and sequentially connected is arranged right above the recovery hole II 301, two ends of the recovery pipe II 302 are provided with openings, cavities are arranged in the recovery pipe II, the left end opening and the right end opening of the recovery part II are respectively communicated with the right end opening of the left communication part II and the left end opening of the right communication part II, and a cover body IIa 303 and a cover body IIb 304 are respectively arranged on the top end opening of the left communication part II and the top end opening of the right communication part II;
the radial cross sections of the recovery parts II positioned in the axial middle part and the radial middle part in the cavity of the heat insulation cavity II 3 are arranged in a concentric ring shape, the axial cross section is arranged in a fan ring shape, and the circle centers of four circular arcs on the axial cross section of the recovery part II are all arranged right below the recovery part II; the top end opening of the left communicating part II sequentially penetrates through the axial left end part of the heat insulation cavity II 3 and the axial left end part of the reflow oven 1, extends to the upper part of the reflow oven 1 and is detachably connected with the cover body IIa 303; an opening at the top end of the right communicating part II sequentially penetrates through the shaft right end part of the heat insulation cavity II 3 and the shaft right end part of the reflow oven 1, extends to the upper part of the reflow oven 1 and is detachably connected with the cover body IIb 304;
a liquid water body with the constant temperature of (85-95) DEG C is stored in the cavity of the recovery pipe II 302, a heater II 310 matched with the cavity of the recovery part II and the cavity of the right communicating part II in shape is inserted in the liquid water body, the structure and the installation mode of the heater II 310 are similar to those of the heater I207, and the power line access end of the heater II 310 is arranged right above the cover body IIb 304;
the temperature of the unit volume water body of the liquid water body in the recovery pipe II 302 is basically consistent with that of the unit volume water body of the liquid water body in the recovery pipe I204;
a temperature control tube 305 which is positioned in the cavity of the left communicating part II and is arranged in the vertical direction is inserted in the liquid water body of the recovery tube II 302, a temperature control area 307 which is used for measuring the temperature and has a temperature range of (85-95) DEG C is recorded on the side wall of the axial upper part of the temperature control tube 305, and liquid mercury 306 is stored in the axial lower part in the cavity of the temperature control area; a lead I308 and a lead II 309 are arranged right above the outside of the cavity of the temperature control tube 305, the current output end of the lead I308 sequentially penetrates through the top ends of the cover IIa 303 and the temperature control tube 305 and extends into the cavity of the temperature control tube 305 and is flush with the axial middle part of the temperature control area 307, and the current input end of the lead II 309 sequentially penetrates through the top ends of the cover IIa 303 and the temperature control tube 305 and extends into the cavity of the temperature control tube 305 and is always communicated with the liquid mercury 306;
as shown in fig. 6, the current input end of the wire i 308 is communicated with the positive electrode of the power supply i 8, the current output end of the wire ii 309 is communicated with the current input end of the conductive winding of the electromagnet 10 in the temperature controller 9, and the current output end of the conductive winding of the electromagnet 10 is communicated with the negative electrode of the power supply i 8; an armature 11 positioned in the temperature controller 9 is installed on the right side of the left end face of the electromagnet 10, the central part on the left side face of the armature 11 faces the left end face of the electromagnet 10, the current input end of the armature 11 is communicated with the anode of a power supply II 15, a return spring 12 is fixedly installed on the central part on the right side face of the armature 11, the central shaft of the return spring 12 and the central shaft of the electromagnet 10 are arranged on the same straight line, and two ends of the return spring 12 are fixedly connected with the central part on the right side face of the armature 11 and the inner wall of the temperature controller 9 respectively; a contact switch 13 positioned in the temperature controller 9 is arranged below the reset spring 12, the top on the left side surface of the contact switch 13 faces the bottom on the right side surface of the armature 11, the current output end of the contact switch 13 is mutually communicated with the negative electrode of the power supply II 15, and a power supply switch 14, a heater I207 and a heater II 310 are connected in series between the current output end of the contact switch 13 and the negative electrode of the power supply II 15;
an anti-sticking coating II 311 made of polytetrafluoroethylene and modified substances thereof is coated on the outer side wall of the recovery part II of the recovery pipe II 302;
the inlet end part in the reflow soldering furnace 1 is provided with a conveying pipe Ia 4 and a conveying pipe Ib 5 which are symmetrically arranged with each other, the radial sections of which are arranged in a concentric circular shape, the axial sections of which are arranged in a fan-ring shape, and the top and the bottom of which are provided with openings, the centers of four arcs on the axial section of the conveying pipe Ia 4 are all arranged on the central shaft of the reflow soldering furnace 1, and the centers of four arcs on the axial section of the conveying pipe Ib 5 are all arranged on the central shaft of the reflow soldering furnace 1; the top opening and the bottom opening of the conveying pipe Ia 4 are communicated with the front side wall opening at the left end of the axial middle part of the heat insulation cavity I2 and the front side wall opening at the axial left end part of the heat insulation cavity II 3 respectively, and the top opening and the bottom opening of the conveying pipe Ib 5 are communicated with the rear side wall opening at the left end of the axial middle part of the heat insulation cavity I2 and the rear side wall opening at the axial left end part of the heat insulation cavity II 3 respectively;
an anti-sticking coating IVa 401 made of polytetrafluoroethylene and modified substances thereof is coated on the convex side wall in the cavity of the delivery pipe Ia 4; an anti-sticking coating IV b501 made of polytetrafluoroethylene and a modified substance thereof is coated on the convex side wall in the cavity of the delivery pipe Ib 5;
the outlet end part in the reflow oven 1 is provided with a conveying pipe IIa 6 and a conveying pipe IIb 7 which are symmetrically arranged with the radial section in a concentric ring shape, the axial section in a fan ring shape and the top and the bottom of which are provided with openings, the centers of the four arcs on the axial section of the conveying pipe IIa 6 are all arranged on the central shaft of the reflow oven 1, and the centers of the four arcs on the axial section of the conveying pipe IIb 7 are all arranged on the central shaft of the reflow oven 1; the top opening and the bottom opening of the conveying pipe IIa 6 are communicated with a front side wall opening at the right end of the axial middle part of the heat insulation cavity I2 and a front side wall opening at the right end part of the shaft of the heat insulation cavity II 3 respectively, and the top opening and the bottom opening of the conveying pipe IIb 7 are communicated with a rear side wall opening at the right end of the axial middle part of the heat insulation cavity I2 and a rear side wall opening at the right end part of the shaft of the heat insulation cavity II 3 respectively;
an anti-sticking coating Va made of polytetrafluoroethylene and modified substances thereof is coated on the convex side wall in the cavity of the conveying pipe IIa 6; an anti-sticking coating vb made of polytetrafluoroethylene and modified substances thereof is coated on the convex side wall in the cavity of the delivery pipe IIb 7;
wherein, the recovery part II of the recovery pipe II 302 with the constant temperature in the range of (85-95) DEG C can condense the soldering flux steam into condensed liquid on the outer pipe wall without solidification, the shape and the structure of the middle part of the recovery part II of the recovery pipe II 302 higher than the end part are matched with the zero initial viscosity action of the anti-sticking coating II 311 coated on the outer side wall of the recovery part II to convey the soldering flux condensate to the end part in the heat insulation cavity II 3 along the outer side wall of the recovery part II of the recovery pipe II 302, the soldering flux condensate is conveyed to the end part in the heat insulation cavity I2 through the arch shape arrangement of the conveying pipe Ia 4, the conveying pipe Ib 5, the conveying pipe IIa 6 and the conveying pipe IIb 7 and the zero initial viscosity action of the anti-sticking coating IVa 401, the anti-sticking coating IVb 501, the anti-sticking coating Va and the anti-sticking coating vb coated on the convex side wall of the conveying pipe IIa, and the soldering flux is discharged out of the hearth of the reflow soldering, the technical effects of further recovering the soldering flux in the hearth of the reflow soldering furnace 1 and conveying the recovered soldering flux to the outside of the hearth of the reflow soldering furnace 1 are achieved, and meanwhile, the recovery and conveying efficiency of the soldering flux is remarkably improved;
as shown in fig. 4, a conveying plate i 312 is mounted on the bottom wall of the left end portion of the shaft in the heat insulation cavity ii 3, a radial section of the conveying plate i 312 is formed by mutually connecting the left end and the right end of a top end circular arc with the left end and the right end of a bottom end circular arc respectively, the circle center of the top end circular arc on the radial section of the conveying plate i 312 is arranged right below the radial section of the conveying plate i 312, the circle center of the bottom end circular arc on the radial section of the conveying plate i 312 is arranged right above the radial section of the conveying plate i 312, and the radial section area of the conveying plate i 312 is gradually reduced from the left end to the right end; the axial section of the conveying plate I312 is in a right-angled triangle shape, and the hypotenuse of the right-angled triangle is an arc with the center of the circle below the axial section of the conveying plate I312; the arc-shaped convex surface at the bottom end of the conveying plate I312 is fixedly connected with the bottom wall of the left end part in the heat insulation cavity II 3, and the edges of the front side and the rear side of the arc-shaped convex surface at the top end of the conveying plate I312 are respectively and smoothly connected with the convex side wall of the axial top in the conveying pipe Ia 4 and the convex side wall of the axial top in the conveying pipe Ib 5;
the conveying plate I312 can remarkably reduce the time that the soldering flux condensate stays on the bottom wall of the axial end part in the heat insulation cavity II 3, so that the soldering flux condensate reaching the bottom wall of the axial end part in the heat insulation cavity II 3 can be conveyed into the conveying pipe I a4 and the conveying pipe I b5 without staying, and the technical effect of further improving the conveying efficiency of the soldering flux is achieved;
an anti-sticking coating IIIa 313 with a radial section in an isosceles obtuse triangle shape is coated on an arc convex surface at the top end of the conveying plate I312;
a conveying plate II 314 which is symmetrically arranged with the conveying plate I312 is arranged on the bottom wall of the right end part of the shaft in the heat insulation cavity II 3, and the structure and the installation mode of the conveying plate II 314 are the same as those of the conveying plate I312; an anti-sticking coating IIIb 315 which is symmetrical to the anti-sticking coating IIIa 313 is coated on the arc convex surface at the top end of the conveying plate II 314;
the isosceles obtuse triangle structures of the anti-sticking coatings IIIa 313 and IIIb 315 are matched with zero initial viscosity of the anti-sticking coatings, so that the staying time of the soldering flux condensate on the conveying boards I312 and II 314 can be remarkably reduced, and the technical effect of further improving the conveying efficiency of the soldering flux is realized.
When the device works, the power switch 14 is firstly closed, at the moment, the temperature control tube 305 measures that the temperature of the liquid water body in the recovery tube II 302 is lower than (85-95) DEG C, the top liquid level of mercury 306 cannot reach the temperature control area 307 by thermal expansion to be conducted with the lead I308, the lead I308 cannot be conducted with the lead II 309 by the mercury 306, the conductive winding of the electromagnet 10 in the temperature controller 9 is in a power-off state, the electromagnet 10 loses magnetism, the armature 11 moves to the left side under the action of the restoring elastic force of the return spring 12 to be communicated with the contact switch 13, the heater I207 and the heater II 310 are in a power-on state, and the heater I207 and the heater II 310 respectively heat the liquid water body in the recovery tube I204 and the recovery tube II 302;
when the temperature control pipe 305 measures that the temperature of the liquid water in the recovery pipe II 302 is within the range of (85-95) DEG C, the top liquid level of mercury 306 can be heated and expanded to reach the temperature control area 307 to be conducted with the lead I308, the lead I308 can be conducted with the lead II 309 through the mercury 306, the conductive winding of the electromagnet 10 in the temperature controller 9 is in a power-on state, the right end of the electromagnet 10 generates an N pole, the magnetic field acting force of the electromagnet 10 on the armature 11 is greater than the restoring elastic force acting force of the return spring 12 on the armature 11, the armature 11 moves towards the right side under the magnetic field acting force of the electromagnet 10 to be disconnected with the contact switch 13, the heater I207 and the heater II 310 are in a power-off state, and the heater I207 and the heater II 310 stop heating the liquid water in the recovery pipe I204 and the recovery pipe II;
the temperature controller 9 controls the heating circuits of the heater I207 and the heater II 310 through the control circuit in the temperature control pipe 305, so that the temperature of the liquid water in the recovery pipe I204 and the recovery pipe II 302 can be kept constant within the range of (85-95) DEG C, the liquid water with the constant temperature within the range of (85-95) DEG C can conduct heat to the pipe wall of the recovery pipe I204 and the pipe wall of the recovery pipe II 302, and the temperature of the pipe wall of the recovery pipe I204 and the pipe wall of the recovery pipe II 302 is also basically kept constant within the range of (85-95) DEG C;
in the process that the integrated circuit board is positioned in a hearth of a reflow soldering furnace 1 for brazing, soldering flux in soldering paste can be gasified to become soldering flux steam, in the process that the soldering flux steam flows along with nitrogen in the hearth of the reflow soldering furnace 1 in a circulating manner, the soldering flux steam can diffuse to a heat insulation cavity I2 and a heat insulation cavity II 3, the temperature of the heat insulation cavity I2 and the temperature of the heat insulation cavity II 3 are lower than that of the hearth of the reflow soldering furnace 1, and meanwhile, the soldering flux steam can enter cavities of the heat insulation cavity I2 and the heat insulation cavity II 3 respectively through a recycling hole I203 and;
the scaling powder steam entering the cavity of the heat insulation cavity I2 is in full contact with the outer side of the pipe wall I of the recovery part I of the recovery pipe I204, the pipe wall I of the recovery part I of the recovery pipe I204 with the temperature basically constant within the range of (85-95) DEG C enables the scaling powder steam to be condensed, the condensate of the scaling powder steam is attached to the anti-sticking coating I208 on the outer side of the pipe wall I of the recovery part I of the recovery pipe I204, the zero initial viscosity effect of the anti-sticking coating I208 and the bow-shaped arrangement of the pipe wall I of the recovery part I of the recovery pipe I204 are matched with each other to convey the scaling powder condensate to two end parts in the heat insulation cavity I2, and the scaling powder condensate is discharged out of the hearth;
the scaling powder steam entering the cavity of the heat insulation cavity II 3 is fully contacted with the outer side of the pipe wall of the recovery part II of the recovery pipe II 302, the pipe wall of the recovery part II of the recovery pipe II 302 with the temperature basically constant within the range of (85-95) DEG C enables the scaling powder steam to be condensed, the condensate of the scaling powder steam is attached to the anti-sticking coating II 311 on the outer side of the pipe wall of the recovery part II of the recovery pipe II 302, the zero initial viscosity effect of the anti-sticking coating II 311 and the bow-shaped arrangement of the pipe wall of the recovery part II of the recovery pipe II 302 are matched with each other to convey the scaling powder condensate to the left end part and;
the conveying plate I312 and the anti-sticking coating IIIa 313 convey the soldering flux condensate reaching the axial left end part of the heat insulation cavity II 3 into a conveying pipe Ia 4 and a conveying pipe Ib 5, the arc-shaped shapes of the conveying pipe Ia 4 and the conveying pipe Ib 5 are respectively matched with the zero initial viscosity action of the anti-sticking coating IVa 401 and the anti-sticking coating IVb 501 to convey the soldering flux condensate to the left end part in the heat insulation cavity I2, and the soldering flux condensate is discharged out of the hearth of the reflow soldering furnace 1 through the left end opening of the heat insulation cavity I2;
the conveying plate II 314 and the anti-sticking coating IIIb 315 convey the soldering flux condensate reaching the right end of the shaft of the heat insulation cavity II 3 into the conveying pipe IIa 6 and the conveying pipe IIb 7, and the arc-shaped arrangement of the conveying pipe IIa 6 and the conveying pipe IIb 7 is matched with the zero initial viscosity action of the anti-sticking coating Va and the anti-sticking coating vb respectively to convey the soldering flux condensate to the right end in the heat insulation cavity I2 and discharge the soldering flux condensate out of the hearth of the reflow soldering furnace 1 through the right end opening of the heat insulation cavity I2.
In addition, the shape structure of the recovery pipe I204 and the recovery pipe II 302 can also adopt an arch shape, a triangle shape and other shape structures in the prior art, wherein the height of the horizontal plane of the axial middle part is higher than that of the horizontal plane of the axial end part;
the condensate liquid attached to the outer walls of the first recovery pipe 204 and the second recovery pipe 302 in the arched or triangular structures can be conveyed smoothly and efficiently along the outer walls of the first recovery pipe 204 and the second recovery pipe 302 under the action of gravity, and the technical effect of improving the conveying efficiency of the flux condensate liquid is achieved.
Claims (7)
1. A reflow oven for soldering an integrated circuit board, comprising a reflow oven (1), characterized in that: the flux recycling and conveying device is characterized in that a recycling and conveying device for recycling and conveying soldering flux is installed in the reflow soldering furnace (1), the recycling and conveying device comprises a heat insulation cavity I (2) which is fixedly installed at the bottom in a hearth of the reflow soldering furnace (1), openings at two ends of the heat insulation cavity I (2) are located outside the reflow soldering furnace (1), a recycling pipe I (204) which is constant in temperature (85-95) DEG C and coated with an anti-sticking coating I (208) on the outer side wall is installed in the heat insulation cavity I (2) of which the axial middle part is uniformly provided with a recycling hole I (203), the horizontal plane height of the axial middle part of the recycling part I of the recycling pipe I (204) is higher than that of the axial end part of the recycling pipe I, and the shape structure of the recycling part I of the recycling pipe I (204) is matched with the cavity;
a heat insulation cavity II (3) which is positioned at the top in a hearth of the reflow soldering furnace (1) and is provided with two closed end parts is arranged right above the heat insulation cavity I (2), a recovery pipe II (302) which has a constant temperature in the range of (85-95) DEG C and is coated with an anti-sticking coating II (311) on the outer side wall is arranged in the heat insulation cavity II (3) with recovery holes II (301) uniformly distributed in the axial middle part on the bottom side wall, the horizontal plane height of the axial middle part of the recovery part II of the recovery pipe II (302) is higher than that of the axial end part of the recovery pipe II, and the shape structure of the recovery part II of the recovery pipe II (302) is matched with the cavity shape structure of the heat insulation cavity II (3);
the left end of the axial middle part of the heat insulation cavity I (2) and the left end part of the heat insulation cavity II (3) are communicated with each other through a conveying pipe Ia (4) and a conveying pipe Ib (5) which are arranged in an arched shape and coated with an anti-sticking coating III on a convex side wall in the cavity, and the distance between the axial middle part of the conveying pipe Ia (4) and the axial middle part of the conveying pipe Ib (5) is larger than the distance between the axial end part of the conveying pipe Ia (4) and the axial end part of the conveying pipe Ib (5);
the right-hand member in thermal-insulated chamber I (2) axial middle part and the right-hand member portion in thermal-insulated chamber II (3) realize intercommunication each other through being bow-shaped shape setting and on the protruding lateral wall in the cavity conveyer pipe IIa (6) and conveyer pipe IIb (7) that coat with anti-sticking coating IV, and the distance between the axial middle part of conveyer pipe IIa (6) and the axial middle part of conveyer pipe IIb (7) is greater than the distance between the axial tip of conveyer pipe IIa (6) and the axial tip of conveyer pipe IIb (7).
2. The reflow oven of claim 1, wherein: the recovery pipe I (204) is arranged in an arc shape.
3. The reflow oven of claim 1, wherein: the recovery pipe I (204) is arranged in a triangular shape.
4. The reflow oven of claim 1, wherein: the recovery pipe II (302) is arranged in an arc shape.
5. The reflow oven of claim 1, wherein: the recovery pipe II (302) is arranged in a triangular shape.
6. The reflow oven of claim 1, wherein: a conveying plate I (312) and a conveying plate II (314) are mounted on the bottom wall of the axial end part in the heat insulation cavity II (3), and the edges of two sides of the arc-shaped convex surface at the top end of the conveying plate I (312) are respectively and smoothly connected with the convex side wall of the axial top part in the conveying pipe Ia (4) and the convex side wall of the axial top part in the conveying pipe Ib (5); two side edges of the arc convex surface at the top end of the conveying plate II (314) are respectively and smoothly connected with the convex side wall at the inner axial top of the conveying pipe II a (6) and the convex side wall at the inner axial top of the conveying pipe II b (7).
7. The reflow oven of claim 6, wherein: and an anti-sticking coating III with a radial section in an isosceles obtuse triangle shape is coated on the arc convex surface at the top end of the conveying plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811323135.6A CN109332839B (en) | 2018-11-08 | 2018-11-08 | Reflow furnace for soldering integrated circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811323135.6A CN109332839B (en) | 2018-11-08 | 2018-11-08 | Reflow furnace for soldering integrated circuit board |
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| CN109332839A CN109332839A (en) | 2019-02-15 |
| CN109332839B true CN109332839B (en) | 2020-11-24 |
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| WO1997026107A1 (en) * | 1996-01-18 | 1997-07-24 | Btu International, Inc. | Solder reflow convection furnace employing flux handling and gas densification systems |
| CN201171922Y (en) * | 2008-02-03 | 2008-12-31 | 日东电子科技(深圳)有限公司 | Welding flux recovery device |
| CN201279647Y (en) * | 2008-09-10 | 2009-07-29 | 熊猫电子集团有限公司 | Soldering fluid cooling and recovering device |
| JP2010118387A (en) * | 2008-11-11 | 2010-05-27 | Tamura Seisakusho Co Ltd | Cooler for reflowed substrate |
| CN207615838U (en) * | 2017-12-26 | 2018-07-17 | 吉安市华荣电子材料科技有限公司 | A kind of scaling powder anti-drip structure |
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- 2018-11-08 CN CN201811323135.6A patent/CN109332839B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997026107A1 (en) * | 1996-01-18 | 1997-07-24 | Btu International, Inc. | Solder reflow convection furnace employing flux handling and gas densification systems |
| CN201171922Y (en) * | 2008-02-03 | 2008-12-31 | 日东电子科技(深圳)有限公司 | Welding flux recovery device |
| CN201279647Y (en) * | 2008-09-10 | 2009-07-29 | 熊猫电子集团有限公司 | Soldering fluid cooling and recovering device |
| JP2010118387A (en) * | 2008-11-11 | 2010-05-27 | Tamura Seisakusho Co Ltd | Cooler for reflowed substrate |
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Application publication date: 20190215 Assignee: Hangzhou sosi Interconnection Technology Co.,Ltd. Assignor: Hangzhou Jirui industry and Trade Co.,Ltd. Contract record no.: X2021330000604 Denomination of invention: Reflow soldering furnace for brazing integrated circuit board Granted publication date: 20201124 License type: Common License Record date: 20211027 |
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Application publication date: 20190215 Assignee: Hangzhou Enhui security products Co.,Ltd. Assignor: Hangzhou Jirui industry and Trade Co.,Ltd. Contract record no.: X2022330000392 Denomination of invention: A reflow oven for soldering integrated circuit boards Granted publication date: 20201124 License type: Common License Record date: 20220810 |
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