CN104772545A - Welding head chip made of copper-iron alloy and molding method thereof - Google Patents
Welding head chip made of copper-iron alloy and molding method thereof Download PDFInfo
- Publication number
- CN104772545A CN104772545A CN201510150671.0A CN201510150671A CN104772545A CN 104772545 A CN104772545 A CN 104772545A CN 201510150671 A CN201510150671 A CN 201510150671A CN 104772545 A CN104772545 A CN 104772545A
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- China
- Prior art keywords
- copper
- solder horn
- iron
- iron alloy
- melting portion
- Prior art date
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- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 229910000640 Fe alloy Inorganic materials 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000003466 welding Methods 0.000 title abstract description 24
- 238000000465 moulding Methods 0.000 title abstract 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 80
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 59
- 229910052802 copper Inorganic materials 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 55
- 229910052742 iron Inorganic materials 0.000 claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 claims description 114
- 238000002844 melting Methods 0.000 claims description 65
- 230000008018 melting Effects 0.000 claims description 65
- 229910052718 tin Inorganic materials 0.000 claims description 35
- 238000003723 Smelting Methods 0.000 claims description 27
- 239000007788 liquid Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 13
- 229910052719 titanium Inorganic materials 0.000 claims description 13
- 239000010936 titanium Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 241000644035 Clava Species 0.000 claims description 3
- 238000000137 annealing Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 13
- 238000005476 soldering Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract 3
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- -1 and therefore Chemical compound 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/025—Bits or tips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a welding head chip made of copper-iron alloy and a molding method thereof. The welding head chip comprises a heat conductor without through holes, the heat conductor is made of copper-iron alloy, the purity of the copper-iron alloy is very high, copper particles and iron particles in the copper-iron alloy are uniformly distributed, when the welding head chip is installed in soldering iron, the heat conductor is directly contacted with soldering tin, iron atoms are distributed among copper atoms in the copper-iron alloy, space where tin atoms can enter does not exist, and the copper corrosion phenomenon in the welding process can be prevented.
Description
Technical field
The present invention relates to field of welding devices technology, refer in particular to a kind of adopt copper-iron alloy to make solder horn chip and forming method.
Background technology
In recent years, along with the development of electronic equipment, develop various for welding flatirons such as printed circuit board wirings.For preventing this solder horn chip owing to using the problem of oxidation for a long time, adopt kinds of schemes.(for example, referring to patent document 1)
Patent document 1[Japan Patent Te Open No. 2010-167461 public Reported], disclosed solder horn chip is used for flatiron body top, see Figure 16 (Figure 16 is solder horn chip top ends sectional drawing in the past), the Pb-free solder solder horn chip that the heating part being arranged on heater uses, inside has handling heating part can insert tubular trunk freely, and be arranged on the heat carrier of trunk tip, heat carrier as nib towards top, its external diameter can reduce, and the flat knife-like of the flat formation of tip portion, simultaneously in the flat width central authorities of the first end of heat carrier, near to or in contact with around scolding tin more than 2 directions, the Pb-free solder scolding tin solder horn chip forming otch is disclosed use.
But, invention described in patent document 1 is, as shown in figure 16 for heat carrier 220, in the full plated surface iron layer 221 of oxygen-free copper solder horn chip, at plating iron layer 221 surperficial first end tin coating 223, beyond tin coating 223, carry out chromium coating 222 in field again.
But along with service time is of a specified duration, tin coating 223, chromium coating 222 is once disappear, and plating iron 221 is with regard to exposing surface.Plating iron 221 easily produces reaction with the tin with solder compositions, and melts gradually in scolding tin and finally can reveal copper.The copper in melting portion touches the scolding tin of fusing in welding process, and copper spreads in the scolding tin of fusing, produces the phenomenon being claimed " food copper ".As carried out pb-free solder, with fast 3 times of the SnPb63 phase specific loss copper speed in past.
Therefore, use flatiron to weld at miniature motor lead-in wire, or carry out the factory of electronic component welding at printed base plate, within about 3 days, solder horn chip must be changed, also spend a lot of solder horn chip cost.
Summary of the invention
In view of this, the present invention is directed to the disappearance of prior art existence, its main purpose be to provide a kind of can prevent the employing copper-iron alloy eating copper phenomenon from making in welding process solder horn chip and forming method.
For achieving the above object, the present invention adopts following technical scheme:
A forming method for solder horn chip, comprises the following steps
(1) melt: the copper of the ratio of weight portion within the scope of 3:7 ~ 7:3 is joined smelting furnace together with iron, nitrogen is passed into as inert gas in smelting furnace, start the power supply of smelting furnace, by furnace heats to 1535 ~ 1550 DEG C, make copper and iron melt for motlten metal liquid;
(2) mix: the temperature in smelting furnace is increased to 1680 ~ 1700 DEG C, copper molten iron to molten condition drops into Titanium and phosphorized copper, make together with Titanium is dissolved in copper, iron, start agitator, to motlten metal liquid uniform stirring in smelting furnace, start supersonic generator, apply vibration of ultrasonic wave to motlten metal liquid, make the copper molten iron Homogeneous phase mixing of molten condition;
(3) come out of the stove: smelting furnace is extinguished, and opens the vacuum valve of smelting furnace, utilize vacuum force, the copper-iron alloy liquid of fusing is cast onto in copper mold, pass through lance ejection activated carbon powder on copper mold surface fast, make copper-iron alloy molten liquid surface cover activated carbon powder;
(4) shaping copper-iron alloy ingot: copper mold is placed in flowing cool water, realizes quick cooled and solidified and obtains copper-iron alloy ingot; In the moment of lower water, high temperature copper mold chance water produces a large amount of steam makes copper-iron alloy surface produce oxidation, and activated carbon powder realizes reducing:
Fe
3O
4+C=3FeO+CO
FeO+C=Fe+CO
2CuO + C = 2Cu+CO
2
Thus obtain the very high copper-iron alloy of purity;
(5) process: the machine-shaping of copper-iron alloy ingot is gone out the heat carrier without through hole;
(6) electroplate: zinc-plated at the tip in the melting portion of heat carrier, the face chromium plating beyond melting portion tip.
As a kind of preferred version, in step (2), in smelting furnace shared by Titanium, the proportion of motlten metal liquid is 0.05 ~ 0.09%, and the proportion that phosphorized copper accounts for motlten metal liquid in smelting furnace is 0.05% ~ 0.07%.
As a kind of preferred version, in the process of step (5), first the copper-iron alloy ingot obtained is forged, cut into square clava, then be rolled into pole, then this pole is processed into cold top-stitching, then under non-acidizing environment, carry out annealing in process, in vacuum environment, prevent acidifying, at the temperature of 400 ~ 500 DEG C, leave standstill 30 minutes.
A kind of solder horn chip adopting copper-iron alloy to make, adopt the forming method of above-mentioned solder horn chip to make, this solder horn chip is provided with the heat carrier without through hole, this heat carrier has the melting portion for melting scolding tin of the cylindrical base for being contained in cylindric flatiron heating part and the formation that stretches from bottom along central shaft, the tip in described melting portion has tin coating, and the face beyond the tip tin coating in described melting portion is chromium coating.
As a kind of preferred version, described melting portion is formed coniform from bottom along central shaft stretching.
As a kind of preferred version, the tip in described melting portion is scarf to central shaft.
As a kind of preferred version, the scarf central authorities of the tip in described melting portion form recess.
As a kind of preferred version, described melting portion is formed cylindric from bottom along central shaft and is cut to inclined-plane.
As a kind of preferred version, described melting portion is formed coniform bottom this along central shaft, and the tip melting portion forms slotted point screwdriver shape.
As a kind of preferred version, described melting portion forms double-layer circular taper along central shaft bottom this.
As a kind of preferred version, described melting portion is extended for coniform along central shaft from bottom, and the portion tip of melting has bending.
As a kind of preferred version, described melting portion forms cutting knife shape from bottom along central shaft.
As a kind of preferred version, there is the bottomless box-shaped of lid in described melting portion, and the cap in this melting portion is fixed on bottom tip.
As a kind of preferred version, described melting portion is " コ " word section configuration, and the convex side in this melting portion is fixed on bottom tip.
As a kind of preferred version, described melting portion stretches from bottom along central shaft to form spade shape.
The present invention compared with prior art has obvious advantage and beneficial effect, specifically, as shown from the above technical solution, because the heat carrier material of solder horn of the present invention is formed by copper-iron alloy, the copper-iron alloy purity adopting method of the present invention to make is very high, and copper particle in copper-iron alloy and iron particle are evenly distributed, even if heat carrier directly contacts with scolding tin, iron atom has entered between the copper atom in copper-iron alloy, without the enterable space of tin atom.
For more clearly setting forth architectural feature of the present invention and effect, below in conjunction with accompanying drawing and specific embodiment, the present invention is described in detail.
Accompanying drawing explanation
Fig. 1 is the flatiron outward appearance oblique view of solder horn chip in first preferred embodiment of the present invention.
Fig. 2 is the perspective view in Fig. 1 arrow P 1 direction.
Fig. 3 is the chip of solder horn shown in Fig. 2 outward appearance oblique view.
Fig. 4 is the side view in arrow P 2 direction of the chip of solder horn shown in Fig. 3.
Fig. 5 is the first end sectional drawing of the chip of solder horn shown in Fig. 4.
Fig. 6 (a) implements front elevation shown in the second preferred embodiment for solder horn chip.
Fig. 6 (b) is the side view of Fig. 6 (a).
Fig. 7 (a) is front elevation shown in solder horn chip enforcement the 3rd preferred embodiment.
Fig. 7 (b) is the side view of Fig. 7 (a).
Fig. 8 (a) is front elevation shown in solder horn chip enforcement the 4th preferred embodiment.
Fig. 8 (b) is the side view of Fig. 8 (a).
Fig. 9 (a) is front elevation shown in solder horn chip enforcement the 5th preferred embodiment.
Fig. 9 (b) is the side view of Fig. 9 (a).
Figure 10 (a) is front elevation shown in solder horn chip enforcement the 6th preferred embodiment.
Figure 10 (b) is the side view of Figure 10 (a).
Figure 11 (a) is front elevation shown in solder horn chip enforcement the 7th preferred embodiment.
Figure 11 (b) is the side view of Figure 11 (a).
Figure 12 (a) is front elevation shown in solder horn chip enforcement the 8th preferred embodiment.
Figure 12 (b) is the side view of Figure 12 (a).
Figure 13 (a) is front elevation shown in solder horn chip enforcement the 9th preferred embodiment.
Figure 13 (b) is the side view of Figure 13 (a).
Figure 14 (a) is front elevation shown in solder horn chip enforcement the tenth preferred embodiment.
Figure 14 (b) is the side view of Figure 14 (a).
Figure 15 (a) is front elevation shown in solder horn chip enforcement the 11 preferred embodiment.
Figure 15 (b) is the side view of Figure 15 (a).
Figure 16 is the sectional drawing of the first end of solder horn chip in the past.
Accompanying drawing identifier declaration:
200, flatiron 201, power line portion
202, handle portion 203, handle part
204-1 ~ 204-11, solder horn chip
205, electrical bar 205a, heating part
206, temperature detection means 230, heat carrier.
Detailed description of the invention
Please refer to shown in Fig. 1 to Fig. 5, that show the concrete structure of first preferred embodiment of the present invention.
Fig. 1 is the use solder horn chip outward appearance oblique view relating to embodiment of the present invention, and Fig. 2 is the perspective view in Fig. 1 arrow P 1 direction.Fig. 3 solder horn chip outward appearance oblique view.The side view in arrow P 2 direction that Fig. 4 is the chip of solder horn shown in Fig. 3.
Wherein, flatiron 200 is made up of power line portion 201, handle portion 202, heating part 205a, maintaining part 203 and solder horn chip 204-1.
Solder horn chip 204-1 is formed by without through hole 204aa, has the cylindrical base 204a of the heat-generating cylindrical portion 205a being arranged on flatiron 200 and is formed along central shaft coniform from bottom 204a, for melting the first end 204b in the melting portion of scolding tin.In addition, 204c belongs to flange, and the words of homogeneous internal diameter not expanding towards outside near the entrance of non-through hole 204aa are impassable yet.
As depicted in figs. 1 and 2, power line portion 201 is for giving heater (not shown) and the detected temperatures distribution of heating part 205a.Handle portion 202 for the ease of operator operation cylindrical portion material, such as; Adopt heat stable resin.Maintaining part 203 only when carrying out single-ended weld job conveying when determining voltage conducting wire 210,211(see Fig. 2), there is the bar-shaped heating rod 205 of the silica of built-in heater first end, and the other end periphery (near right-hand member) in the first end of heating rod 205 controls the temperature detection detection method 206 of solder horn chip 204-1 temperature.
What temperature checking method 206 generally exemplified is thermocouple, is not only limited to thermocouple in the present invention, also can adopt crust thermometric impedance body.The thermocouple of one of temperature checking method 206, is close to along heating rod 205 length direction.Thermocouple and heating rod 205 linear contact lay, therefore can the correct and change of high efficiency detected temperatures.The first end periphery of thermocouple, is kept by the temperature detection retaining ring 206a of metal, and tip can withstand by the flange 204c inner taper of 204a bottom solder horn chip 204-1.
Heater come out heat be conduct to solder horn chip 204-1 from the heating part 205a of heating rod 205 while, conduct to temperature method for detecting 206 detected temperatures.
Fig. 5 is the V-V line sectional drawing of the first end 204b of the chip of solder horn shown in Fig. 4 204-1.Solder horn chip 204-1 heat carrier 230 is in Figure 5 formed by without through hole, there is the cylindrical base 204a being contained in cylindric flatiron 200 heating part 203, and extend from bottom 204a along central shaft, as the coniform melting portion melting scolding tin, the material of heat carrier 230 is made up of copper-iron alloy.Ratio between copper and iron is preferably in the scope of 3:7 ~ 7:3.At first end (figure left end) tin coating 223 of solder horn 204-1, chromium coating 222 also can be carried out in the face beyond tin coating.
Effect and the effect of the present embodiment are: the solder horn chip 204-1 that constructs in Figure 5, carry out pb-free solder substantially can not produce " food copper " phenomenon even if be arranged in the flatiron 200 shown in Fig. 1.This is because heat carrier 230 material of solder horn 204-1 of the present invention is made up of copper-iron alloy, even if heat carrier 230 directly contacts with scolding tin, iron atom has entered between the copper atom in copper-iron alloy, without the enterable space of tin atom.
By at flatiron 200(with reference to Fig. 1) in this solder horn chip is installed, not only can prevent the heat carrier 230 in welding process from consuming, simultaneously because the shape of melting portion 204b-1 is coniform non-directionally easily to take, all may correspond to from small size to large area.
According to above-mentioned, make because heat carrier 230 is copper-iron alloys, embodiment of the present invention, can be provided in welding process the solder horn chip preventing heat carrier 230 from consuming.And, do not need plating iron according to embodiment of the present invention.
Please refer to Fig. 6 (a) and 6(b) shown in, that show the concrete structure of second preferred embodiment of the present invention.
Fig. 6 (a) implements institute's diagram of other schemes for solder horn chip, and Fig. 6 (b) is the side view of (a).The difference of the solder horn chip 204-1 shown in solder horn chip 204-2 and Fig. 4 shown in Fig. 6 (a) and (b) is, the tip of melting portion 204b-2 is cut to inclined-plane to central shaft L1.To the angle of tangent plane 204-2a central axis L 1 generally exemplify be 45 ° but be not limit, as long as and in the scope of 30 ° ~ 60 °.By installing this solder horn chip 204-2 in flatiron 200, the consumption of the heat carrier 230 in welding process can be prevented.Because the melting portion 204b-2 of solder horn chip 204-2 is coniform, and be cut to inclined-plane so can be used in and draw weldering, wire prewelding etc.
If at tangent plane 204-2a central authorities scolding tin, use when can have adjacent component or easily produce tin bridge." central authorities " refer to inside the portion that keeps to the side of tangent plane 204-2a, even if mean that the periphery of solder horn chip 204-2 contacts inner side scolding tin and also can not flow out with adjacent component etc.
Please refer to shown in Fig. 7 (a) He Fig. 7 (b), that show the concrete structure of the 3rd preferred embodiment of the present invention.
It is the side view of (a) that Fig. 7 (a) implements front elevation (b) shown in other schemes for solder horn chip.The difference of the solder horn chip 204-3 shown in Fig. 7 (a) and (b) and the solder horn chip 204-2 shown in Fig. 6 (a) and (b) is, the central authorities of tangent plane 204b-3a form recess 204b-3b.Solder horn chip 204-3 is arranged in flatiron 200, and while can preventing the heat carrier 230 in welding process from consuming, because it is higher to form recess 204b-3b scolding tin confining force, more effective carrying out draws weldering.
Please refer to shown in Fig. 8 (a) He Fig. 8 (b), that show the concrete structure of the 4th preferred embodiment of the present invention.
It is the side view of (a) that Fig. 8 (a) implements front elevation (b) shown in other schemes for solder horn chip.The difference of the solder horn chip 204-1 shown in solder horn chip 204-4 and Fig. 4 shown in Fig. 8 (a) and (b) is, the cylinder extended from bottom 204a along central shaft is cut to inclined-plane, has the coniform melting portion 204b-4 as melting scolding tin.Solder horn chip 204-4 is arranged in flatiron 200, while can preventing the heat carrier 230 in welding process from consuming, because can select the tangent plane 204-4a size in workpiece, draws weldering, wire prewelding so can be used in.
Separately, only when tangent plane 204-4a central authorities carry out scolding tin, there is adjacent component or easily produce Xi Qiao place and can use.
Please refer to shown in Fig. 9 (a) He Fig. 9 (b), that show the concrete structure of the 5th preferred embodiment of the present invention.It is the side view of (a) that Fig. 9 (a) implements front elevation (b) shown in other schemes for solder horn chip.The difference of the solder horn chip 204-1 shown in solder horn chip 204-5 and Fig. 4 shown in Fig. 9 (a) and (b) is, the heat carrier of melting portion 204b-5 is formed coniform from bottom 204a along central shaft, tip forms slotted point screwdriver shape, and forms the melting portion as melting scolding tin.Solder horn chip 204-4 is arranged in flatiron 200, while can preventing the heat carrier 230 in welding process from consuming, because be that straight screwdriver shape can with point-line-surface 3 kinds of contact methods, also can select the width (tip size) in workpiece, any weld job all may correspond to.
Please refer to shown in Figure 10 (a) He Figure 10 (b), that show the concrete structure of the 6th preferred embodiment of the present invention.
It is the side view of (a) that Figure 10 (a) implements front elevation (b) shown in other schemes for solder horn chip.The difference of the solder horn chip 204-1 shown in solder horn chip 204-6 and Fig. 4 shown in Figure 10 (a) and (b) is, the heat carrier melting 204b-6 forms double-layer circular taper from bottom 204a along central shaft.Ground floor cone form 204b-5a and at the second layer cone form 204b-5b of tip because be thin pyramid type, solder horn chip 204-6 is arranged in flatiron 200, while can preventing the heat carrier 230 in welding process from consuming, can utilize in the welding of the substrate correction equal pitch of mobile phone.
Please refer to shown in Figure 11 (a) He Figure 11 (b), that show the concrete structure of the 7th preferred embodiment of the present invention.
Figure 11 (a) implements front elevation shown in other schemes for solder horn chip, and Figure 11 (b) is the side view of Figure 11 (a).The difference of the solder horn chip 204-1 shown in solder horn chip 204-7 and Fig. 4 shown in Figure 11 (a) and (b) is, the heat carrier of melting portion 204b-7 forms coniform and tip bending part from bottom along central shaft.Solder horn chip 204-6 is arranged in flatiron 200, while can preventing the heat carrier 230 in welding process from consuming, can use face and point 2 kinds of ways of contact, or weldering etc. can be drawn to utilize in Xi Qiao excision.
Please refer to shown in Figure 12 (a) He Figure 12 (b), that show the concrete structure of the 8th preferred embodiment of the present invention.
Figure 12 (a) implements front elevation shown in other schemes for solder horn chip, and Figure 12 (b) is the side view of Figure 12 (a).The difference of the solder horn chip 204-1 shown in solder horn chip 204-8 and Fig. 4 shown in Figure 12 (a) and (b) is, melting portion 204b-8 forms cutting knife shape from bottom 204a along central shaft.Solder horn chip 204-8 is arranged in flatiron 200, while can preventing heat carrier 230 in welding process from consuming because shape be blade type can with point-line-surface 3 kinds of contact methods, can in pitch, Xi Qiao excises, and draws weldering etc. to utilize.
Please refer to shown in Figure 13 (a) He Figure 13 (b), that show the concrete structure of the 9th preferred embodiment of the present invention.
Figure 13 (a) implements front elevation shown in other schemes for solder horn chip, and Figure 13 (b) is the side view of Figure 13 (a).The difference of the solder horn chip 204-1 shown in solder horn chip 204-9 and Fig. 4 shown in Figure 13 (a) and (b) is, the cap of bottom 204a tip is fixed, and the end uncovered box-shaped that has possessed as melting scolding tin melts 204b-9.Solder horn chip 204-9 is arranged in flatiron 200, while can preventing the heat carrier 230 in welding process from consuming, can be heated by IC (Integrated Circuit) 2 limit wire simultaneously, the dismounting etc. of SOP (Small Outline Package) can be used in.
Please refer to shown in Figure 14 (a) He Figure 14 (b), that show the concrete structure of the tenth preferred embodiment of the present invention.
Figure 14 (a) implements front elevation shown in other schemes for solder horn chip, and Figure 14 (b) is the side view of Figure 14 (a).The difference of the solder horn chip 204-10 shown in Figure 14 (a) and (b) and the solder horn chip 204-9 shown in Figure 13 (a) and (b) is, melting portion 204b-10 is fixed (being right side in Figure 14 (b)) by the tip convex side of bottom 204a, forms " コ " word section configuration melting portion as melting scolding tin.Solder horn chip 204-10 is arranged in flatiron 200, while can preventing the heat carrier 230 in welding process from consuming, can be heated simultaneously, can be used in the dismounting etc. of SOP by IC2 limit wire.
Please refer to shown in Figure 15 (a) He Figure 15 (b), that show the concrete structure of the 11 preferred embodiment of the present invention.
Figure 15 (a) implements front elevation shown in other schemes for solder horn chip, and Figure 15 (b) is the side view of Figure 15 (a).The difference of the solder horn chip 204-10 shown in Figure 15 (a) and (b) and the solder horn chip 204-9 shown in Figure 13 (a) and (b) is, melting portion 204b-11, extends form spade shape from bottom 204a along central shaft.Solder horn chip 204-10 is arranged in flatiron 200, while can preventing the heat carrier 230 in welding process from consuming, and can heating for a time of wider IC or connector etc.And the welding such as hot pressing or shielded box of soft base plate can be used in.
Hold, the forming method of solder horn chip of the present invention is as follows:
(1) melt: the copper of the ratio of weight portion within the scope of 3:7 ~ 7:3 is joined smelting furnace together with iron, nitrogen is passed into as inert gas to isolate outside air in smelting furnace, start the power supply of smelting furnace, by furnace heats to 1535 ~ 1550 DEG C, copper and iron are melted for motlten metal liquid.The high temperature of 1535 ~ 1550 DEG C is enough to iron is melted, and the fusing point of copper is lower than the fusing point of iron, and therefore, copper and iron all can melt.
In copper-iron alloy proportioning of the present invention, the proportioning of copper and iron can have several, as shown in the table:
The copper iron that form is enumerated can meet application claims than weight average.
(2) mix: the temperature in smelting furnace is increased to 1680 ~ 1700 DEG C, copper molten iron to molten condition drops into Titanium and phosphorized copper, under 1680 ~ 1700 DEG C of high temperature, Titanium melts, and makes together with Titanium is dissolved in copper, iron, start agitator, to motlten metal liquid uniform stirring in smelting furnace, and start supersonic generator, apply vibration of ultrasonic wave to motlten metal liquid, make that the copper molten iron of molten condition is active beats, thus can more Homogeneous phase mixing.
Wherein, when dropping into Titanium, the proportion that described Titanium accounts for motlten metal liquid in smelting furnace is 0.05 ~ 0.09%.According to the interpolation of titanium, iron particle surface can be made to occur moist, can prevent iron particle from floating and iron particle coarsening, and in addition vibration of ultrasonic wave, make iron particle miniaturization and homogeneous distribution, thus with copper particle Homogeneous phase mixing.
In addition, when dropping into phosphorized copper, the proportion that described phosphorized copper accounts for motlten metal liquid in smelting furnace is 0.05% ~ 0.07%.Because phosphorized copper heat is decomposed, the existence of phosphorus makes the moist of iron particle surface play better, more suppresses iron particle to float.It should be noted that the addition of phosphorized copper is too much or very few, all reach undesirable effect, as: if more than 0.07%, may there is the phenomenon chapped in copper-iron alloy, if be less than 0.05%, there is no moist effect, two of copper-iron alloy can not be suppressed well to be separated.
(3) come out of the stove: smelting furnace is extinguished, and open the vacuum valve of smelting furnace, utilize vacuum force, the copper-iron alloy liquid of fusing is cast onto in copper mold, surperficial by the activated carbon powder of lance ejection for reducing at copper mold fast, make copper-iron alloy molten liquid surface cover activated carbon powder.
(4) shaping copper-iron alloy ingot: copper mold is placed in flowing cool water, realizes quick cooled and solidified and obtains copper-iron alloy ingot; In the moment of lower water, high temperature copper mold chance water produces a large amount of steam (containing oxygen) makes copper-iron alloy surface produce oxidation, and activated carbon powder realizes reducing:
Fe
3O
4+C=3FeO+CO
FeO+C=Fe+CO
2CuO + C = 2Cu+CO
2
Thus obtain the very high copper-iron alloy of purity.If press the dose upper limit calculate, Titanium 0.09%+ phosphorized copper 0.07%, sum of the two less than 0.2%, it can thus be appreciated that the copper-iron alloy impurity utilizing the method to obtain is few, and purity is very high, close to 100%.
(5) process: the machine-shaping of copper-iron alloy ingot is gone out the heat carrier 230 without through hole.In this process, first the copper-iron alloy ingot obtained is forged, cut into square clava, then pole is rolled into, again this pole is processed into cold top-stitching, then under non-acidizing environment, carry out annealing in process, in vacuum environment, prevent acidifying, at the temperature of 400 ~ 500 DEG C, leave standstill 30 minutes.
(6) electroplate: zinc-plated at the tip in the melting portion of heat carrier 230, the face chromium plating beyond melting portion tip, in this, as the protective layer of the soldering tip in scolding tin, by this, completes process of manufacture.
In sum, design focal point of the present invention is, carries out pb-free solder substantially can not produce " food copper " phenomenon even if be arranged in the flatiron 200 shown in Fig. 1 by solder horn chip 204-1.This is because heat carrier 230 material of solder horn 204-1 of the present invention is formed by copper-iron alloy, the copper-iron alloy purity adopting method of the present invention to make is very high, and copper particle in copper-iron alloy and iron particle are evenly distributed, even if heat carrier 230 directly contacts with scolding tin, iron atom has entered between the copper atom in copper-iron alloy, without the enterable space of tin atom.
The above, it is only preferred embodiment of the present invention, not technical scope of the present invention is imposed any restrictions, thus every above embodiment is done according to technical spirit of the present invention any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (15)
1. a forming method for solder horn chip, is characterized in that: comprise the following steps
(1) melt: the copper of the ratio of weight portion within the scope of 3:7 ~ 7:3 is joined smelting furnace together with iron, nitrogen is passed into as inert gas in smelting furnace, start the power supply of smelting furnace, by furnace heats to 1535 ~ 1550 DEG C, make copper and iron melt for motlten metal liquid;
(2) mix: the temperature in smelting furnace is increased to 1680 ~ 1700 DEG C, copper molten iron to molten condition drops into Titanium and phosphorized copper, make together with Titanium is dissolved in copper, iron, start agitator, to motlten metal liquid uniform stirring in smelting furnace, start supersonic generator, apply vibration of ultrasonic wave to motlten metal liquid, make the copper molten iron Homogeneous phase mixing of molten condition;
(3) come out of the stove: smelting furnace is extinguished, and opens the vacuum valve of smelting furnace, utilize vacuum force, the copper-iron alloy liquid of fusing is cast onto in copper mold, pass through lance ejection activated carbon powder on copper mold surface fast, make copper-iron alloy molten liquid surface cover activated carbon powder;
(4) shaping copper-iron alloy ingot: copper mold is placed in flowing cool water, realizes quick cooled and solidified and obtains copper-iron alloy ingot; In the moment of lower water, high temperature copper mold chance water produces a large amount of steam makes copper-iron alloy surface produce oxidation, and activated carbon powder realizes reducing:
Fe
3O
4+C=3FeO+CO
FeO+C=Fe+CO
2CuO + C = 2Cu+CO
2
Thus obtain the very high copper-iron alloy of purity;
(5) process: the machine-shaping of copper-iron alloy ingot is gone out the heat carrier without through hole;
(6) electroplate: zinc-plated at the tip in the melting portion of heat carrier, the face chromium plating beyond melting portion tip.
2. the forming method of solder horn chip according to claim 1, it is characterized in that: in step (2), in smelting furnace shared by Titanium, the proportion of motlten metal liquid is 0.05 ~ 0.09%, and the proportion that phosphorized copper accounts for motlten metal liquid in smelting furnace is 0.05% ~ 0.07%.
3. the forming method of solder horn chip according to claim 1, it is characterized in that: in the process of step (5), first the copper-iron alloy ingot obtained is forged, cut into square clava, then be rolled into pole, then this pole is processed into cold top-stitching, then under non-acidizing environment, carry out annealing in process, in vacuum environment, prevent acidifying, at the temperature of 400 ~ 500 DEG C, leave standstill 30 minutes.
4. the solder horn chip adopting copper-iron alloy to make, it is characterized in that: be adopt the method as any one of claims 1 to 3 to mold, this solder horn chip is provided with the heat carrier without through hole, this heat carrier has the melting portion for melting scolding tin of the cylindrical base for being contained in cylindric flatiron heating part and the formation that stretches from bottom along central shaft, the tip in described melting portion has tin coating, and the face beyond the tip tin coating in described melting portion is chromium coating.
5. the solder horn chip that the employing copper-iron alloy according to any one of claim 4 is made, is characterized in that: described melting portion is formed coniform from bottom along central shaft stretching.
6. the solder horn chip made of employing copper-iron alloy according to claim 5, is characterized in that: the tip in described melting portion is scarf to central shaft.
7. the solder horn chip made of employing copper-iron alloy according to claim 6, is characterized in that: the scarf central authorities of the tip in described melting portion form recess.
8. the solder horn chip made of employing copper-iron alloy according to claim 4, is characterized in that: described melting portion is formed cylindric from bottom along central shaft and is cut to inclined-plane.
9. the solder horn chip made of employing copper-iron alloy according to claim 4, is characterized in that: described melting portion is formed coniform bottom this along central shaft, and the tip melting portion forms slotted point screwdriver shape.
10. the solder horn chip made of employing copper-iron alloy according to claim 4, is characterized in that: described melting portion forms double-layer circular taper along central shaft bottom this.
The solder horn chip that 11. employing copper-iron alloys according to claim 4 are made, is characterized in that: described melting portion is extended for coniform along central shaft from bottom, and the portion tip of melting has bending.
The solder horn chip that 12. employing copper-iron alloys according to claim 4 are made, is characterized in that: described melting portion forms cutting knife shape from bottom along central shaft.
The solder horn chip that 13. employing copper-iron alloys according to claim 4 are made, is characterized in that: there is the bottomless box-shaped of lid in described melting portion, and the cap in this melting portion is fixed on bottom tip.
The solder horn chip that 14. employing copper-iron alloys according to claim 4 are made, is characterized in that: described melting portion is " コ " word section configuration, and the convex side in this melting portion is fixed on bottom tip.
The solder horn chip that 15. employing copper-iron alloys according to claim 4 are made, is characterized in that: described melting portion stretches from bottom along central shaft to form spade shape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-002221 | 2014-04-28 | ||
| JP2014002221U JP3191800U (en) | 2014-04-28 | Soldering iron tip |
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| Publication Number | Publication Date |
|---|---|
| CN104772545A true CN104772545A (en) | 2015-07-15 |
| CN104772545B CN104772545B (en) | 2017-04-05 |
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|---|---|---|---|
| CN201520191581.1U Expired - Fee Related CN204657690U (en) | 2014-04-28 | 2015-04-01 | Adopt the solder horn chip that copper-iron alloy is made |
| CN201510150671.0A Active CN104772545B (en) | 2014-04-28 | 2015-04-01 | A kind of forming method of Trimeresurus mucrosquamatus (Cantor). chip |
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| CN201520191581.1U Expired - Fee Related CN204657690U (en) | 2014-04-28 | 2015-04-01 | Adopt the solder horn chip that copper-iron alloy is made |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068633A (en) * | 2015-11-17 | 2017-08-18 | 星和电机株式会社 | Heat-conduction component |
| CN116900120A (en) * | 2023-09-06 | 2023-10-20 | 江苏中佰纳米新材料科技有限公司 | Flexible automatic manufacturing equipment for metal plates |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579533A (en) * | 1994-08-17 | 1996-11-26 | Donald Fegley | Method of making a soldering iron tip from a copper/iron alloy composite |
| CN2700038Y (en) * | 2004-06-17 | 2005-05-18 | 袁忠 | Welding head |
| JP2005254259A (en) * | 2004-03-09 | 2005-09-22 | Dotetsu Gokin Kk | Soldering iron |
| CN1717293A (en) * | 2002-11-26 | 2006-01-04 | 白光株式会社 | Tip of soldering iron, process for producing the same, and electrical soldering iron and electrical solder sucking iron including the iron tip |
| CN1973576A (en) * | 2004-05-25 | 2007-05-30 | 白光株式会社 | Soldering iron with replaceable tip |
| CN200977582Y (en) * | 2006-10-26 | 2007-11-21 | 姚志学 | Welding head |
-
2015
- 2015-04-01 CN CN201520191581.1U patent/CN204657690U/en not_active Expired - Fee Related
- 2015-04-01 CN CN201510150671.0A patent/CN104772545B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579533A (en) * | 1994-08-17 | 1996-11-26 | Donald Fegley | Method of making a soldering iron tip from a copper/iron alloy composite |
| CN1717293A (en) * | 2002-11-26 | 2006-01-04 | 白光株式会社 | Tip of soldering iron, process for producing the same, and electrical soldering iron and electrical solder sucking iron including the iron tip |
| JP2005254259A (en) * | 2004-03-09 | 2005-09-22 | Dotetsu Gokin Kk | Soldering iron |
| CN1973576A (en) * | 2004-05-25 | 2007-05-30 | 白光株式会社 | Soldering iron with replaceable tip |
| CN2700038Y (en) * | 2004-06-17 | 2005-05-18 | 袁忠 | Welding head |
| CN200977582Y (en) * | 2006-10-26 | 2007-11-21 | 姚志学 | Welding head |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068633A (en) * | 2015-11-17 | 2017-08-18 | 星和电机株式会社 | Heat-conduction component |
| CN116900120A (en) * | 2023-09-06 | 2023-10-20 | 江苏中佰纳米新材料科技有限公司 | Flexible automatic manufacturing equipment for metal plates |
| CN116900120B (en) * | 2023-09-06 | 2023-12-05 | 江苏中佰纳米新材料科技有限公司 | Flexible automatic manufacturing equipment for metal plates |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104772545B (en) | 2017-04-05 |
| CN204657690U (en) | 2015-09-23 |
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