CN103199072A - Gold-plated palladium-copper single-crystal bonding wire and manufacturing method thereof - Google Patents
Gold-plated palladium-copper single-crystal bonding wire and manufacturing method thereof Download PDFInfo
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- CN103199072A CN103199072A CN2013100814306A CN201310081430A CN103199072A CN 103199072 A CN103199072 A CN 103199072A CN 2013100814306 A CN2013100814306 A CN 2013100814306A CN 201310081430 A CN201310081430 A CN 201310081430A CN 103199072 A CN103199072 A CN 103199072A
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Abstract
The invention discloses a gold-plated palladium-copper single-crystal bonding wire and a manufacturing method thereof. Base materials of the gold-plated palladium-copper single-crystal bonding wire are composed of, by weight, the following raw materials: 4%-8% of gold (Au), 0.03%-0.08% of palladium (Pb), 0.0001%-0.0003% of calcium (Ca) and 0.0002%-0.0008% of mixed rare earth (Re), and the rest is copper. The manufacturing method comprises the steps: extracting the high purity copper with purity being larger than 99.9995% to prepare a copper alloy keelblook, then preparing a palladium-copper as-cast single-crystal bus, plating gold on the surface of the bus after coarse drawing and heat treatment, and the carrying out finish drawing, the hear treatment, surface cleaning, shunt winding and sizing. According to the manufacturing method, oxidation resistance of the bonding wire can be effectively improved to be similar to that of a gold bonding wire, a quality guarantee period of the bonding wire after the bonding wire is unwrapped is greatly prolonged, elements such as the palladium, the calcium and the rare earth are added inside the bonding wire, so that compared with other products which are in the same type with the bonding wire and are produced by other modes, the bonding wire is higher in mechanical strength, the wire diameter can be further shrunk, welding distance can be shortened, and the method is particularly suitable for packing of a high-density and multi-pin integrated circuit.
Description
Technical field
The road packaging process relates in particular to a kind of gold plated copper palldium alloy monocrystalline bonding wire and manufacture method thereof with metallic bond plying and manufacture method thereof after the present invention relates to microelectronics.
Background technology
The bond sequence of microelectronic device chip refers to adopt at a certain temperature the method for ultrasonic wave pressurization that the bonding wire two ends are welded on respectively on chip disk and the lead frame pin, and realization chip internal circuit is connected with external circuit.Early stage bonding wire is many to be made by proof gold, until now mostly the bonding wire used of producer also be that proof gold is made.Rare day by day along with gold precious metal resource, price continues soaring, and the microelectronics Packaging cost significantly rises, and brings the cost pressure that is difficult to bear for manufacturer, user.Therefore, industry actively seek, cheap relatively, stable and reliable for performance, the easy to process reliable novel bonding wire material of R﹠D costs.
The research application that is used for alternative gold bonding wire at present concentrates on the plying of copper base key mostly, but this class bonding wire also has its weak point: 1. copper wire because of work hardening, makes to be difficult to draw the footpath of the same thin glass-coated microwire with the gold bonding wire in pulling process; 2. because copper wire is really up to the mark, can cause first solder joint to escape silk easily, make the bonding operation frequently interrupt, cause bigger difficulty for the integrated circuit encapsulation of next procedure; 3. because copper wire has the characteristic of easy oxidation, preserve and welding process in be easy to generate oxidation, must use up as early as possible after unpacking, and must add nitrogen hydrogen mixeding gas protected when using, make operational danger increase.
(patent No.: ZL201110156014.9) its cost is than bonding gold wire considerably cheaper by the copper palldium alloy monocrystalline bonding wire of our company research and development, and palladium stable performance in the high air of high temperature, high humidity or sulfide content, erosion that can be acidproof, and has good ductility and plasticity, but it is harder than gold, bending and friction can be born, good surface appearance and gloss can be kept for a long time.
Summary of the invention
The object of the present invention is to provide a kind of gold plated copper palldium alloy monocrystalline bonding wire and manufacture method thereof.Gold plated copper palldium alloy monocrystalline bonding wire of the present invention has overcome the deficiency of copper base key plying, the advantage that had both possessed copper palldium alloy monocrystalline bonding wire, concentrated the advantage of gold bonding wire again, the craft of gilding of employing can reduce material cost greatly, is a kind of novel bonding wire of both economical practicality.
The present invention is achieved in that its method is:
1. extract high purity copper: copper nitrate solution is added high purity water in the 1:4 ratio dilute, be mixed with electrolyte; Immerse in the electrolyte as anode with No. 1 fine copper of national standard, and guarantee to have the fine copper of 95% volume ratio to immerse in the electrolyte; Immerse in the electrolyte as negative electrode with high-purity Copper Foil, guarantee to have high-purity Copper Foil of 95% volume ratio to immerse in the electrolyte equally; The direct current of input (7-9) V, (2.5-3.5) A between anode, negative electrode is kept electrolyte temperature in additional fresh electrolyte mode and is no more than 60 ℃; When treating purity that negative electrode gathers constant weight greater than 99.9995% high purity copper, in time change high-purity Copper Foil, again with clean, dry for standby.
2. be prepared into copper alloy casting ingot: dna purity is greater than 99.9995% high purity copper, add palladium, calcium, rare earth then, content according to percentage by weight be respectively Pd0.03%-0.08%, Ca0.0001%-0.0003%, Re0.0002%-0.0008%, all the other are for copper.The purity of palladium is greater than 99.999%, the purity 99.0%-99.5% of calcium, and Re is the mixed type rare earth.These metals are put into the high purity graphite crucible after mechanical mixture, use the electric induction furnace fusing under the inert gas shielding condition, for guaranteeing stability and the consistency of chemical analysis, are prepared into copper alloy casting ingot.
3. continuous casting becomes as cast condition monocrystalline bus: the copper alloy casting ingot for preparing is added the horizontal casting metal single crystal continuous casting chamber that nitrogen protection is arranged; use Frequency Induction Heating to (1150-1220) ℃; treat to melt fully, after refining and the degasification; liquation is injected the middle liquid storage tank insulation in continuous casting chamber; in the continuous casting chamber of keeping (2-5) L/min nitrogen purge gas flow; finish the horizontal continuous casting of single crystal to molten alloyed copper, obtain ф 3mm, the vertical and horizontal number of die is 1 copper palldium alloy as cast condition monocrystalline bus.
4. slightly pull out: adopt conventional wire-drawing equipment and technology, frock, the copper palldium alloy as cast condition monocrystalline bus of ф 3mm is crossed die drawing through multi-pass pull out operation, be drawn into the copper palldium alloy monocrystalling wire about ф 0.20mm.
5. heat treatment: the copper palldium alloy monocrystalling wire about ф 0.20mm is placed annealing furnace, under (420-460) ℃ temperature, be incubated 25min, pass to nitrogen protection gas between soak, cool off with stove then.
6. surface gold-plating: use conventional electroplating device and technology, the copper palldium alloy monocrystalling wire about the ф 0.20mm after the annealing is electroplated proof gold protection against oxidation layer, electroplate purity requirement with gold greater than 99.99%; Current density (4-4.5) A/d ㎡, the take-up speed of copper palldium alloy monocrystalling wire is (4-5) m/min, thickness of coating is controlled between 10 μ m-20 μ m; Gold plated copper palldium alloy monocrystalline bonding wire after gold-plated, its golden quality (weight) percentage is between 4%-8%.
7. essence is pulled out: the gold plated copper palldium alloy monocrystalline bonding wire that the surface is gold-plated is crossed die drawing through multi-pass and is pulled out operation, is drawn into (the finished product bonding wire of 0.013mm-0.050mm) of different size.
8. heat treatment: gold plated copper palldium alloy monocrystalline bonding wire is placed annealing furnace, under (400-420) ℃ temperature, be incubated 25min, pass to nitrogen protection gas between soak, cool off with stove then.
9. surface clean: gold plated copper palldium alloy monocrystalline bonding wire is cleaned, cleans through ultrasonic wave then with acid solution earlier, again by high purity water clean, oven dry.
10. bundling: finished product gold plated copper palldium alloy monocrystalline bonding wire is carried out after-combustion, bundling, packing.
Remarks: (reference value) when 1. the alloy silk electrodeposited coating thickness of ф 0.20mm was 2 μ m, the weight percent content of Au was 8.25%.
When 2. the alloy silk of ф 0.20mm was drawn to ф 0.018mm, thickness of coating was 0.057 μ m.
When 3. the alloy silk of ф 0.20mm was drawn to ф 0.050mm, thickness of coating was 0.159 μ m.
Technique effect of the present invention is: can effectively promote the antioxygenic property of bonding wire, make its non-oxidizability and bonding gold wire suitable, prolong the shelf-life after the bonding wire product is sealed off greatly; The inner elements such as palladium, calcium, rare earth that add make this product higher than the product mechanical strength of the same type of alternate manner production, are conducive to further dwindle line footpath, the shortening weld spacing of bonding wire, are applicable to high density, the encapsulation of many pins more.
Embodiment
Embodiment 1
The present invention realizes like this, a kind of gold plated copper palldium alloy monocrystalline bonding wire, the basis material of this bonding wire is made up of the raw material of following percentage by weight: gold (Au) 4%, palladium (Pa) 0.03%, calcium (Ca) 0.0001%, mixed type rare earth (Re) 0.0002%, all the other are copper, sum equals 100%.The purity that requires gold greater than 99.99%, the purity of copper greater than 99.9995%, the purity of palladium greater than 99.999%, the purity of calcium is that 99.0%-99.5%, Re is the mixed type rare earth.
The manufacture method of gold plated copper palldium alloy monocrystalline bonding wire, method is as follows:
1. extract high purity copper: be raw material with No. 1 fine copper of national standard, dna purity is greater than 99.9995% high purity copper, through clean, dry for standby.
2. be prepared into copper alloy casting ingot: by embodiment 1 aforementioned relevant regulations requirement; in high purity copper, add high-purity palladium, calcium, rare earth respectively; these metals are put into the high purity graphite crucible after mechanical mixture, use the electric induction furnace fusing under the inert gas shielding condition, are prepared into copper gold alloying ingot.
3. continuous casting becomes as cast condition monocrystalline bus: the copper alloy casting ingot for preparing is added the horizontal casting metal single crystal continuous casting chamber that nitrogen protection is arranged; after using Frequency Induction Heating, fusing, refining and degasification; finish the horizontal continuous casting of single crystal to molten alloyed copper, obtain ф 3mm, the vertical and horizontal number of die is 1 copper palldium alloy as cast condition monocrystalline bus.
4. slightly pull out: the copper palldium alloy as cast condition monocrystalline bus of ф 3mm is drawn into the copper palldium alloy monocrystalling wire that diameter is 0.20mm.
5. heat treatment: be the copper palldium alloy monocrystalling wire annealing of 0.20mm with diameter.
6. surface gold-plating: copper palldium alloy monocrystalling wire is electroplated the proof gold protective layer, electroplate purity requirement with gold greater than 99.99%, the control of surface gold-plating layer is at the thickness of 1 μ m-2 μ m.
7. essence is pulled out: with the aforementioned gold plated copper palldium alloy monocrystalline bonding wire that is coated with the 0.20mm of proof gold protective layer, precision is drawn into the finished product bonding wire that diameter is respectively ф 13 μ m-50 μ m.
8. heat treatment: gold plated copper palldium alloy monocrystalline bonding wire is carried out annealing in process.
9. surface clean: clean with acid solution earlier, clean through ultrasonic wave then, again by high purity water clean, oven dry.
10. bundling: finished product gold plated copper palldium alloy monocrystalline bonding wire is carried out after-combustion, bundling, packing.
Embodiment 2
The present invention realizes like this, a kind of gold plated copper palldium alloy monocrystalline bonding wire, the basis material of this bonding wire is made up of the raw material of following percentage by weight: gold (Au) 8%, palladium (Pa) 0.08%, calcium (Ca) 0.0003%, mixed type rare earth (Re) 0.0008%, all the other are copper, sum equals 100%.The purity that requires gold greater than 99.99%, the purity of copper greater than 99.9995%, the purity of palladium greater than 99.999%, the purity of calcium is that 99.0%-99.5%, Re is the mixed type rare earth.
The manufacture method of gold plated copper palldium alloy monocrystalline bonding wire, method is as follows:
1. extract high purity copper: be raw material with No. 1 fine copper of national standard, dna purity is greater than 99.9995% high purity copper, through clean, dry for standby.
2. be prepared into copper alloy casting ingot: by embodiment 2 aforementioned relevant regulations requirements; in high purity copper, add high-purity palladium, calcium, rare earth respectively; these metals are put into the high purity graphite crucible after mechanical mixture, use the electric induction furnace fusing under the inert gas shielding condition, are prepared into copper gold alloying ingot.
3. continuous casting becomes as cast condition monocrystalline bus: the copper alloy casting ingot for preparing is added the horizontal casting metal single crystal continuous casting chamber that nitrogen protection is arranged; after using Frequency Induction Heating, fusing, refining and degasification; finish the horizontal continuous casting of single crystal to molten alloyed copper, obtain ф 3mm, the vertical and horizontal number of die is 1 copper palldium alloy as cast condition monocrystalline bus.
4. slightly pull out: the copper palldium alloy as cast condition monocrystalline bus of ф 3mm is drawn into the copper palldium alloy monocrystalling wire that diameter is 0.20mm.
5. heat treatment: be the copper palldium alloy monocrystalling wire annealing of 0.20mm with diameter.
6. surface gold-plating: copper palldium alloy monocrystalling wire is electroplated the proof gold protective layer, electroplate purity requirement with gold greater than 99.99%, the control of surface gold-plating layer is at the thickness of 1 μ m-2 μ m.
7. essence is pulled out: with the aforementioned gold plated copper palldium alloy monocrystalline bonding wire that is coated with the 0.20mm of proof gold protective layer, precision is drawn into the finished product bonding wire that diameter is respectively ф 13 μ m-50 μ m.
8. heat treatment: gold plated copper palldium alloy monocrystalline bonding wire is carried out annealing in process.
9. surface clean: clean with acid solution earlier, clean through ultrasonic wave then, again by high purity water clean, oven dry.
10. bundling: finished product gold plated copper palldium alloy monocrystalline bonding wire is carried out after-combustion, bundling, packing.
Embodiment 3
The present invention realizes like this, a kind of gold plated copper palldium alloy monocrystalline bonding wire, the basis material of this bonding wire is made up of the raw material of following percentage by weight: gold (Au) 5%, palladium (Pa) 0.06%, calcium (Ca) 0.0002%, mixed type rare earth (Re) 0.0005%, all the other are copper, sum equals 100%.The purity that requires gold greater than 99.99%, the purity of copper greater than 99.9995%, the purity of palladium greater than 99.999%, the purity of calcium is that 99.0%-99.5%, Re is the mixed type rare earth.
The manufacture method of gold plated copper palldium alloy monocrystalline bonding wire, method is as follows:
1. extract high purity copper: be raw material with No. 1 fine copper of national standard, dna purity is greater than 99.9995% high purity copper, through clean, dry for standby.
2. be prepared into copper alloy casting ingot: by embodiment 3 aforementioned relevant regulations requirements; in high purity copper, add high-purity palladium, calcium, rare earth respectively; these metals are put into the high purity graphite crucible after mechanical mixture, use the electric induction furnace fusing under the inert gas shielding condition, are prepared into copper gold alloying ingot.
3. continuous casting becomes as cast condition monocrystalline bus: the copper alloy casting ingot for preparing is added the horizontal casting metal single crystal continuous casting chamber that nitrogen protection is arranged; after using Frequency Induction Heating, fusing, refining and degasification; finish the horizontal continuous casting of single crystal to molten alloyed copper, obtain ф 3mm, the vertical and horizontal number of die is 1 copper palldium alloy as cast condition monocrystalline bus.
4. slightly pull out: the copper palldium alloy as cast condition monocrystalline bus of ф 3mm is drawn into the copper palldium alloy monocrystalling wire that diameter is 0.20mm.
5. heat treatment: be the copper palldium alloy monocrystalling wire annealing of 0.20mm with diameter.
6. surface gold-plating: copper palldium alloy monocrystalling wire is electroplated the proof gold protective layer, electroplate purity requirement with gold greater than 99.99%, the control of surface gold-plating layer is at the thickness of 1 μ m-2 μ m.
7. essence is pulled out: with the aforementioned gold plated copper palldium alloy monocrystalline bonding wire that is coated with the 0.20mm of proof gold protective layer, precision is drawn into the finished product bonding wire that diameter is respectively ф 13 μ m-50 μ m.
8. heat treatment: gold plated copper palldium alloy monocrystalline bonding wire is carried out annealing in process.
9. surface clean: clean with acid solution earlier, clean through ultrasonic wave then, again by high purity water clean, oven dry.
10. bundling: finished product gold plated copper palldium alloy monocrystalline bonding wire is carried out after-combustion, bundling, packing.
Claims (2)
1. gold plated copper palldium alloy monocrystalline bonding wire, the basis material that it is characterized in that this bonding wire is made up of the raw material of following percentage by weight: gold (Au) 4%-8%, palladium (Pa) 0.03%-0.08%, calcium (Ca) 0.0001%-0.0003%, mixed type rare earth (Re) 0.0002%-0.0008%, all the other are copper, sum equals 100%, the purity that requires gold greater than 99.99%, the purity of copper greater than 99.9995%, the purity of palladium greater than 99.999%, the purity of calcium is that 99.0%-99.5%, Re is the mixed type rare earth.
2. the manufacture method of the described gold plated copper palldium alloy of claim 1 a monocrystalline bonding wire is characterized in that processing step and the method for making are as follows:
1. extract high purity copper: be raw material with No. 1 fine copper of national standard, dna purity is greater than 99.9995% high purity copper, through clean, dry for standby;
2. be prepared into copper alloy casting ingot: in high purity copper, add high-purity palladium, calcium, rare earth respectively, content is respectively according to percentage by weight: palladium accounts for that 0.03%-0.08%, calcium account for 0.0001%-0.0003%, rare earth accounts for 0.0002%-0.0008%, all the other are copper, and sum equals 100%; The purity that requires copper greater than 99.9995%, the purity of palladium greater than 99.999%, the purity 99.0%-99.5% of calcium, Re is the mixed type rare earth; These metals are put into the high purity graphite crucible after mechanical mixture, use the electric induction furnace fusing under the inert gas shielding condition, are prepared into copper gold alloying ingot;
3. be prepared into as cast condition monocrystalline bus: the copper alloy casting ingot for preparing is added the horizontal casting metal single crystal continuous casting chamber that nitrogen protection is arranged, after using Frequency Induction Heating, fusing, refining and degasification, liquation is injected the liquid storage tank insulation, finish the horizontal continuous casting of single crystal to molten alloyed copper, obtain ф 3mm, the vertical and horizontal number of die is 1 copper palldium alloy as cast condition monocrystalline bus;
4. slightly pull out: the copper palldium alloy as cast condition monocrystalline bus of ф 3mm is drawn into the copper palldium alloy monocrystalling wire that diameter is 0.20mm;
5. heat treatment: be the copper palldium alloy monocrystalling wire annealing of 0.20mm with diameter;
6. surface gold-plating: copper palldium alloy monocrystalling wire is electroplated the proof gold protective layer, electroplate purity requirement with gold greater than 99.99%, the control of surface gold-plating layer is at the thickness of 1 μ m-2 μ m;
7. essence is pulled out: with the aforementioned gold plated copper palldium alloy monocrystalline bonding wire that is coated with the 0.20mm of proof gold protective layer, precision is drawn into the finished product bonding wire that diameter is respectively ф 13 μ m-50 μ m;
8. heat treatment: gold plated copper palldium alloy monocrystalline bonding wire is carried out annealing in process;
9. surface clean: clean with acid solution earlier, clean through ultrasonic wave then, again by high purity water clean, oven dry;
10. bundling: finished product gold plated copper palldium alloy monocrystalline bonding wire is carried out after-combustion, bundling, packing.
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| CN104377185A (en) * | 2014-01-17 | 2015-02-25 | 江西蓝微电子科技有限公司 | Gold-plated palladium-silver alloy single crystal bonding wire and manufacturing method thereof |
| CN117230415A (en) * | 2023-01-17 | 2023-12-15 | 合肥中晶新材料有限公司 | Bonding copper-palladium alloy wire for semiconductor packaging and manufacturing method and application thereof |
| EP4306678A1 (en) * | 2022-07-13 | 2024-01-17 | Hermes Sellier | Method for producing a black and self-healing workpiece having a precious metal substrate, and workpiece obtained |
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| CN102517528A (en) * | 2011-12-09 | 2012-06-27 | 徐云管 | Method for manufacturing ultrahigh-tension wire with single-crystal alloy material |
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| CN102361026A (en) * | 2011-10-19 | 2012-02-22 | 广东佳博电子科技有限公司 | Copper-based bonding wire with anti-oxidation function |
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| CN104377185A (en) * | 2014-01-17 | 2015-02-25 | 江西蓝微电子科技有限公司 | Gold-plated palladium-silver alloy single crystal bonding wire and manufacturing method thereof |
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| EP4306678A1 (en) * | 2022-07-13 | 2024-01-17 | Hermes Sellier | Method for producing a black and self-healing workpiece having a precious metal substrate, and workpiece obtained |
| FR3137924A1 (en) * | 2022-07-13 | 2024-01-19 | Hermes Sellier | Method for producing a part with a black, self-healing appearance having a precious metal substrate, and part obtained |
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