CN103194637B - Bonding alloy filamentary silver and preparation method thereof - Google Patents
Bonding alloy filamentary silver and preparation method thereof Download PDFInfo
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- CN103194637B CN103194637B CN201310151822.5A CN201310151822A CN103194637B CN 103194637 B CN103194637 B CN 103194637B CN 201310151822 A CN201310151822 A CN 201310151822A CN 103194637 B CN103194637 B CN 103194637B
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/438—Post-treatment of the connector
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
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- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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Abstract
The invention relates to bonding alloy filamentary silver and a preparation method thereof, and belongs to the technical field of processing of a bonding wire. The bonding alloy filamentary silver comprises the following metal materials by mass ratio: less than 90wt% of silver, 3.0-10.0wt% of gold, and 3.0-8.0wt% of palladium; and the bonding alloy filamentary silver also comprises at least two of following metals of 10-100ppm of calcium, 4-10ppm of beryllium, 10-100ppm of cerium, and 50-500ppm of copper. The preparation method comprises the steps of 1) preparing materials; 2) smelting mother alloy; 3) continuously casting an alloy rod; 4) roughly working, intermediately drawing, and finely drawing; 5) carrying out middle annealing; 6) ultra-finely drawing; 7) finally annealing; 8) winding; and 9) packaging. The technology disclosed by the invention is specified and reasonable in design, and simple and convenient to operate; the obtained product is strong in electrical conductivity, has certain inoxidizability, good plasticity, high rupturing load, good elongation and low cost, can meet the demands of the semiconductor encapsulation industry and a light-emitting diode (LED) illumination technology on performance of the bonding alloy filamentary silver, and can be used as a substitute for a bonding alloy wire.
Description
Technical field
The present invention relates to a kind of bonding alloy filamentary silver and preparation method, belong to bonding wire processing technique field.
Background technology
Bonding wire be semiconducter device and unicircuit assembling time, for making the micro-wire internal lead realizing electrical connection in the I/O bonding point of chip internal circuit and lead frame between point of contact.Current main Types has spun gold, alloy gold wire, copper wire, plating palladium copper wire etc.
The resistivity of silver is 1.586*10
-8μ Ω m, in all metals, resistivity is minimum, and conductivity is optimum, and the thermal diffusivity of silver is better than gold, but the balling-up of fine silver silk is unstable, and oxidizable, its use also exists very large challenge.For reducing packaging cost, adapt to the needs of LED bonding, bonding alloy filamentary silver is seasonable and give birth to.
Bonding alloy filamentary silver has excellent physicals and good mechanical property, and greatly can reduce product cost, and become effective substitute of bonding gold wire gradually, bonding alloy filamentary silver has following performance characteristics:
1, the cost of bonding alloy filamentary silver is lower
The alloy filamentary silver of all size used in wire bonding, its cost is the highest can reduce by 40%.
2, the good mechanical properties of bonding alloy filamentary silver
Bonding alloy filamentary silver has higher elongation and breaking load, can obtain excellent ball neck intensity and higher camber line stability like this in mold pressing and encapsulation process.
3, the electric property of bonding alloy filamentary silver is excellent
Along with chip frequency improves constantly, have higher requirement to the electrical property of conductor material in encapsulation, silver-colored resistivity is 1.586*10
-8μ Ω m, in all metals, resistivity is minimum, and conductivity is optimum.
4, the thermal property of bonding alloy filamentary silver is excellent
Along with the raising of chip density and reducing of volume, the heat radiation in chip manufacturing proces is the important content that design and processes is considered, thermal conductivity 429 W/ (mK) of argent, thermal diffusivity is better than gold.
5, the at present shortcoming that exists of bonding alloy filamentary silver and technology difference
1) no matter alloy filamentary silver or fine silver silk are due to the existence of alloying element, expose in short-term and there will not be problem of oxidation, but still there is problem of oxidation in long-time placement.
2) bonding alloy filamentary silver is produced and is all needed gas shield in encapsulation process.
3) because bonding alloy filamentary silver intensity is lower, drawability slightly inferior to bonding gold wire, therefore needs adjustment equipment pulling force in process of production or changes little working modulus mould, thus avoids occurring fracture of wire problem.
Summary of the invention
The object of the invention is to the deficiency solving prior art existence, provide one to have certain oxidation-resistance, plasticity-, there is higher breaking load and better elongation, and cheap bonding alloy filamentary silver and preparation method thereof.
For achieving the above object, the present invention is by the following technical solutions:
A kind of bonding alloy filamentary silver, its special feature is the metallic substance comprising following weight ratio: silver (Ag) < 90wt %, gold (Au) 3.0wt%-10.0wt%, palladium (Pd) 3.0wt%-8.0wt%;
Also comprise at least two kinds of following metallic substance: calcium (Ca) 10-100ppm, beryllium (Be) 4-10ppm, cerium (Ce) 10-100ppm, copper (Cu) 50-500ppm.
The preparation method of above-mentioned bonding alloy filamentary silver, its special feature is:
1), following metallic substance is adopted:
Purity is 99.999wt% gold 3.0wt%-10.0wt%, purity is the palladium 3.0wt%-8.0wt% of 99.97wt%, calcium grain 0.40wt%-0.80wt%, beryllium sheet 0.40wt%-0.80wt%, cerium 0.40wt%-0.80wt% and oxygen free copper 0.4-1.0 wt%, surplus is purity is 99.999wt% silver;
2) mother alloy of following melting, is adopted
A, Au-Be mother alloy;
B, Au-Ca mother alloy;
C, Au-Ce mother alloy;
D, Au-Cu mother alloy;
3), following proportioning is adopted:
Getting purity by weight percentage is respectively 99.999wt% gold plaque 0.0wt%-9.20wt%, purity is the palladium sheet 3.0wt%-8.0wt% of 99.97wt%, Au-Be mother alloy 0-0. 25wt%, Au-Ca mother alloy 0-2.5 wt%, Au-Ce mother alloy 0-2.5 wt%, Au-Cu mother alloy 0-12.5 wt%, all the other for purity be 99.999wt% silver.
Further, above-mentioned bonding alloy filamentary silver preparation method 3), the following proportioning of middle employing:
Getting purity by weight percentage is respectively 99.999wt% gold plaque 0.0wt%-9.20wt%, purity is the palladium sheet 3.0wt%-8.0wt% of 99.97wt%, Au-Be mother alloy 0.05 wt%-0. 25wt%, Au-Ca mother alloy 0.125 wt%-2.5 wt%, Au-Ce mother alloy 0.125 wt%-2.5 wt%, Au-Cu mother alloy 0.5 wt%-12.5 wt%, all the other for purity be 99.999wt% silver.
The preparation method of bonding alloy filamentary silver, 2), the melting method of Au-Be mother alloy is:
Taking purity is by weight 99.999wt% gold 99.20wt%-99.60wt%, beryllium sheet 0.40wt%-0.80wt%;
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by broken beryllium sheet and put into the unsettled monkey of stove;
Ii), vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey, broken beryllium sheet and goldleaf are added in the large crucible in stove, stir 20-30 time, leave standstill 10-20 minute;
Iii), furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats ii) step, 2-3 time, thoroughly this mother alloy of the rear taking-up of cooling.
The preparation method of bonding alloy filamentary silver, 2), the melting method of Au-Ca mother alloy is:
Taking purity is by weight 99.999wt% gold 99.20wt%-99.60wt%, calcium grain 0.40wt%-0.80wt%;
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by calcium grain and put into the unsettled monkey of stove;
Ii), vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey, calcium grain and goldleaf are added in the large crucible in stove, stir 20-30 time, leave standstill 10-20 minute;
Iii), furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats ii) step, 2-3 time, thoroughly this mother alloy of the rear taking-up of cooling.
The preparation method of bonding alloy filamentary silver, 2), the melting method of Au-Ce mother alloy is:
Taking purity is by weight 99.999wt% gold 99.20wt%-99.60wt%, cerium 0.40wt%-0.80wt%;
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by broken cerium block and put into the unsettled monkey of stove;
Ii), vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey, broken cerium block and goldleaf are added in the large crucible in stove, stir 20-30 time, leave standstill 10-20 minute;
Iii), furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats ii) step, 2-3 time, thoroughly this mother alloy of the rear taking-up of cooling.
The preparation method of bonding alloy filamentary silver, 2), the melting method of Au-Cu mother alloy is:
Taking purity is by weight 99.999wt% gold 99.00 wt%-99.60 wt%, and purity is the oxygen free copper 0.40wt%-1.00wt% of 99.99wt%;
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by broken copper sheet and put into the unsettled monkey of stove;
Ii), vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey, broken copper sheet and goldleaf are added in the large crucible in stove, stir 20-30 time, leave standstill 10-20 minute;
Iii), furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats ii) step, 2-3 time, thoroughly this mother alloy of the rear taking-up of cooling.
The preparation method of above-mentioned bonding alloy filamentary silver specifically comprises the following steps:
1), get the raw materials ready: take various metallic substance by required weight;
Purity is 99.999wt% gold 3.0wt%-10.0wt%, purity is the palladium 3.0wt%-8.0wt% of 99.97wt%, calcium grain 0.40wt%-0.80wt%, beryllium sheet 0.40wt%-0.80wt%, cerium 0.40wt%-0.80wt% and oxygen free copper (99.99%) 0.4-1.0 wt%, surplus is purity is 99.999wt% silver.
2), the melting of mother alloy
According to Au-Be, Au-Ca, Au-Ce, Au-Cu alloy phase diagram, determine each mother alloy smelting temperature.Adopt high-frequency melting furnace, vacuum protection, vacuum tightness is 0.1 × 10
-3pa, smelting temperature 1050-1250 DEG C, repeatedly stirs, and obtains the mother alloy of uniform composition.
The melting of a, Au-Be mother alloy;
The melting of b, Au-Ca mother alloy;
The melting of c, Au-Ce mother alloy;
The melting of d, Au-Cu mother alloy;
3), cast alloy bar:
Adopt vertical continuous casting furnace, in purity be 99.999wt% silver basis on add alloying element and be drawn into the alloy bar that diameter is 5-10 mm.
A, to get purity respectively be by weight percentage 99.999wt% gold plaque 0.0wt%-9.20wt%, purity is the palladium sheet 3.0wt%-8.0wt% of 99.97wt%, step 2) the middle Au-Be mother alloy 0-0. 25wt% prepared, Au-Ca mother alloy 0-2.5 wt%, Au-Ce mother alloy 0-2.5 wt%, Au-Cu mother alloy 0-12.5 wt%, all the other for purity be 99.999wt% silver.
B, to feed intake: the mother alloy of gold plaque, palladium sheet and required interpolation is put into the unsettled monkey of stove, and purity is the large crucible putting into stove of 99.999wt% silver;
C, vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, argent melts completely, maintains this temperature, refining 10-20 minute.Open monkey unsettled in stove, the gold plaque in monkey, palladium sheet and mother alloy are added in the large crucible in stove, stir 20-30 time, maintain this temperature, refining 10-20 minute;
D, cast alloy bar: stop vacuumizing, applying argon gas, pressure 0.01-0.05Pa, adopt continuous drawing casting method, speed 20-60mm/min, obtains ganoid alloy bar.
4), rough, in draw, carefully draw: will the alloy bar that continuous drawing casting method continuous casting is good be adopted, through rough, in draw, carefully draw, be drawn into micron order work in-process filament size.
5), process annealing: will carefully draw the alloy filamentary silver of acquisition 350-450 DEG C of annealing, winding tension 3-15g, take-up speed 150-250rpm.
6), ultra-finely to draw: by the alloy filamentary silver through process annealing, be drawn into final dimension needed for client.Mould unit elongation 4-9%, drawing speed 180-480 m/min.
7), annealing eventually:
By the alloy filamentary silver of final dimension 450-600 DEG C of annealing, winding tension 3-15g, take-up speed 100-200rpm.
8), coiling:
Winding tension is 3-30g, and threading speed is 500-750rpm.
9), pack:
Alloy filamentary silver after coiling is put into packing box with holes, puts into siccative, and adopt vacuum machine to carry out encapsulation process.
Described step 2) middle employing high-frequency melting furnace, vacuum tightness is 0.1 × 10
-3pa.
Rough in described step 4), in draw, the processing parameter that carefully draws is respectively:
A, rough: mould unit elongation 7-18%, drawing speed 6-22m/min;
B, in draw: mould unit elongation 9-18%, drawing speed 60-180 m/min;
C, carefully to draw: mould unit elongation 4-15%, drawing speed 180-480 m/min;
Bonding alloy filamentary silver preparation method provided by the present invention, technological design is reasonable, specification, easy and simple to handle, the bonding alloy filamentary silver conductive capability produced is strong, there is certain oxidation-resistance, good plasticity-, there is higher breaking load and good elongation, and cheap, the requirement of semiconductor packaging industry, LED illumination technology para-linkage alloy filamentary silver performance can be met completely.This product as the substitute of bonding gold wire, can be the cost that Semiconductor enterprises reduces by 40%, and bonding wire manufacturing enterprise can produce this type product, without the need to the equipment that investment for trnasforming urban land is new, for enterprise is cost-saving, increases the benefit.
Accompanying drawing explanation
Fig. 1: be bonding alloy filamentary silver preparation method schema of the present invention.
Embodiment
Below provide the specific embodiment of the present invention, be used for being further described formation of the present invention.
Embodiment 1
The present embodiment bonding alloy filamentary silver, be made up of the metallic substance of following weight ratio: purity is gold (Au) 8wt% of 99.999wt%, purity is palladium (Pd) 3 wt% of 99.97wt%, commercially available purity is oxygen free copper (Cu) 200ppm of 99.99%, calcium (Ca) 80ppm, cerium (Ce) 60ppm, beryllium (Be) 8ppm, all the other content are the silver (Ag) of purity 99.999wt%.
Product type is KT1, and its mechanical property is in table 3.
Its preparation method comprises the following steps:
1) master alloy melting
The method of a, melting Au-Be mother alloy is:
Taking purity is by weight 99.999wt% gold 99.20 wt%-99.60 wt%, beryllium sheet 0.40wt%-0.80wt%.
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by broken beryllium sheet and put into the unsettled monkey of stove;
Ii), vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey, add the goldleaf being surrounded by broken beryllium sheet, stir 20-30 time, leave standstill 10-20 minute.
Iii), furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats ii) step, 2-3 time, thoroughly this mother alloy of the rear taking-up of cooling.
The method of b, melting Au-Ca mother alloy is:
Taking purity is by weight 99.999wt% gold 99.20 wt%-99.60 wt%, calcium grain 0.40wt%-0.80wt%.
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by calcium grain and put into the unsettled monkey of stove;
Ii), vacuum melting and furnace cooling step are with ii in a) and iii).
The method of c, melting Au-Ce mother alloy is:
Taking purity is by weight 99.999wt% gold 99.20 wt%-99.60 wt%, cerium 0.40wt%-0.80wt%.
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by broken cerium block and put into the unsettled monkey of stove;
Ii), vacuum melting and furnace cooling step are with ii in a) and iii).
The method of d, melting Au-Cu mother alloy is:
Taking purity is by weight 99.999wt% gold 99.00 wt%-99.60 wt%, and purity is the oxygen free copper 0.40wt%-1.00wt% of 99.99wt%.
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by broken copper sheet and put into the unsettled monkey of stove;
Ii), vacuum melting and furnace cooling step are with ii in a) and iii).
2), get the raw materials ready: 5kg altogether.Taking purity is 99.999wt% gold 395.67-398.09g, and purity is 99.97wt% palladium sheet 150g, gold-copper mother alloy 1.00-2.50g, gold-calcium mother alloy 0.50-1.00g, gold-cerium mother alloy 0.375-0.75g, gold-beryllium mother alloy 0.05-0.10g, the silver of surplus to be purity be 99.999 wt%.
3), continuous casting alloy bar:
Equipment used: vertical continuous casting smelting furnace
Gold and silver are placed in the large crucible in stove, and gold-copper, gold-calcium, gold-beryllium, gold-cerium mother alloy are put into the unsettled monkey of stove.Build bell to vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metallic gold and silver melt completely, maintain this temperature, refining 10-20 minute.Open monkey unsettled in stove, add gold-copper, gold-calcium, gold-beryllium, gold-cerium mother alloy, and stir 20-30 time, maintain this temperature, refining 10-20 minute.Stopping vacuumizes, applying argon gas, pressure 0.01-0.05Pa, adopts continuous drawing casting method, speed 20-60mm/min, and obtaining diameter is the ganoid silver alloys rod of 8 ± 1mm.
4), rough, in draw, carefully draw:
Be the alloy bar of 8 ± 1mm by diameter, through rough, in draw and thin drawing process, product is drawn into micron order work in-process needed for process annealing.
A, rough: φ 8mm → φ 1.5mm, mould unit elongation 7-18%, drawing speed 6-22m/min;
B, in draw: φ 1.5mm → φ 0.3mm, mould unit elongation 9-18%, drawing speed 60-180 m/min;
C, carefully to draw: φ 0.3mm → φ 0.08mm, mould unit elongation 4-15%, drawing speed 180-480 m/min;
5), process annealing:
Annealing temperature 350-450 DEG C, winding tension 3-15g, take-up speed 150-250rpm.
6), ultra-finely to draw: φ 0.08mm → φ 0.015mm, mould unit elongation 4-9%, drawing speed 180-480 m/min.
7), annealing eventually:
Annealing temperature is 450-600 DEG C, winding tension 3-15g, take-up speed 100-200rpm.
8), coiling:
Winding tension is 3-30g, and threading speed is 500-750rpm.
9), pack:
Bonding alloy filamentary silver after coiling is put into packing box with holes, puts into siccative, and adopt vacuum machine to carry out encapsulation process.
Embodiment 2
The present embodiment difference from Example 1 is:
The present embodiment bonding alloy filamentary silver, be made up of the metallic substance of following weight ratio: purity is gold (Au) 8wt% of 99.999wt%, purity is palladium (Pd) 3 wt% of 99.97wt%, calcium (Ca) 80ppm, cerium (Ce) 60ppm, beryllium (Be) 8ppm, all the other content are the silver (Ag) of purity 99.999wt%.
Operating procedure is with embodiment 1, and this product type name is called KT3, and its mechanical property is in table 3.
Embodiment 3
The present embodiment difference from Example 1 is:
The present embodiment bonding alloy filamentary silver, be made up of the metallic substance of following weight ratio: purity is gold (Au) 8wt% of 99.999wt%, purity is palladium (Pd) 3 wt% of 99.97wt%, calcium (Ca) 80ppm, beryllium (Be) 8ppm, all the other content are the silver (Ag) of purity 99.999wt%.
Subsequent technique is with embodiment 1, and this product type name is called KT5, and its mechanical property is in table 3.
Embodiment 4
The present embodiment difference from Example 1 is:
The present embodiment bonding alloy filamentary silver, be made up of the metallic substance of following weight ratio: purity is gold (Au) 3.5wt% of 99.999wt%, purity is palladium (Pd) 6 wt% of 99.97wt%, commercially available oxygen free copper (Cu) (99.99%) 60ppm, calcium (Ca) 20ppm, cerium (Ce) 90ppm, beryllium (Be) 5ppm, all the other content are the silver (Ag) of purity 99.999wt%.
Technological operation step is with embodiment 1.
Embodiment 5
The present embodiment difference from Example 1 is:
The present embodiment bonding alloy filamentary silver, be made up of the metallic substance of following weight ratio: purity is gold (Au) 9.5wt% of 99.999wt%, purity is palladium (Pd) 8 wt% of 99.97wt%, commercially available oxygen free copper (Cu) (99.99%) 480ppm, calcium (Ca) 50ppm, cerium (Ce) 20ppm, beryllium (Be) 10ppm, all the other content are the silver (Ag) of purity 99.999wt%.
Technological operation step is with embodiment 1.
According to the bonding alloy filamentary silver that composition and engineering step of the present invention is produced, the existence of its gold (Au) and palladium (Pd) significantly can improve the bonding performance of alloy filamentary silver, is easy to welding.Cerium (Ce), the acting in conjunction of calcium (Ca) and beryllium (Be) can improve the intensity of alloy in the mode of solution strengthening, in addition, cerium (Ce) can improve the fatigue resistance of material; Calcium (Ca) can improve plasticity and the weldability of material; Beryllium (Be) can improve radian, can meet the particular requirement of LED bonding wire.
The bonding alloy filamentary silver product prepared according to formula of the present invention and processing step, record its physicals as shown in table 1, its mechanical property is as shown in table 2:
The bonding alloy filamentary silver that the present invention produces and home and abroad like product Technical comparing:
Choosing diameter is that the bonding alloy filamentary silver of 20 μm and 25 μm carries out mechanical property parameters and compares, as shown in table 3, table 4.As can be seen from the table, my company bonding alloy filamentary silver performance of producing and company of the Korea S alloy filamentary silver performance of producing is suitable.
The present invention is intended to the low cost bonding alloy filamentary silver preparing applicable IC Packaging Industry and LED industry use; determine the technological process of production of bonding alloy filamentary silver; the processing parameters such as wire-drawing die parameter and process annealing, whole annealing temperature, speed, the large-scale production for bonding alloy filamentary silver provides theory and practice foundation.
(1) choose applicable alloying element and determine the content of alloying element, adopting continuous casing, obtaining alloy bar;
(2) wire-drawing process determines desirable Mould Machining rate and wire drawing speed;
(3) desirable process annealing wire diameter and annealing temperature is determined in drawing process;
(4) desirable whole annealing temperature, winding tension and threading speed is determined.
Current, price of gold constantly rises, and causes bonding gold wire proportion in device cost constantly to rise, the successful development of bonding alloy filamentary silver, can be the cost of Semiconductor enterprises reduction by 40%, this product as the substitute of bonding gold wire, can be widely used in IC Packaging Industry and LED industry.Simultaneously due to without the need to transformation and investment new installation, for bonding wire manufacturing enterprise produces this type product, IC Packaging Industry, LED industry use bonding alloy filamentary silver to provide convenient, so the potential market scale of bonding alloy filamentary silver is very huge.
Claims (7)
1. a bonding alloy filamentary silver, is characterized in that the metallic substance comprising following weight ratio: Ag < 90wt %, Au 3.0wt%-10.0wt%, Pd 3.0wt%-8.0wt%;
Also comprise at least two kinds of following metallic substance: Ca 10-100ppm, Be 4-10ppm, Ce 10-100ppm, Cu 50-500ppm;
The preparation method of described bonding alloy filamentary silver:
1), following metallic substance is adopted:
Purity is 99.999wt% gold 3.0wt%-10.0wt%, purity is the palladium 3.0wt%-8.0wt% of 99.97wt%, calcium grain 0.40wt%-0.80wt%, beryllium sheet 0.40wt%-0.80wt%, cerium 0.40wt%-0.80wt% and oxygen free copper 0.4-1.0 wt%, surplus is purity is 99.999wt% silver;
2) mother alloy of following melting, is adopted
A, Au-Be mother alloy;
B, Au-Ca mother alloy;
C, Au-Ce mother alloy;
D, Au-Cu mother alloy;
3), following proportioning is adopted:
Getting purity by weight percentage is respectively that 99.999wt% gold plaque is greater than 0 and is less than or equal to 9.20 wt%, purity is the palladium sheet 3.0wt%-8.0wt% of 99.97wt%, Au-Be mother alloy 0-0. 25wt%, Au-Ca mother alloy 0-2.5 wt%, Au-Ce mother alloy 0-2.5 wt%, Au-Cu mother alloy 0-12.5 wt%, all the other for purity be 99.999wt% silver;
Preparation method comprises the following steps:
1), get the raw materials ready: take various metallic substance by required weight;
2), the melting of mother alloy
According to Au-Be, Au-Ca, Au-Ce, Au-Cu alloy phase diagram, determine each mother alloy smelting temperature; Adopt high-frequency melting furnace, vacuum protection, vacuum tightness is 0.1 × 10
-3pa, smelting temperature 1050-1250 DEG C, repeatedly stirs, and obtains the mother alloy of uniform composition;
The melting of a, Au-Be mother alloy;
The melting of b, Au-Ca mother alloy;
The melting of c, Au-Ce mother alloy;
The melting of d, Au-Cu mother alloy;
3), cast alloy bar:
Adopt vertical continuous casting furnace, in purity be 99.999wt% silver basis on add alloying element and be drawn into the alloy bar that diameter is 5-10 mm;
A, to get purity respectively be by weight percentage that 99.999wt% gold plaque is greater than 0 and is less than or equal to 9.20 wt%, purity is the palladium sheet 3.0wt%-8.0wt% of 99.97wt%, step 2) the middle Au-Be mother alloy 0-0. 25wt% prepared, Au-Ca mother alloy 0-2.5 wt%, Au-Ce mother alloy 0-2.5 wt%, Au-Cu mother alloy 0-12.5 wt%, all the other for purity be 99.999wt% silver;
B, to feed intake: the mother alloy of gold plaque, palladium sheet and required interpolation is put into the unsettled monkey of stove, and purity is the large crucible putting into stove of 99.999wt% silver;
C, vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, argent melts completely, maintains this temperature, refining 10-20 minute; Open monkey unsettled in stove, the gold plaque in monkey, palladium sheet and mother alloy are added in the large crucible in stove, stir 20-30 time, maintain this temperature, refining 10-20 minute;
D, cast alloy bar: stop vacuumizing, applying argon gas, pressure 0.01-0.05Pa, adopt continuous drawing casting method, speed 20-60mm/min, obtains ganoid alloy bar;
4), rough, in draw, carefully draw:
To the alloy bar that continuous drawing casting method continuous casting is good be adopted, through rough, in draw, carefully draw, be drawn into micron order work in-process filament;
5), process annealing: will carefully draw the alloy filamentary silver of acquisition 350-450 DEG C of annealing, winding tension 3-15g, take-up speed 150-250rpm;
6), ultra-finely to draw: by the alloy filamentary silver through process annealing, be drawn into final dimension needed for client, mould unit elongation 4-9%, drawing speed 180-480 m/min;
7), annealing eventually:
By the alloy filamentary silver of final dimension 450-600 DEG C of annealing, winding tension 3-15g, take-up speed 100-200rpm;
8), coiling:
Winding tension is 3-30g, and threading speed is 500-750rpm;
9), pack:
Alloy filamentary silver after coiling is put into packing box with holes, puts into siccative, and adopt vacuum machine to carry out encapsulation process.
2., according to bonding alloy filamentary silver according to claim 1, it is characterized in that described preparation method
3), the following proportioning of middle employing:
Getting purity by weight percentage is respectively that 99.999wt% gold plaque is greater than 0 and is less than or equal to 9.20 wt%, purity is the palladium sheet 3.0wt%-8.0wt% of 99.97wt%, Au-Be mother alloy 0.05 wt%-0. 25wt%, Au-Ca mother alloy 0.125 wt%-2.5 wt%, Au-Ce mother alloy 0.125 wt%-2.5 wt%, Au-Cu mother alloy 0.5 wt%-12.5 wt%, all the other for purity be 99.999wt% silver.
3., according to the bonding alloy filamentary silver described in claim 1 or 2, it is characterized in that the melting method of Au-Be mother alloy in described preparation method is:
Taking purity is by weight 99.999wt% gold 99.20wt%-99.60wt%, beryllium sheet 0.40wt%-0.80wt%;
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by broken beryllium sheet and put into the unsettled monkey of stove;
Ii), vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey, broken beryllium sheet and goldleaf are added in the large crucible in stove, stir 20-30 time, leave standstill 10-20 minute;
Iii), furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats ii) step, 2-3 time, thoroughly this mother alloy of the rear taking-up of cooling.
4., according to the bonding alloy filamentary silver described in claim 1 or 2, it is characterized in that the melting method of Au-Ca mother alloy in described preparation method is:
Taking purity is by weight 99.999wt% gold 99.20wt%-99.60wt%, calcium grain 0.40wt%-0.80wt%;
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by calcium grain and put into the unsettled monkey of stove;
Ii), vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey, calcium grain and goldleaf are added in the large crucible in stove, stir 20-30 time, leave standstill 10-20 minute;
Iii), furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats ii) step, 2-3 time, thoroughly this mother alloy of the rear taking-up of cooling.
5., according to the bonding alloy filamentary silver described in claim 1 or 2, it is characterized in that described preparation method's step 2) in the melting method of Au-Ce mother alloy be:
Taking purity is by weight 99.999wt% gold 99.20wt%-99.60wt%, cerium 0.40wt%-0.80wt%;
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by broken cerium block and put into the unsettled monkey of stove;
Ii), vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey, broken cerium block and goldleaf are added in the large crucible in stove, stir 20-30 time, leave standstill 10-20 minute;
Iii), furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats ii) step, 2-3 time, thoroughly this mother alloy of the rear taking-up of cooling.
6., according to the bonding alloy filamentary silver described in claim 1 or 2, it is characterized in that the melting method of Au-Cu mother alloy in described preparation method is:
Taking purity is by weight 99.999wt% gold 99.00 wt%-99.60 wt%, and purity is the oxygen free copper 0.40wt%-1.00wt% of 99.99wt%;
I), feed intake: the gold accounting for golden gross weight 90-95% is directly put into the large crucible of stove, all the other gold make goldleaf, are wrapped in goldleaf by broken copper sheet and put into the unsettled monkey of stove;
Ii), vacuum melting: build bell and vacuumize, when in stove, vacuum tightness reaches 0.1 × 10
-3start heating during Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey, broken copper sheet and goldleaf are added in the large crucible in stove, stir 20-30 time, leave standstill 10-20 minute;
Iii), furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats ii) step, 2-3 time, thoroughly this mother alloy of the rear taking-up of cooling.
7. according to bonding alloy filamentary silver described in claim 1 or 2, it is characterized in that rough in described preparation method's step 4), in draw, the processing parameter that carefully draws is respectively:
A, rough: mould unit elongation 7-18%, drawing speed 6-22m/min;
B, in draw: mould unit elongation 9-18%, drawing speed 60-180 m/min;
C, carefully to draw: mould unit elongation 4-15%, drawing speed 180-480 m/min.
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| CN114657408A (en) * | 2022-05-24 | 2022-06-24 | 宁波康强电子股份有限公司 | Silver alloy bonding wire and manufacturing method thereof |
| CN115044877A (en) * | 2022-06-29 | 2022-09-13 | 烟台招金励福贵金属股份有限公司 | Preparation method of silver-based ternary alloy target |
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