CN101468417B - Receding aperture plate in cooling module of reflow welding stove - Google Patents
Receding aperture plate in cooling module of reflow welding stove Download PDFInfo
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- CN101468417B CN101468417B CN2007101728586A CN200710172858A CN101468417B CN 101468417 B CN101468417 B CN 101468417B CN 2007101728586 A CN2007101728586 A CN 2007101728586A CN 200710172858 A CN200710172858 A CN 200710172858A CN 101468417 B CN101468417 B CN 101468417B
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- orifice plate
- plate body
- backflow orifice
- heating wire
- reflux
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Abstract
The invention relates to a reflux orifice plate in a reflow furnace cooling module, which comprises a reflux orifice plate body, a heat-preserving board, a plurality of air conducting pipes, a temperature sensor, an electric heating wire and a ceramic terminal. The reflux orifice plate body and the heat-preserving board are correspondingly provided with a plurality of through holes used for mounting the air conducting pipes; the air conducting pipes are connected to the refux orifice plate body and the heat-preserving board; the temperature sensor and the electric heating wire are arranged onthe reflux orifice plate body respectively and arranged between the reflux orifice plate body and the heat-preserving board; and the ceramic terminal is arranged on the upper surface of the heat-preserving board and electrically connected with the temperature sensor. The reflux orifice plate can ensure that the surface temperature (about 150 DEG C) is slightly higher than the gasifying temperature of a soldering flux all the time, achieve the aim that the soldering flux is not adhered to or piled on the surface of the reflux orifice plate, and keep the cleanliness and free maintenance of the surface of the reflux orifice plate all the time. The reflux orifice plate can not influence the temperature of reflux cooling air completely under the condition that the heating wire works, and can meet the requirements of the cooling efficiency of a printed circuit board and a process temperature curve.
Description
Technical field
The present invention relates to a kind of reflow soldering that is used for the circuit board that is loaded with electronic devices and components is carried out soldering, relate in particular to the backflow orifice plate in a kind of reflow soldering refrigerating module.
Background technology
Reflow soldering (Reflow Oven) is the equipment that is used for the circuit board that is loaded with electronic devices and components is carried out soldering.It is by providing a kind of heating environment, thereby solder(ing) paste being heated melt allows surface-pasted components and parts and circuit board combine reliably by the solder(ing) paste alloy.The solder(ing) paste that soldering is used is that the scaling powder and the powder scolder of smectic are made paste, be coated in the soldering position of each components and parts of circuit board by printing, and accurate thereon mounted with electronic components, utilize reflow soldering to carry out heat fused, reach reliable soldering to components and parts.
Scaling powder in the solder(ing) paste is the mixture of main component with rosin normally, is the auxiliary material that guarantee that brazing process carries out smoothly.The main effect of scaling powder is to remove scolder and by the oxide on weldering mother metal surface, make the metal surface reach necessary cleannes, and the oxidation once more on surface when preventing to weld reduces solder surface tension force, improves welding performance.During the heat fused solder(ing) paste, scaling powder can gasify and become steam.Can liquefy when low-temperature space (about below 110 ℃) time that the scaling powder of gasification touches in the reflow ovens.Except heating module, reflow soldering all has a refrigerating module to guarantee metallurgy characteristic and reduce plate temperature.In the air reflow soldering, scaling powder steam was directly discharged body of heater before cooling, can not stay the scaling powder condensate in refrigerating module., in most nitrogen protection reflow solderings, in order to reduce nitrogen (N
2) consumption, internal mix gas will recycle, scaling powder steam can not directly be discharged body of heater, therefore scaling powder steam has an opportunity fully to contact with refrigerating module, make its temperature be lower than 110C, and condensation occurs, on the backflow orifice plate of these scaling powder condensate liquids cognition attached to refrigerating module.When the scaling powder of liquid state is stacked into certain degree, just can form drop, finally drip, and have very big probability to drop onto on the wiring board (PCB), cause the off quality of wiring board even scrap.In order to prevent this type of incident, general way is the scaling powder of regular manual wipping cleaning cooling zone backflow orifice surface in the industry, and maintenance is cleaned in return-flow system inside.The skilled worker that abundant maintenance technology and general knowledge generally need be shut down and be arranged to have to this work operates, and also needs to dismantle correlated parts sometimes, to clear up easily and thoroughly and to safeguard.But increased the time and the work difficulty of maintenance so again, thereby remote-effects are to production efficiency and the output of using the client.
Summary of the invention
Purpose of the present invention exactly in order to overcome the problem that above-mentioned prior art exists, provides the backflow orifice plate in a kind of reflow soldering refrigerating module that has a heating and heat preserving function.
In order to achieve the above object, the present invention has adopted following technical scheme: the backflow orifice plate in a kind of reflow soldering refrigerating module, comprise backflow orifice plate body, be characterized in: also comprise warming plate, a plurality of guide ducts, temperature sensor, electrical heating wire and ceramic terminal, the corresponding a plurality of through holes that are used to install guide duct that are provided with on described backflow orifice plate body and the warming plate, a plurality of guide ducts are connected on backflow orifice plate body and the warming plate, temperature sensor and electrical heating wire are installed on the backflow orifice plate body respectively and are arranged between backflow orifice plate body and the warming plate, and ceramic terminal is installed in the upper surface of warming plate and is electrically connected with temperature sensor.
Backflow orifice plate in the reflow soldering refrigerating module of the present invention heats the backflow orifice surface owing on backflow orifice plate body electrical heating wire has been installed, come real-time monitoring form surface temperature and it is carried out closed-loop control by temperature sensor simultaneously, the surface temperature that makes the backflow orifice plate is the gasification temperature of a little higher than scaling powder all the time, thereby reach the purpose that scaling powder does not stick and be deposited in the backflow orifice surface, remain the cleaning voluntarily of backflow orifice surface and non-maintaining.The cleaning that so just can save usually cooling zone backflow orifice plate special messenger when special is safeguarded, has greatly improved the running time and the production efficiency of machine.In addition,, the temperature of backflow cooling air be can under the situation of heating wire works, not influence fully, the cooling effectiveness and the requirement of temperature process curve of PCB wiring board satisfied owing to adopted warming plate to carry out thermal insulation.
Description of drawings
Fig. 1 is the overall structure schematic diagram of the backflow orifice plate in the reflow soldering refrigerating module of the present invention;
Fig. 2 is the decomposition texture schematic diagram of the backflow orifice plate in the reflow soldering refrigerating module of the present invention.
The specific embodiment
Referring to Fig. 1, Fig. 2, the backflow orifice plate in the reflow soldering refrigerating module of the present invention comprises backflow orifice plate body 1, warming plate 2, a plurality of Teflon guide duct 3, temperature sensor 4, electrical heating wire 5 and ceramic terminal 6.The corresponding a plurality of through holes 11,21 that are used to install guide duct that are provided with on backflow orifice plate body 1 and warming plate 2, a plurality of guide ducts 3 are connected on backflow orifice plate body 1 and the warming plate 2, temperature sensor 4 and electrical heating wire 5 are installed on the backflow orifice plate body respectively and are arranged between backflow orifice plate body and the warming plate, and ceramic terminal 6 is installed in the upper surface of warming plate and is electrically connected with temperature sensor.Backflow orifice plate body 1 and warming plate 2 are connected and fixed by a plurality of attachment screws 7 and hold-down screw 8.
Totally six length directions along backflow orifice plate body of electrical heating wire 5 among the present invention evenly is installed on the backflow orifice plate body 1 at interval.Heater strip can be band shape or strip, adopts the termination screw to fix.Heater strip power is 300-800W.The heater strip material is an inconel, high-temperature resistant 760 degree.
Operation principle of the present invention can be described as follows in conjunction with Fig. 1, Fig. 2: cooling for reflux wind by the elongate slots at backflow orifice plate body 1 two ends return into, via sending by the top fan behind the cooling system, the backflow wind is to warming plate 2, blow wiring board through Teflon guide duct 3 through backflow orifice plate body 1, reach cooling effect to PCB.Simultaneously, by being fixed in the temperature that temperature sensor 4 under the ceramic terminal 6 can detect backflow orifice plate body 1 surface in real time, duty by equipment computer control electrical heating wire 5 makes backflow orifice plate body 1 surface temperature be higher than the gasification temperature of scaling powder all the time.
Claims (6)
1. the backflow orifice plate in the reflow soldering refrigerating module, comprise backflow orifice plate body, it is characterized in that: comprise warming plate, a plurality of guide ducts, temperature sensor, electrical heating wire and ceramic terminal, the corresponding a plurality of through holes that are used to install guide duct that are provided with on described backflow orifice plate body and the warming plate, a plurality of guide ducts are connected on backflow orifice plate body and the warming plate, temperature sensor and electrical heating wire are installed on the backflow orifice plate body respectively and are arranged between backflow orifice plate body and the warming plate, and ceramic terminal is installed in the upper surface of warming plate and is electrically connected with temperature sensor.
2. the backflow orifice plate in the reflow soldering refrigerating module as claimed in claim 1 is characterized in that: described guide duct is the Teflon guide duct.
3. the backflow orifice plate in the reflow soldering refrigerating module as claimed in claim 1 is characterized in that: totally six length directions along backflow orifice plate body of described electrical heating wire evenly is installed on the backflow orifice plate body at interval.
4. the backflow orifice plate in the reflow soldering refrigerating module as claimed in claim 1 is characterized in that: described electrical heating wire is band shape or strip, adopts the termination screw to fix.
5. the backflow orifice plate in the reflow soldering refrigerating module as claimed in claim 1 is characterized in that: described electrical heating wire power is 300-800W.
6. the backflow orifice plate in the reflow soldering refrigerating module as claimed in claim 1 is characterized in that: described electrical heating wire material is an inconel, high-temperature resistant 760 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101728586A CN101468417B (en) | 2007-12-24 | 2007-12-24 | Receding aperture plate in cooling module of reflow welding stove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101728586A CN101468417B (en) | 2007-12-24 | 2007-12-24 | Receding aperture plate in cooling module of reflow welding stove |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101468417A CN101468417A (en) | 2009-07-01 |
| CN101468417B true CN101468417B (en) | 2010-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101728586A Active CN101468417B (en) | 2007-12-24 | 2007-12-24 | Receding aperture plate in cooling module of reflow welding stove |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103042289B (en) * | 2012-12-31 | 2017-02-08 | 北京中科同志科技有限公司 | Cooling system and reflow welding machine |
| CN108240770A (en) * | 2016-12-26 | 2018-07-03 | 上海朗仕电子设备有限公司 | A kind of reflow ovens semicircle heating unit |
| CN113305385B (en) * | 2021-05-25 | 2022-11-15 | 中国电子科技集团公司第二十九研究所 | Welding device and welding method based on inter-board vertical interconnection printed board assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2753104Y (en) * | 2004-11-23 | 2006-01-18 | 深圳市易迈克实业有限公司 | Refluxing welder |
| CN1893773A (en) * | 2005-06-30 | 2007-01-10 | 古河电气工业株式会社 | Reflow oven |
| CN1993197A (en) * | 2004-08-04 | 2007-07-04 | 千住金属工业株式会社 | Reflow oven |
| CN201131084Y (en) * | 2007-12-24 | 2008-10-08 | 上海朗仕电子设备有限公司 | Receding aperture plate in cooling module of reflow welding stove |
-
2007
- 2007-12-24 CN CN2007101728586A patent/CN101468417B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1993197A (en) * | 2004-08-04 | 2007-07-04 | 千住金属工业株式会社 | Reflow oven |
| CN2753104Y (en) * | 2004-11-23 | 2006-01-18 | 深圳市易迈克实业有限公司 | Refluxing welder |
| CN1893773A (en) * | 2005-06-30 | 2007-01-10 | 古河电气工业株式会社 | Reflow oven |
| CN201131084Y (en) * | 2007-12-24 | 2008-10-08 | 上海朗仕电子设备有限公司 | Receding aperture plate in cooling module of reflow welding stove |
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| Publication number | Publication date |
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| CN101468417A (en) | 2009-07-01 |
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